JPH06103616B2 - Photoelectric sensor - Google Patents
Photoelectric sensorInfo
- Publication number
- JPH06103616B2 JPH06103616B2 JP27868985A JP27868985A JPH06103616B2 JP H06103616 B2 JPH06103616 B2 JP H06103616B2 JP 27868985 A JP27868985 A JP 27868985A JP 27868985 A JP27868985 A JP 27868985A JP H06103616 B2 JPH06103616 B2 JP H06103616B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- sensor
- display window
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Switches Operated By Changes In Physical Conditions (AREA)
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 （イ）発明の分野 この発明は、例えば表示灯を有するアンプ内蔵フォトマ
イクロセンサなどの光電センサに関する。Description: (a) Field of the Invention The present invention relates to a photoelectric sensor such as a photomicrosensor with a built-in amplifier having an indicator lamp.
（ロ）発明の背景 従来のアンプ内蔵フォトマイクロセンサとしては、例え
ば表示用LEDとICチップとリードフレームを一体とした
部品（以下アンプ部と呼ぶ）に投光用素子と受光用素子
を半田付けし、の部品を抜け防止のスナップフィットに
よりケースに固定し、ケースの一部に窓をあけ、そこに
透明樹脂でできた部品をはめこみ表示窓としている。(B) Background of the Invention As a conventional photomicrosensor with a built-in amplifier, for example, a light emitting element and a light receiving element are soldered to a component (hereinafter referred to as an amplifier section) in which an LED for display, an IC chip and a lead frame are integrated. The parts are fixed to the case with a snap fit to prevent them from coming off, a window is opened in a part of the case, and a part made of transparent resin is used as a display window.
しかしながら、このような従来のアンプ内蔵フォトマイ
クロセンサにあっては、アンプ部抜け防止の構造と表示
窓用の透明樹脂部品が必要になるため、スペース効率が
悪く、かつ表示窓用部品分だけコストアップするという
問題点がある。However, such a conventional photomicrosensor with a built-in amplifier requires a structure for preventing the amplifier from coming off and a transparent resin part for the display window, resulting in poor space efficiency and cost reduction for the display window part. There is a problem of uploading.
（ハ）発明の目的 この発明は、表示窓用の部品を省略し、組立性が良く小
型で安価な光電センサの提供を目的とする。(C) Object of the Invention An object of the present invention is to provide a photoelectric sensor which is easy to assemble, small in size, and inexpensive in which parts for a display window are omitted.
（ニ）発明の要約 この発明は、発光素子を膨出状態にして、ICチップおよ
びリードフレームと共に透明樹脂により一体成形すると
共に、投受光素子の支持部を形成してセンサ本体を形成
し、上記センサ本体の支持部に投受光素子を支持してそ
れぞれのリード線を所定のリードフレーム位置に固着
し、前記センサ本体を収納するケースに、発光素子の膨
出部と無理嵌めされる表示窓と、投受光素子の投受光窓
とを形成し、上記ケースに前記センサ本体を収納したと
き、発光素子の膨出部を表示窓に係合して両者を固定し
た光電センサであることを特徴とする。(D) Summary of the Invention According to the present invention, a light emitting element is expanded and integrally molded with an IC chip and a lead frame by a transparent resin, and a support portion of the light emitting and receiving element is formed to form a sensor main body. The light emitting / receiving element is supported on the supporting portion of the sensor body, and the respective lead wires are fixed to predetermined lead frame positions, and the bulging portion of the light emitting element and the display window forcibly fitted to the case for housing the sensor body. A photoelectric sensor in which a light projecting and receiving window of a light projecting and receiving element is formed, and when the sensor body is housed in the case, the bulging portion of the light emitting element is engaged with the display window to fix the two. To do.
（ホ）発明の効果 この発明によれば、センサ本体に発光素子を膨出状態に
形成し、このセンサ本体を収納するケースに発光素子の
膨出部と無理嵌めされる表示窓を形成し、上記ケースに
前記センサ本体を収納したとき、発光素子の膨出部を表
示窓に係合して両者を固定したものであるから、発光素
子を導く表示窓用部品を不要とし、スペースを縮小で
き、かつ小型化ができ、表示窓用の部品を不要とするた
め、組立性も良好で安価に提供できる。(E) Effect of the Invention According to the present invention, the light emitting element is formed in a swelled state in the sensor main body, and the swelled portion of the light emitting element is formed in the case for accommodating the sensor main body to form a display window, When the sensor body is housed in the above case, the bulging portion of the light emitting element is engaged with the display window to fix the two, so that a part for the display window for guiding the light emitting element is unnecessary, and the space can be reduced. In addition, the size can be reduced, and the parts for the display window are unnecessary, so that the assemblability is good and the cost can be provided at a low cost.
（ヘ）発明の実施例 この発明の一実施例を、以下図面に基づいて詳述する。(F) Embodiment of the Invention One embodiment of the present invention will be described in detail below with reference to the drawings.
図面は光電センサを示し、この光電センサ１は、センサ
本体２と、一対の投、受光素子3,4と、これら収納する
ケース５とから構成されている。The drawing shows a photoelectric sensor, and this photoelectric sensor 1 comprises a sensor main body 2, a pair of light emitting and receiving elements 3 and 4, and a case 5 for housing these.
上述のセンサ本体２は、例えばLEDのような発光素子11
を膨出状態にして、ICチップおよびリードフレーム12と
共に透明樹脂により一体成形すると共に、上述の投、受
光素子3,4の支持部13,13を連設形成している。The sensor body 2 described above includes a light emitting element 11 such as an LED.
In a swelling state, the IC chip and the lead frame 12 are integrally molded with transparent resin, and the supporting portions 13, 13 for the above-mentioned light projecting and light receiving elements 3, 4 are continuously formed.
上述の支持部13,13は断面Ｔ字状に形成されて、その先
端部に投、受光素子3,4を当接すると共に、各リード線1
4,14をリブ13aの上下に沿わせて配線し、リード線14,14
の遊端を支持部13,13の終端に形成したＨ字状のガイド
部15,15に通して、センサ本体２より突出したリード線
6,6を第２図に示すように折曲げて対応リード線6,14、
6,14を半田付けする。The above-mentioned supporting portions 13 and 13 are formed in a T-shape in cross section, and project the light-receiving elements 3 and 4 at the tip of the supporting portions 13 and 13 and abut each lead wire 1.
Wire 4 and 14 along the top and bottom of rib 13a, and
The lead wire protruding from the sensor body 2 by passing the free end of the sensor through the H-shaped guide portions 15, 15 formed at the ends of the support portions 13, 13.
Bending 6 and 6 as shown in Fig. 2 and corresponding lead wires 6 and 14,
Solder 6,14.
上述のように投、受光素子3,4を取付けたセンサ本体２
を、前述のケース５のセンサ本体挿入孔21より挿入し、
この時センサ本体２より膨出した発光素子11は挿入孔21
に設けたガイド溝22に圧入して挿入し、ガイド溝22の奥
部に設けた表示窓23に発光素子11の膨出部を係合させて
ケース５にセンサ本体２を固定する。Sensor body 2 with light emitting and receiving elements 3 and 4 attached as described above
Through the sensor body insertion hole 21 of the case 5,
At this time, the light emitting element 11 bulging from the sensor body 2 has an insertion hole 21.
Then, the sensor main body 2 is fixed to the case 5 by press-fitting and inserting into the guide groove 22 provided in the guide groove 22, and engaging the bulging portion of the light emitting element 11 with the display window 23 provided in the inner portion of the guide groove 22.
なお、符号11aは発光素子11の前上部に形成した面取部
で、ガイド溝22への圧入を容易に行ない得るように形成
している。Reference numeral 11a is a chamfer formed in the front upper part of the light emitting element 11, and is formed so that the guide groove 22 can be easily press-fitted.
また、16…はセンサ本体２より突出したリード線、24,2
4は投、受光素子3,4の挿入用カバー部、25はカバー部24
の内側に設けた投受光窓である。Also, 16 ... Lead wires protruding from the sensor body 2, 24,2
4 is a cover for inserting the light emitting and receiving elements 3 and 4, 25 is a cover 24
It is a light projecting / receiving window provided inside.
図示の実施例によれば、センサ本体２に発光素子11を膨
出状態に形成し、このセンサ本体２を収納するケース５
に発光素子11の膨出部と無理嵌めされる表示窓23を形成
し、上述のケース５に前述のセンサ本体２を収納したと
き、発光素子11の膨出部を表示窓23に係合固定したもの
であるから、発光素子を導く表示窓用部品を不要とし、
スペースを縮小でき、かつ小型化ができ、表示窓用の部
品を不要とするため、組立性も良好で安価に提供でき
る。According to the illustrated embodiment, the light emitting element 11 is formed in a swelled state in the sensor body 2 and the case 5 for accommodating the sensor body 2 is provided.
A display window 23 is formed to be fitted into the bulging portion of the light emitting element 11 by force. When the sensor body 2 is housed in the case 5 described above, the bulging portion of the light emitting element 11 is engaged and fixed to the display window 23. Therefore, the parts for the display window leading the light emitting element are unnecessary,
The space can be reduced, the size can be reduced, and the parts for the display window are unnecessary, so that the assembling property is good and the cost can be provided at a low cost.
図面はこの発明の一実施例を示し、 第１図は光電センサの分解斜視図、 第２図はリード線の結線状態を示す斜視図、 第３図は組立後の縦断側面図である。 １…光電センサ、２…センサ本体 ３…投光素子、４…受光素子 ５…ケース、６…リード線 11…発光素子、12…リードフレーム 13…支持部、14…リード線 23…表示窓、25…投受光窓 1 shows an embodiment of the present invention, FIG. 1 is an exploded perspective view of a photoelectric sensor, FIG. 2 is a perspective view showing a lead wire connection state, and FIG. 3 is a vertical sectional side view after assembly. DESCRIPTION OF SYMBOLS 1 ... Photoelectric sensor, 2 ... Sensor main body 3 ... Light emitting element, 4 ... Light receiving element 5 ... Case, 6 ... Lead wire 11 ... Light emitting element, 12 ... Lead frame 13 ... Support part, 14 ... Lead wire 23 ... Display window, 25 ... Emitter / receiver window
Claims (1)
びリードフレームと共に透明樹脂により一体成形すると
共に、投受光素子の支持部を形成してセンサ本体を形成
し、 上記センサ本体の支持部に投受光素子を支持してそれぞ
れのリード線を所定のリードフレーム位置に固着し、 前記センサ本体を収納するケースに、発光素子の膨出部
と無理嵌めされる表示窓と、投受光素子の投受光窓とを
形成し、 上記ケースに前記センサ本体を収納したとき、発光素子
の膨出部を表示窓に係合して両者を固定した 光電センサ。1. A light emitting element is expanded and integrally molded with a transparent resin together with an IC chip and a lead frame, and a supporting portion for the light emitting and receiving element is formed to form a sensor main body. The light emitting and receiving element is supported by the respective lead wires and the lead wire is fixed to a predetermined lead frame position, and a case for accommodating the sensor main body is provided with a display window forcibly fitted to the bulging portion of the light emitting element and a light emitting and receiving element. A photoelectric sensor in which a light projecting and receiving window is formed, and when the sensor body is housed in the case, the bulging portion of the light emitting element is engaged with the display window to fix the two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27868985A JPH06103616B2 (en) | 1985-12-10 | 1985-12-10 | Photoelectric sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27868985A JPH06103616B2 (en) | 1985-12-10 | 1985-12-10 | Photoelectric sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62136730A JPS62136730A (en) | 1987-06-19 |
| JPH06103616B2 true JPH06103616B2 (en) | 1994-12-14 |
Family
ID=17600802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27868985A Expired - Lifetime JPH06103616B2 (en) | 1985-12-10 | 1985-12-10 | Photoelectric sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06103616B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6364840B2 (en) * | 2014-03-15 | 2018-08-01 | オムロン株式会社 | Photo sensor |
-
1985
- 1985-12-10 JP JP27868985A patent/JPH06103616B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62136730A (en) | 1987-06-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |