JPH0586483A - Plating method and plating device for scroll compressor and scroll member - Google Patents

Plating method and plating device for scroll compressor and scroll member

Info

Publication number
JPH0586483A
JPH0586483A JP4070609A JP7060992A JPH0586483A JP H0586483 A JPH0586483 A JP H0586483A JP 4070609 A JP4070609 A JP 4070609A JP 7060992 A JP7060992 A JP 7060992A JP H0586483 A JPH0586483 A JP H0586483A
Authority
JP
Japan
Prior art keywords
plating
scroll
plating solution
fine particles
phosphorus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4070609A
Other languages
Japanese (ja)
Other versions
JP3031045B2 (en
Inventor
Yukiko Tamura
由紀子 田村
Kiju Endo
喜重 遠藤
Toshihiro Yamada
俊宏 山田
Tadashi Iizuka
董 飯塚
Nobuo Abe
信雄 阿部
Kazuo Ikeda
和雄 池田
Joji Okamoto
譲治 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4070609A priority Critical patent/JP3031045B2/en
Publication of JPH0586483A publication Critical patent/JPH0586483A/en
Application granted granted Critical
Publication of JP3031045B2 publication Critical patent/JP3031045B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04CROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C18/00Rotary-piston pumps specially adapted for elastic fluids
    • F04C18/02Rotary-piston pumps specially adapted for elastic fluids of arcuate-engagement type, i.e. with circular translatory movement of co-operating members, each member having the same number of teeth or tooth-equivalents
    • F04C18/0207Rotary-piston pumps specially adapted for elastic fluids of arcuate-engagement type, i.e. with circular translatory movement of co-operating members, each member having the same number of teeth or tooth-equivalents both members having co-operating elements in spiral form
    • F04C18/0246Details concerning the involute wraps or their base, e.g. geometry

Abstract

PURPOSE:To execute a surface treatment for reducing friction at a low cost by forming a swiveling scroll and a stationary scroll of an aluminum alloy. CONSTITUTION:An electroless nickel-phosphorus plating layer 5 which is not combined with fine particles is provided on an electroless nickel-phosphorus plating layer 1 on both or one surface of the swiveling scroll and stationary scroll formed of the aluminum material 3. Since the fine particle are embedded into the plating film, the peeling of the fine particles does not arise and the wear resistance of both of the plated sliding surface and the non-plated sliding surface is improved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、スクロール圧縮機に係
り、特にアルミニウムの旋回スクロールと固定スクロー
ルを備えたスクロール圧縮機及びその旋回スクロールと
固定スクロールの表面処理装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scroll compressor, and more particularly to a scroll compressor provided with an aluminum orbiting scroll and a fixed scroll, and a surface treatment device for the orbiting scroll and the fixed scroll.

【0002】[0002]

【従来の技術】スクロール圧縮機は図11に示すような
鏡板7上にうず巻状のラップ8を有するスクロ−ル部材
60を2ケ互いのうず巻が噛み合うように噛み合わせ、
一方を固定し、他方を旋回させてうず巻部分でガスを圧
縮する形式のものである。
2. Description of the Related Art In a scroll compressor, two scroll members 60 each having a spiral wrap 8 on an end plate 7 as shown in FIG.
This is a type in which one is fixed and the other is swirled to compress the gas at the spiral part.

【0003】近年スクロール圧縮機において、旋回スク
ロールの回転の高速化に伴い、旋回スクロールの遠心力
をできるだけ減少させるため、比重の小さいアルミニウ
ム材が用いられるようになってきた。しかしアルミニウ
ム材では耐摩耗性の面で問題が生じる。これを解決する
ため様々な表面処理方法が開発されてきた。
In recent years, in scroll compressors, aluminum materials having a small specific gravity have come to be used in order to reduce the centrifugal force of the orbiting scroll as much as possible as the rotation speed of the orbiting scroll increases. However, aluminum materials have a problem in terms of wear resistance. To solve this, various surface treatment methods have been developed.

【0004】従来のスクロール圧縮機においては、旋回
スクロール及び固定スクロールのいずれか一方をアルミ
ニウム材とし、他方を鋳鉄として、そのアルミニウム材
の表面に表面処理を施す方法が考えられている。例え
ば、特開昭62−199982号公報に記載のように、
旋回スクロールの表面に無電解ニッケル−ホウ素めっき
を施す方法、特開昭64−80785号公報に記載のよ
うに、旋回スクロール、または固定スクロールの表面に
ニッケル、タングステン等を所定量含んだめっき皮膜を
施す方法がある。
In the conventional scroll compressor, there has been considered a method in which one of the orbiting scroll and the fixed scroll is made of aluminum and the other is made of cast iron, and the surface of the aluminum material is subjected to a surface treatment. For example, as described in JP-A No. 62-199982,
A method of electroless nickel-boron plating on the surface of an orbiting scroll, as described in JP-A-64-80785, a surface of an orbiting scroll or a fixed scroll is provided with a plating film containing a predetermined amount of nickel, tungsten or the like. There is a way to do it.

【0005】又旋回スクロール、固定スクロールの両方
をアルミニウム材とした例としては、実開平3−998
01号公報に記載のように、旋回スクロール、又は固定
スクロールのいずれか一方の少なくとも渦巻状ラップ及
び端板の内面に無電解ニッケル−リンめっき或いはアル
ミナや炭化珪素(以下SiCと称する)系の硬質微粒子
を複合分散させた無電解ニッケル−リンめっきを施した
スクロール型流体機械、特開平2−125988号公報
に記載のように、旋回スクロール、または固定スクロー
ルのいずれか一方の表面に硬質陽極酸化処理を、他方の
表面にすずめっき処理を施す方法などがある。
Further, as an example in which both the orbiting scroll and the fixed scroll are made of aluminum material, an actual flat blade 3-998 is used.
As described in Japanese Patent Publication No. 01-001, electroless nickel-phosphorus plating or alumina or silicon carbide (hereinafter referred to as SiC) -based hard material on at least the inner surface of the spiral wrap and the end plate of either the orbiting scroll or the fixed scroll. A scroll-type fluid machine in which fine particles are compound-dispersed and electroless nickel-phosphorus plating is applied, and as described in Japanese Patent Laid-Open No. 125988/1990, a hard anodizing treatment is applied to the surface of either the orbiting scroll or the fixed scroll. There is a method of performing tin plating on the other surface.

【0006】[0006]

【発明が解決しようとする課題】しかしながら上記従来
技術において、スクロ−ル圧縮機に用いる旋回スクロー
ルまたは固定スクロールのいずれか一方のスクロールを
アルミニウム材としてその表面に表面処理を施し、他方
を鋳鉄とした組合せの場合には、その摺動面の耐摩耗性
は良好であるが、軽量化の点で問題があった。
However, in the above-mentioned prior art, either the orbiting scroll or the fixed scroll used in the scroll compressor is made of an aluminum material and the surface thereof is subjected to a surface treatment, and the other is made of cast iron. In the case of the combination, the sliding surface had good wear resistance, but there was a problem in terms of weight reduction.

【0007】また両方をアルミニウム材とした場合に
は、少なくとも一方に表面処理を施す必要があり、量産
化及び低コスト化の点で問題があった。特に粒子複合の
表面処理を施した場合は、めっき表面上にある硬質粒子
が剥離し、その粒子が研磨剤として働き、相手側さらに
は表面処理した面自身まで摩耗してしまうという問題が
あった。本発明の課題は、旋回スクロール及び固定スク
ロールをアルミニウムを用いて軽量化する際に必要とな
る、耐摩耗性向上のための表面処理のコストを低減する
にある。
Further, when both are made of aluminum, it is necessary to perform a surface treatment on at least one of them, which is a problem in terms of mass production and cost reduction. In particular, when the particle composite surface treatment was applied, there was a problem that the hard particles present on the plating surface were peeled off, the particles acted as an abrasive, and the other side and the surface-treated surface itself were worn. .. An object of the present invention is to reduce the cost of the surface treatment for improving the wear resistance, which is required when reducing the weight of the orbiting scroll and the fixed scroll by using aluminum.

【0008】更に本発明の別の課題としてはアルミニウ
ムを用いた旋回スクロール及び固定スクロールの少なく
とも摺動面に耐摩耗性となじみ性を兼ね備えた表面処理
を施し、加工精度を高めることなく性能を向上させたス
クロ−ル圧縮機とすることにある。
Another object of the present invention is to improve the performance without increasing the machining accuracy by subjecting at least the sliding surface of the orbiting scroll and the fixed scroll using aluminum to a surface treatment having both wear resistance and conformability. It is to make it a scroll compressor.

【0009】更に本発明の別の課題としては旋回スクロ
ール及び固定スクロールの表面に耐摩耗性となじみ性を
兼ね備えた表面処理若しくは耐摩耗性を備えた表面処理
を施すに適しためっき装置を提供することにある。
Another object of the present invention is to provide a plating apparatus suitable for subjecting the surfaces of orbiting scrolls and fixed scrolls to a surface treatment having both wear resistance and familiarity or a surface treatment having wear resistance. Especially.

【0010】[0010]

【課題を解決するための手段】上記の課題は、スクロ−
ル圧縮機に用いる旋回スクロールと固定スクロールのう
ちのいずれか一方にめっきの表面の硬質微粒子が表面か
ら剥離しない構造を持つ微粒子複合めっきを施すことに
より達成される。
[Means for Solving the Problems]
This is achieved by subjecting either one of the orbiting scroll and the fixed scroll used in the compressor to fine particle composite plating having a structure in which hard fine particles on the surface of plating do not separate from the surface.

【0011】微粒子がめっき表面から剥離しない構造と
して、微粒子複合無電解ニッケル−リンめっき層の上に
微粒子が複合していない無電解ニッケル−リンめっき層
を設ける。
As a structure in which fine particles are not separated from the plating surface, an electroless nickel-phosphorus plating layer in which fine particles are not composite is provided on the fine particle composite electroless nickel-phosphorus plating layer.

【0012】めっきの表面の微粒子が表面から剥離しな
い構造を持つ微粒子複合無電解めっきは、めっき処理過
程において、まず微粒子が混合されためっき液内でめっ
き処理を行い、つぎに微粒子が混合されていないめっき
液内でめっき処理を行うことにより得られる。このめっ
き処理は同じめっき液槽内で行っても良く、微粒子を複
合しためっき液の槽と微粒子を複合しないめっき液の槽
を用いて行っても良い。
In the fine particle composite electroless plating having a structure in which fine particles on the surface of the plating are not separated from the surface, in the plating treatment process, the plating treatment is first performed in a plating solution in which the fine particles are mixed, and then the fine particles are mixed. It is obtained by performing the plating treatment in a non-plating solution. This plating treatment may be performed in the same plating solution tank, or may be performed using a plating solution tank containing fine particles and a plating solution tank not containing fine particles.

【0013】更に上記の課題はアルミニウム合金製スク
ロールの表面に設けた耐摩耗性微粒子複合めっき層に微
粒子を複合しないめっき層を厚く設けることにより達成
される。尚、微粒子を複合しためっき層を薄く形成する
場合、無電解ニッケル−リンめっき液に複合させる微粒
子としては粒子径が0.1μm以下の超微粒子を用い
る。また、微粒子は硬質のもの、例えば炭化珪素、二酸
化珪素、アルミナ、二酸化ジルコニア及びダイヤモンド
等が良い。
Further, the above-mentioned problems can be achieved by providing a thick abrasion-resistant fine particle composite plating layer provided on the surface of an aluminum alloy scroll with a plating layer not containing fine particles. When forming a thin plating layer including fine particles, ultrafine particles having a particle diameter of 0.1 μm or less are used as fine particles to be added to the electroless nickel-phosphorus plating solution. Further, the fine particles are preferably hard ones, such as silicon carbide, silicon dioxide, alumina, zirconia dioxide and diamond.

【0014】更に上記の課題は微粒子複合めっき装置を
下記の構成のものとすることにより達成される。
Further, the above object can be achieved by using the fine particle composite plating apparatus having the following constitution.

【0015】.微粒子を複合しためっき液が満たされ
る槽と、めっき液撹拌手段と、めっき部品を鉛直軸に保
持する手段と、この保持手段を通る水平軸の周囲に保持
手段を回転させる第1の回転手段と、鉛直軸を回転させ
る第2の回転手段とを備えた微粒子複合めっき装置。
.. A tank filled with a plating solution containing fine particles, a plating solution stirring means, a means for holding the plating component on a vertical axis, and a first rotating means for rotating the holding means around a horizontal axis passing through the holding means. , A fine particle composite plating apparatus comprising: a second rotating means for rotating a vertical axis.

【0016】.微粒子を複合しためっき液が満たされ
る槽と、めっき液撹拌手段と、めっき部品を鉛直軸に保
持する手段と、この保持手段を通る水平軸の周囲に保持
手段を回転させる第1の回転手段と、鉛直軸を回転させ
る第2の回転手段と、槽にその出入口を接続しめっき液
を循環させる循環ポンプと、この循環ポンプの入口側に
設ける微粒子回収フイルタとを備えた微粒子複合めっき
装置。
.. A tank filled with a plating solution containing fine particles, a plating solution stirring means, a means for holding the plating component on a vertical axis, and a first rotating means for rotating the holding means around a horizontal axis passing through the holding means. A fine particle composite plating apparatus provided with a second rotating means for rotating a vertical shaft, a circulation pump for connecting the inlet and outlet of the tank to circulate a plating solution, and a fine particle recovery filter provided on the inlet side of the circulation pump.

【0017】.めっき液が満たされる槽と、この槽を
基準めっき液が満たされる領域と基準めっき液に微粒子
を複合しためっき液が満たされる領域とに区切る仕切り
板と、この複数の領域のめっき液をそれぞれ撹拌する撹
拌手段と、めっき部品を鉛直軸に保持する手段と、この
保持手段を通る水平軸の周囲に保持手段を回転させる第
1の回転手段と、鉛直軸を回転させる第2の回転手段
と、保持手段をめっき液中に浸したまま複数の領域を移
動させる移動手段とを備えた微粒子複合めっき装置。
.. A tank filled with the plating solution, a partition plate that divides this tank into an area filled with the reference plating solution and an area filled with the plating solution in which the reference plating solution contains fine particles, and the plating solutions in the plurality of areas are stirred. Stirring means, means for holding the plated component on the vertical axis, first rotating means for rotating the holding means around a horizontal axis passing through the holding means, and second rotating means for rotating the vertical axis. A fine particle composite plating apparatus comprising: a moving unit that moves a plurality of regions while the holding unit is immersed in a plating solution.

【0018】.上記、、の槽が湯槽の中に配置
されている微粒子複合めっき装置。
.. The fine particle composite plating apparatus in which the above tanks are arranged in a hot water tank.

【0019】.環状の流路を持ちめっき液を収納する
槽と、槽中のめっき液を環状の流路に沿って循環させる
還流手段と、環状の流路の少なくとも1か所に流路に交
差して配置された開閉可能の仕切り板と、仕切り板の下
流側に流路に交差して基準めっき液のみを通過させるフ
ィルタと、めっき部品を保持する手段と、保持手段をめ
っき液中で回転させつつ流路に沿って移動させる移動手
段とを備えた微粒子複合めっき装置。
.. A tank having an annular flow path for accommodating the plating solution, a reflux means for circulating the plating solution in the tank along the annular flow path, and at least one location of the annular flow path intersecting the flow path. Openable and closable partition plate, a filter that crosses the flow path on the downstream side of the partition plate and allows only the reference plating solution to pass, a means for holding the plated component, and a holding means for rotating while flowing in the plating solution. A fine particle composite plating apparatus having a moving means for moving along a path.

【0020】[0020]

【作用】旋回スクロールと固定スクロールのうちのいず
れか一方の表面に無電解ニッケル−リンめっきが被覆さ
れていると、前記両スクロールがアルミニウムで形成さ
れていても、めっき膜があるため、アルミニウム同士の
摺動がなく摺動面の焼き付き等の発生の恐れがないスク
ロ−ル圧縮機とすることができる。
When the electroless nickel-phosphorus plating is coated on the surface of either the orbiting scroll or the fixed scroll, even if both scrolls are made of aluminum, there is a plating film, and therefore aluminum does not adhere to each other. It is possible to provide a scroll compressor in which there is no sliding and there is no risk of seizure or the like on the sliding surface.

【0021】また、めっき膜内に微粒子、例えばSiC
などの硬度の高い物質の微粒子が分散され、且つめっき
膜表面に露出しているこれら微粒子がめっき膜に埋め込
まれ係止されているので、この微粒子がめっき膜表面か
ら剥離して研磨剤として動作することがなく、めっきさ
れた摺動面とめっきされない摺動面の双方の耐摩耗性が
向上する。
In addition, fine particles such as SiC are contained in the plating film.
Fine particles of a substance with high hardness such as are dispersed, and these fine particles exposed on the surface of the plating film are embedded and locked in the plating film, so these particles separate from the surface of the plating film and act as an abrasive. Wear resistance of both the plated sliding surface and the non-plated sliding surface is improved.

【0022】本発明に係る微粒子複合無電解ニッケル−
リンめっき膜形成に際しては、まず微粒子が混合された
めっき液内で無電解めっき処理が行われる。この第1の
段階で形成されためっき膜には、めっき液内に混合され
ている微粒子が埋め込まれた形になっているが、その表
面には、一部分だけがめっき膜表面から露出した微粒子
からめっき膜表面に付着した状態の微粒子まで色々な状
態の微粒子が混在している。次に、この状態のめっき膜
の上に、微粒子が混合されていないめっき液内で無電解
めっき処理が行われる。この第2の段階ではめっき膜に
は新たな微粒子は付着せずめっきの金属のみが付着する
ため、第1の段階に形成されためっき膜の表面に露出し
ていた微粒子は、めっき膜内に埋め込まれる。第2の段
階のめっき時間を長くすれば微粒子は、めっき膜内に埋
め込まれる。第2の段階のめっき時間を長くすれば微粒
子はめっき膜内に完全に埋め込まれるし、短くすれば微
粒子を例えば半分程度埋め込まれた状態にすることがで
きる。
Fine particle composite electroless nickel according to the present invention
When forming a phosphorous plating film, first, electroless plating is performed in a plating solution in which fine particles are mixed. The plating film formed in this first step has a form in which fine particles mixed in the plating solution are embedded, but only a part of the surface of the fine particles exposed from the surface of the plating film is formed. Fine particles in various states are mixed up to fine particles in a state of adhering to the surface of the plating film. Next, the electroless plating process is performed on the plating film in this state in a plating solution in which no fine particles are mixed. In this second step, new fine particles do not adhere to the plating film but only the metal of the plating adheres. Therefore, the fine particles exposed on the surface of the plating film formed in the first step are Embedded. If the plating time in the second step is lengthened, the fine particles will be embedded in the plating film. If the plating time in the second stage is lengthened, the fine particles will be completely embedded in the plating film, and if the plating time is shortened, the fine particles will be in a state of being embedded, for example, about half.

【0023】第2の段階のめっき処理を終了して得られ
ためっき膜表面の微粒子は、めっき層内に係止されてお
り、剥離しにくくなっている。これによりめっき膜表面
から剥離し摺動面に対して研磨剤となる微粒子が少なく
なり、スクロール表面の摩耗が低減される。
The fine particles on the surface of the plating film obtained after finishing the plating treatment in the second stage are locked in the plating layer and are not easily peeled off. As a result, the amount of fine particles that peel from the surface of the plating film and act as an abrasive on the sliding surface is reduced, and the abrasion of the scroll surface is reduced.

【0024】また、耐摩耗性を有する微粒子を複合させ
た層を薄くし、その上に微粒子を複合しない層を厚くす
ると、旋回スクロールと固定スクロールを組み立てた後
のなじみ運転時に微粒子を複合しない層の互いに摺動す
る部分が摩耗してもアルミニウムまで摩耗することがな
くなり、適正なシール効果を得ることができる。
If the layer containing fine particles having wear resistance is thinned and the layer not containing fine particles is thicker thereon, the layer not containing fine particles during familiar running after the orbiting scroll and the fixed scroll are assembled. Even if the parts that slide with each other wear, the aluminum does not wear, and a proper sealing effect can be obtained.

【0025】この時、どちらか一方の摩耗が進み微粒子
複合層に達しても、その後は相手部分の摩耗が進むた
め、アルミニウムの表面は保護される。このような互い
に摺動する部分のシール効果を得るための層はいわゆる
“なじみ層”である。
At this time, even if either one wears and reaches the fine particle composite layer, the other part wears thereafter and the aluminum surface is protected. The layer for obtaining the sealing effect of such sliding portions is a so-called "familiar layer".

【0026】このように摩耗により遊離する層は微粒子
を複合しない層であるため、微粒子が遊離し研磨剤とし
て働くことがない。又なじみ層を厚くすることにより、
スクロールの形状を高精度に加工することなく、その表
面に被覆した層によりシール効果のある適正形状が形成
される。
Since the layer that is released by abrasion is a layer that does not combine fine particles, the fine particles do not separate and do not act as an abrasive. By thickening the familiar layer,
An appropriate shape having a sealing effect is formed by the layer coated on the surface of the scroll without processing the shape of the scroll with high accuracy.

【0027】本発明のめっき装置は上記のめっき層を形
成するに最適なものである。
The plating apparatus of the present invention is optimal for forming the above-mentioned plating layer.

【0028】スクロール部材を保持する保持手段を自転
させるとともに鉛直軸の回りに回転させることにより、
めっき液が奥行きのある構造からなるスクロール部材の
全域に供給され均質なめっき層が形成される。
By rotating the holding means for holding the scroll member about its own axis and rotating it about the vertical axis,
The plating solution is supplied to the entire area of the scroll member having a deep structure to form a uniform plating layer.

【0029】又、微粒子を複合しためっき液の微粒子を
除去するフィルター及び仕切り板を備えることにより微
粒子複合めっき液と微粒子を複合しないめっき液とを形
成できるため容易に2層構造から成るめっき層を形成で
きる。
Further, since a fine particle composite plating solution and a plating solution which does not combine fine particles can be formed by providing a filter and a partition plate for removing fine particles of the plating solution containing fine particles, it is possible to easily form a plating layer having a two-layer structure. Can be formed.

【0030】[0030]

【実施例】以下、本発明の実施例を図1〜図10及び図
12を参照して説明する。
Embodiments of the present invention will be described below with reference to FIGS. 1 to 10 and 12.

【0031】まずめっきの前処理工程を図10に示す。
以後述べるめっき処理は、すべてこの前処理後行った。
なお、図中のAD−68F、AD−101、AD−30
1−3Xは、いずれも上村工業株式会社製の試薬であ
る。
First, the pretreatment process for plating is shown in FIG.
The plating treatments described below were all performed after this pretreatment.
In addition, AD-68F, AD-101, AD-30 in the figure
1-3X are all reagents manufactured by Uemura Industry Co., Ltd.

【0032】本発明の実施例1を図1に示す。図は、ス
クロールを形成するアルミニウム3の表面に被覆したS
iC複合無電解ニッケル−リンめっき膜1の断面を示
し、このめっき膜1はSiCの微粒子2を含んで形成さ
れており、SiC微粒子2はめっき膜1内に均一に分散
されている。
Example 1 of the present invention is shown in FIG. The figure shows S coated on the surface of aluminum 3 forming a scroll.
The cross section of the iC composite electroless nickel-phosphorus plating film 1 is shown, and this plating film 1 is formed including the SiC fine particles 2, and the SiC fine particles 2 are uniformly dispersed in the plating film 1.

【0033】更に、めっき膜1の上にSiC微粒子2の
入っていないニッケル−リンめっき層5が被覆されてい
る。このようなめっき層5には、スクロール部材の加工
精度及び組立て精度の誤差を補うことができる効果があ
る。すなわち一般にスクロール圧縮機では、旋回スクロ
ールと固定スクロールの間隙の大小によってその性能が
左右される。性能を高めるには高精度の加工と組立てに
より間隙を少なくすることが必要となるが、これには非
常な困難が伴う。そこで今所定厚さの耐摩耗性に欠ける
無電解ニッケル−リンめっきを、SiC複合無電解ニッ
ケル−リンめっき(以下めっきはすべて無電解めっきで
ある)上にほどこすと、稼働時に余分なニッケル−リン
めっき層は摩耗して膜厚が減少し、クリアランスは一定
に保たれる。言い換えれば、このめっき層はいわゆるな
じみ層であり、シール材の役目を果たすことになる。こ
のことにより、加工精度あるいは組立て精度の誤差を吸
収することができる。
Further, the nickel-phosphorus plating layer 5 containing no SiC fine particles 2 is coated on the plating film 1. Such a plating layer 5 has an effect of compensating for errors in processing accuracy and assembling accuracy of the scroll member. That is, the performance of a scroll compressor generally depends on the size of the gap between the orbiting scroll and the fixed scroll. Higher performance requires precision machining and assembly to reduce the gap, which is extremely difficult. Therefore, an electroless nickel-phosphorus plating having a predetermined thickness, which lacks wear resistance, is now applied onto the SiC composite electroless nickel-phosphorus plating (hereinafter, all plating is electroless plating). The phosphorus-plated layer is worn and its thickness is reduced, and the clearance is kept constant. In other words, this plating layer is a so-called familiar layer, and serves as a sealing material. This makes it possible to absorb an error in processing accuracy or assembly accuracy.

【0034】尚、図1にはSiC微粒子が完全にニッケ
ル−リンめっき層5に覆われた状態を示したが、SiC
微粒子を複合しないニッケル−リンめっき層を薄くする
と、SiC微粒子2は一部が表面に露出しめっき層1及
びめっき層5に係止された状態となる。
Although FIG. 1 shows a state in which the SiC fine particles are completely covered with the nickel-phosphorus plating layer 5,
When the nickel-phosphorus plating layer that does not combine fine particles is thinned, the SiC fine particles 2 are partially exposed on the surface and are in a state of being locked by the plating layers 1 and 5.

【0035】図2は本実施例においてSiC微粒子を複
合しためっき層を施した旋回スクロールの断面図であ
る。スクロール部材は図に示すように鏡板7とこの鏡板
7にほぼ垂直に形成したラップ8とからなり、図2の上
方から見るとこのラップ8が図11に示すようにうず巻
状を呈している。尚本実施例においては鏡板7の下方の
一部を除きほぼ全域にめっきを施したが、相手部材との
摺動部分のみにめっきをしても良い。
FIG. 2 is a sectional view of an orbiting scroll provided with a plating layer in which SiC fine particles are compounded in this embodiment. The scroll member comprises an end plate 7 and a wrap 8 formed substantially perpendicular to the end plate 7 as shown in the figure. When viewed from above in FIG. 2, the wrap 8 has a spiral shape as shown in FIG. .. In the present embodiment, plating is applied to almost the entire area except a part below the end plate 7, but plating may be applied only to the sliding portion with the mating member.

【0036】以上のようなSiC複合ニッケル−リンめ
っきは、以下に述べる方法により処理することができ
る。
The SiC composite nickel-phosphorus plating as described above can be treated by the method described below.

【0037】図3は被めっき物14を溶液中で回転させ
る機構を示したものである。本機構は、めっき液が満た
された槽12の上方に配置された移動手段である直線駆
動軸11と、直線駆動軸11に駆動されて水平方向に移
動する移動台27と、移動台27に回転可能に装着され
た中空の鉛直方向回転駆動軸28と、移動台に装着され
鉛直方向回転駆動軸28をその軸の周囲に回転させる回
転駆動手段10と、鉛直方向回転駆動軸28の内部に、
回転駆動軸28の軸心とほぼ平行に挿通された水平回転
駆動軸29と、水平回転駆動軸29に傘歯車を介して連
結され鉛直方向回転駆動軸28の側面に設けられた開口
30を通って駆動軸28の外部にほぼ水平に突出した水
平回転軸26と、水平回転軸26の先端に装着された保
持手段25と、鉛直方向回転駆動軸28の上端部に装着
され水平回転駆動軸29の上端部をその軸の周囲に回転
駆動する回転駆動手段9とを結んで構成されている。鉛
直方向回転駆動軸28は、その軸心をほぼ鉛直にしてそ
の下部側面の開口30がめっき液の液面より下になるよ
うに配置されている。
FIG. 3 shows a mechanism for rotating the object to be plated 14 in a solution. This mechanism includes a linear drive shaft 11 which is a moving means arranged above the bath 12 filled with the plating solution, a movable base 27 which is driven by the linear drive shaft 11 and moves in the horizontal direction, and a movable base 27. A hollow vertical rotary drive shaft 28 rotatably mounted, a rotary drive means 10 mounted on a moving table for rotating the vertical rotary drive shaft 28 around the shaft, and a vertical rotary drive shaft 28 inside the rotary rotary drive shaft 28. ,
A horizontal rotary drive shaft 29 inserted substantially parallel to the axis of the rotary drive shaft 28 and an opening 30 provided on the side surface of the vertical rotary drive shaft 28 connected to the horizontal rotary drive shaft 29 via a bevel gear. The horizontal rotary shaft 26 that projects substantially horizontally outside the drive shaft 28, the holding means 25 attached to the tip of the horizontal rotary shaft 26, and the horizontal rotary drive shaft 29 attached to the upper end of the vertical rotary drive shaft 28. Is connected to the rotation driving means 9 for rotating the upper end of the shaft around its axis. The vertical rotation drive shaft 28 is arranged such that its axial center is substantially vertical and the opening 30 on the lower side surface thereof is below the liquid level of the plating solution.

【0038】上記の機構は以下のように動作する。まず
保持手段25により被めっき物14がめっき液中に保持
される。回転駆動手段9が水平回転駆動軸29を回転さ
せると、水平回転軸26が傘歯車を介して回転され、保
持手段25に保持された被めっき物14が水平軸の周囲
に回転される。保持手段25は、被めっき物14の中心
軸がほぼ水平回転軸26の軸心と一致するように被めっ
き物14を保持しており、被めっき物14はそれ自身の
中心軸の周囲に回転する。また、回転駆動手段10が鉛
直方向回転駆動軸28を回転させると、水平回転軸26
はそれ自身の軸心の周囲に回転しつつ、鉛直方向回転駆
動軸28の開口30の回転とともに、鉛直軸の周囲に回
転する。
The above mechanism operates as follows. First, the holding means 25 holds the object to be plated 14 in the plating solution. When the rotary drive means 9 rotates the horizontal rotary drive shaft 29, the horizontal rotary shaft 26 is rotated via the bevel gear, and the plated object 14 held by the holding means 25 is rotated around the horizontal axis. The holding means 25 holds the object to be plated 14 such that the central axis of the object to be plated 14 substantially coincides with the axis of the horizontal rotary shaft 26, and the object to be plated 14 rotates around its own central axis. To do. When the rotary drive means 10 rotates the vertical rotary drive shaft 28, the horizontal rotary shaft 26 is rotated.
While rotating about its own axis, it rotates about the vertical axis as the opening 30 of the vertical rotation drive shaft 28 rotates.

【0039】めっき液中での上述の2方向の回転によ
り、めっき液及びめっき液中に浮遊している微粒子の動
きの方向と被めっき物14表面との相対関係が一定の状
態に留まることなく変化し、被めっき物14のめっきの
付着量の上下の差や、表裏の差がなくなり、表面全体で
めっき、微粒子が均一に付着する。また直線駆動軸11
により被めっき物14を左右に移動させ、槽の場所によ
る差を無くすことができる。次にSiC微粒子が混合さ
れていないめっき液に移動してめっきを行うことによ
り、めっき膜表面に混在していたさまざまな状態のSi
C微粒子がニッケル−リンめっき膜の中に埋め込まれて
いく。
By the above-described two-direction rotation in the plating solution, the relative relationship between the direction of movement of the plating solution and the fine particles floating in the plating solution and the surface of the object to be plated 14 does not remain constant. There is no difference between the upper and lower sides of the amount of plating adhered on the object to be plated 14 and the difference between the front and back sides, and the plating and fine particles are uniformly adhered to the entire surface. In addition, the linear drive shaft 11
Thus, the object to be plated 14 can be moved to the left and right, and the difference due to the location of the tank can be eliminated. Next, by moving to a plating solution in which SiC fine particles are not mixed and performing plating, Si in various states mixed on the surface of the plating film is mixed.
C fine particles are embedded in the nickel-phosphorus plating film.

【0040】以上のような機構により、スクロールのよ
うな複雑な形状のものでもSiC粒子が均一に分散した
複合めっきを得ることができる。
With the mechanism as described above, it is possible to obtain a composite plating in which SiC particles are uniformly dispersed even in a complicated shape such as a scroll.

【0041】実施例2を図4により説明する。図4は、
スクロールを形成するアルミニウム3の表面にSiC微
粒子を複合した無電解ニッケル−リンめっき層1と、そ
の上に無電解ニッケル−リンめっき層5を施したスクロ
ールの表面層を含む部分断面図である。表面層を除く部
分は、実施例1と同じである。本実施例においては、S
iC微粒子2を複合した無電解ニッケル−リンめっき層
1の厚さを2μm、無電解ニッケル−リンめっき層5の
厚さを15μmとして形成した。
The second embodiment will be described with reference to FIG. Figure 4
FIG. 3 is a partial cross-sectional view including an electroless nickel-phosphorus plating layer 1 in which SiC fine particles are compounded on the surface of aluminum 3 forming a scroll, and a surface layer of the scroll on which an electroless nickel-phosphorus plating layer 5 is applied. The part excluding the surface layer is the same as that of the first embodiment. In this embodiment, S
The electroless nickel-phosphorus plating layer 1 including the iC fine particles 2 was formed with a thickness of 2 μm and the electroless nickel-phosphorus plating layer 5 was formed with a thickness of 15 μm.

【0042】又、本実施例で用いたSiC微粒子2は、
このSiC微粒子2を複合しためっき層1が薄いためめ
っき層1の中に均一に分散するように粒径が0.1μm
以下の超微粒子を用いた。本実施例においては、なじみ
層となる無電解ニッケル−リンめっき層5を厚くしたた
め、実施例1の場合に比較しスクロールの加工精度及び
組立て精度の誤差を吸収する効果がより大きい。
The SiC fine particles 2 used in this embodiment are
Since the plating layer 1 including the SiC fine particles 2 is thin, the particle size is 0.1 μm so as to be uniformly dispersed in the plating layer 1.
The following ultrafine particles were used. In this embodiment, since the electroless nickel-phosphorus plating layer 5 serving as the familiar layer is thickened, the effect of absorbing the error in the working accuracy and assembling accuracy of the scroll is greater than that in the first embodiment.

【0043】実施例3を図5に示す。図に示すめっき装
置は、湯槽17と、湯槽17内に配置された槽12と、
槽12を第1、第2の二つの領域に仕切る可動式仕切り
板20と、槽12の上方に装着された被めっき物移動回
転機構(図3に記載したものと同様の機構であり、説明
は省略する)18と、前記二つの領域にそれぞれ配置さ
れた撹拌子19及びホットマグネチックスターラー13
とを含んで構成されている。第1の領域にはSiC微粒
子が混合されていないニッケル−リンめっき液15が、
第2の領域にはSiC微粒子が混合されていないニッケ
ル−リンめっき液16が、それぞれ満たされている。な
お、本実施例で混合したSiCの微粒子の粒径は0.1
μm程度であるが、最大1μm程度とするのが望まし
い。
Example 3 is shown in FIG. The plating apparatus shown in the figure includes a bath 17 and a bath 12 arranged in the bath 17.
A movable partition plate 20 for partitioning the tank 12 into two regions, a first and a second region, and a plated object moving / rotating mechanism mounted above the tank 12 (a mechanism similar to that described in FIG. 18), a stirrer 19 and a hot magnetic stirrer 13 respectively arranged in the two regions.
It is configured to include and. In the first region, the nickel-phosphorus plating solution 15 in which SiC particles are not mixed,
The second region is filled with the nickel-phosphorus plating solution 16 in which the SiC fine particles are not mixed. The particle size of the SiC particles mixed in this example is 0.1.
Although it is about μm, it is desirable that the maximum is about 1 μm.

【0044】まず被めっき物14はSiC微粒子が混合
されためっき液15の入った右側の第1の領域に入れら
れ、SiCの複合めっきの処理が行われる。このとき被
めっき物14は被めっき物回転移動機構18によって液
中で回転される。一方めっき液はホットマグネチックス
ターラー13と撹拌子19により撹拌される。この段階
では、ニッケル−リンめっき膜のなかにSiC微粒子が
均一に分散して埋め込まれためっき膜が形成される。所
定の時間後、可動式の仕切り板20が開かれ、被めっき
物14はすばやく左側のSiC微粒子が混合されていな
いめっき液16が満たされた第2の領域へ移動され、再
びめっきの処理が行われる。第1の領域から第2の領域
へ移動された段階では、形成されためっき膜の表面に
は、一部分だけがめっき膜表面から露出した微粒子から
めっき膜表面に付着しただけで全体が露出した状態の微
粒子まで色々な露出状態のSiC微粒子が混在してい
る。第2の領域では、めっき液の中にSiC微粒子が混
合されていないので、SiC微粒子を含まないニッケル
−リンめっき膜が形成され、時間の経過とともに、第2
の領域に移動したときにめっき膜表面に混在していたさ
まざまな状態のSiC微粒子が、次第にニッケル−リン
めっき膜に埋め込まれていく。なお、めっきは第1、第
2の領域とも無電解めっきである。
First, the object to be plated 14 is placed in the first region on the right side containing the plating solution 15 in which SiC particles are mixed, and the composite plating of SiC is performed. At this time, the object to be plated 14 is rotated in the liquid by the object to be plated rotation moving mechanism 18. On the other hand, the plating solution is stirred by the hot magnetic stirrer 13 and the stirring bar 19. At this stage, a plating film in which the SiC fine particles are uniformly dispersed and embedded in the nickel-phosphorus plating film is formed. After a predetermined time, the movable partition plate 20 is opened, and the object to be plated 14 is quickly moved to the second area on the left side, which is filled with the plating solution 16 in which the SiC fine particles are not mixed, and the plating process is performed again. Done. At the stage of moving from the first region to the second region, the entire surface of the formed plating film is exposed by only adhering to the plating film surface from the fine particles partially exposed from the plating film surface. The fine SiC particles of various exposed states are mixed. In the second region, since the SiC fine particles are not mixed in the plating solution, a nickel-phosphorus plating film containing no SiC fine particles is formed.
The SiC fine particles in various states, which were mixed on the surface of the plating film when moved to the region, are gradually embedded in the nickel-phosphorus plating film. The plating is electroless plating in both the first and second regions.

【0045】次に実施例4を図6に示す。図に示すめっ
き装置は、湯槽17と、湯槽17内に配置された槽12
と、槽12の上方に装着された被めっき物移動回転機構
(図3に記載したものと同様の機構であり、説明は省略
する)18と、槽12に底部に配置された撹拌子19
と、槽12の底部外方に配置されたホットマグネチック
スターラー13とを含んで構成されている。被めっき物
14にはSiC粒子が混合されためっき液15中でSi
C複合めっきの処理が行われる。めっき中、被めっき物
14は被めっき物移動回転機構(図3に記載したものと
同様の機構であり、説明は省略する)18によって回転
され、まためっき液も撹拌される。所定の時間後、被め
っき物14の回転とめっき液15の撹拌が停止される。
めっき液15の撹拌が停止されると、めっき液中のSi
C粒子は重いので沈降する。これを利用してめっき液の
上ずみのSiC粒子のないところで、第2段階のめっき
(SiC粒子の埋込のためのめっき)の処理が行われ
る。
Next, a fourth embodiment is shown in FIG. The plating apparatus shown in the figure includes a hot water tank 17 and a hot water tank 12 arranged in the hot water tank 17.
An object moving and rotating mechanism (a mechanism similar to that described in FIG. 3 and description thereof is omitted) 18 mounted above the tank 12, and an agitator 19 arranged at the bottom of the tank 12.
And a hot magnetic stirrer 13 arranged outside the bottom of the tank 12. In the plating solution 15 in which SiC particles are mixed, the object 14 to be plated contains Si.
C composite plating is performed. During plating, the object to be plated 14 is rotated by the object moving and rotating mechanism (a mechanism similar to that described in FIG. 3, description is omitted) 18, and the plating solution is also stirred. After a predetermined time, the rotation of the object to be plated 14 and the stirring of the plating solution 15 are stopped.
When the stirring of the plating solution 15 is stopped, Si in the plating solution 15
Since the C particles are heavy, they settle. Utilizing this, the second-stage plating (plating for embedding SiC particles) is performed where there is no upper SiC particle in the plating solution.

【0046】この方法によれば、めっきの処理を同一め
っき液内で行うことができ、かつ非常に簡単な装置で操
作も容易である。
According to this method, the plating process can be performed in the same plating solution, and the operation is easy with a very simple device.

【0047】実施例5を図7に示す。図に示すめっき装
置は、湯槽17と、湯槽17内に配置されSiC複合ニ
ッケル−リンめっき液15が満たされる槽12と、前記
めっき液を撹拌する撹拌手段である撹拌子19及びホッ
トマグネチックスターラー13と、被めっき物14をめ
っき液中に保存して回転、移動させる被めっき物移動回
転機構(図3に記載したものと同様の機構であり、説明
は省略する)18と、槽12にその出入口を接続されて
めっき液を循環させる循環ポンプ22と、循環ポンプの
入り口側に装着されて前記SiC複合ニッケル−リンめ
っき液15に含まれているSiC微粒子を回収するフィ
ルタ21とを含んで構成されている。
Example 5 is shown in FIG. The plating apparatus shown in the figure includes a hot water tank 17, a tank 12 arranged in the hot water tank 17 and filled with a SiC composite nickel-phosphorus plating solution 15, a stirrer 19 as a stirring means for stirring the plating solution, and a hot magnetic stirrer. 13, a plated object moving / rotating mechanism (a mechanism similar to that described in FIG. 3, description thereof is omitted) 18 for storing and rotating the plated object 14 in a plating solution, and a tank 12 It includes a circulation pump 22 connected to the inlet / outlet to circulate the plating solution, and a filter 21 mounted on the inlet side of the circulation pump to collect the SiC fine particles contained in the SiC composite nickel-phosphorus plating solution 15. It is configured.

【0048】本実施例によれば、被めっき物14は、ま
ずSiC微粒子を混合した液15内で第1段階のめっき
(SiC粒子を含むめっき)処理が施される。第1段階
のめっきの処理が終了すると、SiC粒子を混合した液
15は、槽の底部からポンプ22で抜きだされ、フィル
タ21を通って、SiC粒子が取り除かれ、めっき液だ
けが槽に戻される。めっき液中からSiC粒子が取り除
かれたのち、第2段階のめっき(SiC粒子を含まない
めっき)が行われる。この方法は、実施例4の改良型で
ある。実施例4と同様に同一溶液内でめっきの処理が行
われるが、上述のように、SiC粒子を溶液内から完全
に取り除く機構を持つことから、より確実にSiC粒子
をめっき層内に埋め込むことができる。
According to the present embodiment, the object to be plated 14 is first subjected to the first stage plating (plating containing SiC particles) in the liquid 15 in which SiC fine particles are mixed. When the treatment of the first stage plating is completed, the liquid 15 mixed with SiC particles is pumped out from the bottom of the tank by the pump 22, the SiC particles are removed through the filter 21, and only the plating solution is returned to the tank. Be done. After the SiC particles are removed from the plating solution, the second stage plating (plating not containing SiC particles) is performed. This method is an improved version of Example 4. Although the plating treatment is performed in the same solution as in Example 4, as described above, since the SiC particles are completely removed from the solution, the SiC particles should be more reliably embedded in the plating layer. You can

【0049】その他の例として実施例6を図8に示す。
図に示すめっき装置は、環状の流路をなしてめっき液を
収容する流水プール型槽12と、槽中のめっき液を環状
の流路に沿って循環させる循環手段(図示せず)と、環
状の流路に所定の間隔をおいて3個所に装着された開閉
可能の仕切り板20と、仕切り板20のうちの一つの下
流側に、仕切り板20と所定の間隔をおいて配置され仕
切り板20との間にSiC複合ニッケル−リンめっき液
領域を形成するフィルタ21と、被めっき物14をめっ
き液中に浸したまま回転させつつ流路に沿ってめっき液
の流れと逆方向に移動させる被めっき物移動回転機構2
4とを含んで構成されている。被めっき物移動回転機構
24は、被めっき物移動回転機構18と同様の保持手
段、回転手段を備え、環状の流路に沿って被めっき物を
移動させるように構成されている。
As another example, Embodiment 6 is shown in FIG.
The plating apparatus shown in the drawing is a running water pool type tank 12 that forms a ring-shaped flow path and stores a plating solution, and a circulation means (not shown) that circulates the plating solution in the tank along the ring-shaped flow path. An openable and closable partition plate 20 is installed in three places in the annular flow path at predetermined intervals, and a partition plate 20 is arranged at a predetermined interval with the partition plate 20 on the downstream side of one of the partition plates 20. A filter 21 that forms an SiC composite nickel-phosphorus plating solution region between the plate 20 and the plate 20, and the object to be plated 14 is rotated while being immersed in the plating solution, and is moved along the flow path in the direction opposite to the flow of the plating solution. Plated object moving and rotating mechanism 2
4 is included. The plated object moving / rotating mechanism 24 is provided with the same holding means and rotating means as the plated object moving / rotating mechanism 18, and is configured to move the plated object along the annular flow path.

【0050】本実施例は、めっき槽を流水プールのよう
な形にして、溶液の流れと逆方向に被めっき物14を自
転しながら動かす。まためっき槽には可動式の仕切り板
20が付いていて、被めっき物14は、SiC粒子が混
合したニッケル−リンめっき液15の入った槽中を通過
しつつ第1段階のめっき処理を行い、次いで、SiC粒
子が混合していない溶液16の入った槽へ移動して第2
の段階のめっき処理を行う。被めっき物14の移動速度
を加減することによって、処理されるめっきの膜厚を所
望の膜厚にすることができる。これは、量産化に対応す
ることができるめっきの処理装置である。
In this embodiment, the plating tank is shaped like a running water pool, and the object to be plated 14 is rotated while rotating in the direction opposite to the flow of the solution. Further, the plating tank is provided with a movable partition plate 20, and the object to be plated 14 is subjected to the first stage plating treatment while passing through a tank containing a nickel-phosphorus plating solution 15 in which SiC particles are mixed. , And then moved to the tank containing the solution 16 in which the SiC particles were not mixed,
Perform the plating treatment at the stage. By adjusting the moving speed of the object to be plated 14, the film thickness of the plating to be processed can be set to a desired film thickness. This is a plating processing device that can be mass-produced.

【0051】以上のような方法を用いて、SiC複合め
っきの上にSiC粒子を含まないめっきを施して、めっ
き表面にあるSiC粒子をめっき層内に埋め込む。
Using the method as described above, the SiC composite plating is plated with no SiC particles to embed the SiC particles on the plating surface in the plating layer.

【0052】また図9に、従来の方法によって形成した
SiC粒子複合無電解ニッケル−リンめっき(従来方法
による処理で微粒子がめっき膜表面上にあるめっき)
と、実施例3に示す装置で形成されたSiC複合無電解
ニッケル−リンめっき(図1に示す形状とした)の摺動
試験の結果を示す。なお、めっきは固定試験片に施し
た。
Further, FIG. 9 shows a SiC particle composite electroless nickel-phosphorus plating formed by a conventional method (plating in which fine particles are present on the surface of the plated film by the conventional method).
And the result of the sliding test of the SiC composite electroless nickel-phosphorus plating (having the shape shown in FIG. 1) formed by the apparatus shown in Example 3. The fixed test pieces were plated.

【0053】試験条件 (イ)試験片の形状 (1)固定試験片(円板状) 径37mm 厚さ12
mm (2)回転試験片(リング状) 外径26mm 内径1
6mm 厚さ12mm (ロ)摺動条件 (1)速度 3.14m/s (2)荷重 12.2kgf/cm2 (3)潤滑油 フレオールF56 (ハ)供試材 (1)固定試験片 AHS(11%Si含有A
1) (2)回転試験片 AHS(11%Si含有A
1) 図9から明らかなように、従来法の場合にはめっき処理
した面自身はほとんど摩耗していないが相手側を摩耗し
てしまう。しかし今回の本発明法の場合は両方共ごくわ
ずかな摩耗のみである。
Test conditions (a) Shape of test piece (1) Fixed test piece (disk shape) Diameter 37 mm Thickness 12
mm (2) Rotating test piece (ring shape) Outer diameter 26 mm Inner diameter 1
6mm Thickness 12mm (b) Sliding condition (1) Speed 3.14m / s (2) Load 12.2kgf / cm 2 (3) Lubricating oil Flare F56 (c) Specimen (1) Fixed test piece AHS ( 11% Si content A
1) (2) Rotation test piece AHS (A containing 11% Si
1) As is apparent from FIG. 9, in the case of the conventional method, the plated surface itself is hardly worn, but the other side is worn. However, in the case of the method of the present invention this time, only slight wear is observed in both cases.

【0054】上述の各実施例では、めっき膜中に分散さ
れる微粒子としてSiC微粒子を用いたが、SiC以外
に、SiO2、Al23、ZiO2などの酸化物、ダイヤ
モンド、硬度の高い金属などの、めっき液中に分散しや
すい微粒子を用いてもよい。また、これらの微粒子を埋
め込むめっき膜としては、実施例において用いたニッケ
ル−リンめっき膜のほかに、銅、クロム、すずなどのめ
っき膜を用いてもよい。
In each of the above-mentioned embodiments, SiC fine particles are used as fine particles dispersed in the plating film. However, in addition to SiC, oxides such as SiO 2 , Al 2 O 3 and ZiO 2 , diamond, and high hardness are used. Fine particles that are easily dispersed in the plating solution, such as metal, may be used. Further, as the plating film for embedding these fine particles, in addition to the nickel-phosphorus plating film used in the embodiment, a plating film of copper, chromium, tin or the like may be used.

【0055】図12は実施例7を説明する図であり、ス
クロ−ル圧縮機70の全体構造を示す断面図である。圧
縮部は、鏡板上にうず巻状のラップを有する固定スクロ
−ル40と、同じく鏡板上にうず巻状のラップを有する
旋回スクロ−ル8と、旋回スクロ−ル8の自転を防止す
るオルダムリング42からなり、固定スクロ−ル40及
び旋回スクロ−ル8のラップ同士を噛み合わせた構成と
なっている。この圧縮部では、旋回スクロ−ル8がシャ
フト45を介して旋回運動することにより、吸入口50
から吸入されたガスは旋回スクロ−ル6及び固定スクロ
−ル40により形成される空間(圧縮室)がスクロ−ル
中心方向に移動するに従って容積が減少されて圧縮され
る。圧縮されたガスは固定スクロ−ル中央に設けられた
吐出口52から吐出される。
FIG. 12 is a view for explaining the seventh embodiment and is a sectional view showing the entire structure of the scroll compressor 70. The compression section includes a fixed scroll 40 having a spiral wrap on the end plate, a swivel scroll 8 also having a spiral wrap on the end plate, and an Oldham for preventing rotation of the swirl scroll 8. It is composed of a ring 42, and has a configuration in which the wraps of the fixed scroll 40 and the turning scroll 8 are meshed with each other. In this compression unit, the swirl scroll 8 swivels through the shaft 45, so that the suction port 50
The volume of the gas sucked from is reduced and compressed as the space (compression chamber) formed by the swirl scroll 6 and the fixed scroll 40 moves toward the center of the scroll. The compressed gas is discharged from the discharge port 52 provided at the center of the fixed scroll.

【0056】本実施例においては、前記実施例2により
表面を被覆したアルミニウム合金製のスクロ−ル部材を
旋回スクロ−ル部材及び固定スクロ−ル部材の両方に用
いた。通常の運転条件による運転(4時間)後の両スク
ロ−ル部材はなじみ層部分が数個所で摩耗し一部にSi
C微粒子2を複合した層が露出していたが、アルミニウ
ム部分は露出せず、性能も良好な結果を示した。
In this example, the aluminum alloy scroll member whose surface was coated according to Example 2 was used as both the swivel scroll member and the fixed scroll member. After operating under normal operating conditions (4 hours), the familiar layers of both scroll members were worn at several places, and some of them became Si.
The layer in which the C fine particles 2 were compounded was exposed, but the aluminum portion was not exposed, and the performance was also good.

【0057】また、アルミニウム合金製旋回スクロ−ル
部材の表面に、前記実施例1に説明した方法によりSi
C微粒子複合ニッケル−リンめっき皮膜(平均厚さ7μ
m)と、ニッケル−リンめっきのみの皮膜(平均厚さ3
μm)の構成から成るめっき層を被覆してスクロ−ル圧
縮機に組込み通常の運転条件により運転した。固定スク
ロ−ル部材には鋳鉄(FC25)を用いた。
On the surface of the aluminum alloy swirl scroll member, Si was applied by the method described in the first embodiment.
C fine particle composite nickel-phosphorus plating film (average thickness 7μ
m) and a film of nickel-phosphorus plating only (average thickness 3
The coating was applied to a scroll compressor and operated under normal operating conditions. Cast iron (FC25) was used for the fixed scroll member.

【0058】運転後の旋回スクロ−ルの摺動部表面はニ
ッケル−リンめっき層がわずかに摩耗し一部にSiCを
複合した皮膜も露出していた。一方、固定スクロ−ル部
材の摺動部分は、ほとんど摩耗せず良好な摺動面を呈し
ていた。
On the surface of the sliding portion of the orbiting scroll after the operation, the nickel-phosphorus plating layer was slightly worn, and a film composed of SiC was partially exposed. On the other hand, the sliding portion of the fixed scroll member was hardly worn and exhibited a good sliding surface.

【0059】本実施例では、表面皮膜をスクロ−ル部材
の表面のほぼ全域に被覆したものを用いたが、固定スク
ロ−ルのラップ部と鏡板のラップ側、旋回スクロ−ルの
ラップ部と鏡板のラップ側及びオルダムリング組込部等
の摺動部分のみにめっきを施したものを用いても同様の
効果が得られた。
In this embodiment, the surface film of the scroll member is applied to almost the entire surface of the scroll member. However, the wrap portion of the fixed scroll, the lap side of the end plate, and the wrap portion of the orbiting scroll are used. The same effect was obtained even when the plating was applied only to the lap side of the end plate and the sliding part such as the Oldham ring built-in part.

【0060】[0060]

【発明の効果】本発明によれば、アルミニウム合金で形
成した旋回スクロール及び固定スクロールの少なくとも
いずれか一方を、その表面に微粒子を複合した無電解ニ
ッケル−リンめっき層とその上に無電解ニッケル−リン
めっき層を施したもので形成するか、微粒子を複合した
無電解ニッケル−リンめっき層の表面が無電解ニッケル
−リンのみの層からなるもので形成することにより、め
っき層の微粒子が脱落しないためスクロール圧縮機の耐
摩耗性が向上する。又、微粒子を複合した無電解ニッケ
ル−リンめっき層の上に設けた無電解ニッケル−リンめ
っき層を厚くすることにより無電解ニッケル−リンめっ
き層がなじみ層となりシール性と耐摩耗性をかね備えた
スクロール圧縮機とすることができる。又、本発明のめ
っき装置を用いることによりスクロール部材の表面に微
粒子複合層と微粒子を複合しない層の2層からなる表面
被膜を容易に形成できる。
According to the present invention, at least one of an orbiting scroll and a fixed scroll formed of an aluminum alloy, an electroless nickel-phosphorus plated layer having fine particles on the surface thereof and an electroless nickel-plated layer thereon. Fine particles of the plating layer do not fall off by forming with a phosphorus plating layer or by forming the surface of the electroless nickel-phosphorus plating layer that is a composite of fine particles with a layer containing only electroless nickel-phosphorus Therefore, the wear resistance of the scroll compressor is improved. Also, by increasing the thickness of the electroless nickel-phosphorus plating layer provided on the electroless nickel-phosphorus plating layer in which fine particles are combined, the electroless nickel-phosphorus plating layer becomes a familiar layer and has sealing property and wear resistance. Can be a scroll compressor. Further, by using the plating apparatus of the present invention, a surface coating consisting of two layers, a fine particle composite layer and a layer not containing fine particles, can be easily formed on the surface of the scroll member.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例1のめっき状況を示す断面図である。FIG. 1 is a cross-sectional view showing a plating situation of Example 1.

【図2】本発明のめっき処理を施したスクロール部材の
断面図である。
FIG. 2 is a cross-sectional view of a scroll member that has been plated according to the present invention.

【図3】実施例1に用いためっき装置の斜視図である。FIG. 3 is a perspective view of a plating apparatus used in Example 1.

【図4】実施例2のめっき状況を示す断面図である。FIG. 4 is a cross-sectional view showing a plating situation of Example 2.

【図5】本発明の実施例を示すめっき装置の断面図であ
る。
FIG. 5 is a sectional view of a plating apparatus showing an embodiment of the present invention.

【図6】本発明の実施例を示すめっき装置の断面図であ
る。
FIG. 6 is a sectional view of a plating apparatus showing an embodiment of the present invention.

【図7】本発明の実施例を示すめっき装置の断面図であ
る。
FIG. 7 is a sectional view of a plating apparatus showing an embodiment of the present invention.

【図8】本発明のめっき装置の説明図である。FIG. 8 is an explanatory diagram of a plating apparatus of the present invention.

【図9】摺動試験結果を示すグラフである。FIG. 9 is a graph showing a sliding test result.

【図10】めっきの前処理を示す手順図である。FIG. 10 is a procedure diagram showing a pretreatment for plating.

【図11】スクロ−ル部材の斜視図である。FIG. 11 is a perspective view of a scroll member.

【図12】スクロ−ル圧縮機の断面図である。FIG. 12 is a cross-sectional view of a scroll compressor.

【符号の説明】[Explanation of symbols]

1…SiC複合ニッケル−リンめっき膜、 2…SiC
粒子、3…アルミニウム材、 5…ニッケル−リンめっ
き層、 6…旋回スクロール、7…鏡板、 8…ラッ
プ、 9…回転駆動手段、 10…回転駆動手段、11
…移動手段(直線駆動軸)、 12…槽、13…ホット
マグネチックスタ−ラ−、 14…被めっき物、15…
SiC混合ニッケル−リンめっき液、 16…ニッケル
−リンめっき液、17…湯槽、 18…被めっき物移動
回転機構、 19…撹拌子、20…可動式仕切り板、
21…フィルタ、 22…循環ポンプ、23…液の流れ
る方向、 24…被めっき物移動回転機構、25…保持
手段、 26…水平回転軸、 27…移動台、28…鉛
直方向回転駆動軸、 29…水平回転駆動軸、 30…
開口、40…固定スクロ−ル、 42…オルダムリン
グ、 45…シャフト、50…吸入口、 52…吐出
口、 60…スクロ−ル部材、70…スクロ−ル圧縮
機。
1 ... SiC composite nickel-phosphorus plating film, 2 ... SiC
Particles, 3 ... Aluminum material, 5 ... Nickel-phosphorus plating layer, 6 ... Orbiting scroll, 7 ... End plate, 8 ... Wrap, 9 ... Rotation drive means, 10 ... Rotation drive means, 11
... moving means (linear drive shaft), 12 ... tank, 13 ... hot magnetic stirrer, 14 ... object to be plated, 15 ...
SiC mixed nickel-phosphorus plating solution, 16 ... Nickel-phosphorus plating solution, 17 ... Hot water tank, 18 ... Plating object moving / rotating mechanism, 19 ... Stirrer, 20 ... Movable partition plate,
21 ... Filter, 22 ... Circulation pump, 23 ... Liquid flow direction, 24 ... Plated object moving and rotating mechanism, 25 ... Holding means, 26 ... Horizontal rotating shaft, 27 ... Moving base, 28 ... Vertical rotating drive shaft, 29 ... horizontal rotation drive shaft, 30 ...
Opening, 40 ... Fixed scroll, 42 ... Oldham ring, 45 ... Shaft, 50 ... Suction port, 52 ... Discharge port, 60 ... Scroll member, 70 ... Scroll compressor.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 飯塚 董 栃木県下都賀郡大平町大字富田800番地 株式会社日立製作所栃木工場内 (72)発明者 阿部 信雄 栃木県下都賀郡大平町大字富田800番地 株式会社日立製作所栃木工場内 (72)発明者 池田 和雄 栃木県下都賀郡大平町大字富田800番地 株式会社日立製作所栃木工場内 (72)発明者 岡本 譲治 静岡県清水市村松390番地 株式会社日立 製作所清水工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toru Iizuka 800 Tomita, Ohira-cho, Shimotsuga-gun, Tochigi Prefecture Tochigi Plant, Hitachi, Ltd. (72) Nobuo Abe Oita-cho, Shimotsuga-gun, Tochigi 800 Address Tomita 800 Hitachi Co., Ltd.Tochigi Plant (72) Inventor Kazuo Ikeda 800 Tomita, Ohira-cho, Shimotsuga-gun, Tochigi Prefecture Hitachi Co., Ltd.Tochigi Plant (72) Inventor, Joji Okamoto 390 Muramatsu, Shimizu City, Hitachi Co., Ltd.Shimizu Plant, Hitachi Ltd.

Claims (15)

【特許請求の範囲】[Claims] 【請求項1】鏡板にうず巻状のラップを形成した旋回ス
クロールと、同様に鏡板にうず巻状のラップを形成した
固定スクロールとを噛み合わせ、前記旋回スクロールを
自転防止機構により自転を阻止し旋回運動させるもので
あって、前記旋回スクロール及び固定スクロールはアル
ミニウム合金からなりその両方若しくは一方の表面に微
粒子を複合させた無電解ニッケル−リンめっき層を形成
してなるスクロール圧縮機において、前記微粒子複合無
電解ニッケル−リンめっき層は微粒子をその内部に封じ
込み、その表面はニッケル−リンのみの層から成ること
を特徴とするスクロール圧縮機。
1. An orbiting scroll having a spiral wrap formed on an end plate and a fixed scroll having a spiral wrap formed on the end plate are meshed with each other, and the orbiting scroll is prevented from rotating by a rotation preventing mechanism. The orbiting scroll and the fixed scroll are made to orbit, and the orbiting scroll and the fixed scroll are made of an aluminum alloy, and a scroll compressor formed by forming an electroless nickel-phosphorus plating layer on the surface of both or one of them, A scroll compressor characterized in that a composite electroless nickel-phosphorus plating layer encloses fine particles inside thereof and its surface is composed of a layer of nickel-phosphorus only.
【請求項2】鏡板にうず巻状のラップを形成した旋回ス
クロールと、同様に鏡板にうず巻状のラップを形成した
固定スクロールとを噛み合わせ、前記旋回スクロールを
自転防止機構により自転を阻止し旋回運動させるもので
あって、前記旋回スクロール及び固定スクロールはアル
ミニウム合金からなりその両方若しくは一方の表面に微
粒子を複合させた無電解ニッケル−リンめっき層を形成
してなるスクロール圧縮機において、前記微粒子複合無
電解ニッケル−リンめっき層の上に無電解ニッケル−リ
ンめっき層を形成したことを特徴とするスクロール圧縮
機。
2. An orbiting scroll having a spiral wrap formed on the end plate and a fixed scroll having a spiral wrap formed on the end plate are meshed with each other, and the orbiting scroll is prevented from rotating by a rotation preventing mechanism. The orbiting scroll and the fixed scroll are made to orbit, and the orbiting scroll and the fixed scroll are made of an aluminum alloy, and a scroll compressor formed by forming an electroless nickel-phosphorus plating layer on the surface of both or one of them, A scroll compressor having an electroless nickel-phosphorus plating layer formed on a composite electroless nickel-phosphorus plating layer.
【請求項3】鏡板にうず巻状のラップを形成した旋回ス
クロールと、同様に鏡板にうず巻状のラップを形成した
固定スクロールとを噛み合わせ、前記旋回スクロールを
自転防止機構により自転を阻止し旋回運動させるもので
あって、前記旋回スクロール及び固定スクロールはアル
ミニウム合金からなりその両方若しくは一方の摺動面に
微粒子を複合させた無電解ニッケル−リンめっき層を形
成してなるスクロール圧縮機において、前記微粒子複合
無電解ニッケル−リンめっき層は微粒子をその内部に封
じ込み、その表面はニッケル−リンのみの層から成るこ
とを特徴とするスクロール圧縮機。
3. An orbiting scroll in which a spiral wrap is formed on an end plate is meshed with a fixed scroll in which an end wrap is similarly formed in an end plate, and the orbiting scroll is prevented from rotating by a rotation preventing mechanism. In a scroll compressor for orbiting, the orbiting scroll and the fixed scroll are made of an aluminum alloy and are formed with an electroless nickel-phosphorus plated layer in which fine particles are compounded on both or one sliding surface of the aluminum alloy. A scroll compressor characterized in that the fine particle composite electroless nickel-phosphorus plating layer encloses fine particles inside thereof, and the surface thereof is composed of a layer of only nickel-phosphorus.
【請求項4】鏡板にうず巻状のラップを形成した旋回ス
クロールと、同様に鏡板にうず巻状のラップを形成した
固定スクロールとを噛み合わせ、前記旋回スクロールを
自転防止機構により自転を阻止し旋回運動させるもので
あって、前記旋回スクロール及び固定スクロールはアル
ミニウム合金からなりその両方若しくは一方の摺動面に
微粒子を複合させた無電解ニッケル−リンめっき層を形
成してなるスクロール圧縮機において、前記微粒子複合
無電解ニッケル−リンめっき層の上に無電解ニッケル−
リンめっき層を形成したことを特徴とするスクロール圧
縮機。
4. An orbiting scroll having a spiral wrap formed on an end plate and a fixed scroll having a spiral wrap similarly formed on the end plate are meshed with each other, and the orbiting scroll is prevented from rotating by a rotation preventing mechanism. In a scroll compressor for orbiting, the orbiting scroll and the fixed scroll are made of an aluminum alloy and are formed with an electroless nickel-phosphorus plated layer in which fine particles are compounded on both or one sliding surface of the aluminum alloy. The fine particle composite electroless nickel-electroless nickel-on the phosphorus plating layer
A scroll compressor in which a phosphorous plating layer is formed.
【請求項5】前記無電解ニッケル−リンめっき層の厚さ
が、前記微粒子複合無電解ニッケル−リンめっき層の厚
さより厚いことを特徴とする請求項2又は4に記載のス
クロール圧縮機。
5. The scroll compressor according to claim 2, wherein the thickness of the electroless nickel-phosphorus plating layer is thicker than the thickness of the fine particle composite electroless nickel-phosphorus plating layer.
【請求項6】前記微粒子が炭化珪素、二酸化珪素、アル
ミナ、二酸化ジルコニア及びダイヤモンドのいずれかか
らなることを特徴とする請求項1乃至4のいずれかに記
載のスクロール圧縮機。
6. The scroll compressor according to claim 1, wherein the fine particles are made of any one of silicon carbide, silicon dioxide, alumina, zirconia dioxide and diamond.
【請求項7】スクロール部材の表面にめっき層を形成す
るスクロール部材のめっき方法において、微粒子を複合
した無電解ニッケル−リンめっき液を満たした浴槽内で
めっきした後、無電解ニッケル−リンめっき液を満たし
た浴槽内で再びめっきすることを特徴とするスクロール
部材のめっき方法。
7. A method of plating a scroll member, wherein a plating layer is formed on the surface of the scroll member, after plating in a bath filled with an electroless nickel-phosphorus plating solution containing fine particles, and then an electroless nickel-phosphorus plating solution. A method for plating a scroll member, characterized in that plating is performed again in a bath filled with water.
【請求項8】スクロール部材の表面にめっき層を形成す
るスクロール部材のめっき方法において、微粒子を複合
した無電解ニッケル−リンめっき液を満たした浴槽内
で、前記微粒子をめっき液中に浮遊させてめっきした
後、前記微粒子を浴槽下部に沈殿させ、浴槽上部のめっ
き液で再びめっきすることを特徴とするスクロール部材
のめっき方法。
8. A method for plating a scroll member in which a plating layer is formed on the surface of the scroll member, wherein the fine particles are suspended in a plating solution in a bath filled with an electroless nickel-phosphorus plating solution containing fine particles. After the plating, the fine particles are settled in the lower part of the bath, and the plating solution is re-plated with a plating solution in the upper part of the bath.
【請求項9】スクロール部材の表面にめっき層を形成す
るスクロール部材のめっき方法において、微粒子を複合
した無電解ニッケル−リンめっき液を満たした浴槽内で
前記微粒子をめっき液中に浮遊させてめっきした後、前
記めっき液をフィルターを通るように循環させて前記微
粒子を除去し、再びめっきすることを特徴とするスクロ
ール部材のめっき方法。
9. A method of plating a scroll member, wherein a plating layer is formed on the surface of the scroll member, wherein the particles are suspended in a plating solution in a bath filled with an electroless nickel-phosphorus plating solution containing particles and plated. After that, the plating solution is circulated through a filter to remove the fine particles, and plating is performed again.
【請求項10】前記スクロール部材が、めっき中の一定
期間若しくは全期間において前記スクロール部材を通る
回転軸及び/又は前記スクロール部材を外れた回転軸に
取り付けられ回転することを特徴とする請求項7乃至9
のいずれかに記載のスクロール部材のめっき方法。
10. The scroll member is attached to and rotated by a rotary shaft passing through the scroll member and / or a rotary shaft deviating from the scroll member during a fixed period or the whole period during plating. Through 9
The method for plating a scroll member according to any one of 1.
【請求項11】微粒子を複合しためっき液が満たされる
槽と、前記めっき液を撹拌する撹拌手段と、めっきされ
る部品をめっき液中に保持し鉛直軸に取り付けられる保
持手段と、前記保持手段を通る水平軸の周囲に前記保持
手段を回転させる第1の回転手段と、前記鉛直軸を回転
させる第2の回転手段とを備えてなることを特徴とする
微粒子複合めっき装置。
11. A bath filled with a plating solution containing fine particles, stirring means for stirring the plating solution, holding means for holding a component to be plated in the plating solution and attached to a vertical shaft, and the holding means. A fine particle composite plating apparatus comprising: a first rotating means for rotating the holding means around a horizontal axis passing through and a second rotating means for rotating the vertical axis.
【請求項12】微粒子を複合しためっき液が満たされる
槽と、前記めっき液を撹拌する撹拌手段と、めっきされ
る部材をめっき液中に保持し鉛直軸に取り付けられる保
持手段と、前記保持手段を通る水平軸の周囲に前記保持
手段を回転させる第1の回転手段と、前記鉛直軸を回転
させる第2の回転手段と、前記槽にその出入口を接続さ
れてめっき液を循環させる循環ポンプと前記循環ポンプ
の入口側に装着されて前記微粒子を回収するフィルタと
を備えてなることを特徴とする微粒子複合めっき装置。
12. A tank filled with a plating solution containing fine particles, stirring means for stirring the plating solution, holding means for holding a member to be plated in the plating solution and attached to a vertical shaft, and the holding means. A first rotating means for rotating the holding means around a horizontal axis passing through, a second rotating means for rotating the vertical axis, and a circulation pump for circulating a plating solution with its inlet and outlet connected to the bath. A fine particle composite plating apparatus, comprising: a filter mounted on the inlet side of the circulation pump to collect the fine particles.
【請求項13】めっき液が満たされる槽と、前記槽を少
なくとも基準めっき液が満たされる領域と前記基準めっ
き液に微粒子を複合しためっき液が満たされる領域とに
区切る仕切り板と、前記複数の領域に配置されめっき液
を撹拌する撹拌手段と、めっきされる部品をめっき液中
に保持し鉛直軸に取り付けられる保持手段と、前記保持
手段を通る水平軸の周囲に前記保持手段を回転させる第
1の回転手段と、前記鉛直軸を回転させる第2の回転手
段と、前記保持手段のめっき液中に浸したまま前記複数
の領域を移動させる移動手段とを備えてなることを特徴
とする微粒子複合めっき装置。
13. A tank filled with a plating solution, a partition plate partitioning the tank into at least a region filled with a reference plating solution and a region filled with a plating solution containing fine particles in the reference plating solution, and the partition plate. A stirring means disposed in the region for stirring the plating solution; a holding means for holding the component to be plated in the plating solution and attached to a vertical shaft; and a rotating means for rotating the holding means around a horizontal axis passing through the holding means. Fine particles comprising: a first rotating means, a second rotating means for rotating the vertical shaft, and a moving means for moving the plurality of regions while being immersed in the plating solution of the holding means. Complex plating equipment.
【請求項14】前記槽が湯槽の中に配置されていること
を特徴とする請求項11乃至13のいずれかに記載の微
粒子複合めっき装置。
14. The fine particle composite plating apparatus according to claim 11, wherein the bath is arranged in a hot water bath.
【請求項15】環状の流路をなしてめっき液を収納する
槽と、前記槽中のめっき液を前記環状の流路に沿って循
環させる還流手段と、前記環状の流路の少なくとも1か
所に前記流路に交差して配置された開閉可能の仕切り板
と、前記仕切り板の下流側に前記流路に交差して配置さ
れ前記仕切り板との間に基準めっき液に微粒子を複合し
た微粒子複合めっき液領域を形成するめっき液中の基準
めっき液のみを通過させるフィルタと、めっき部品をめ
っき液中に保持する保持手段と、前記保持手段をめっき
液中で回転させつつ前記流路に沿って移動させる移動手
段とを備えることを特徴とする微粒子複合めっき装置。
15. A tank for forming a ring-shaped flow path for accommodating a plating solution, a reflux means for circulating the plating solution in the tank along the ring-shaped flow path, and at least one of the ring-shaped flow paths. A partition plate that can be opened and closed and that is disposed so as to intersect with the flow path at a location, and a partition plate that is disposed so as to intersect with the flow path at the downstream side of the partition plate and that is composed of fine particles in a standard plating solution A filter that passes only the reference plating solution in the plating solution that forms the fine particle composite plating solution region, a holding means that holds the plating component in the plating solution, and a flow path while rotating the holding means in the plating solution. A fine particle composite plating apparatus comprising: a moving unit that moves along the same.
JP4070609A 1991-03-29 1992-03-27 Fine particle composite plating equipment Expired - Fee Related JP3031045B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4070609A JP3031045B2 (en) 1991-03-29 1992-03-27 Fine particle composite plating equipment

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP6674191 1991-03-29
JP3-66741 1991-03-29
JP4070609A JP3031045B2 (en) 1991-03-29 1992-03-27 Fine particle composite plating equipment

Publications (2)

Publication Number Publication Date
JPH0586483A true JPH0586483A (en) 1993-04-06
JP3031045B2 JP3031045B2 (en) 2000-04-10

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ID=26407942

Family Applications (1)

Application Number Title Priority Date Filing Date
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4429911A1 (en) * 1993-08-23 1995-03-02 Toyoda Automatic Loom Works Coating structure for a movable element of a compressor
WO2003038148A1 (en) * 2001-11-02 2003-05-08 Ebara Corporation Plating apparatus and plating method
US7264453B2 (en) * 2003-03-31 2007-09-04 Kabushiki Kaisha Toyota Jidoshokki Horizontal scroll compressor having a connecting passage on the opposite side of a suction port for connecting a motor accommodating chamber with a suction chamber
WO2008059907A1 (en) * 2006-11-17 2008-05-22 Mitsubishi Heavy Industries, Ltd. Method for forming corrosion resistant plating layer and rotating machine
US7556483B2 (en) * 2003-03-31 2009-07-07 Kabushiki Kaisha Toyota Jidoshokki Electronic compressor having a reservoir chamber and an oil return passage for connecting the reservoir chamber with a suction chamber
JP2013191640A (en) * 2012-03-12 2013-09-26 Mitsubishi Materials Corp Substrate for power module and manufacturing method of the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4429911A1 (en) * 1993-08-23 1995-03-02 Toyoda Automatic Loom Works Coating structure for a movable element of a compressor
DE4429911B4 (en) * 1993-08-23 2004-09-02 Kabushiki Kaisha Toyota Jidoshokki, Kariya scroll compressor
WO2003038148A1 (en) * 2001-11-02 2003-05-08 Ebara Corporation Plating apparatus and plating method
US7332198B2 (en) 2001-11-02 2008-02-19 Ebara Corporation Plating apparatus and plating method
US7264453B2 (en) * 2003-03-31 2007-09-04 Kabushiki Kaisha Toyota Jidoshokki Horizontal scroll compressor having a connecting passage on the opposite side of a suction port for connecting a motor accommodating chamber with a suction chamber
US7556483B2 (en) * 2003-03-31 2009-07-07 Kabushiki Kaisha Toyota Jidoshokki Electronic compressor having a reservoir chamber and an oil return passage for connecting the reservoir chamber with a suction chamber
WO2008059907A1 (en) * 2006-11-17 2008-05-22 Mitsubishi Heavy Industries, Ltd. Method for forming corrosion resistant plating layer and rotating machine
JP2013191640A (en) * 2012-03-12 2013-09-26 Mitsubishi Materials Corp Substrate for power module and manufacturing method of the same

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