JPH06104053A - High frequency circuit - Google Patents

Abstract

PURPOSE:To provide excellent electric performance by inserting and crimping an elastic spiral spring having a spring bore diameter to continuously form its concentric line in a base thickness direction, and enhancing the adhesion of a component ground conductor surface with a concentric ground outer conductor including the crimped and attracted spring by this spring crimp to enhance electric continuity. CONSTITUTION:As a concentric conductor, an inner conductor 4 both ends of which are caulked is used, and as a concentric outer conductor, a spring 7 is provided between the spring insert groove 11 of an outer conductor 3 and a component ground conductor part 9 on the base adhering surface of a component 1 through a base through-hole 10. The spring 7 has contracted spring property, and is inserted and crimped, whereby the spring 7 having the contracted spring property forms the concentric outer conductor by the crimping to an earth conductor part 17a or both surfaces also in the thickness direction of a printed board 2. Thus, a connection having low loss, no high frequency wave leak or interference, and good impedance matching state can be easily and surely performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency component mounted in close contact with a board and a high-frequency circuit including an input / output interface provided on the opposite side of the board from the component, and more particularly to the high-frequency circuit. The present invention relates to a connection structure between an output terminal and an input / output interface sandwiching a substrate.

[0002]

2. Description of the Related Art Conventionally, as a structure of an interface circuit of this kind, as a first example, as shown in FIG. 3, a component of a high frequency component 1 is inserted into a board hole 2b of a printed board 2 having a microstrip line 2a on one surface. The output terminal 8 is inserted, and the high frequency component 1 is closely attached to the printed board 2 via the spring-like spring material 12, and is connected to the land 2c and the solder 13 on the side opposite to the component mounting surface of the printed board 2, From that location, a high-frequency signal was guided to the connector 6a of the input / output interface 6 via the on-board transmission circuit such as the microstrip line 2a. In addition, this input / output interface plug 6
The a is attached and fixed to the housing 15 with screws 14.

As a second example, as shown in the sectional view of FIG. 4 and its exploded perspective view of FIG. 5, the printed circuit board 2 is mounted perpendicularly to the contact surface of the high frequency component 1 mounted on one surface of the printed circuit board 2. The component input / output terminal 8 and the high-frequency component 1 are connected to the input / output interface 6 provided on the opposite side of the printed circuit board 2 by the coaxial line portion such as the coaxial inner conductor 4. . Reference numeral 3 is a coaxial outer conductor, and 5 is a positioning dielectric for the coaxial inner conductor 4.

In such a structure, a line is formed in the board thickness direction between the component input / output terminal 8 and the coaxial line portion formed on the opposite side of the printed board 2 and the high frequency component 1 and the printed board 2 are formed. Between the printed circuit board 2 and the coaxial line portion on the opposite side of the high-frequency component 1 with respect to the outer circumference of the coaxial outer conductor 3 between the printed circuit board 2 and the input / output interface connector 6a. By arranging the through holes 16 in the printed board 2 along the shape, the ground conductor portion 17a of the coaxial line portion is formed also in the board thickness direction.
Further, a substrate using the coaxial line outer conductor 3 and the substrate through hole 16 which are formed on the surface opposite to the high frequency component 1 in order to improve the electrical connectivity of the coaxial outer conductor 3 and prevent high frequency leakage from occurring. A spring member 12 made of a flat plate having a spring property is inserted between the coaxial conductor portion 17b serving as a coaxial portion and between the coaxial conductor portion 17b and the component grounding conductor portion 9 on the board contact surface of the high frequency component 1, and crimped. By doing so, electrical continuity and adhesion of each contact surface were secured.

[0005]

However, regarding these conventional high-frequency circuits, regarding the first example described in FIG. 3, the printed circuit board 2 is provided between the component input / output terminal 8 and the input / output interface connector 6. Since the high-frequency signal is routed by the above transmission line, when this connection method is used in a circuit in which the propagation insertion loss that requires high output power and low noise cannot be ignored, the output power and noise characteristics will deteriorate. There was a problem of inviting. Also,
In the second example described with reference to FIG. 4, the through-hole 16 is used for coaxial formation in the board thickness direction located between the component input / output terminal 8 and the coaxial line portion formed on the opposite surface with the printed board 2 interposed therebetween. Since it is performed in a pseudo manner, there is a problem that high frequency leakage and impedance mismatch occur because the coaxial is not completely formed. In addition, the elastic flat plate spring material 18 is inserted in order to achieve electrical continuity of the ground conductor portion 17a at the contact surfaces between the printed circuit board 2 and the coaxial line portion and between the printed circuit board 2 and the high frequency component 1. Problems such as short-circuit with the coaxial inner conductor 4 and impedance mismatch, and high-frequency component 1 and the printed circuit board 2 sandwiching the high-frequency component 1 and the coaxial outer conductor 3 on the opposite side stepping on the outer periphery of the spring material 18 cause high-frequency leakage from the gap. As a result, there is a problem in terms of assemblability that attention must be paid to the positioning of the spring material 18 such as the problem that occurs.

Therefore, the present invention has been made in order to solve the above-mentioned conventional problems, and an object thereof is to provide a low loss between a component input / output terminal and an external interface without high frequency leakage and interference. Another object of the present invention is to provide a high frequency circuit that enables connection with a good impedance matching state.

[0007]

In order to achieve such an object, a high frequency circuit according to the present invention is provided with a through hole in a substrate and a coaxial cable on the front and back surfaces between a component input / output terminal surface of a high frequency component and a coaxial line portion. By providing a line ground conductor part and inserting an elastic spiral spring through the through hole and crimping, a coaxial line ground conductor part is formed between the outer conductor of the coaxial line part and the component ground conductor part of the high frequency component. It is interposed and electrically contacted.

[0008]

In the present invention, electrical continuity between the outer conductor of the coaxial line portion and the component ground conductor portion of the high frequency component can be achieved, and the degree of adhesion between the high frequency component and the coaxial line portion can be improved.

[0009]

The present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a circuit configuration according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of FIG. 1, and the same parts as those in the above-mentioned drawings are designated by the same reference numerals. In these figures,
The high frequency circuit includes a high frequency component 1, a printed board 2 having a board through hole 10 and a ground conductor portion 17a formed on the front and back surfaces, a coaxial outer conductor 3 having a spring insertion groove 11 formed therein, and a coaxial inner conductor 4. A positioning dielectric 5 for the coaxial inner conductor 4, a connector 6a for the input / output interface 6,
The elastic spiral spring 7 is inserted between the high frequency component 1 and the spring insertion groove 11 of the coaxial outer conductor 3.

In this structure, the component input / output terminal 8 and the high frequency component 1 are connected to the connector 6a of the input / output interface 6 provided on the opposite sides of the printed circuit board 2 by the coaxial line portion. In order to make a direct connection, the inner conductor 4 having both ends crimped is used as the coaxial inner conductor, and the spring insertion groove 11 of the outer conductor 3 and the component ground conductor portion 9 on the board-contacting surface of the component 1 are used as the coaxial outer conductor. By inserting and crimping a spring-like spiral spring 7 having a spring inner diameter substantially equal to the inner diameter of the coaxial outer conductor 3 through the board through hole 10, a ground conductor portion on the front and back surfaces in the thickness direction of the printed board 2 is also formed. Since the spiral spring 7 having a spring property, which is contracted by crimping to the 17a, serves as a coaxial outer conductor, Electrical continuity of the grounded outer conductor from the coaxial outer conductor 3 to the component grounded conductor portion 9 is ensured, and the continuity of the coaxial line portion formed from the input / output interface plug 6a to the high frequency component 1 and the spring crimping are performed. High frequency leakage due to adhesion,
Prevention of interference will be guaranteed.

Further, the positioning of the spiral spring 7 for ensuring the electrical continuity of the coaxial line portion is structured by the spring insertion groove 11 inside the coaxial outer conductor 3, the substrate through hole 10 and the inner conductor positioning dielectric 5. Is uniquely determined,
By eliminating the problem of the circuit gap during crimping due to carelessness during assembly and the short circuit between the coaxial inner conductor 4 and the spring type flat spring 7, which occurred in the second conventional example shown in FIG. Therefore, the coaxial portion can be formed easily and reliably.

[0012]

As described above, according to the present invention, when an external input / output interface of a high-frequency component mounted in close contact with one surface of the substrate is provided on the side opposite to the component with the substrate interposed therebetween, In order to connect directly from the component input / output terminals to the input / output interface plug via the board with a reliable coaxial line configuration, the coaxial cable is formed on the opposite side of the board with the ground conductor surface around the component input / output terminals. The coaxial line is continuously formed in the substrate thickness direction by inserting and crimping an elastic spiral spring having a spring inner diameter as a coaxial grounded outer conductor between the line portion and the line through hole. By crimping the spring, the component grounding conductor surface and the coaxial grounding outer conductor including the spring that has been crimped and shrunk enhances the adhesion and improves electrical performance. By guaranteeing the continuity, the loss is lower than that of the conventional example, there is no high frequency leakage / interference, and it is possible to easily and reliably realize a connection with a good impedance matching state. To be

[Brief description of drawings]

FIG. 1 is a sectional view showing a circuit configuration according to an embodiment of a high-frequency circuit according to the present invention.

FIG. 2 is an exploded perspective view illustrating the circuit element of FIG.

FIG. 3 is a sectional view showing a first example of a circuit configuration of a conventional high frequency circuit.

FIG. 4 is a cross-sectional view showing a second example of the circuit configuration of a conventional high frequency circuit.

5 is an exploded perspective view illustrating the circuit configuration of FIG.

[Explanation of symbols]

 1 high frequency component 2 printed circuit board 3 coaxial outer conductor 4 coaxial inner conductor 5 inner conductor positioning dielectric 6 input / output interface 6a input / output interface plug 7 spring-like spiral spring 8 high frequency component input / output terminal 9 high frequency component ground conductor Part 10 Substrate through hole 11 Spring insertion groove 12 Spring spring material 13 Solder 14 Screw 15 Housing 16 Through hole 17a Ground conductor part 17b Coaxial conductor part 18 Spring spring material

Claims (1)

[Claims] 1. An external input / output interface for a high-frequency component mounted in close contact with one surface of a substrate is provided on the opposite side of the high-frequency component with the substrate interposed therebetween.
A high-frequency component input / output terminal, which is provided so as to project toward the contact surface between the substrate and the high-frequency component and which projects perpendicularly to the surface, and the input / output interface are directly connected by a coaxial line portion. In a high frequency circuit, a through hole is provided in the substrate between the component input / output terminal surface of the high frequency component and the coaxial line portion, and a coaxial line ground conductor portion is provided on the front and back surfaces, and a spiral shape having elasticity through the through hole. A high frequency circuit, characterized in that the coaxial line grounding conductor part is interposed between the outer conductor of the coaxial line part and the component grounding conductor part of the high frequency component by inserting and crimping a spring to make electrical contact. .