JPH06103800B2 - Chip circuit component mounting device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a chip-shaped circuit component mounting device used when mounting a chip-shaped circuit component on a circuit board.

[Prior Art] A plurality of suction parts are provided so as to correspond to mounting positions of a plurality of chip-shaped circuit parts (electronic parts such as capacitors and resistors) on a circuit board, and a plurality of circuit parts are simultaneously mounted by this suction part. The method of adsorbing and supplying to a predetermined position on the circuit board has already been performed. When mounting the circuit components by this type of method, the plurality of circuit components are arranged in advance on an arrangement plate (template) different from the circuit board, and then the plurality of circuit components are simultaneously transferred onto the circuit board. This makes it possible to mount a plurality of circuit components efficiently.

[Problems to be Solved by the Invention] By the way, conventionally, when a plurality of types of chip-shaped circuit components having different shapes are mounted on a circuit board, the circuit components having the same shape are mounted on the circuit board at the same time. The components were not mounted on the circuit board at the same time. Therefore, the number of steps is increased, and the time required for manufacturing is increased.

Therefore, it is an object of the present invention to provide a chip-shaped circuit component mounting device capable of quickly and easily mounting a plurality of chip-shaped circuit components having different shapes on a circuit board.

[Means for Solving the Problems] [The present invention for achieving the above object will be described with reference to the reference numerals of the drawings showing the embodiments. A device for mounting 1a, 1b, 1c at the same time, the plurality of chip-shaped circuit components 1 corresponding to the arrangement pattern of the plurality of chip-shaped circuit components 1a, 1b, 1c on the circuit board 26.
Circuit component placement device 2 for placing a, 1b and 1c in advance
And a component suction device 20 for sucking the plurality of chip-shaped circuit components 1a, 1b, 1c arranged in the circuit component placement device 2 and transferring them onto the circuit board 26. The circuit component placement device Reference numeral 2 denotes a plurality of component accommodating recesses 13 for accommodating a plurality of chip-shaped circuit components 1a, 1b, 1c having different shapes.
a, 13b, 13c, the plurality of component storage recesses 13a, 13c
The height of the bottom surface of b, 13c is set substantially the same, the component suction device 20, the plurality of chip-shaped circuit components 1a, 1b,
A plurality of adsorbents having suction holes 34 for adsorbing 1c
21a, 21b, 21c, a mounting plate 23 to which the plurality of adsorbents 21a, 21b, 21c are attached, and the adsorbents 21a, 21b, 21
c suction means for putting the suction hole 34 into a suction state, and the suction bodies 21a, 21b, 21c have different suction surfaces depending on the difference in shape of the plurality of chip-shaped circuit components 1a, 1b, 1c. 33a, 33b, 33c, the distance from the mounting plate 23 to the suction surface 33a, 33b, 33c is different depending on the difference in the shape of the plurality of chip-shaped circuit components 1a, 1b, 1c,
The circuit board of the plurality of chip-shaped circuit components 1a, 1b, 1c from the mounting plate 23 in a state in which the plurality of suction bodies 21a, 21b, 21c suction the plurality of chip-shaped circuit components 1a, 1b, 1c The present invention relates to a chip-shaped circuit component mounting device in which the plurality of suction bodies 21a, 21b, 21c are formed so that the distances to the mounting surfaces with respect to 26 are equal to each other. [Operation] In the above invention, since a plurality of suction bodies having different suction surface shapes are arranged on the mounting plate, it is possible to simultaneously suction a plurality of circuit components having different shapes and mount them on the circuit board at the same time.

[Embodiment] Next, a mounting apparatus and a mounting method according to an embodiment of the present invention will be described with reference to FIGS. 1 to 16.

The mounting apparatus of this embodiment is configured such that a plurality of chip-shaped circuit components 1a, 1b, 1c having different shapes shown in FIG. 1 are simultaneously mounted on the same circuit board. The circuit component 1a is, for example, a cylindrical capacitor having a pair of electrodes on the outer peripheral surface. Circuit component 1b is also a cylindrical capacitor, but has a larger diameter than circuit component 1a. The circuit component 1c is a square type multilayer capacitor.

The component supply device 3 for supplying these circuit components 1a, 1b, 1c to the component placement device 2 has through holes 5a, 5b,
It is configured by fitting the transfer pipes 6a, 6b, 6c into the 5c. Pipes 6a, 6b, 6c are circuit components 1a, 1b, 1c
Is connected to a source (not shown). A circuit component 1 that supplies the amount of protrusion of the pipes 6a, 6b, 6c from the lower surface of the fixed plate 4.
It changes according to the size of a, 1b, and 1c.

The component placement device 2 includes a plurality of component storage cases 8a, 8b, which are different from the placement plate 7, which can be called a template,
8c, a suction device 9, and a suction passage 10. The circuit components 1a, 1b, 1c, etc. must be placed on the placement plate 7 in correspondence with the placement positions of the circuit components on the circuit board. At this time, if a plurality of types of circuit component placement devices 2 are prepared corresponding to a plurality of types of circuit boards, the cost inevitably increases. Therefore, in this embodiment, a large number of through-holes 11 are provided in the arrangement plate 7 in a matrix form, and the through-holes 11 are provided in the component storage case 8a,
Engagement protrusions 12 such as 8b and 8c are removably fitted. This makes it possible to change the positions and types of the component storage cases 8a to 8c according to changes in the component placement position of the circuit board and the component type.

The component storage cases 8a to 8c include the component storage recesses 13a, 13b, 13c.
Of each. In FIG. 1, since the shapes of the components 1a, 1b, 1c to be stored in the component storage cases 8a to 8c are different, the recess 13
The shapes of a, 13b, and 13c are also different from each other. However, the height H from the top surface of the arrangement plate 7 to the center of the bottom surface of each recess 13a, 13b, 13c
Are substantially the same. The heights Ha, Hb, Hc from the upper surface of the arrangement plate 7 to the upper ends of the recesses 13a, 13b, 13c are different from each other. The height positions of the tips of the transfer pipes 6a, 6b, 6c are also changed corresponding to the change of the height positions of the upper surfaces of the storage cases 8a, 8b, 8c. If the height positions of the tips of the transfer pipes 6a, 6b, 6c are aligned, for example, a large gap is created between the tips of the pipes 6a, 6c and the storage cases 8a, 8c, and the supplied circuit components 1a, 1c. There is a risk that the material will pop out of the storage cases 8a and 8c, but such a problem does not occur in the apparatus of FIG. One of the protrusions 12 of each of the storage cases 8a to 8c has a recess 13
Through holes 14 are provided to reach the left ends of a, 13b, and 13c. Since the through hole 14 is connected to the suction device 9 via the suction passage 10, when the suction device 9 is operated, the recess 13a is formed.
The circuit components 1a to 1c put into the to 13c can be sucked to the left side of the concave portions 13a to 13c.

By the way, the respective circuit components 1a to 1c are inserted into the recesses 13a to 13c through the pipes 6a to 6c in a vertically long state as shown in FIG. It is required that the circuit components 1a to 1c be in a horizontally long state as shown in FIG. Such circuit components 1a-1c
In order to easily achieve the positioning, the tips of the pipes 6a to 6c are arranged near the right ends of the recesses 13a to 13c. Due to the dust, the bottom surfaces of the circuit components 1a to 1c falling from the pipes 6a to 6c are attracted toward the through hole 14 and reliably fall down. In addition,
Vibration or the like may be applied in order to easily and surely achieve the fall of the circuit components 1a to 1c.

The bottom surfaces of the recesses 13a, 13b, 13c have cross-sectional shapes corresponding to the circuit components 1a, 1b, 1c as shown in FIGS. 8, 9, and 10. That is, the recess 13a is formed in a U-shaped cross section as shown in FIG. 8 and has a semicircular bottom surface 15a. As shown in FIG. 9, the recess 13b is formed in a U-shaped cross section larger than that in FIG. 8 corresponding to the large-diameter circuit component 1b, and similarly has a semicircular bottom surface 15b. The recess 13c is a rectangular circuit component 1c as shown in FIG.
Has a flat bottom surface 15c. However, this bottom surface 15c
It has inclined surfaces 16a and 16b facing toward. This inclined surface 16a, 16b
Is provided for sliding the rectangular circuit component 1c. The left wall surfaces 17a, 17b, 17c shown in FIGS. 5, 6, and 7 of the recesses 13a, 13b, 13c are reference planes in the x direction on the xy plane for arranging the circuit components 1a, 1b, 1c. Has been done. The bottom surfaces 15a, 15b, 15c of the recesses 13a, 13b, 13c are inclined downward to the left as shown in FIGS. 1 and 2. Thereby, the thrown-in circuit components 1a, 1b, 1c can be easily tilted and positioned.

As shown in FIG. 2, the component suction device 20 includes a plurality of suction bodies.
21a, 21b, 21c, a plurality of holding bodies 22, and a mounting plate 23
And a suction pipe 24. Adsorbents 21a, 21b, 21c
Absorbs a plurality of circuit components 1a, 1b, 1c of the arranging device 2 simultaneously under the control of the vacuum suction device 25 to which the suction pipe 24 is connected, and transfers them to the circuit board 26 shown in FIG. Therefore, the component suction device 20 can also be called a component moving device or a component mounting device.

The circuit components 1a, 1b, 1c, etc. are dispersedly arranged on the circuit board 26 as shown in FIG. Therefore, one type of circuit board 26
Assuming that the component suction device 20 is configured to conform to, the through holes 27 in the mounting plate 23 are formed in the circuit components 1a, 1b,
It may be provided only in correspondence with the position and the number such as 1c. However, in this embodiment, a large number of through holes 27 are arranged in a matrix in the mounting plate 23 so as to be compatible with a plurality of types of circuit boards. The mutual spacing between the centers of the through holes 27 in the x-axis direction, that is, the pitch X and the pitch Y in the y-axis direction.
Is determined to be the same as the minimum distance between the centers of the circuit components 1a, 1b, 1c, etc. on the various circuit boards 26, or to be an integral fraction. In other words, the circuit components 1a, 1b on the circuit board 26,
The position of 1c or the like is determined in advance on the line indicated by the imaginary line or at this intersection, so as to correspond to all the circuit components 1a, 1b, 1c, etc. arranged with the regularity of the circuit board 26. Through holes 27 are provided in the mounting plate 23.

The through hole 27 of the mounting plate 23 made of a metal plate is provided so as to extend from one main surface to the other main surface, and the vacuum suction pipe 24
And the pipe-shaped engaging portion 28 of the holder 22. In this example, two engaging portions 28 and two through holes 27 are provided for each holding body 22.

The holders 22 of the respective adsorbents 21a, 21b, 21c are configured the same. As shown in FIG. 11, each holding body 22 has two pipe-shaped engaging portions 28, and also has a concave portion 29 into which a part of the adsorbing bodies 21a, 21b, 21c and the like are inserted, and further the engaging portions. Recess from the end face of 28
It has through holes 30 up to 29. This holder 22 is an adsorbent 21.
Since it has a positioning function for a, 21b, 21c, etc., it is made of ABS resin having relatively high rigidity. The pipe-shaped engaging portion 28 is formed so that it can be detachably fitted into the through hole 27 of the mounting plate 23.

The adsorbents 21a, 21b, 21c are formed of an elastic body (rubber) for preventing damage to the circuit components 1a, 1b, 1c and absorbing tolerances. However, the engaging portion 31 composed of the upper half of the holding member 22
Since it is fitted into the recess 29 of the circuit board 26 and the mounting plate.
There is almost no displacement between the x-axis direction and the y-axis direction on the 23 principal surfaces. The shape of the engaging portion 31 of each adsorbent 21a, 21b, 21c is the same, but the length and shape of the pipe-shaped protrusions 32a, 32b, 32c depend on the shape of the circuit components 1a, 1b, 1c to be adsorbed. Is changing. From the end surface of the engaging portion 31, each protrusion 32a, 32b,
The through holes 34 extending to the tip surfaces 33a, 33b, 33c of the 32c are held by the holder 22.
It is connected to the suction pipe 24 through the through hole 30 of. First
Although only one adsorbent 21a is shown in FIG. 12, the other adsorbents 21b and 21c have substantially the same structure. Adsorbent 21
The end surface 33a of a is formed to have an arcuate cross section as shown in FIG. 13 in order to adsorb the cylindrical circuit component 1a. Adsorbent 21
The end surface 33b of b is formed in a large-diameter arc-shaped surface for adsorbing the large-diameter cylindrical circuit component 1b. Adsorbent 21c
The end surface 33c is formed into a flat surface as shown in FIG. 14 in order to adsorb the rectangular circuit component 1c.

Next, a method of mounting the circuit components 1a, 1b, 1c on the circuit board 26 using this mounting device will be described. First, the component supply device 3 movably supported is guided onto the component placement device 2 positioned on a support (not shown).
At this time, as shown in FIG. 1, the tips of the transfer pipes 6a, 6b, 6c are offset to the right of the center of the recesses 13a, 13b, 13c. When the suction device 9 is operated and the circuit components 1a, 1b, 1c are charged into the pipes 6a, 6b, 6c simultaneously or separately while sucking through the through holes 14, the circuit components 1a, 1b, 1c are pipes 6a, 6b, 6c. It is put into the concave portions 13a, 13b, 13c via the. At this time, through hole 1
Based on the suction of the circuit components 1a, 1b, 1c to the left based on 4 and the downward slope of the bottom surfaces 15a, 15b, 15c of the recesses, the circuit component 1a easily falls over as shown by the broken line in FIG. 1, for example. Then
As shown in FIG. 2, the circuit component 1 is provided on the left wall surface 17a, 17b, 17c.
A state in which a, 1b, and 1c are brought into contact with each other is obtained. This gives x
Positioning of the circuit components 1a, 1b, 1c with respect to the x direction in the y plane is achieved. Since the bottom surfaces 15a, 15b of the recesses 13a, 13b for accommodating the cylindrical circuit components 1a, 1b are formed in a semicircular shape, the central axis of the cylindrical circuit components 1a, 1b is a semicircular bottom surface 15.
Circuit parts 1a, so as to match the centers of a and 15b (lowest point)
1b is automatically positioned and the position in the y direction of the xy plane is determined. Left wall surface 17a, 17b, 17c of each recess 13a, 13b, 13c
The positional relationship between the component placement device 2 and the circuit board 26 is predetermined so as to correspond to the left end position of the planned placement area of the circuit components 1a, 1b, 1c on the circuit board 26.

As shown in FIG. 2, the tapered tips of the adsorbents 21a, 21b, 21c, which are arranged in advance so as to correspond to the positions where the circuit components are to be arranged on the circuit board 26, are inserted into the recesses 13a, 13b, 13c, as shown in FIG. 33a, 33b, 33c are pressed against the circuit components 1a, 1b, 1c. The height position of the circuit components 1a, 1b, 1c and the end faces 33a, 3
Even if the height positions of 3b and 33c are slightly displaced from the reference position,
Since the adsorbents 21a, 21b, 21c are elastically deformable objects made of rubber, all the circuit components 1a, 1b, 1c are brought into contact with or close to the end faces 33a, 33b, 33c by absorbing these variations. Can be made. By stopping suction by the through holes 14 of the storage cases 8a, 8b, 8c and performing suction by the through holes 34 of the adsorbents 21a, 21b, 21c, the circuit components 1a, 1b, 1c by the adsorbents 21a, 21b, 21c. Can be adsorbed and held.

By moving the component suction device 20 relative to the component placement device 2 in the vertical direction (upward direction) in FIG.
The circuit components 1a, 1b, 1c can be completely taken out from b, 13c.

Next, one or both of the circuit board 26 and the component suction device 20 are moved in the horizontal direction, and xy provided on the circuit board 26.
By aligning the positioning reference of the plane with the positioning reference of the xy plane provided on the mounting plate 23, x and y of both
Align the positions in the directions. Thereafter, by moving one or both of the component suction device 20 and the circuit board 26 in the vertical direction, the circuit component 1a on the adhesive surface having a temporary adhesion function such as cream solder at a desired position of the circuit board 26, Press 1b and 1c. In FIG. 2, since the heights of the bottom surfaces of the recesses 13a, 13b, 13c are substantially the same, the circuit components are mounted on the flat circuit board 26.
The 1a, 1b and 1c can be brought into contact with each other substantially at the same time.
Even if the lower surface height positions of the circuit components 1a, 1b, 1c have variations, the suction bodies 21a, 21b, 21c are elastically deformed, so that the variations can be absorbed.

Thereafter, the component suction device 20 is relatively separated from the circuit board 26, and the circuit components 1a, 1b, 1c are joined to the wiring conductors 35 by solder (not shown).

The advantages of this embodiment are as follows.

(1) The end faces 33a, 33 of the adsorbents 21a, 21b, 21c, despite the different shapes and heights of the plurality of circuit components 1a, 1b, 1c.
Since the shapes of b, 33c are changed according to the circuit components 1a, 1b, 1c, and the height positions of the bottom surfaces 15a, 15b, 15c of the recesses 13a, 13b, 13c are made substantially constant, the adsorbent 21a is formed. , 21b, 21c
Circuit board 1a, 1b, 1c is adsorbed at the same time by the circuit board
Can be mounted on 26 at the same time.

(2) Since the depths of the recesses 13a, 13b, 13c are not the same, but are changed according to the heights of the circuit components 1a, 1b, 1c, the recesses 13a, 1c
The distance from the inlet of 3b, 13c to the circuit component 1a, 1b, 1c is not too long. Therefore, the adsorbents 21a, 21b, 21c
Can be easily inserted into the recesses 13a, 13b, 13c.

(3) Even if the heights of the component storage cases 8a, 8b, and 8c change variously, the amount of protrusion of the transfer pipes 6a, 6b, and 6c from the fixed plate 4 also changes, so that a gap between them is unnecessarily large. It can be prevented from growing. As a result, circuit components 1a, 1b from the gap,
The jumping out of 1c is prevented.

(4) The pipe 6 is displaced from the center of the recesses 13a, 13b, 13c.
Since the tips of a, 6b, 6c are arranged, the circuit components 1a, 1b, 1c put in the recesses 13a, 13b, 13c can be easily tilted.

(5) Since the suction through hole 14 is arranged at a position closer to one side than the center of the recesses 13a, 13b, 13c, the circuit component 1a,
The tilting of 1b and 1c and the contact with the wall surfaces 17a, 17b and 17c can be easily achieved.

(6) Since the bottom surfaces 15a, 15b, 15c of the recesses 13a, 13b, 13c are inclined, the circuit components 1a, 1b, 1c can be easily tilted in the desired direction.

(7) Since the bottom surfaces 15a and 15b of the recesses 13a and 13b are formed in a semicircular shape and the recesses 13c have inclined surfaces 16a and 16b, the recess 1
The circuit components 1a, 1b, 1c can be positioned in the centers of 3a, 13b, 13c.

(8) Since the storage cases 8a, 8b, 8c are detachably attached to the arrangement plate 7, various circuits can be configured using the same device.

(9) A large number of through holes 27 are provided in the mounting plate 23, and the holder 22
The circuit parts 1a,
Various component suction devices 20 adapted to various arrangements of 1b and 1c can be obtained by simply changing the mounting position of the holding body 22. That is, the holder 22 can be shared by various circuit boards and circuit components.

(10) Since the through holes 27 of the mounting plate 23 are arranged in a matrix, it is possible to easily cope with various arrangements of the circuit components 1a, 1b, 1c and the like.

(11) Since the engaging portions 31 such as the adsorbents 21a, 21b, 21c are inserted into the concave portions 29 of the holding body 22, the adsorbent 21 is formed.
Even if a, 21b, and 21c are elastic bodies, this positional deviation does not occur significantly.

[Modification] The present invention is not limited to the above-described embodiments, and the following modifications are possible, for example.

(1) The bottom surface 15a of the storage case 8a may be flattened as shown in FIG. In this case, the positioning of the circuit component 1a in the recess 13a is performed, for example, by holding the circuit component 1a in a semi-fixed manner by the adsorbent 21a and moving in the x direction and the y direction so that the circuit component 1a is abutted on two orthogonal wall surfaces. It can be done by contact. This positioning method is disclosed in JP-A-59-152698. Bottom surfaces 15b and 15c of the recesses 13b and 13c may be flat surfaces as in FIG.

(2) A recess in the case 8c for accommodating the rectangular circuit component 1c
An inclined surface 40 as shown in FIG. 18 may be provided on the bottom surface 15c of 13c. By doing so, it is possible to prevent the rectangular circuit component 1c from being stabilized in an inclined closed state. That is, circuit parts
It is possible to prevent a state in which one side of 1c is stably positioned at the center of the bottom portion 15c (inclined insertion state).

(3) As shown in FIG. 19, the through hole 4 is formed in the right wall surface of the recess 13a.
1 may be provided, and compressed gas (air) may be sent from there as shown by the arrow 42 to invert and position the circuit component 1a. At this time, the through hole 14 may or may not be sucked.

(4) The through hole 14 of the storage case 13a may be provided in the left side wall as shown in FIG.

(5) As shown in FIG. 21, a through hole 42 may be provided in the right side wall of the storage case 13a as in FIG. 19, and the through hole 14 may be omitted.

(6) The recess 13a may be formed by combining a number of plates 43 as shown in FIG.

(7) The pipe 24 may be directly engaged with the engaging portion 28 of the holding body 22.

(8) Through hole 27 of mounting plate 23 and engaging portion 28 of holder 22
May be formed to have directivity, and one holding body 22 may be provided with one pipe-shaped engaging portion 28.

(9) The mutual spacing of the two engaging portions 28 of one holding body 22 was made to coincide with the mutual spacing of the through holes 27 of the mounting plate 23, but two through holes 27 were formed at each intersection of the matrix. It may be provided.

(10) Do not connect many pipes 24 to the mounting plate 23,
A common vacuum (exhaust) chamber may be provided on this upper surface. In this case, if there is a through hole 27 to which the holder 22 is not attached, this through hole 27 is closed with a closing member.

(11) A protrusion including the through hole 27 may be provided on the lower surface of the attachment plate 23, and the holder 22 may be engaged with the protrusion so as to cover it.

[Advantages of the Invention] As is apparent from the above, according to the present invention, it is possible to provide a chip-shaped circuit component mounting apparatus capable of mounting a plurality of circuit components having different shapes on a circuit board at the same time.

[Brief description of drawings]

FIG. 1 is a sectional view showing a component supply device and a component placement device in a mounting device according to an embodiment of the present invention, FIG. 2 is a sectional view showing a component placement device and a suction device, and FIG. 3 is a suction device. FIG. 4 is a cross-sectional view showing a circuit board, FIG. 4 is a cross-sectional view showing a circuit board on which circuit components are mounted, and FIGS. 5, 6, and 7 are plan views showing three component storage cases shown in FIG. 8, 9 and 10 are sectional views corresponding to the lines VIII-VIII, IX-IX and XX in FIGS. 5, 6 and 7 and FIG. 11 is shown in FIG. FIG. 12 is a perspective view of the holding body, FIG. 12 is a perspective view of the adsorbent of FIG. 2, FIG. 13 is a partially enlarged cross-sectional view taken along line XIII-XIII of FIG. 12, and FIG. 14 is another adsorption of FIG. FIG. 15 is an enlarged sectional view of the body, FIG. 15 is a plan view showing the arrangement of circuit components on the circuit board, FIG. 16 is a perspective view showing the mounting plate of FIG. 2, and FIG. Figure 18 is a sectional view of a portion corresponding to FIG. 18, FIG. 18 is a sectional view of a portion corresponding to FIG. 10 showing a modified example of the storage case, and FIG. 19 is a sectional view of a portion corresponding to FIG. FIG. 20, FIG. 20 is a sectional view of a portion corresponding to FIG. 2 showing a modified example of the storage case, FIG. 21 is a sectional view of a portion corresponding to FIG. 2 showing a modified example of the storage case, and FIG. It is sectional drawing of the part corresponding to FIG. 2 which shows the modification of a storage case. 1a, 1b, 1c …… Circuit parts, 2 …… Parts placement device, 3 ……
Component transfer device, 7 ... Arrangement plate, 8a, 8b, 8c ... Component storage case, 9 ... Suction device, 20 ... Component suction device, 21a, 2
1b, 21c …… Adsorber, 22 …… Holder, 23 …… Mounting plate, 26 …… Circuit board.

Claims (1)

[Claims] 1. A device for simultaneously mounting a plurality of chip-shaped circuit components (1a, 1b, 1c) having different shapes on a circuit board (26), wherein the plurality of chip circuit components (1a, 1b, 1c) are mounted on the circuit board (26). A circuit component placement device (2) for previously placing the plurality of chip-shaped circuit components (1a, 1b, 1c) so as to correspond to the placement pattern of the chip-shaped circuit components (1a, 1b, 1c); A component suction device (20) for sucking the plurality of chip-shaped circuit components (1a, 1b, 1c) arranged in the component arrangement device (2) and transferring them onto the circuit board (26), The circuit component placement device (2) has a plurality of component storage recesses (13a, 13b, 13c) for storing a plurality of chip-shaped circuit components (1a, 1b, 1c) having different shapes, The heights of the bottom surfaces of the component accommodating recesses (13a, 13b, 13c) are set to be substantially the same. The attachment device (20) includes a plurality of adsorbents (21a, 21b, 21c) having suction holes (34) for adsorbing the plurality of chip-shaped circuit components (1a, 1b, 1c), and From a mounting plate (23) to which a plurality of adsorbents (21a, 21b, 21c) are attached, and a suction means for bringing the suction holes (34) of the adsorbents (21a, 21b, 21c) into a suction state. The suction body (21a, 21b, 21c) has different suction surfaces (33a, 33b, 33c) depending on the shapes of the plurality of chip-shaped circuit components (1a, 1b, 1c), and the attachment From the plate (23) to the suction surface (33a, 33b, 33
The distance to c) is the distance between the chip-shaped circuit components (1a, 1
b, 1c) according to the difference in shape, and the plurality of adsorbents (21a, 21b, 21c) adsorb the plurality of chip-shaped circuit components (1a, 1b, 1c) The plurality of suction bodies (21a, 21b, 21c) so that the distances from (23) to the mounting surfaces of the plurality of chip-shaped circuit components (1a, 1b, 1c) on the circuit board (26) are equal to each other. A chip-shaped circuit component mounting device, wherein: