JPH0596809U - Fiber optic data link holder - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a highly reliable optical fiber data link holder that does not directly apply stress to the lead legs of an optical semiconductor element or the fixed legs of a holder when inserting or removing an optical fiber. [Structure] On a front surface of a holder main body 9, there are provided a fixing portion 11 for inserting and fixing an end portion of an optical fiber, and a leaf spring portion 12 integrally molded with the fixing portion 11 which is bent and deformed toward the optical semiconductor element 1. Characterize.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a structure of an optical fiber data link holder for connecting and fixing an optical fiber and an optical semiconductor device.

[0002]

[Prior Art]

 A conventional technique will be described with reference to FIGS. 3 and 4. 3 is a perspective view of a conventional optical fiber data link holder, and FIG. 4 is a sectional view taken along the line B-B 'of FIG.

A conventional optical fiber data link holder has a molding holder 2 for holding an optical semiconductor element as shown in FIGS. 3 and 4, and an optical semiconductor element 1 is placed from the top surface of the molding holder 2. After being inserted and fixed with an adhesive resin or the like, the molded case 2 is covered with a shield case 3 from the back surface and fixed to a printed circuit board or the like. The shield case 3 has fixing feet 3'for soldering and fixing a printed circuit board or the like. The fixing portion 4 for fixing the optical signal transmitting fiber cable and the like is integrally molded with the molding holder 2. In the figure, 1'denotes a fixed foot of the optical semiconductor element 1.

FIG. 5 is a perspective view of another conventional optical fiber data link holder, and FIG. 6 is a sectional view taken along the line C-C ′ of FIG.

As shown in FIGS. 5 and 6, the optical semiconductor element 1 is temporarily fixed to the molding holder 5, and is fixed to the molding holder 5 from the back side by the resin-molded back cover 6 without using an adhesive resin. It In addition, the molding holder 5 has a fixing pin 5'for positioning and temporarily fixing to a printed circuit board or the like, and a hole 7 for attaching a screw to an external chassis or the like, so as to fix a fiber cable for transmitting an optical signal or the like. The portion 8 is integrally molded with the molding holder 5 as in the conventional example shown in FIGS. 3 and 4.

[0006]

[Problems to be solved by the device]

 By the way, in the structure of the conventional optical fiber data link holder, as described above, as shown in FIGS. 3 to 6, the fixing portion for fixing the optical signal transmitting fiber cable and the like (hereinafter, simply referred to as an optical fiber) is molded. It is molded integrally with the holder. For this reason, when the optical fiber is inserted and removed, stress is applied to the soldering part of the lead leg of the optical semiconductor element because the optical semiconductor element is fixed to the molded holder, and pattern peeling or pattern breakage of the printed circuit board etc. occurs. There was a problem.

For example, in the conventional example shown in FIGS. 3 and 4, the holder is fixed to the printed circuit board or the like only by soldering the lead leg 1 ′ of the optical semiconductor element 1 and the fixed leg 3 ′ of the shield case 3. Since this is done, the stress cannot be suppressed sufficiently, and the above-mentioned peeling of the substrate pattern occurs.

Moreover, the optical semiconductor element 1 is fixed to the molding holder 2 at a high cost due to a fixing method using an adhesive resin or the like, and the workability is poor.

Further, in the conventional example shown in FIGS. 5 and 6, the molding holder 5 has a pin 5 ′ for temporarily fixing to a printed circuit board and a hole 7 for attaching a screw to an external chassis, etc. Although the structure is such that stress is not easily applied to the lead legs 1'of the element 1, the external dimensions of the product are increased due to the provision of the mounting holes, the die structure is complicated, the miniaturization is restricted, and the cost is increased.

Therefore, an object of the present invention is to provide a highly reliable optical fiber data link in which stress is not easily applied to the lead leg of an optical semiconductor element even when the optical fiber is inserted or removed without increasing the external dimensions or complicating the structure. To provide a holder.

[0011]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention provides an optical fiber data link holder for holding an optical fiber end and an optical semiconductor element so as to optically couple the optical fiber end with the optical fiber end of the holder body. On the front surface of the facing surface, a fixing portion for inserting and fixing the end portion of the optical fiber and a leaf spring portion which is integrally formed with the fixing portion and is bent and deformed toward the optical semiconductor element are provided.

[0012]

[Action]

 Since the optical fiber data link holder of the present invention has the above-mentioned structure, the stress applied to the holder when the optical fiber is inserted or removed is absorbed by the deflection of the leaf spring portion. Therefore, the stress is not directly applied to the lead legs of the optical semiconductor element, so that the reliability can be improved.

[0013]

【Example】

 An embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a perspective view of an optical fiber data link holder according to this embodiment, and FIG. 2 is a sectional view taken along the line A-A ′ of FIG. The same functions as those of the conventional example shown in FIGS. 3 and 4 are designated by the same symbols.

In the optical fiber data link holder of the present embodiment, as shown in FIGS. 1 and 2, the optical semiconductor element 1 is temporarily fixed to the holder body 9, and the back surface of the optical semiconductor element 1 is a metal back cover. It is fixed to the holder body 9 by being pressed by 10. The lead legs 1'of the optical semiconductor element 1 and the fixing legs 10 'provided on the metal back cover 10 are fixed by soldering to the printed circuit board.

Then, a fixing portion 11 for inserting and fixing the end portion of the optical fiber, which is the feature of this embodiment, is formed on the front surface of the holder body 9 facing the optical fiber (not shown), and the fixing portion 11 is integrally molded. And a plate spring portion 12 that is bent and deformed in the direction of the optical semiconductor element 1. Here, the leaf spring portion 12 is integrally molded with the holder body 9.

Reference numeral 11 ′ is a through hole for fixing the optical fiber of the fixing portion 11.

In the structure as described above, for example, when inserting and fixing the optical fiber in the holder, the optical fiber is inserted into the through hole 11 ′ and further pressed in the direction of the optical semiconductor element 1. At this time, the entire fixing portion 11 through which the optical fiber is inserted is also pressed toward the optical semiconductor element, but the plate spring portion 3 integrally molded with the fixing portion 11 bends and absorbs the force.

As described above, since the leaf spring portion 12 is provided and the leaf spring portion 12 and the fixing portion 11 are integrated with the holder body 9, it is possible to insert or remove the optical fiber into the holder body 9. At this time, the leaf spring portion 12 bends to absorb the stress. Therefore, it is possible to avoid directly applying the stress of inserting and removing the optical fiber to the lead leg 1'as it is, so that high reliability can be obtained.

Moreover, according to this structure, since no adhesive resin is used and it is not necessary to provide a screw hole or the like that extends to the outside of the holder, it is possible to prevent the external dimensions from becoming large with a simple structure. .. Further, since the mounting process of the metal back lid 10 on the holder body 9 is the same as the conventional process, the number of steps is not increased.

Further, the leaf spring portion 12 can be adjusted in stress by considering the thickness, width, characteristics of the resin used, and the like, so that the spring can be prevented from being bent or deformed. This enables stable insertion and removal of optical fibers.

[0022]

[Effect of the device]

 As described above, according to the optical fiber data link holder of the present invention, the stress at the time of inserting and removing the optical fiber from the holder is not directly applied to the lead legs of the optical semiconductor element, so that the reliability is high. can get.

[Brief description of drawings]

FIG. 1 is a perspective view of an optical fiber data link holder according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line A-A ′ in FIG.

FIG. 3 is a perspective view of a conventional optical fiber data link holder.

FIG. 4 is a sectional view taken along line B-B ′ of FIG.

FIG. 5 is a perspective view of an optical fiber data link holder according to another conventional example.

6 is a cross-sectional view taken along the line C-C ′ of FIG.

[Explanation of symbols]

 1 Optical semiconductor element 9 Holder body 11 Fixed part 12 Leaf spring part

Claims (1)

[Scope of utility model registration request] 1. An optical fiber data link holder for holding an end portion of an optical fiber and an optical semiconductor element so as to optically couple them, in a front surface of a surface of a holder body facing the end portion of the optical fiber.
An optical fiber data link holder comprising: a fixing portion into which the end portion of the optical fiber is inserted and fixed; and a leaf spring portion which is integrally formed with the fixing portion and is bent and deformed toward the optical semiconductor element.