JPH058098B2 - - Google Patents
Info
- Publication number
- JPH058098B2 JPH058098B2 JP60151405A JP15140585A JPH058098B2 JP H058098 B2 JPH058098 B2 JP H058098B2 JP 60151405 A JP60151405 A JP 60151405A JP 15140585 A JP15140585 A JP 15140585A JP H058098 B2 JPH058098 B2 JP H058098B2
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- chemical plating
- adhesive layer
- release sheet
- water vapor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 230000035699 permeability Effects 0.000 claims description 7
- 229920006255 plastic film Polymers 0.000 claims description 6
- 239000002985 plastic film Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920000306 polymethylpentene Polymers 0.000 description 3
- 239000011116 polymethylpentene Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Description
〔産業上の利用分野〕
本発明は化学めつき用積層板の製造方法に係
り、熱硬化性樹脂含浸基材の表面に、離形性シー
ト上に形成した接着剤層を重ね合せ、加熱加圧し
て一体化した後に、離型シートのはくりが容易で
あり、離形性シートの表面が平滑である化学めつ
き用積層板を製造する方法に関するものである。
〔従来技術〕
半硬化状態の熱硬化性樹脂含浸基材の表面に、
離形性シート上に形成した接着剤層を重ね合せ、
加熱加圧成形することにより、化学めつき用積層
板を製造することは、既に公知の技術である。こ
のような製造方法において、例えば、特開昭52−
121775では離形性シートとしてアルミニウム箔を
使用する技術を、特開昭58−199151では加熱加圧
成形において圧抜きする技術を提供している。
前記熱硬化性樹脂がエポキシ樹脂の場合には、
加熱加圧成形の際に未反応低分子ガスの発生は少
なく、離形性シートが熱硬化性樹脂含浸基材上に
均一かつ平滑に付着した状態で成形することは比
較的容易であるが、前記基材が溶剤を含有した状
態の場合、あるいは熱硬化性樹脂がフエノール樹
脂の場合には、加熱加圧成形の際に未反応低分子
ガスが大量に発生するために、加熱加圧成形が完
了した時点で離形性シートが部分的に浮いてしま
う。このように、部分的に離形性シートが浮いて
いる化学めつき用積層板の問題点については、特
開昭58−199151に詳述されている。この問題点を
解消するために、特開昭58−199151においては加
熱加圧成形時に圧抜きを行うが、圧抜きをする
と、一瞬にして大量の未反応低分子ガスが発生す
るため、作業安全上極めて危険である。また、時
には化学めつき用積層板自体が層間で破壊するこ
ともある。
〔発明の目的〕
本発明者等は、従来熱硬化性樹脂含浸基材の表
面に、離形性シート上に形成した接着剤層を重ね
合せ、加熱加圧成形するに際し、該離形性シート
が前記基材と均一かつ平滑に付着せず、部分的に
浮いたり離形性シートにシワが発生したりするの
を解決するために、融点が200℃以上で、かつ水
蒸気透過率が５ｇ／m2・24hrs・atm・25μｍ以上
のプラスチツクフイルムを離形性シートとして使
用することが有効であるとの知見を得て、本発明
を完成させたものである。
〔発明の構成〕
本発明は、複数枚の半硬化状態熱硬化性樹脂含
浸基材の表面に、離形性シート上に形成した接着
剤層を重ね合せ、加熱加圧成形する化学めつき用
積層板の製造方法において、融点が200℃以上で、
かつ水蒸気透過率が５ｇ／m2・24hrs・atm・25μ
ｍ以上のプラスチツクフイルム上に接着剤層を形
成することを特徴とする化学めつき用積層板の製
造方法である。
本発明において用いられるプラスチツクフイル
ムは、融点が高いポリエチレンテレフタレート、
ポリメチルペンテン、ポリスルホン、ポリエーテ
ルスルホン、ポリスチレン、ポリカーボネート、
トリアセテート、ポリエーテルエーテルケトン等
からなるフイルムで、かつ水蒸気透過率が５ｇ／
m2・24hrs・atm・25μｍ以上のものである。
耐熱性の点から、特に融点が高いプラスチツク
フイルムとして、ポリエチレンテレフタレート、
ポリカーボネート、トリアセテート、ポリメチル
ペンテンが好ましい。
該プラスチツクフイルムの厚みは、接着剤層形
成及び加圧加熱による一体化成形時の熱的、機械
的必要特性より、通常20μｍ以上100μｍ以下のも
のを使用するが、好ましくは40μｍ以上60μｍ以
下である。
〔発明の効果〕
本発明によれば、硬化性樹脂含浸基材より発生
する未反応低分子ガス又は縮合水による水蒸気を
前記基材中に保持含有することなく、基材の外面
に拡散蒸発させることができると同時に、融点が
高いために熱劣化による損傷が少なく、外観的に
も均一かつ平滑性を保持した状態で一体化成形す
ることができる。また、化学めつき用積層板とし
て使用するにあたり、離形性シートを剥離する場
合にも、破れや亀裂などを生じないで剥離するこ
とが可能である。さらに離形シート自体から溶出
する不純分や添加剤等により、化学めつき用積層
板の接着剤表面が汚染されることもないために、
めつき工程での密着不良の発生もない。
〔実施例〕
本発明の化学めつき用積層板の製造方法につい
て、以下に実施例及び比較例により説明する。以
下において、水蒸気透過率は１気圧（atm）下に
おける25μｍ厚フイルムでの数値である。
実施例 １
融点260℃、水蒸気透過率28ｇ／m2・24hrs、厚
さ40μｍのポリエチレンテレフタレート（PET）
フイルム上にNBRゴム／フエノール樹脂を主成
分とする接着剤を塗工し、160℃で30分加熱し、
溶剤を除去すると共に接着剤をＢステージ状態に
プレキユアーさせ、接着剤層の厚さを50μｍにし
た。ポリエチレンテレフタレートフイルム上に形
成された接着剤層を、フエノール樹脂を含浸した
紙基材の両面に重ね合せ、プレスにより170℃で
120分間加熱硬化した。プレスから取り出したと
ころ、ポリエチレンテレフタレートフイルムは化
学めつき用積層板に均一かつ平滑に付着してお
り、且つ容易に剥離することができた。
実施例 ２
融点240℃、水蒸気透過率60ｇ／m2・24hrs、厚
さ60μｍのポリカーボネート（PC）フイルムを使
用し、実施例１と同様にして化学めつき用積層板
を得た。
実施例 ３
融点290℃、水蒸気透過率700ｇ／m2・24hrs、
厚さ50μｍのトリアセテートフイルムを使用し、
実施例１と同様にして化学めつき用積層板を得
た。
実施例 ４
融点240℃、水蒸気透過率100ｇ／m2・24hrs、
厚さ40μｍのポリスチレンフイルムを使用し、実
施例１と同様にして化学めつき用積層板を得た。
実施例 ５
融点240℃、水蒸気透過率100ｇ／m2・24hrs、
厚さ50μｍのポリメチルペンテン（TPX）フイル
ムを使用し、実施例１と同様にして化学めつき用
積層板を得た。
実施例 ６
実施例１において、フエノール樹脂含浸紙基材
のかわりに溶剤の含有率３％のエポキシ樹脂含浸
ガラス基材を使用した以外は実施例１と同様にし
て化学めつき用積層板を得た。
比較例 １
融点360℃、水蒸気透過率1.3ｇ／m2・24hrs、
厚さ50μｍのポリエーテルスルホン（PES）のフ
イルムを使用し、実施例１と同様にして化学めつ
き用積層板を得た。
比較例 ２
融点260℃、水蒸気透過率0.4ｇ／m2・24hrs、
厚さ50μｍのテフロン（FEP）フイルムを使用
し、実施例１と同様にして化学めつき用積層板を
得た。
比較例 ３
水蒸気透過率０ｇ／m2・24hrs、厚さ50μｍのア
ルミニウム箔を使用し、実施例１と同様にして化
学めつき用積層板を得た。
比較例 ４
融点170℃、水蒸気透過率８ｇ／m2・24hrs、厚
さ40μｍのポリプロピレン（PP）フイルムを使用
し、実施例１と同様にして化学めつき用積層板を
得た。
比較例 ５
実施例６において、離形性シートとして厚さ
50μｍのアルミニウム箔を使用した以外は実施例
６と同様にして化学めつき用積層板を得た。
実施例１、２、３、４、５及び比較例１、２、
３、４で得られた化学めつき用積層板についての
評価結果を表−１に示す。
[Industrial Field of Application] The present invention relates to a method for manufacturing a laminate for chemical plating, in which an adhesive layer formed on a release sheet is superimposed on the surface of a thermosetting resin-impregnated base material, and the adhesive layer is heated and heated. The present invention relates to a method for manufacturing a laminate for chemical plating, in which the release sheet can be easily peeled off after being pressed and integrated, and the surface of the release sheet is smooth. [Prior art] On the surface of a semi-cured thermosetting resin-impregnated base material,
Overlap the adhesive layer formed on the release sheet,
It is already a known technique to produce a chemically plated laminate by hot-pressing. In such a manufacturing method, for example, JP-A-52-
No. 121775 provides a technique for using aluminum foil as a release sheet, and JP-A-58-199151 provides a technique for depressurization during hot-press molding. When the thermosetting resin is an epoxy resin,
There is little generation of unreacted low-molecular gas during hot-pressure molding, and it is relatively easy to mold with the release sheet uniformly and smoothly adhered to the thermosetting resin-impregnated base material. When the base material contains a solvent or when the thermosetting resin is a phenolic resin, a large amount of unreacted low molecular gas is generated during heat and pressure molding, so heat and pressure molding is difficult. When the process is completed, the release sheet will partially lift up. The problem of the chemically plated laminate in which the release sheet is partially floating is described in detail in JP-A-58-199151. In order to solve this problem, in JP-A-58-199151, pressure is removed during hot-pressure molding, but when pressure is removed, a large amount of unreacted low-molecular gas is instantly generated, making work safer. It is extremely dangerous. In addition, sometimes the chemically plated laminate itself may break between the layers. [Object of the Invention] The present inventors conventionally overlaid an adhesive layer formed on a release sheet on the surface of a base material impregnated with a thermosetting resin, and when performing heat and pressure molding, the release sheet In order to solve the problem that the release sheet does not adhere uniformly and smoothly to the base material and partially floats or wrinkles occur on the release sheet, a sheet with a melting point of 200°C or higher and a water vapor permeability of 5 g/ The present invention was completed based on the finding that it is effective to use a plastic film of m2, 24 hrs, atm, 25 μm or more as a release sheet. [Structure of the Invention] The present invention provides a method for chemical plating in which an adhesive layer formed on a release sheet is superimposed on the surface of a plurality of semi-cured thermosetting resin-impregnated base materials, and the adhesive layer is formed under heat and pressure. In the method for manufacturing laminates, the melting point is 200℃ or higher,
And water vapor transmission rate is 5g/ m2・24hrs・atm・25μ
This is a method for producing a laminate for chemical plating, characterized in that an adhesive layer is formed on a plastic film of m or more. The plastic film used in the present invention is made of polyethylene terephthalate, which has a high melting point.
polymethylpentene, polysulfone, polyethersulfone, polystyrene, polycarbonate,
A film made of triacetate, polyetheretherketone, etc., with a water vapor transmission rate of 5g/
m2・24hrs・atm・25μm or more. In terms of heat resistance, polyethylene terephthalate, plastic film with a particularly high melting point,
Polycarbonate, triacetate and polymethylpentene are preferred. The thickness of the plastic film is usually 20 μm or more and 100 μm or less, but preferably 40 μm or more and 60 μm or less, in view of the thermal and mechanical properties required during adhesive layer formation and integral molding by pressure heating. . [Effects of the Invention] According to the present invention, unreacted low molecular gas or water vapor due to condensed water generated from a curable resin-impregnated base material is diffused and evaporated onto the outer surface of the base material without being retained in the base material. At the same time, due to its high melting point, there is little damage due to thermal deterioration, and it can be integrally molded while maintaining a uniform and smooth appearance. Furthermore, when the release sheet is to be peeled off when used as a laminate for chemical plating, it is possible to do so without causing any tears or cracks. Furthermore, the adhesive surface of the chemically plated laminate will not be contaminated by impurities or additives leached from the release sheet itself.
There is no occurrence of poor adhesion during the plating process. [Example] The method for producing a chemically plated laminate according to the present invention will be described below using Examples and Comparative Examples. In the following, the water vapor permeability is a value for a 25 μm thick film under 1 atmosphere (atm). Example 1 Polyethylene terephthalate (PET) with a melting point of 260°C, a water vapor permeability of 28g/ m2・24hrs, and a thickness of 40μm.
An adhesive mainly composed of NBR rubber/phenol resin is applied onto the film and heated at 160℃ for 30 minutes.
The solvent was removed and the adhesive was pre-cured to a B-stage state so that the thickness of the adhesive layer was 50 μm. The adhesive layer formed on the polyethylene terephthalate film was laminated on both sides of a paper base material impregnated with phenolic resin, and then pressed at 170℃.
It was heat cured for 120 minutes. When taken out from the press, the polyethylene terephthalate film was found to be uniformly and smoothly adhered to the chemically plated laminate, and could be easily peeled off. Example 2 A laminate for chemical plating was obtained in the same manner as in Example 1 using a polycarbonate (PC) film having a melting point of 240° C., a water vapor permeability of 60 g/m 2 ·24 hrs, and a thickness of 60 μm. Example 3 Melting point 290℃, water vapor transmission rate 700g/m 2・24hrs,
Using a triacetate film with a thickness of 50 μm,
A laminate for chemical plating was obtained in the same manner as in Example 1. Example 4 Melting point 240℃, water vapor transmission rate 100g/m 2・24hrs,
A laminate for chemical plating was obtained in the same manner as in Example 1 using a polystyrene film having a thickness of 40 μm. Example 5 Melting point 240℃, water vapor transmission rate 100g/m 2・24hrs,
A laminate for chemical plating was obtained in the same manner as in Example 1 using a polymethylpentene (TPX) film having a thickness of 50 μm. Example 6 A laminate for chemical plating was obtained in the same manner as in Example 1 except that an epoxy resin-impregnated glass substrate with a solvent content of 3% was used instead of the phenol resin-impregnated paper substrate. Ta. Comparative example 1 Melting point 360℃, water vapor transmission rate 1.3g/m 2・24hrs,
A laminate for chemical plating was obtained in the same manner as in Example 1 using a polyether sulfone (PES) film having a thickness of 50 μm. Comparative example 2 Melting point 260℃, water vapor transmission rate 0.4g/m 2・24hrs,
A laminate for chemical plating was obtained in the same manner as in Example 1 using a Teflon (FEP) film with a thickness of 50 μm. Comparative Example 3 A laminate for chemical plating was obtained in the same manner as in Example 1 using aluminum foil having a water vapor permeability of 0 g/m 2 ·24 hrs and a thickness of 50 μm. Comparative Example 4 A laminate for chemical plating was obtained in the same manner as in Example 1 using a polypropylene (PP) film having a melting point of 170° C., a water vapor permeability of 8 g/m 2 ·24 hrs, and a thickness of 40 μm. Comparative Example 5 In Example 6, the thickness of the release sheet was
A laminate for chemical plating was obtained in the same manner as in Example 6 except that 50 μm aluminum foil was used. Examples 1, 2, 3, 4, 5 and comparative examples 1, 2,
Table 1 shows the evaluation results for the chemically plated laminates obtained in 3 and 4.
【表】
表−１の評価項目は表−２の基準によつて行つ
た。[Table] The evaluation items in Table-1 were performed according to the criteria in Table-2.
【表】【table】
Claims (1)
表面に、離形性シート上に形成した接着剤層を重
ね合せ、加熱加圧成形する化学めつき用積層板の
製造方法において、融点が200℃以上で、かつ水
蒸気透過率が５ｇ／m2・24hrs・atm・25μｍ以上
のプラスチツクフイルム上に接着剤層を形成する
ことを特徴とする化学めつき用積層板の製造方
法。1. In a method for producing a laminate for chemical plating, in which an adhesive layer formed on a release sheet is superimposed on the surface of a plurality of semi-cured thermosetting resin-impregnated base materials, and the adhesive layer is formed under heat and pressure, the melting point A method for producing a laminate for chemical plating, which comprises forming an adhesive layer on a plastic film having a temperature of 200°C or higher and a water vapor permeability of 5 g/m 2 24 hrs ATM 25 μm or higher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60151405A JPS6213323A (en) | 1985-07-11 | 1985-07-11 | Method for manufacturing laminated board for chemical plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60151405A JPS6213323A (en) | 1985-07-11 | 1985-07-11 | Method for manufacturing laminated board for chemical plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6213323A JPS6213323A (en) | 1987-01-22 |
| JPH058098B2 true JPH058098B2 (en) | 1993-02-01 |
Family
ID=15517869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60151405A Granted JPS6213323A (en) | 1985-07-11 | 1985-07-11 | Method for manufacturing laminated board for chemical plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6213323A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129781A (en) * | 2008-11-27 | 2010-06-10 | Denso Corp | Method of manufacturing multilayer board |
-
1985
- 1985-07-11 JP JP60151405A patent/JPS6213323A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6213323A (en) | 1987-01-22 |
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