JPH059830U - Wire electric discharge machine - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a wire electric discharge machine with excellent work efficiency. [Structure] Machining liquid ejecting mechanism 3 for ejecting machining liquid toward the upper and lower guide mechanisms 10 and 11, respectively
0 and 40, and purification mechanisms 50 and 60 for sucking chips generated from the working liquid and the work supplied into the tank body 20 were attached.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a wire electric discharge machine, and more particularly to a wire electric discharge machine having a mechanism for injecting a machining liquid toward a workpiece and a mechanism for sucking the machining liquid in a tank.

[0002]

[Prior Art]

 As a conventional wire electric discharge machine, one having a configuration shown in FIG. 2 is known.

In this wire electric discharge machine, a wire 2 supplied from a wire supply bobbin 1 passes through a wire pulley 6 and a support pulley 7 via a damper pulley 3 and a brake roller 5 which works in conjunction with the pulley 4. And is guided and supported by an upper guide mechanism 10 and a lower guide mechanism 11 provided with a power feeding die 8 and a die guide 9. An electric discharge machining section A is provided between the upper and lower guide mechanisms 10 and 11, and a workpiece is electric discharge machined in the electric discharge machining section A. The wire 2 exiting the lower guide mechanism 11 passes through the support pulley 12, the pigtail guide 13, the wire winding roller 14, and the pinch roller 15 and is collected in the wire collecting box 16. The reference numerals 17 and 18 in FIG. 2 are sensors for detecting wire breakage. Further, on the outer circumference of the wire 2 supported and guided by the upper and lower guide mechanisms 10 and 11, there is provided a tank body 20 for filling a working liquid necessary for electric discharge machining.

By the way, chips are generated between the wire 2 and the work due to electric discharge machining, and the machining speed may decrease the machining efficiency due to the machining scrap.

Therefore, conventionally, the upper and lower guide mechanisms 10 and 11 are provided with a machining fluid ejecting mechanism for ejecting machining fluid toward the work, and the chips are removed from the work by the ejected machining fluid. Improves processing efficiency.

However, in the above-mentioned conventional technique, the chips removed by the jetted machining fluid stay in the machining fluid in the tank body and float, which makes it difficult to visualize the work as the machining progresses. There was an inconvenience that processing became difficult.

In order to solve these problems, for example, a machining fluid injection mechanism is provided on the upper guide mechanism side, and a purification mechanism is provided on the lower guide mechanism side for sucking the machining fluid and chips supplied into the tank body. You can also take

However, in such means, since the machining fluid is ejected from only one surface side of the work, the machining fluid jetted to the chips generated on the other surface side of the work can reach the machining fluid. However, there is a drawback that the chip removal efficiency is reduced and the work efficiency of the work is deteriorated.

[0009]

[Problems to be solved by the device]

 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a wire electric discharge machine having excellent machining efficiency for a workpiece.

[0010]

[Means for Solving the Problems]

 Therefore, in the wire electric discharge machine according to the present invention, a machining liquid jetting mechanism for jetting a machining liquid toward the upper and lower guide mechanisms, respectively, and a machining liquid and a workpiece supplied into the tank are provided. It was configured with a purification mechanism that sucks the generated chips.

[0011]

[Action]

 According to the wire electric discharge machine of the present invention, the machining fluid is ejected from the machining fluid ejecting mechanism toward the workpiece, whereby chips generated from the workpiece can be removed from both upper and lower surfaces of the workpiece. Further, the removed chips are sucked by the purifying mechanism, so that the work can be reliably viewed.

[0012]

【Example】

 An embodiment of the wire electric discharge machine of the present invention will be described with reference to FIG.

In the description of the present embodiment, configurations common to those of the above-described conventional technique are designated by the same reference numerals, and detailed description thereof will be omitted.

In the wire electric discharge machine according to the present embodiment, a machining liquid ejecting mechanism 30.40 for ejecting a machining liquid toward the upper and lower guide mechanisms 10.11 and a tank body, respectively. It is different from the conventional one in that a cleaning mechanism 50/60 for sucking chips (not shown) generated from the working fluid and the work supplied to the inside 20 is attached.

The working liquid jetting mechanisms 30 and 40 include inner cylinders 31 and 41 for accommodating the upper and lower guide mechanisms 10 and 11, and an outer cylinder 32 and a cylinder surrounding the inner cylinders 31 and 41. And 42. The inner cylinder 31 and the outer cylinder 32 are slightly reduced in diameter on the electric discharge machining section A side, and a flow path 33 is formed between them. Similarly, a flow path 43 is formed between the inner cylinder 41 and the outer cylinder 42. A supply path for supplying the working liquid with a constant pressure is connected to the inside of the flow paths 33 and 43 (not shown). Further, openings 34 and 44 are formed in the facing surfaces of the flow paths 33 and 43 at positions facing the work.

The purifying mechanisms 50 and 60 are formed in an annular shape, and are connected to the suction heads 51 and 61 attached to the outer surfaces of the outer cylinders 32 and 42, and are connected to these suction heads 51 and 61. From the pipes 52 and 62 drawn to the outside of the tank body 20, the filters 53 and 63 sequentially arranged in the middle of these pipes 52 and 62 toward the downstream side, and the suction pumps 54 and 64. It is configured.

The suction heads 51 and 61 are arranged in the tank body 20 and have suction ports (not shown) that open into the tank body 20 when the tank body 20 is filled with the machining liquid. It is formed on the upper and lower surfaces and the outer peripheral surface.

The pipes 52 and 62 are respectively connected to the suction head portions 51 and 61 in a communicating state, whereby the pipes 52 and 62 are connected to the suction ports of the suction heads 51 and 61, respectively. There is. Further, suction pumps 54, 64 are attached to the pipes 52, 62 via the filters 53, 63, and the working fluid sucked by these suction pumps 54, 64 is stored in a tank (not shown). It is designed to be stored in.

Next, the operation of the wire electric discharge machine of the present embodiment configured as described above will be described.

Also in the electric discharge machine of this embodiment, the electric discharge machining with the wire 2 is performed on the work piece in a state where the tank body 20 is filled with the machining liquid as in the conventional case. At this time, the machining fluid is ejected from the machining fluid ejecting mechanism 30, 40 toward the workpiece, and the suction pumps 54, 64 are driven to eject the machining fluid from the inside of the tank body 20 via the suction heads 51, 61. Suck it out.

According to the electric discharge machine of this embodiment, when chips are generated between the work and the wire 2 due to the electric discharge machining, the machining liquid jetting mechanisms 30 and 40 arranged above and below the chips direct the work toward the work. Chips can be removed from both the upper and lower sides of the workpiece by spraying the machining fluid with it.

Therefore, there is an advantage that the efficiency of removing chips can be improved and the processing efficiency of a work can be improved.

Further, the chips removed from the work as described above float in the working liquid when left unattended, which hinders visual inspection of the work. However, according to the electric discharge machine of this embodiment, the chips can be sucked to the outside together with the machining liquid via the suction heads 51 and 61. That is, chips can be removed from the inside of the tank body 20 by the cleaning mechanisms 50 and 60.

Therefore, there is an advantage that the work can be visually confirmed and the work efficiency of the work can be further improved.

Further, since the cleaning mechanisms 50 and 60 are provided at the upper and lower positions, the chips generated on both the upper and lower sides of the work can be sucked at the position close to the generation position.

Therefore, the chips can be sucked reliably and efficiently, and the visual inspection of the work can be made even more reliable.

Further, since the chips sucked by the suction pumps 54, 64 are filtered by the filters 53, 63, it is possible to prevent the chips from damaging the inside of the suction pumps 54, 64.

Further, since the suction heads 51 and 61 are formed with suction ports on the upper and lower surfaces and the outer peripheral surface thereof, which open into the processing liquid when the processing liquid is filled inside the tank body 20, There is also an advantage that chips that tend to stay near the inner wall surface of the can be sucked reliably and efficiently.

[0029]

[Effect of the device]

 The wire electric discharge machine of the present invention has a machining liquid jetting mechanism for jetting the machining fluid toward the work piece, and a machining fluid supplied into the tank and the chips generated from the work, to the upper and lower guide mechanisms, respectively. Since the cleaning mechanism is installed, the efficiency of removing chips generated from the work can be increased, and the processing efficiency of the work can be improved.

Further, since the chips, which float in the working liquid and hinder the visual observation of the work, can be sucked out together with the working liquid from the purifying mechanism and can be removed from the tank body, The visual inspection can be reliably performed, and the processing efficiency can be further improved.

Furthermore, the chips generated on the upper and lower surfaces of the work can be sucked by the cleaning mechanism at a position close to the position where the work is generated, so that the chips can be sucked reliably and efficiently. Can be further ensured.

[Brief description of drawings]

FIG. 1 shows an embodiment of a wire electric discharge machine of the present invention, and is a schematic configuration diagram thereof.

FIG. 2 shows a conventional wire electric discharge machine and is a schematic configuration diagram thereof.

[Explanation of symbols]

 2 wire 10 upper guide mechanism 11 lower guide mechanism 20 tank body 30 upper working fluid jetting mechanism 40 lower working fluid jetting mechanism 50 upper purifying mechanism 60 lower purifying mechanism A electric discharge machining section

Claims (1)

[Claims for utility model registration] [Claim 1] Between the upper / lower guide mechanism for guiding the wire fed in the vertical direction at two positions separated in the lengthwise direction, and the upper / lower guide mechanism The electric discharge machining part provided and on which the work is arranged, and covering the electric discharge machining part,
Further, in the wire electric discharge machine equipped with a tank filled with a machining fluid, the upper and lower guide mechanisms each have a machining fluid ejecting mechanism for ejecting the machining fluid toward the work, and a tank body. A wire electric discharge machine equipped with a cleaning mechanism for sucking chips supplied from the supplied machining fluid and work.