JPH0585346B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a rubber chip tile used as a walking tile, etc., which is adhered to a surface to be constructed such as an indoor or outdoor flooring.

[Conventional technology]

Traditionally, rubber chip tiles for walking are used by being attached to the subfloor surface indoors or outdoors, but in order to use them to attach the subfloor surface, first, the base surface must be coated with an organic solvent-based synthetic resin. Alternatively, a rubber-based adhesive or the like is applied over a wide area, and the tiles are successively adhered to the applied surface.

The conventional manufacturing method for such walking rubber chip tiles is to first press-mold a mass of rubber chips mixed with a curable resin using a press under a large pressure of about 10 kg/cm ² , and then heat it. This is a manufacturing method in which a rubber chip block molded product of a considerable thickness is produced by curing, and then this is sliced to a desired thickness to produce rubber chip tiles of a predetermined thickness.

On the other hand, a construction method that does not use rubber chip tiles is to apply a mixture of rubber chip mass and curable resin directly to the subfloor surface to the desired thickness, and then finish by rolling the top surface with a hot roller. There is.

[Problem to be solved by the invention]

In the conventional method of attaching walking rubber chip tiles to the subfloor surface as described above, it is extremely difficult to uniformly apply the adhesive to the required thickness on the subfloor surface, resulting in uneven application. easy. Particularly in areas where there are steps or uneven surfaces on the base surface, corners at protruding or upper corners, or edges along side walls, the adhesive may not be applied sufficiently, resulting in unapplied areas. Sometimes. Correspondingly applied tiles therefore have the disadvantage that they are not sufficiently adhered or that some parts of the tiles are raised above the underlying surface from the beginning. In addition to this, this construction method
As time elapses between the application of the adhesive and the installation of the tile, the surface to which the adhesive is applied often dries too much, resulting in a decrease in adhesive strength or a lack of adhesive strength. This brings about the disadvantage that initial adhesion strength cannot be obtained, and a uniform and good tile-laying construction surface cannot be obtained over the entire surface to be constructed.

Furthermore, since this conventional rubber chip tile is manufactured by the method described above, slicing work using a press molding machine and a slicing device is required, which makes the manufacturing work cumbersome and increases the manufacturing cost. It is accompanied by inconveniences such as difficulty in

On the other hand, the method of laying and coating a mixture of rubber chips and curable resin directly on the subfloor surface and rolling the top surface with a hot roller to finish the work requires complicated work at the construction site, increases work time, and It takes more than 24 hours for the resin to harden, making it impossible to walk during that time, and especially in the winter when the temperature is low, it takes even more time to harden, making it even more inconvenient and inefficient. be. Furthermore, in the case of outdoor construction,
If the resin is exposed to rain before it is cured, uncured resin may flow out, making it impossible to completely cure the resin. In this case too,
Adhesion to the underlying surface is not sufficient throughout. A further disadvantage is that, unlike tiling, it is difficult to partially repair the paved surface over time, and it is usually necessary to remove even a good paved surface, making the repair work cumbersome and wasteful.

[Means to solve the problem]

The present invention provides a rubber chip tile that eliminates the above-mentioned inconveniences in the pasting of rubber chip tiles for walking. It is made by covering a thermofusible film with a heat-fusible film.

Furthermore, the present invention solves the above-mentioned disadvantages of the conventional rubber chip tile manufacturing method and provides a method for manufacturing rubber chip tiles that can be mass-produced easily and inexpensively. One side of the film is coated with a hot-melt adhesive, and a mixture of a mass of rubber chips and a curable adhesive as a binder is coated on the upper surface of the coated layer, and then a rubber chip molding layer of a certain thickness is formed by pressure. Along with forming
It is characterized by curing a curable adhesive to obtain a laminated sheet.

Furthermore, the present invention eliminates the inconveniences associated with the conventional construction method using rubber chip tiles, and makes it possible to easily and reliably adhere all rubber chip tiles to the entire predetermined subsurface surface with a large initial adhesion force, and to achieve good results. The purpose of the present invention is to provide a construction method for rubber chip tiles that can obtain a rubber chip tile construction surface that is suitable for use in construction. The method is characterized in that the adhesive layer is melted and the melted surface of the adhesive layer is attached to the surface to be applied.

[Effect]

Since the rubber chip tile of the present invention has a heat-melt adhesive layer on one side and a heat-melt film on the outer surface of the adhesive layer, the rubber chip tiles can be stacked and stored for storage, etc.
In addition, it is easy to transport and handle. When adhering to a work surface such as a floor subsurface, by applying flame from a burner or hot air from a hot air blower to the entire back surface of the rubber chip tile, the heat-fusible film will melt and the adhesive will melt in a short time. As the layer melts, the molten material of the film enters the molten adhesive layer, and its surface becomes the molten surface of the adhesive layer, so the entire molten surface is used to adhere to the surface to be applied. be able to. In this case, the thermofusible film is about 10
If the thickness is extremely thin, about 30 microns, it will melt by heating with a burner or hot air blower, easily penetrate into the molten adhesive layer, and disappear from the surface.
A high adhesion force over the entire surface of the adhesive melt layer can be quickly and easily obtained, ensuring good adhesion of each tile.

The thermofusible film is generally a synthetic resin film, and its thickness is preferably in the range of about 10 to 30 microns. A minimum thickness of about 10 microns is sufficient as a supporting base material during the production of rubber chip tiles and as a protective material for the surface of the adhesive layer, and a thickness of about 30 microns is especially instantaneous. Hot melt adhesive is approximately 0.5
Preferably it is a polymer modified asphalt with a thickness of ~3 mm and a softening point in the range of 100-120°C. If the thickness is at least about 0.5 mm, the amount of asphalt heated and melted by a torch burner or hot air blower will be sufficient to envelop the molten material of the film and sufficiently bond the entire back surface of the tile to the surface to be installed. Approximately 3
The thickness of 1 mm is such that the amount of asphalt heated and melted does not protrude from the joints of the tiles, resulting in a good-looking waterproof construction surface.

The polymer modified asphalt has at least about
If it has a softening point of 100°C, the adhesive strength will not decrease even when exposed to direct sunlight in midsummer, especially when the tile is attached as an outdoor walking tile.
The softening temperature of approximately 120℃ is the tile manufacturing process.
When coating the upper surface of a hot-melt film in a heated and molten state, the rubber chips of the present invention can be coated by heating and melting at a low temperature of 180°C or less, and the film does not melt due to the heat, and the rubber chips of the present invention can be coated easily and smoothly. Tile manufacturing method can be performed.

According to the method for manufacturing rubber chip tiles of the present invention, a hot-melt film is used as a base material, the mixture can be applied stably and well through the adhesive-coated surface, and a rubber chip molding layer can be formed. By the pressure curing treatment, the rubber chip molding layer becomes a rubber chip molding plate, and at the same time, the stable and strong rubber chip tile of the present invention having an adhesive layer and a heat-melt film integrally laminated and bonded on one side of the plate is obtained. It will be done.

In this case, the manufacturing method of the present invention may be a batch method or a continuous manufacturing method depending on the dimensions of the hot-melt film base material, and after manufacturing the laminated sheet by the above-mentioned pressurization and curing. , which can be cut into tile products of a predetermined size.
Further, in this case, since the pressing force is extremely small, it is possible to provide a product that is relatively bulky, lightweight, has relatively low elasticity, and has excellent adhesion stability.

In addition, in the production method of the present invention, if a long film is used as the heat-fusible film, continuous production is possible and productivity can be significantly improved. In addition, in the manufacturing method of the present invention, the laminated molded sheet may be subjected to a curing treatment to further complete its curing, if necessary.

In this manufacturing method, in particular, when the mixture is applied after applying a primer to the upper surface of the hot-melt adhesive, the rubber chip molded plate of the product rubber chip tile and the adhesive layer are The peel strength between the rubber chips is extremely increased, and a stable and robust rubber chip tile having the adhesive layer firmly provided on the back side of the rubber chip molded plate can be obtained.

〔Example〕

Next, examples of the present invention will be described in detail.

FIG. 1 shows one example of the rubber chip tile of the present invention, 1 is a rubber chip molded plate constituting its main body, and according to the present invention, the rubber chip molded plate 1
The rubber chip tile P of the present invention is constructed by providing a heat-melting adhesive layer 2 on one side of the rubber chip tile P and applying a heat-melting film 3 to the surface of the adhesive layer. Preferably, by interposing a primer 4 between the rubber chip molded plate 1 and the heat-melt adhesive layer 2, mutual peel strength is high. Layer 2 is extremely strongly bonded, resulting in an even better rubber chip tile product that is stable and robust.

The rubber chip molded plate 1 may be a rubber chip tile manufactured by the conventional manufacturing method described above. That is, this is immediately polymerized on the top surface of the hot-fusible adhesive layer coated on the top surface of the hot-fusible film 3, or polymerized after being coated with a primer and bonded by pressure to obtain the rubber chip tile of the present invention. It will be done.
The rubber chip molded plate in this case has a hardness of about 60 to 70 and a bulk specific gravity of about 1.4 to 1.5. In particular, as the rubber chip tile P of the present invention, the hardness and bulk specific gravity of the rubber chip molded plate are extremely low, so it is extremely lightweight and easy to handle during transportation and pasting work, and has moderate elasticity and can be easily pasted. If a product with improved properties and walkability, or a product with appropriate water absorbency is desired, it can be produced by the rubber chip tile production method of the present invention, which will be described later. According to this, the slicing process required for manufacturing rubber chip tiles using the conventional method can be omitted, so a significantly lower pressing force is required.
As a result, a rubber chip tile consisting of a rubber chip molded plate 1 having a hardness of about 40 to 50 and a bulk specific gravity of about 0.8 to 0.5 can be manufactured, and a product satisfying the above requirements can be obtained.

The rubber chip tile P shown in FIG. 1 has the above-mentioned properties obtained by the manufacturing method of the present invention.

The rubber chip molding plate 1 is made by pressurizing a mixture of a mass (group) of rubber chips A and an appropriate amount of curable resin B as a binder, and hardening and molding the mixture in a predetermined compressed state. . As the rubber chips, from an economical point of view, it is preferable to use old tires finely ground to a particle size of about 1 to 3 mm. The binder that fixes the rubber chip mass in a constant molded state includes moisture-curable polyurethane resin, liquid polybutadiene resin,
Epoxy resin etc. are used, and as needed,
A curing agent, a curing accelerator, and an inorganic colored pigment are added and mixed. When using a moisture-curable resin, it will react with the moisture contained in the rubber chips and coloring pigments and harden, but to accelerate the reaction, add 0.6% water to the resin.
It may be added in an amount of about 1.0% by weight. The mixing ratio of rubber chip mass and curable resin is generally about 20 parts by weight of resin to 100 parts by weight of rubber chips. When a coloring pigment is added, it is generally added in an amount of about 5 to 15% by weight based on the resin.

The thickness of the rubber chip molded plate 1 is relatively thick, and is generally at least about 5 mm thick and up to 50 mm thick.

The adhesive for the meltable adhesive layer 2 that is pressed onto one side of the rubber molded plate 1 may be a synthetic resin that easily melts under the flame of a burner and produces adhesive properties, or straight asphalt, blown asphalt, catalytic blown asphalt, or rubber. - Any asphalt-based adhesive such as polymer-modified asphalt such as asphalt may be used. Asphalt-based adhesives are preferably used, most preferably polymer-modified asphalts. The polymer-modified asphalt is prepared by mixing straight asphalt with a resin such as SBS (styrene-butadiene-styrene) rubber, APP (atactic polypropylene) resin, or EVA (ethylene-vinyl acetate) resin in a molten state. , thereby improving the temperature properties and increasing the tackiness of the asphalt. It is preferable to use a meltable adhesive having a softening point in the range of 100 to 120°C in the production method of the present invention described later and when used as an outdoor walking tile. For example, when preparing the polymer-modified asphalt with a range of 80 to 100, a blending ratio of 100 parts by weight of straight asphalt to 21 parts by weight of SBS rubber or 23 parts by weight of APP resin, each having a softening point of 100°C can be obtained. With a blending ratio of 100 parts by weight of 80-100 straight asphalt to 25 parts by weight of SBS rubber or 27 parts by weight of APP resin, products having a softening point of 120°C can be obtained. Among polymers
SBS rubber easily mixes with asphalt, and the obtained modified asphalt exhibits excellent low-temperature flexibility and is suitably used.

In addition, if necessary, inorganic fillers such as talc, calcium carbonate, silica sand, and dolomite are mixed into the hot-melt adhesive in a range of about 10 to 30% by weight based on asphalt to maintain high adhesive strength. However, the adhesive layer can be stably maintained when exposed to direct radiation such as sunlight.

The thickness of the hot-melt adhesive layer 2 is preferably at least about 0.5 mm in consideration of uneven surfaces and in order to achieve sufficient adhesion. On the other hand, when tiles are adhered and laid one after another on a construction surface, it is preferable to limit the thickness to a maximum of about 3 mm so that the adhesive does not protrude from the joints of the tiles.

The heat-fusible film 3 covering and bonding the outer surface of the hot-fusible adhesive layer 2 is easily melted by a burner during the installation of tiles, as will be described later.
It needs to be so thin that even if it is mixed into the hot-melt adhesive layer, it will not adversely affect its adhesiveness, in other words, it needs to be in a small amount. Generally, synthetic resin films are used, and high density polyethylene resin or polypropylene resin films are particularly suitable;
Preferably, the thickness is in the range of about 10-30 microns.
As will be described later, the hot-melt film functions as a supporting base material during tile production and as a covering material to protect the outer surface of the product tile.
Preferably, it has a thickness of at least about 10 microns. Furthermore, in the construction, it is preferable to melt the material in a short time using a burner, so it is advantageous to limit the thickness to about 30 microns at most.

A more preferred rubber chip tile P of the present invention is:
The peel strength between the rubber chip molded plate 1 and the heat-melt adhesive layer 2 is large, and the heat-melt adhesive layer 2
is extremely firmly bonded to the back surface of the rubber chip molded plate 1. It is sufficient that the peel strength is at least 0.5 Kgf/cm ² . As will be described later in the manufacturing process, therefore, it is preferable to use a primer, if desired, to ensure high peel strength. The primer coating layer 4 of the product P shown in the drawing was formed by such a manufacturing method. The material of the primer coating layer 4 is, for example, an emulsion-based primer such as an acrylic copolymer resin emulsion or a chloroprene rubber latex, and in particular, an acrylic copolymer resin emulsion having a glass transition point of -5 to 0°C. is optimal.

The rubber chip tile of the present invention described above is mainly used as an indoor or outdoor walking tile, and may also be used as a wall tile if desired. How to use it will be described later.

Next, an example of the method for producing rubber chip tiles of the present invention will be described.

The manufacturing method may be a batch method or a continuous manufacturing method. In the case of batch type, preferably in the molding frame,
Prepare a rectangular hot-melt film that has been cut to a predetermined size in advance, use this as a base material, and uniformly coat the entire top surface with a hot-melt adhesive to a predetermined thickness, and then apply emulsion to the entire top surface. After uniformly spraying the primer liquid for molds, etc., a mixture of pre-adjusted rubber chips, curable resin, and curing agent in a predetermined ratio is filled, and then pressure is applied from above with a pressure roll or a pressure plate. After a rubber chip molding layer of a predetermined thickness is compression-molded and heated for a predetermined period of time to perform a curing treatment, the pressure plate is removed to produce a predetermined rubber chip tile of the present invention. If necessary, this may be cured afterwards. By repeating this operation, mass production in batches is possible. Additionally, if a smaller sized tile is desired, the tile is further cut.

FIG. 2 shows an example of the continuous production method for rubber chip tiles of the present invention. Pre-prepared long and wide strip thickness 10
A thermofusible film 3 made of high-density polyethylene resin or polypropylene resin with a diameter of 30 microns is pulled forward from the supply drum 5 as a base material. The delivered strip film base material 1 is passed through a guide roll 6 and coated with a roll coater or a knife coater.
In the illustrated embodiment, a hot-melt adhesive 2 with a softening point adjusted in advance is coated on one side with a roll coater 7.
The polymer modified asphalt at a temperature in the range of 100-120°C is applied to a thickness of about 0.5-3 mm, preferably about 1-2 mm. In this case, the polymer-modified asphalt is preferably heated to a temperature in the range of 160 to 180°C and kept at a viscosity that allows easy coating.
Thus, the hot-melt film base material 1 provided with the coating layer 2 of the modified asphalt is cooled by air cooling or water cooling (not shown), and the temperature of the film base material 3 reaches approximately 90°C. After being cooled, it is placed on the first belt conveyor 8 and transferred to one side, and during the transfer, an emulsion-based primer is uniformly applied to the upper surface of the coating layer 2 by a primer spraying device 9 of 0.1 ~0.3
Spread at a rate of Kg/m ² . The moisture in the primer is rapidly evaporated and solidified by the residual heat of the sheet to form the primer coating layer 4. As the emulsion primer, for example, an acrylic copolymer resin emulsion primer is used. Next, particles with a diameter of 1 to 3 mm, which have been filled in the hopper in advance, are placed on the top surface of the primer-treated coating layer 2 on the base material 3, which is transferred at a constant speed, from a hopper type feeder 10 provided above. A mixture 1 made by uniformly mixing rubber chips, a curable resin, and at least a curing agent at a predetermined blending ratio is supplied in fixed amounts at a time and laminated to a uniform thickness over the entire surface.
Reference numeral 11 indicates guide plates provided along both ends of the base material, thereby preventing the mixture 1 from protruding from both ends of the sheet.

Next, a pair of pressure rolls 12, 12 are arranged on which the transfer base material 3 is placed with a predetermined distance between the upper and lower sides.
The mixture layer 1 is formed into a rubber chip molding layer 1 having a constant thickness. The pressing force in this case is
For example, let it be 500Kg/ ^m2 . In this way, in order to finish the mixture layer 1 into a rubber chip molding layer 1 having a desired thickness, it is necessary to adjust the supply amount in advance, taking into account the reduction in thickness due to pressurization. A comfortable walking feeling can be obtained by setting the thickness of the rubber chip molding layer 1 to about 5 mm or more, but preferably about 10 mm.
The thickness is set within the range of ~30mm.

After pressure molding, the base material 3 on which the rubber chip forming layer 1 is laminated is moved on the second conveyor 113 in front, and then transferred to a heating box 14 which is approximately the same as the full width of the base material 9 in front or is wider and longer. After being heated for 8 to 12 minutes at a temperature below the softening point of the polymer-modified asphalt, ie at a temperature of 90 DEG to 110 DEG C., it leaves the box. During this time, the rubber chip molding layer 1 is thermally cured. The heating source of the heating box 14 is
Far-infrared heaters, infrared heaters, etc. can be used, but in order to effectively cure a thick rubber chip molding layer, it is preferable to use a far-infrared heater.
The laminated sheet S obtained in this way is
The material is transferred to a conveyor 15, where it is sequentially cut into predetermined dimensions by a cutting blade 16 between the second and third conveyors 13 and 15. A large number of laminated molded sheets P obtained by cutting in this manner are stored as they are in a warehouse or the like, and preferably, the large number of sheets are placed in a curing room using a cart 17 and maintained at 30 to 40°C. It can be brought into a room and cured for 24 hours to accelerate hardening and make it more complete. The hardness of the rubber chip molded layer 1 of the laminated molded sheet P obtained in this way has a measured value of 40 or more on a JIS hardness meter,
It had sufficient hardness. In other words, this constitutes the rubber chip forming plate 1 which is the main body of the product rubber chip tile P after cutting. If the laminated molded sheet P cut in this way is manufactured using a long base material 3 whose width is the same as the width of the planned tile from the beginning, the laminated molded sheet P cut in this way is By cutting, a rubber chip tile product of the present invention having a predetermined size is immediately obtained. In addition, when using a long base material 3 whose width is multiple times the width of the planned tile, in addition to the above-mentioned cross-cutting, in addition to the above-mentioned cross-cutting, the width of the long base material 3 is further cut at intervals of the predetermined tile width in the width direction. The tile product is then cut into a tile product with predetermined dimensions. In this case, it is preferable that the upper and lower two sheets be rotated and cut through a slitter. In this way, the rubber chip tiles P of the present invention as shown in the first figure are continuously mass-produced. The dimensions and shape of the product tile are arbitrary; for example, 300mm x 300
mm, 500mm x 500mm square, 300mm x 500mm
For example, it has a rectangular shape.

The rubber chip molded plate 1 of the rubber chip tile obtained in this way has a hardness of 40 to 60 and a bulk specific gravity.
A value of about 0.6 to 0.8 is preferable, and because it is lightweight, it is easy to transport and apply, and since there is no rebound elastic force during application, there is no lifting from the surface to be applied, and stable application is possible. It has characteristics such as no rebound when walking, non-slip and comfortable walking properties, and also has moderate water absorbency and does not cause water puddles on the upper surface.

The rubber chip tile of the present invention thus obtained is mainly used for walking, and an embodiment of the method for applying the same will be described with reference to FIG.

The worker places the tile P on the floor subfloor surface G with the back side facing up, and evenly applies the flame of the torch burner T to the entire back side to heat it, first melting the heat-melting film 3, and then melting the heat-melting film 3. Immediately after melting the adhesive layer 2, it is pressed and adhered to the base surface G with the melted surface facing downward. The heat of the molten asphalt is absorbed by the base, and the asphalt cools and solidifies, so that it is firmly adhered to the base. By repeating this operation and sequentially laying out each tile P as shown in the figure, a tile paved surface can be formed. Even if a hot air blower is used instead of the torch burner described above, the back surface of the tile can be heated and melted in the same manner as in the case of the torch burner. As the heating device, for example, a Leister hot air blower is used.

According to the construction method of the present invention, the heat-fusible film is melted by the burner or the hot-air blower and simultaneously penetrates into the molten layer of the hot-fusible adhesive. At this time, the flame of the burner or the force of hot air facilitates its invasion. In this way, the surface instantaneously changes to the molten surface of the bonding agent layer, so that it can be pressed with the entire surface of the adhesive molten layer, and at the same time, the heat of the molten adhesive is radiated to the substrate and the temperature of the adhesive decreases rapidly. solidify. In this way, each tile can be well adhered to the underlying surface on its entire surface, and there are no defects on the underlying surface that occur in conventional construction methods, where the tiles are applied after applying an adhesive to the underlying surface. There is no possibility that the tiles will be applied completely or in a raised state, and a stable tile-attached construction surface can be formed over the entire surface.

Next, a more specific example will be described.

Example 1 An iron formwork with inner dimensions of 410 mm x 345 mm and height of 20 mm was placed on a flat iron plate with dimensions of 450 mm in length and width, and a polyethylene resin film with a thickness of 15 microns was used as the base material, and one side of it was 65% by weight of Strehl asphalt with a penetration of 80 to 100, 15% by weight of SBS rubber (manufactured by Asahi Kasei Corporation, Tuffrene A), 20% by weight of talc.
A base material made by coating SBS rubber-modified asphalt with a softening point of 110°C to a thickness of 1.1 mm is cut to approximately the same dimensions as the inner dimensions of the steel formwork, and SBS is applied to the bottom of the formwork. Lay the rubber-modified asphalt with the coated side facing up, and use a spray gun to apply acrylic copolymer resin emulsion (manufactured by Saiden Chemical Co., Ltd., YC-101) on top of it as a primer.
After spraying in an amount of 100 g/m ² , it was dried with hot air at 50° C. for 3 minutes. Separately, 1,270 g of rubber chips with a particle size of 1 to 3 mm (manufactured by Muraoka Rubber Co., Ltd.), one-component moisture-curing urethane resin (TP1221, manufactured by Dainippon Ink and Chemicals Co., Ltd.)
257g, curing accelerator (manufactured by Dainippon Ink and Chemicals)
A mixture of 17.2 g and 171 g of Bengara (manufactured by Toda Kogyo Co., Ltd.) was stirred for 5 minutes using an all-purpose mixer and mixed uniformly, and a mixture was applied to the top surface of the coating layer in the iron mold so that the surface was as flat as possible. It was stacked and packed like this. The material was then rolled using an iron roll with a surface length of 410 mm, a diameter of 20 mm, and a weight of 1340 g. The pressure in this case is 0.05Kg/cm ²
I went there. Next, this was left in a thermostat adjusted to 100°C for 10 minutes to harden the resin and produce rubber chip tiles. The sample taken out from the thermostat was removed from the mold and left in a room maintained at 30°C for 24 hours to further cure sufficiently. The hardness of the rubber chip tile was 45 on a JIS hardness meter. or,
Its bulk specific gravity was 0.75.

Example 2 The following compounding composition was used as a mixture, and the mixture was immediately flattened from the surface without applying a primer to the same modified asphalt coating layer as in Example 1. Rubber chip tiles were produced in the same manner as in Example 1, except that they were laminated and filled in the same manner as in Example 1.

Rubber chips (manufactured by Muraoka Rubber Co., Ltd.) 1270g Moisture-curable liquid polybutadiene (MC50 manufactured by Idemitsu Petrochemical Co., Ltd.) 257g Bengara 171g The hardness of the produced rubber chip tiles was 41, and the bulk specific gravity was 0.78.

Example 3 A long and wide strip film made of polypropylene resin with a thickness of 10 microns was used as the base material, and the penetration was 80 to 100.
Straight asphalt 62% by weight, Toughprene
Modified asphalt with a softening point of 120°C, which was obtained by melting and homogeneously mixing 16% by weight of A and 22% by weight of talc, was coated on one side of the film to a thickness of 1.0 mm using a roll coater at a melting temperature of 180°C. Next, place the modified asphalt on the conveyor with the side coated with it facing up, and while moving at a constant speed, apply 0.2 kg/0.2 kg of acrylic copolymer resin emulsion (manufactured by Saiden Chemical Co., Ltd., YC-101) using a spray device. Sprayed at a rate of m ² . After the water in the emulsion has evaporated, a mixture of rubber chips and a curable resin having the composition shown in Example 1 is mixed uniformly in advance, and the mixture is poured from a metering feeder over the entire surface width of the substrate on the conveyor. Laminated to a thickness of mm. A pair of guide iron plates 11 having a height of 20 mm were provided in advance along both side edges of the laminated base material to prevent the rubber chip mixture from protruding from both side edges of the base material. Next, the rubber chip mixture layer was passed between a pair of upper and lower pressure rolls to be pressurized. The pressure at this time is 500
Kg/m ² and the thickness of the rubber chip layer after pressurization was 10 mm. Next, the laminated base material after pressure molding was passed through a heating box adjusted to 100° C. for 10 minutes to harden the mixture layer, thereby forming a rubber chip molded plate. The laminated molded sheet that came out of the heating box was cut into pieces of 2 m to produce laminated molded sheets of predetermined dimensions. Next, a large number of the laminated molded sheets were left in a room maintained at 30° C. for 24 hours to further cure the rubber chip molded sheets. After curing in this manner for 24 hours, the laminated sheet was passed through a rotating blade slitter having two upper and lower sheets and cut to produce a large number of 300 mm square rubber chip tiles of the present invention.

Example 4 The rubber chip tiles shown in Example 3 were
It was pasted on an asbestos slate plate measuring 910mm x 8mm. With the back side of the tile facing up, the flame from a torch burner was applied evenly to the entire back side of the tile, first melting the polypropylene resin film and then melting the modified asphalt, which was completely melted in about 20 seconds. did. It was melted and immediately adhered to the base. This process was repeated and the tiles were successively pasted and laid out. A good tiled surface was obtained in which all the tiles were equally firmly adhered to the asbestos slate slab.

Collect 70mm x 70mm samples from several arbitrary locations,
A tensile test was conducted according to the adhesive strength test method of JIS A6909 to determine the adhesive strength. A test was conducted on 5 sheets and the average value was found to be 6.3Kgf/cm ²
It was confirmed that the tile was firmly adhered to the base.

〔Effect of the invention〕

As described above, according to the present invention, the rubber chip tile is composed of a molded rubber chip plate, a heat-melt adhesive layer is provided on one side, and a heat-melt film is coated on the outer surface of the rubber chip tile. The front panel not only provides the convenience of being stacked for handling such as transportation and storage, but when using it, the construction method of the present invention allows the film on the back side of the tile and the underlying layer to be heated using a torch burner or the like. By melting the adhesive layer and pressing the molten surface against the installation surface such as the subfloor surface, each tile can be reliably adhered to the installation surface.
The adhesion work can be carried out quickly, and the various inconveniences mentioned above that occur in the conventional construction method, which involves applying an adhesive to the work surface and then adhering the tiles to the applied surface, can be avoided. In this way, a good tile construction surface can be formed over the entire surface to be constructed.

In this case, the thickness of the thermofusible film is about 10 to
When the thickness is 30 microns, the film can cover and protect the meltable adhesive layer well, and can be melted in a short time using a burner. In addition, when the thickness of the hot-melt adhesive layer is approximately 0.5 mm or more, it is heated and melted with a burner or hot air blower, and the surface of the molten layer can provide sufficient adhesion to uneven substrates. Moreover, when the thickness is about 3 mm or less, good adhesion can be achieved without the adhesive protruding from the outer edge of the tile when it is applied to the base. In addition, when the softening point of the adhesive is in the range of 100 to 120°C, the adhesive strength will decrease even if the tile is exposed to direct sunlight in midsummer after being installed as a walking tile on the roof of a building. On the other hand, in the manufacturing method of the present invention, when a thermoplastic film is used as a base material and the adhesive is applied by heating and melting on the top surface, the heating temperature is The temperature is sufficient to be 180° C. or lower, and the film can be coated and formed well without melting.

Further, according to the method for manufacturing rubber chip tiles of the present invention, a heat-melt adhesive layer is coated on the top surface of a heat-melt film as a base material, and a mixture of a rubber chip mass and a curable resin is further applied on the top surface. Since the sheet is laminated and then subjected to pressure molding and curing treatment to produce a laminated sheet, it can be manufactured either in batches or continuously. In this case, when a long material is used as the heat-fusible film, productivity can be improved. In addition, the laminated sheet can be completely cured by curing it if necessary. According to this manufacturing method, compared to compression molding a rubber chip mixture under high pressure using a conventional press machine, the bulk specific gravity and hardness of the rubber chip molded plate are extremely small, and it is possible to manufacture lightweight rubber chip tiles. This improves handling, adhesion, and walkability during transportation and application work.
Furthermore, in this manufacturing method, when a primer is applied to the top surface of the adhesive coating layer and then a molded layer of the mixture is bonded to the top surface by pressure heating as described above, the adhesive layer is applied to the tile. It has the effect of providing a stable and robust rubber chip tile product that is extremely firmly bonded to the back surface of the molded plate.

[Brief explanation of the drawing]

FIG. 1 is a side view of an example of the rubber chip tile of the present invention, FIG. 2 is a side view of an example of a manufacturing apparatus for carrying out the method of manufacturing the rubber chip tile of the present invention, and FIG. 1 shows a slope view of an example of the implementation of the rubber chip tile construction method of the present invention. 1...Rubber chip molding plate, rubber chip molding layer, 2
...Hot melt adhesive layer, 3... Heat meltable film, base material, 4... Primer, P... Rubber chip tile of the present invention, S... Laminate molded sheet, 5... Supply drum, 7
...Coater, 8...First conveyor, 9...Primer spray device, 10...Feeder, 12...Pressure roll, 13...Second conveyor, 14...Heating box, 16...Cutting blade, T...Torch burner, G...
Construction surface, subfloor surface.

Claims (1)

[Scope of Claims] 1. A rubber chip tile comprising a rubber chip molded plate with a heat-melt adhesive layer on one side and a heat-melt film coated on the surface of the adhesive layer. 2. The rubber chip tile according to claim 1, wherein a primer coating layer is interposed between the rubber chip molded plate and the hot bath meltable adhesive layer. 3. The rubber chip molded plate is made by molding and curing a mixture of rubber chip mass and curable resin into a plate shape, and the heat-melting adhesive layer has a thickness of about 0.5 to 3 mm and a temperature range of about 100 to 120°C. Rubber chip tile according to claim 1 or 2, comprising a polymer-modified asphalt having a softening point, said hot-melt film comprising a synthetic resin film having a thickness of about 10 to 30 microns. 4 A heat-melt film is used as a base material, one side of the film is coated with a heat-melt adhesive cured by heating at a temperature at which the film does not melt, and a mass of rubber chips and hardening are applied to the upper surface of the coated layer. The method is characterized in that after laminating a mixture of curable adhesives to a desired uniform thickness, a rubber chip molding layer of a constant thickness is formed by applying pressure, and at the same time, the curable adhesive is cured to form a laminated molded sheet. A method for manufacturing rubber chip tiles. 5. A thermofusible synthetic resin film with a thickness of 10 to 30 microns is used as a base material, and on one side of the film, approximately 0.5 to 3 mm of a thermofusible adhesive made of polymer-modified asphalt with a softening point of about 100 to 120°C is applied. coated to a thickness of
On top of the coating layer, at least about 50% of the mass of rubber chips with a particle size of about 1 to 3 mm and a curable adhesive are applied.
After laminating the sheets to a thickness of mm, the rubber chips are pressurized to form a molded layer of a certain thickness, the curable adhesive is cured by heating, and the resulting laminated molded sheet is cut into desired dimensions. The method for producing a rubber chip tile according to claim 4. 6. The method for producing rubber chips according to claim 4 or 5, characterized in that the laminated molded sheet is subjected to a curing treatment in the following manner. 7. The method for producing rubber chip tiles according to claim 4 or 5, characterized in that after applying a primer to the upper surface of the coating layer of the hot-melt adhesive, the mixture is laminated to a desired thickness. 8. The method for producing rubber chip tiles according to claim 5, wherein the thermofusible film is long. 9. Heating the back side of the rubber chip tile according to claim 1, 2 or 3 with a torch burner or a hot air blower to melt the heat-meltable film and the adhesive layer,
A method of constructing rubber chip tiles, characterized in that the melted surface of the adhesive layer is adhered to a surface to be constructed.