JPH06126782A - Resin mold of electronic part - Google Patents

Abstract

PURPOSE:To provide the resin mold of electronic part, with which problems such as poor areal productivity and material consumption rate due to the inevitable necessity of runner and gate are solved and consequently make it possible to obtain product at low cost as for the resin mold of electronic parts. CONSTITUTION:A cavity part 10 consists of a main runner 12, which is connected to the flow passage for flowing resin under molten state in the cavity 10, sub-runners 13 branched from the main runner 12, first product parts 15, each of which is connected through each first gate 14 with each sub-runner 13, and second product parts 17, each of which is connected through each second gate 16 with each first product part 15. Thus, products, which are two times as many as conventional products can be obtained from the cavity part having the area nearly as same as one for producing conventional products, resulting in allowing to remarkably improve areal productivity and material consumption rate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding die for electronic parts used in obtaining electronic parts produced by resin molding.

[0002]

2. Description of the Related Art A conventional resin molding die for electronic parts will be described with reference to FIG. FIG. 3 is a perspective view showing a cavity portion, which is a main portion of a conventional resin molding die for an electronic component, and the cavity portion 1 is composed of an upper mold and a lower mold (not shown) which are configured to be openable and closable. A pair of resin molding dies are symmetrically incorporated into each of the resin molding dies, and the resin molding dies are configured to be in close contact with each other when closed.

A main runner 2 connected to a flow path for injecting a molten resin into the cavity portion 1, a plurality of sub-runners 3 branched from the main runner 2, and the respective sub-runners. 3 is formed by engraving a product part 5 connected to the gate 3 through the gate 4, and the pair of cavity parts 1 are in close contact with each other to form the main runner 2, the sub-runner 3, the gate 4, and the product part 5. The resin in a molten state flows into the hollow portion to be finally obtained to obtain a desired product.

[0004]

However, in the above-mentioned conventional configuration, even if a plurality of product parts 5 are formed in the cavity part 1, the main runner 2, sub-runner 3, and gate 4 other than the product parts 5 are provided in the cavity part 1. In addition to having a large ratio to 1 and having a low area productivity, there is a problem that the material usage rate is also bad because the parts other than the product part 5 are often discarded.

An object of the present invention is to solve the conventional problems described above, and to provide a resin molding die for an electronic component capable of improving the area productivity and the material usage rate at the same time and obtaining the electronic component at a low cost. To do.

[0006]

In order to solve the above-mentioned problems, a resin molding die for an electronic component according to the present invention has a cavity portion which is constructed to be openable and closable so as to be in close contact with each other. In a resin molding die including a mold and a lower mold, a main runner connected to a flow path for flowing a molten resin into the molding die into each of the above-mentioned cavities, and a plurality of main runners branched from the main runner. Sub-runners, a first product section connected to the respective sub-runners via a first gate, and a second product section further connected to the first product section via a second gate It is configured to have a section.

[0007]

With this structure, it is possible to form a desired number of product portions in the cavity portion having substantially the same area as that of the conventional cavity portion in an amount twice as large, and it is possible to greatly improve the area productivity.

Further, since the shape and dimensions other than the product portion are almost the same as the conventional one, the material usage rate can be greatly improved.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing the structure of a resin molding die for an electronic component according to the present invention, which is an example of continuous hoop insert molding of a switch.

In the figure, 6 denotes an upper mold part of a resin molding die for an electronic component, 7 denotes a lower mold part thereof, and the upper mold part 6 and the lower mold part 7 are joined to the upper mold part 6. The guide 8 is configured to slide freely by fitting it into the bearing 9 connected to the lower mold part 7 to open and close the mold, and to be in close contact with each other when the mold is closed. Has been done.

Reference numeral 10 denotes a cavity portion, which is the upper mold portion 6 described above.
And the lower mold part 7 are assembled in a pair and symmetrically. Reference numeral 11 is an inlet port that is connected to a nozzle portion (not shown) of the injection molding machine and that allows a molten resin to flow into the mold.

FIG. 2 is a perspective view for explaining the cavity portion 10 in detail, which is connected to an inlet 11 for letting the molten resin described in FIG. 1 into the mold. Runner 12 and this main runner 12
From a plurality of sub-runners 13, a first product section 15 connected to each of the sub-runners 13 via a first gate 14, and a second gate 16 connected to the first product section 15. The second product portion 17 connected through is formed so as to be engraved.

The cavity 10 having the above structure
The mold is closed and the pair of cavity parts 10 are brought into close contact with each other, so that the main runner 12, the sub-runner 13, the first gate 14, the first product part 15,
The molten resin is caused to flow into the cavity formed by the second gate 16 and the second product portion 17, and the plurality of first
Finally, a plurality of desired products are simultaneously obtained by the product section 15 and the second product section 17.

In the above embodiment, the continuous hoop insert molding of the switch is taken as an example, and the second product portion 17 is formed on the first product portion 15 via the second gate 16. However, the present invention is not limited to this. Needless to say, it is not limited to this.

[0015]

As described above, in the resin molding die for electronic parts according to the present invention, it is possible to form twice as many desired product parts in the cavity part having substantially the same area as the conventional cavity part. Therefore, the area productivity can be greatly improved.

Further, since the shape and dimensions other than the product portion are almost the same as the conventional ones, the material usage rate can be greatly improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a resin molding die for an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a cavity portion according to the embodiment.

FIG. 3 is a perspective view showing a cavity portion of a resin molding die for a conventional electronic component.

[Explanation of symbols]

 6 Upper mold part 7 Lower mold part 8 Guide 9 Bearing 10 Cavity part 11 Inlet port 12 Main runner 13 Sub-runner 14 First gate 15 First product part 16 Second gate 17 Second product part

Claims (1)

[Claims] 1. A resin molding die comprising an upper die and a lower die which are openable and closable and each has a cavity portion incorporated therein so as to be in close contact with each other. A main runner connected to the flow path for injecting the molten resin into the main runner, a plurality of sub-runners branched from the main runner, and a first gate connected to each of the sub-runners via the first gate. A resin molding die for an electronic component, comprising a first product part and a second product part connected to the first product part via a second gate.