JPH06120770A - Electronic parts - Google Patents

Abstract

PURPOSE:To provide electronic parts which have such structure that the penetration of a sealing material in the fused state to the storage part of a case is difficult at the time of hermetically sealing the storage part of the case by the sealing material. CONSTITUTION:A base member 20 which prevents a sealing material 30 from penetrating a storage part 1b of a case 1 is arranged in an aperture part 1a of the case 1. Cuts 21 to 23 to be pierced by external connection parts 10b, 11c, and 14c of lead terminals 10, 11, and 14 are formed in the base member 20. A resin layer 25 which is fused at a temperature (for example, 100 deg.C) lower than the temperature (for example, 120 to 150 deg.C) at which the sealing material 30 shows fluidity is provided on the surface of the base member 20. Consequently, the resin layer 25 provided on the base member 20 is fused to fill up gaps generated in cuts 21 to 23 or/and gaps generated between the case 1 and the base member 20 before the sealing material 30 shows fluidity.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, such as a ladder type filter, for closing an opening of a case having a substantially box shape with a sealing material for sealing to seal a housing portion of the case.

[0002]

2. Description of the Related Art Conventionally, there is an electronic component having a structure in which an electric functional element and lead terminals are housed in a housing portion of a case having a substantially box shape. This electronic component needs to close the opening of the case with a sealing material. At that time, the sealing material for sealing is temporarily fluidized, but in order to prevent the sealing material having sealing fluidity from entering the housing portion of the case, Base member 4 illustrated in FIG.
0 is allocated. This base member 40 is usually provided with a U-shaped cut 4 for penetrating an external connection portion of the lead terminal.
1 and I-shaped notches 42 and 43 are formed.

By the way, as shown in FIGS. 8 and 9, a U-shaped notch 41 and an I-shaped notch 42 (I-shaped notch 4
3) may be inserted into the lead terminals 45 and 46, respectively, and the tongue pieces 41a and 42 of the notches 41 and 42 are formed.
a is bent, and gaps 48 and 49 are formed in the cuts 41 and 42. A gap is also formed between the base member 40 and the opening of the case. Therefore, there is a possibility that the fluid sealing material 50 may enter the housing portion of the case from these gaps and deteriorate the electrical characteristics of the electrical functional element.

Therefore, an object of the present invention is to provide an electronic component having a structure in which a fluid sealing material is unlikely to enter the housing portion of the case when the housing portion of the case is sealed with the sealing material. It is in.

[0005]

In order to solve the above problems, an electronic component according to the present invention is inserted into (a) a substantially box-shaped case and (b) a housing portion of the case. An electric functional element; (c) a lead terminal which is inserted into the housing of the case and whose external connecting portion is led out from the opening of the case; and (d) a sealing material for sealing the housing of the case. (E) a resin layer which is provided in the opening of the case and has a notch for penetrating the external connection portion of the lead terminal, and which melts at a temperature lower than the temperature at which the sealing material has fluidity. And a base member provided at least in the cut portion.

When the housing portion of the case is sealed with a sealing material,
Before the encapsulating material temporarily becomes fluid, the resin layer provided on the base member is melted to fill the gap formed in the notch through which the lead terminal penetrates and / or the gap formed with the case. Therefore, even if the sealing material is fluid, it does not enter the housing portion of the case.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of an electronic component according to the present invention will be described below with reference to the accompanying drawings. This embodiment will be described by taking a ladder type filter as an example of the electronic component. As shown in FIGS. 1 and 2, the ladder-type filter has a substantially box-shaped case 1.
And four piezoelectric resonators 5, 6, 7, and 8, an input terminal 10 and an output terminal 11, a relay terminal 12, and a ground terminal 14.
It consists of and. The piezoelectric resonators 5, 6, 7 and 8 as electric functional elements are well known in which electrodes are provided on the front and back surfaces, respectively.

The input terminal 10 is provided with a contact piece portion 10a, an external connection portion 10b and a protrusion 10c, and the protrusion 10c is in pressure contact with the upper surface of the piezoelectric resonator 5. The output terminal 11 is the contact piece 11
a is provided with a contact piece portion 11b which is bent and superposed in double, an external connection portion 11c, and protrusions 11d and 11e.
d is in pressure contact with the lower surface of the piezoelectric resonator 7, and the protrusion 11e is in pressure contact with the upper surface of the piezoelectric resonator 8. The relay terminal 12 includes a contact piece 12c, a relay piece 12d, and projections 12f, 12g, 12 which are formed by bending and overlapping the contact pieces 12a and 12b.
h, the projection 12f is in pressure contact with the lower surface of the piezoelectric resonator 5,
The protrusion 12g comes into pressure contact with the upper surface of the piezoelectric resonator 6, and the protrusion 12h
Are in pressure contact with the lower surface of the piezoelectric resonator 8.

The ground terminal 14 comprises a contact piece 14a, a contact piece 14b which is bent and superposed in a double manner, an external connecting portion 14c, and projections 14d and 14e. The projection 14d is pressed against the lower surface of the piezoelectric resonator 6, The protrusion 14e is in pressure contact with the upper surface of the piezoelectric resonator 7. The piezoelectric resonators 5, 6, 7, 8 and the terminals 10, 11, 12, 14 are inserted through the opening 1 a of the case 1.

Next, the base member 20 is set on the step portion of the opening 1a of the case 1. The base member 20 prevents a sealing material 30 described later from entering the housing portion 1b of the case 1. As shown in FIGS. 3 and 4, the base member 20 has a U-shaped cut 21 and an I-shaped cut 22, 23 for penetrating the external connection portions 10b, 11c, 14c of the lead terminals 10, 11, 14, respectively. Has been formed. When the base member 20 is set at the step of the opening 1a, the external connecting portions 10b, 11c, 14c
Gaps 28 and 29 are formed in the notches 21 to 23 that penetrate (see FIG. 5 and FIG. 6), and a gap is also formed between the base member 20 and the case 1.

The base member 20 has a sealing material 30 on one surface.
Is provided with a resin layer 25 that melts at a temperature (for example, 100 ° C.) lower than the temperature at which the liquid has fluidity (120 to 150 ° C. when an epoxy resin is used as the sealing material 30). For example, the total thickness of the base member 20 provided with the resin layer 25 is set to 120 to 180 μm. As a material of the base member 20, a glass cloth material, a polyimide material, an insulating paper or the like is used. As the resin layer 25, a polyethylene-based or acrylic-based thermoplastic adhesive, cemedine (trade name),
Alternatively, a thermosetting adhesive or the like is used. The base member 20 is arranged such that the resin layer 25 is located on the housing portion 1b side of the case 1.

After the base member 20 is set in the opening 1a of the case 1, a sealing material 30 made of a semi-cured epoxy resin or the like is inserted into the opening 1a. Next, the sealing material 3
0 is heated to be fully cured. At this time, the sealing material 30 temporarily becomes fluid at a predetermined temperature (120 to 150 ° C. in the case of an epoxy resin). However, since the base member 20 also rises in temperature as the sealing material 30 is heated,
The temperature before the encapsulant 30 becomes temporarily fluid (for example, 1
At 00 ° C.), the resin layer 25 provided on the base member 20 is in a molten state. A part of the molten resin layer 25 is cut 2
The gaps 28 and 29 formed in 1 to 23 or / and the gap formed between the base member 20 and the case 1 are filled (see FIG. 2). Therefore, the fluid sealing material 30 is prevented from entering the housing portion 1b of the case 1 by the base member 20. As a result, the fluid sealing material 30 is hardened without penetrating into the housing portion of the case 1 to seal the housing portion 1b of the case 1. Each terminal 1
External connection parts 10b, 11c, 14c of 0, 11, 14
After the encapsulating material 30 is cured, the encapsulating material is bent along the side surface and the bottom surface of the case 1 (see FIG. 2) to have a surface mounting type shape.

The electronic component according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the gist thereof. Although the above embodiments have described the ladder type filter, the present invention is not limited to this, and any electronic component may be used as long as it seals the housing portion of the case with a sealing material. Further, although the resin layer is provided on the entire surface of the one surface of the base member in the above embodiment, it may be provided only on the cut portion.

Further, the base member does not need to be arranged such that the resin layer forming surface is on the housing portion side of the case, and the same is true even if the resin layer forming surface is arranged on the sealing material side. It works and produces effects.

[0015]

As is apparent from the above description, according to the present invention, at least the cut portion of the base member is provided with the resin layer that melts at a temperature lower than the temperature at which the sealing material has fluidity. The resin layer is melted before the encapsulant becomes fluid, and the gap formed in the notch through which the lead terminal penetrates and / or the gap formed with the case can be filled. Therefore, when sealing the housing portion of the case with the sealing material, it becomes difficult for the sealing material having fluidity to enter the housing portion of the case.
As a result, it is possible to obtain an electronic component in which the deterioration of the electrical characteristics of the electric functional element due to the penetration of the sealing material does not easily occur.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an electronic component according to an embodiment of the present invention during assembly.

FIG. 2 is a partial vertical sectional view of the electronic component shown in FIG.

FIG. 3 is a plan view of the base member shown in FIG.

FIG. 4 is a configuration diagram of the base member shown in FIG.

5 is a cross-sectional view showing a state in which the lead terminal penetrates a U-shaped notch provided in the base member shown in FIG.

6 is a cross-sectional view showing a state in which the lead terminal penetrates an I-shaped cut provided in the base member shown in FIG.

FIG. 7 is a plan view of a conventional base member.

8 is a cross-sectional view showing a state in which the lead terminal penetrates a U-shaped cut provided in the base member shown in FIG. 7.

9 is a cross-sectional view showing a state in which the lead terminal penetrates an I-shaped cut provided in the base member shown in FIG. 7.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Case 1a ... Opening 1b ... Accommodating part 5,6,7,8 ... Piezoelectric resonator 10,11,14 ... Terminals 10b, 11c, 14c ... External connection part 20 ... Base members 21,22,23 ... 25 ... Resin layer 30 ... Sealing material

Claims (1)

[Claims] 1. A case having a substantially box shape, an electric functional element inserted in a housing portion of the case, and a lead terminal inserted in a housing portion of the case and having an external connection portion led out from an opening portion of the case. A sealing material for sealing the housing portion of the case, and a notch for penetrating the external connection portion of the lead terminal, which is provided in the opening portion of the case, and the sealing material flows. An electronic component, comprising: a base member having a resin layer that melts at a temperature lower than a temperature at which the property is imparted, provided in at least the cut portion.