JPH0582200A - Heat seal connector - Google Patents

Heat seal connector

Info

Publication number
JPH0582200A
JPH0582200A JP24111491A JP24111491A JPH0582200A JP H0582200 A JPH0582200 A JP H0582200A JP 24111491 A JP24111491 A JP 24111491A JP 24111491 A JP24111491 A JP 24111491A JP H0582200 A JPH0582200 A JP H0582200A
Authority
JP
Japan
Prior art keywords
conductor
heat seal
seal connector
bar
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24111491A
Other languages
Japanese (ja)
Inventor
Toshiyuki Sakuma
敏幸 佐久間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24111491A priority Critical patent/JPH0582200A/en
Publication of JPH0582200A publication Critical patent/JPH0582200A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Abstract

PURPOSE:To improve workability for aligning a circuit with a heat seal connector by arraying a dummy conductor outside the row of circuit connecting conductors, and forming a short conductor bar laterally extended from the dummy conductor. CONSTITUTION:In aligning a heat seal connector 14 with a mating electrode terminal or the like on a printed circuit board for connection, a T-shaped section formed with a dummy conductor 18 and a conductor bar 19 is superposed on a corresponding mating T-shaped section. In this case, even when a connector 14 is superposed, an alignment T-shaped mark on the printed circuit board must be visible through the connector 14. For this purpose, hot melt resin 20 is so applied to the surface of the bar 19 and the vicinity thereof as to have a cutout shape, in order to make the bar 19 visible. Furthermore, the dummy conductor 18 is extended to the edge of a layer 20, and the conductor 18 located at the edge is used for alignment. A dummy terminal is fitted as mentioned, and only conductors arrayed inside thereof are used for the electrical connection of circuits.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はヒートシールコネクタに
係り、特に作業性を容易にし、かつ信頼性の高い接続を
可能とするヒートシールコネクタに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat seal connector, and more particularly to a heat seal connector which facilitates workability and enables highly reliable connection.

【0002】[0002]

【従来の技術】ヒートシールコネクタは、例えば、図4
に示す如く液晶表示素子とこれを駆動するドライバーI
C(図示せず)との間を電気的に接続するために使用され
ている。図において、液晶表示素子1のガラス基板2の
端部に形成されている、例えばITO(Indium Tin Oxid
e)などからなる電極端子3とヒートシールコネクタ4の
導体5とが、この導体5上に、導電材料が分散されて塗
布されているホットメルト樹脂(図示せず)により接着さ
れる。一方、ヒートシールコネクタ4の他方端は、例え
ばプリント基板(図示せず)上に形成されている電極端子
群に、対応するヒートシールコネクタ4の導体5を一致
させて、同じく導体5上に塗布されているホットメルト
樹脂により接着される(電子通信学会技術研究報告Vol.
86,No.211(CPM86−66),49−54頁,'
86、雑誌「電子材料」1988年2月号第37頁〜第4
3頁など)。
2. Description of the Related Art A heat seal connector is shown in FIG.
A liquid crystal display element and a driver I for driving the same as shown in FIG.
It is used to electrically connect to C (not shown). In the figure, for example, ITO (Indium Tin Oxid) is formed on the end portion of the glass substrate 2 of the liquid crystal display element 1.
The electrode terminal 3 made of e) and the conductor 5 of the heat seal connector 4 are adhered onto the conductor 5 with a hot melt resin (not shown) in which a conductive material is dispersed and applied. On the other hand, the other end of the heat seal connector 4 is applied on the conductor 5 by matching the conductor 5 of the corresponding heat seal connector 4 to the electrode terminal group formed on, for example, a printed circuit board (not shown). It is bonded by the hot melt resin (Technical Report of IEICE Vol.
86, No. 211 (CPM86-66), pp. 49-54, '
86, magazine "Electronic Materials" February 1988, pages 37 to 4
Page 3, etc.).

【0003】[0003]

【発明が解決しようとする課題】前記ヒートシールコネ
クタにより、例えば液晶表示素子とこれを駆動するIC
が搭載されているプリント基板上の電極端子とを、電気
的に接続するために、ヒートシールコネクタの導体と、
液晶表示素子の電極端子あるいはプリント基板上の電極
端子との位置合わせを行うにあたっては、ヒートシール
コネクタの導体の幅方向の重なり部分を拡大鏡で見て目
合わせを行なっていた。しかしながら、導体の配列ピッ
チが狭くなってきたり(例えば0.35mm以下)、導体の
本数が増えると斜め方向のずれに対するマージンが少な
くなるので従来の目合わせ方法では作業性が極度に悪く
なってしまう。
With the heat seal connector, for example, a liquid crystal display device and an IC for driving the liquid crystal display device are provided.
In order to electrically connect the electrode terminals on the printed circuit board on which is mounted, the conductor of the heat seal connector,
When aligning with the electrode terminals of the liquid crystal display element or the electrode terminals on the printed circuit board, the widthwise overlapping portions of the conductors of the heat-seal connector were observed with a magnifying glass. However, as the arrangement pitch of the conductors becomes narrower (for example, 0.35 mm or less) or the number of conductors increases, the margin for misalignment in the diagonal direction decreases, so the workability becomes extremely poor with the conventional alignment method. ..

【0004】本発明の目的の一つは、ヒートシールコネ
クタの接続の作業性を向上させ、かつ信頼性の高い接続
を可能とするヒートシールコネクタを提供することにあ
る。
One of the objects of the present invention is to provide a heat seal connector which improves the workability of connection of the heat seal connector and enables highly reliable connection.

【0005】[0005]

【課題を解決するための手段】このような目的を達成す
るために本発明によるヒートシールコネクタは、液晶表
示素子と駆動ICとの間などの回路間の電気的接続に本
来必要な導体に加えて、その配列の外側に余分なダミイ
導体を配列し、その最外側に、そのダミイ導体から横に
伸びる短い導体バー(bar)を形成し、ここに形成される
T字状部分を位置合せに利用出来るようにしたことを特
徴とするものである。
In order to achieve such an object, the heat seal connector according to the present invention is provided with a conductor originally necessary for electrical connection between circuits such as a liquid crystal display element and a driving IC. Then, an extra dami conductor is arranged on the outside of the array, a short conductor bar (bar) extending laterally from the dami conductor is formed on the outermost side, and the T-shaped portion formed here is aligned. It is characterized by making it available.

【0006】[0006]

【作用】ヒートシールコネクタに設けられたダミイ導体
と、これから横に伸びる短い導体バーが、ヒートシール
コネクタに接続されるべき相手側回路との目合せ用の、
いわゆる「十字マーク」の役目を果すので、目合せが作業
性良く達成出来、接続が信頼性の高いものとなる。
The function of the damy conductor provided on the heat seal connector and the short conductor bar extending laterally from the damie conductor for aligning with the mating circuit to be connected to the heat seal connector,
Since it serves as a so-called "cross mark", the alignment can be achieved with good workability, and the connection is highly reliable.

【0007】[0007]

【実施例】以下、本発明の一実施例を図1を参照しなが
ら説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.

【0008】図1は本発明になるヒートシールコネクタ
の一実施例の斜視図である。ヒートシールコネクタ14
は、例えば25μm厚のPET(ポリエチレンテレフタレ
イト)からなるフィルム基材16の上に、回路間を接続
するための幅0.15mm,配列ピッチ0.3mmで形成され
る、黒鉛,カーボンブラック,銀粉末などからなる20
μm厚の導体15と,導体15の外側に配列され、導体
15と同じ材料で形成される調整用導体17と,この調
整用導体17の更に外側に配列され、導体15と同じ材
料で形成される幅0.15mmのダミイ導体18と,この
ダミイ導体18と一体で、これから導体15の延在方向
とほぼ直交する方向に延在する、例えば幅0.2mmの短
い導体バー(bar)19と、導体15,調整用導体17,
ダミイ導体18の上に塗布されている、導電材料を分散
含有しているホットメルト樹脂層20とからなる。な
お、ホットメルト樹脂層20には、導体バー19を露出
させる窓部30が設けられている。ホットメルト樹脂層
20は導体15,調整用導体17,ダミイ導体18など
の部分の上に、これらに沿って縞状に印刷形成されてい
る(図1においては図面が複雑になるのを避けるため、
この縞状に示すのを省いている)領域と、この縞状の導
電材料含有のホットメルト樹脂層が存在しない部分で、
絶縁性のホットメルト樹脂が印刷されている領域の二つ
からなる。なお、他の方法としては、導電材料を分散含
有するホットメルト樹脂を縞状にせず全面一様に塗布し
ても良い。
FIG. 1 is a perspective view of an embodiment of the heat seal connector according to the present invention. Heat seal connector 14
Is formed on a film substrate 16 made of, for example, 25 μm-thick PET (polyethylene terephthalate) with a width of 0.15 mm for connecting circuits and an arrangement pitch of 0.3 mm, graphite, carbon black, 20 made of silver powder
a conductor 15 having a thickness of μm, an adjusting conductor 17 arranged outside the conductor 15 and formed of the same material as the conductor 15, and arranged outside the adjusting conductor 17 and formed of the same material as the conductor 15. A dummy conductor 18 having a width of 0.15 mm, and a short conductor bar 19 integral with the dummy conductor 18 and extending in a direction substantially orthogonal to the extending direction of the conductor 15, for example, a conductor bar 19 having a width of 0.2 mm. , Conductor 15, adjusting conductor 17,
It consists of a hot-melt resin layer 20 which is applied on the dami conductor 18 and contains a conductive material in a dispersed manner. The hot melt resin layer 20 is provided with a window 30 that exposes the conductor bar 19. The hot-melt resin layer 20 is formed by printing in stripes on the conductor 15, the adjusting conductor 17, the damy conductor 18, etc. (in order to avoid complicating the drawing in FIG. 1). ,
In this area, the striped pattern is omitted, and the striped conductive material-containing hot melt resin layer does not exist.
It consists of two areas on which an insulating hot melt resin is printed. As another method, the hot melt resin containing the conductive material dispersed therein may be applied uniformly over the entire surface without forming a striped pattern.

【0009】ヒートシール14が接続されるべき相手側
のプリント基板の上の電極端子などとの位置合せは、ダ
ミイ導体18と導体バー19とで形成されるT字状部分
を、相手側の対応する十字状部あるいT字状部に重ね合
わせることによって行われるので、ヒートシールコネク
タ14が重ねられたときでも、ヒートシール14を通し
てプリント基板側の位置合わせ用十字状あるいはT字状
マーク部が見えなければならない。このように相手側の
位置合わせマークが見えるためには、上記窓部30を設
けるか、導体バー19が見えるように導体バー19上及
びその近傍のホットメルト樹脂層20を切り欠いた形状
に塗布することが必要である。なお、さらにダミイ導体
18上のホットメルト樹脂層20にも窓部30同様の窓
部あるいは切欠き部を設けることができる。しかしなが
ら図1においては、ダミイ導体18をホットメルト樹脂
層20の端面にまで延在させ、この端面部のダミイ導体
18を位置合わせに利用している。なお、図1において
回路接続用導体15をホットメルト樹脂層20の端面ま
で延在させていないのは、導体15が空気中に露出して
変質するのを防止するためである。
To align the heat seal 14 with an electrode terminal or the like on the mating printed board to which the heat seal 14 is to be connected, the T-shaped portion formed by the dami conductor 18 and the conductor bar 19 should be aligned with the mating counterpart. Since the cross-shaped portion or the T-shaped portion is overlapped with each other, even when the heat-seal connector 14 is overlapped, the alignment cross-shaped or T-shaped mark portion on the printed circuit board side is passed through the heat seal 14. Must be visible In order to see the alignment mark on the other side in this way, the window 30 is provided, or the hot melt resin layer 20 on and near the conductor bar 19 is cut out so that the conductor bar 19 can be seen. It is necessary to. Further, the hot-melt resin layer 20 on the damy conductor 18 may be provided with a window portion or a cutout portion similar to the window portion 30. However, in FIG. 1, the damy conductor 18 is extended to the end face of the hot melt resin layer 20, and the damey conductor 18 at this end face portion is used for alignment. In FIG. 1, the circuit connecting conductor 15 is not extended to the end face of the hot melt resin layer 20 in order to prevent the conductor 15 from being exposed to the air and being deteriorated.

【0010】ヒートシールコネクタ14の生産時、回路
接続用導体15の抵抗値を管理する必要があるが、この
導体15の抵抗値を測定する代わりに、窓部30に露出
された二つの導体バー19間の抵抗すなわちダミイ導体
18の抵抗値を測定することにより導体15の抵抗値を
管理することが出来る。この測定により、ヒートシール
コネクタの不良品を排除することが可能である。
At the time of producing the heat seal connector 14, it is necessary to control the resistance value of the conductor 15 for circuit connection. Instead of measuring the resistance value of the conductor 15, two conductor bars exposed at the window 30 are used. The resistance value of the conductor 15 can be controlled by measuring the resistance between the 19 and the resistance value of the dami conductor 18. By this measurement, it is possible to exclude defective products of the heat seal connector.

【0011】図2は、図1に依り説明したヒートシール
コネクタ14を用いて液晶表示素子1と、これを駆動す
るドライバICが搭載されているプリント基板22の電
極端子23を電気的に接続する例を示すものである。
FIG. 2 electrically connects the liquid crystal display element 1 to the electrode terminals 23 of the printed circuit board 22 on which the driver IC for driving the liquid crystal display element 1 is mounted by using the heat seal connector 14 described with reference to FIG. It shows an example.

【0012】図において液晶表示素子1のガラス基板2
の端部には、この液晶表示素子1の表示電極(図示せず)
に継がる電極端子3と、ヒートシールコネクタ14のダ
ミイ導体18と導体バー19とで形成されるT字状部に
対応するT字状部を備え、通常電極端子3と同じ材料で
作られるダミイ電極端子21とが形成されている。一方
プリント基板22には、液晶表示素子1を駆動する信号
を液晶表示素子1に供給するための電極端子23と、さ
らに、この駆動電圧供給電極端子の外側には、ヒートシ
ールコネクタ14のダミイ導体18と導体バー19とで
形成されるT字状部に対応するT字状部を備えるダミイ
電極端子24とが形成されている。
In the figure, a glass substrate 2 of a liquid crystal display element 1 is shown.
A display electrode (not shown) of the liquid crystal display element 1 is provided at the end of
The electrode terminal 3 connected to the heat seal connector 14 and the T-shaped portion corresponding to the T-shaped portion formed by the damy conductor 18 and the conductor bar 19 of the heat-seal connector 14 are provided, and are normally made of the same material as the electrode terminal 3. The electrode terminal 21 is formed. On the other hand, the printed circuit board 22 is provided with an electrode terminal 23 for supplying a signal for driving the liquid crystal display element 1 to the liquid crystal display element 1, and further outside the drive voltage supply electrode terminal, a dummy conductor of the heat seal connector 14 is provided. A damey electrode terminal 24 having a T-shaped portion corresponding to the T-shaped portion formed by 18 and the conductor bar 19 is formed.

【0013】先ず液晶表示素子1とヒートシールコネク
タ14の接続は、液晶表示素子1のダミイ電極端子21
のT字状部に、ヒートシールコネクタ14のダミイ導体
18と導体バー19により形成されるT字状部が一致す
る様に位置合わせを行ない、例えば約180℃で加熱、
加圧を行ない接着固定する。この際の位置合わせは、導
体15の幅方向はダミイ導体18の幅で合わせ、長手方
向は導体バー19で行う。
First, the liquid crystal display element 1 and the heat seal connector 14 are connected to each other by the dummy electrode terminal 21 of the liquid crystal display element 1.
The T-shaped part of the heat seal connector 14 is aligned with the T-shaped part formed by the conductor bar 19 and the T-shaped part of the heat-seal connector 14, and heated at about 180 ° C., for example.
Apply pressure to bond and fix. In this case, the conductor 15 is aligned with the width of the dummy conductor 18 in the width direction of the conductor 15 and the conductor bar 19 in the longitudinal direction.

【0014】次にプリント基板22のダミイ電極端子2
4のT字状部分にヒートシールコネクタ14のダミイ導
体18と導体バー19により形成されるT字状部が一致
する様に位置合わせを行ない、例えば180℃で加熱,
加圧を行ない接着固定する。
Next, the dummy electrode terminal 2 of the printed circuit board 22
The T-shaped portion of No. 4 is aligned so that the T-shaped portion formed by the damy conductor 18 and the conductor bar 19 of the heat seal connector 14 is aligned, and heated at 180 ° C., for example.
Apply pressure to bond and fix.

【0015】なお、図1により説明したヒートシールコ
ネクタ14において、導体15の外側に調整用導体17
が設けられているのは、一般にヒートシールコネクタで
電気的接続の固定を行なった場合、回路接続用導体のう
ち、より外側に配列されるものによる程、接続部分の抵
抗が高くなる傾向にあるので、回路間の接続には利用さ
れない、いわばダミイ端子を設け、これより内側に配列
された導体のみを回路間の電気的接続に用いる。従って
図1においては調整用導体17はヒートシール14の四
隅に一個ずつしか設けられていないが、この数を増せば
導体15による接続部の抵抗をより一様にすることがで
きる。
In the heat seal connector 14 described with reference to FIG. 1, the adjustment conductor 17 is provided outside the conductor 15.
In general, when a heat-seal connector is used to fix the electrical connection, the resistance of the connecting portion tends to increase as the circuit connecting conductors are arranged on the outer side. Therefore, a so-called damy terminal, which is not used for connection between circuits, is provided, and only the conductors arranged inside the terminal are used for electrical connection between circuits. Therefore, in FIG. 1, only one adjusting conductor 17 is provided at each of the four corners of the heat seal 14, but if the number is increased, the resistance of the connecting portion by the conductor 15 can be made more uniform.

【0016】図3は、図2の如く液晶表示素子1とプリ
ント基板22とを、本発明によるヒートシールコネクタ
14により電気的に接続したものを、さらに光源と組み
合わせコンパクトに液晶表示モジュールとしてまとめた
ものである。なお、液晶表示素子1の電極端子のうち、
ヒートシールコネクタ14により電気的接続の行われて
いない液晶表示素子1の辺の電極端子は図3に示す如
く、この端子とプリント基板22上の対応する電極端子
間に、導電性エラスチックコネクタ(カーボン微粒子が
混入されて導電性を有するシリコンゴムの薄層と絶縁性
シリコンゴムの薄層とを交互に幾重にも積層して形成さ
れたもの)25を介してプリント基板22の上の回路と
電気的に接続されている。
In FIG. 3, the liquid crystal display device 1 and the printed circuit board 22 as shown in FIG. 2 are electrically connected by the heat seal connector 14 according to the present invention and further combined with a light source to be compactly assembled as a liquid crystal display module. It is a thing. Among the electrode terminals of the liquid crystal display element 1,
As shown in FIG. 3, the electrode terminal on the side of the liquid crystal display element 1 which is not electrically connected by the heat seal connector 14 has a conductive elastic connector (carbon fiber) between this terminal and the corresponding electrode terminal on the printed circuit board 22. And a circuit on the printed circuit board 22 through a thin layer of conductive silicon rubber mixed with fine particles and a thin layer of insulating silicon rubber which are alternately laminated in multiple layers. Connected to each other.

【0017】液晶表示素子1に接続されたプリント基板
22はプラスチックモールドで形成された枠状体42の
窓部に嵌め込まれ、これに金属製フレーム41を重ね、
その爪43を枠状体42に形成されている切込み44内
に折り曲げることによりフレーム41を枠状体42に固
定する。
The printed circuit board 22 connected to the liquid crystal display element 1 is fitted into the window portion of the frame-like body 42 formed by plastic molding, and the metal frame 41 is superposed on it.
The frame 41 is fixed to the frame-shaped body 42 by bending the claw 43 into the notch 44 formed in the frame-shaped body 42.

【0018】液晶表示素子1の上下端に配置される冷陰
極蛍光灯36,この冷陰極蛍光灯36からの光を液晶表
示素子1に均一に照射させるためのアクリル板からなる
導光体37,金属板に白色塗料を塗布して形成された反
射板38,導光体37からの光を拡散する乳白色の拡散
板39が図3の順序で、枠状体42の裏側からその窓部
に嵌め込まれる。冷陰極蛍光灯36を点灯する為のイン
バータ電源回路(図示せず)は枠状体42の右側裏部に設
けられた凹部(図示せず。反射板38の凹所45に対向
する位置にある。)に収納される。拡散板39,導光体
37,冷陰極蛍光灯36及び反射板38は、反射板38
に設けられている舌片46を、枠状体42に設けられて
いる小口47内に折り曲げることにより固定される。
A cold cathode fluorescent lamp 36 disposed at the upper and lower ends of the liquid crystal display element 1, a light guide 37 made of an acrylic plate for uniformly irradiating the liquid crystal display element 1 with light from the cold cathode fluorescent lamp 36, A reflecting plate 38 formed by applying white paint to a metal plate, and a milky white diffusing plate 39 for diffusing light from the light guide 37 are fitted into the window portion from the back side of the frame-shaped body 42 in the order of FIG. Be done. An inverter power supply circuit (not shown) for turning on the cold cathode fluorescent lamp 36 is located at a position (not shown) provided on the right back side of the frame-shaped body 42 and facing the recess 45 of the reflection plate 38. .). The diffusion plate 39, the light guide 37, the cold cathode fluorescent lamp 36, and the reflection plate 38 are the reflection plate 38.
It is fixed by bending the tongue piece 46 provided in the inside of the small opening 47 provided in the frame-shaped body 42.

【0019】[0019]

【発明の効果】本発明によれば、回路間の接続をヒート
シールコネクタで行なう場合、回路とヒートシールコネ
クタの位置合わせが作業性良く、かつ信頼性高く行うこ
とが出来る。
According to the present invention, when the circuits are connected by the heat seal connector, the circuit and the heat seal connector can be aligned with each other with good workability and high reliability.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明によるヒートシールコネクタの一実施例
を示す要部斜視図である。
FIG. 1 is a perspective view of essential parts showing an embodiment of a heat seal connector according to the present invention.

【図2】本発明によるヒートシールコネクタにより液晶
表示素子とプリント基板との電気的接続の例を説明する
要部斜視図である。
FIG. 2 is a perspective view of relevant parts for explaining an example of electrical connection between a liquid crystal display element and a printed circuit board by a heat seal connector according to the present invention.

【図3】本発明によるヒートシールコネクタにより接続
された液晶表示素子とプリント基板を、さらに光源と組
み合わせてなる液晶表示モジュールの要部分解斜視図で
ある。
FIG. 3 is an exploded perspective view of a main part of a liquid crystal display module in which a liquid crystal display element and a printed circuit board connected by a heat seal connector according to the present invention are further combined with a light source.

【図4】従来のヒートシールコネクタと液晶表示素子の
接続を説明するための要部斜視図である。
FIG. 4 is a perspective view of a main part for explaining a connection between a conventional heat seal connector and a liquid crystal display element.

【符号の説明】[Explanation of symbols]

1…液晶表示素子,2…ガラス基板,3…電極端子,1
4…ヒートシールコネクタ,15…導体,17…調整用
導体,18…ダミイ導体,19…導体バー,20…ホッ
トメルト樹脂層,22…プリント基板,23…信号供給
電極端子,24…ダミイ電極端子,30…窓部。
1 ... Liquid crystal display element, 2 ... Glass substrate, 3 ... Electrode terminal, 1
4 ... Heat seal connector, 15 ... Conductor, 17 ... Adjustment conductor, 18 ... Damily conductor, 19 ... Conductor bar, 20 ... Hot melt resin layer, 22 ... Printed circuit board, 23 ... Signal supply electrode terminal, 24 ... Damily electrode terminal , 30 ... Window.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 基材フィルム,回路接続用導体,ホット
メルト樹脂層を積層してなるヒートシールコネクタにお
いて、回路接続用導体の配列の外側に、ダミイ導体を配
列し、そのダミイ導体から横に延在する短い導体バーが
形成されてなることを特徴とするヒートシールコネク
タ。
1. A heat seal connector comprising a base film, a conductor for circuit connection, and a hot-melt resin layer laminated on each other, wherein damy conductors are arranged outside the array of conductors for circuit connection, and laterally from the damy conductor. A heat-seal connector, wherein a short conductor bar extending is formed.
JP24111491A 1991-09-20 1991-09-20 Heat seal connector Pending JPH0582200A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24111491A JPH0582200A (en) 1991-09-20 1991-09-20 Heat seal connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24111491A JPH0582200A (en) 1991-09-20 1991-09-20 Heat seal connector

Publications (1)

Publication Number Publication Date
JPH0582200A true JPH0582200A (en) 1993-04-02

Family

ID=17069496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24111491A Pending JPH0582200A (en) 1991-09-20 1991-09-20 Heat seal connector

Country Status (1)

Country Link
JP (1) JPH0582200A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006302554A (en) * 2005-04-18 2006-11-02 Matsushita Electric Ind Co Ltd Flexible flat cable
WO2009043724A1 (en) * 2007-09-28 2009-04-09 Gigaset Communications Gmbh Connecting film and electrical connection element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006302554A (en) * 2005-04-18 2006-11-02 Matsushita Electric Ind Co Ltd Flexible flat cable
WO2009043724A1 (en) * 2007-09-28 2009-04-09 Gigaset Communications Gmbh Connecting film and electrical connection element

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