JPH058085Y2 - - Google Patents

Description

[Detailed description of the invention] Industrial application field The present invention relates to an improvement in chip manufacturing means.
In particular, this invention relates to improvements in the means for producing chips of small diameter material for use in papermaking.

Prior Art and Problems There are two methods for producing chips used in paper manufacturing.

First, a manual mowing cutter is used to cut small-diameter trees, chopstick scraps, and other small-diameter materials.
This chip manufacturing method relies on manual labor for all tasks such as using a grass cutting cutter and supplying materials, so it is difficult to cut the material to the same size and perform the work quickly, making the chips non-functional. Sizing,
This leads to inefficiency in work.

In order to solve this problem, a chip manufacturing means using a second power is known. This second
To outline the main parts of the chip manufacturing means shown in Figure 3, one side of a grid-shaped fixed cutting blade row C' ₁ and a grid-shaped rotary cutting blade row C' ₂ are attached to one side, respectively, and the rotary cutting is performed. The blade row C′ ₂ is rotated in the direction of the arrow by a power source (not shown), and the small-diameter material (not shown) supplied between both cutting blade rows is pressed and cut into chips by the rotating cutting blade row C′ ₂ . The process is carried out by manually supplying small-diameter materials. The second chip manufacturing means is
Although it relies on manual labor to supply materials, it can be said to be superior to the first chip manufacturing method because the cutter work is automated. However, with this second chip manufacturing means, chips are manufactured only after the rotary cutting blade row _C'2 makes one reciprocation, and small-diameter material must be supplied each time a chip is manufactured. , the disadvantage is that it takes a long time to produce chips, the work is inefficient, and the productivity is unsatisfactory; the disadvantage is that the supply amount varies due to dependence on human labor for supplying the material, and the fixed cutting blade row C′ ₁ and Because the material holding means that prevents the small-diameter material from jumping up between the rotary cutting blade row C′ 2 and the rotating cutting blade row C′ ₂ is not visible, the small-diameter material bounces during the cutting operation, disrupts the arrangement, and shortens the length. It has the disadvantage that chips are produced that are irregular and unsuitable for papermaking.

The present invention was devised in view of the problems of the second chip manufacturing method, and includes a sizing chip manufacturing device with excellent productivity that can continuously produce sizing chips with the same length dimension, and a sizing chip manufacturing device for use with the device. The purpose is to provide rotating cutting blades, material hoppers, material holding devices, etc.

Means for Solving the Problem The means achieved by the present invention to achieve the above object is to form a large number of material drawing parts in the circumferential direction at the cutting edge of the rotary cutting blade, and to arrange the large number of material drawing parts in a straight line on a plane. A large number of rotating cutting blades are arranged in parallel on the machine frame at equal intervals to form one rotating cutting blade row, and the other rotating cutting blade row is configured in the same manner as the one rotating cutting blade row. The rotary cutting blades of both rotary cutting blade rows are arranged at the same height position as the one of the above rotary cutting blade rows, and the rotary cutting blades of both rotary cutting blade rows are engaged with each other, and a vibrating type is installed above one or the other rotary cutting blade row in the machine frame. A material hopper is provided with a supply port facing the rotary cutting blade row meshing part, and the one or the other rotary cutting blade row is exposed into the material hopper from the comb bottom formed on the supply port side portion of the material hopper. A vibrating screen is provided below one or the other rotary cutting blade row in the frame with the workpiece receiving side arranged below the engagement of the rotary cutting blade row, and the peripheral surface of the disk is formed concave and the cutting edge is attached to the periphery. In addition to forming a large number of material lead-in portions at equal intervals in the circumferential direction of the cutting edge, a supply port is opened at the bottom of one side wall of the peripheral wall, and a supply port is provided by a vibrating bottom plate provided on the peripheral wall. The mouth side part is configured as a comb bottom for the rotary cutting blades, one and the other rotary cutting blade rows are arranged in a facing and interlocking manner, and a material hopper is provided above one or the other rotary cutting blade row. The base end of a movable rod is pivoted to the part of the machine frame that faces the material hopper, and the tip protrudes toward the material hopper.A idler is pivoted to the tip of the movable lever, and the movable rod is attached above the engagement part of the rotary cutting blade row. For example, it was placed in

Operation: A large amount of small-diameter material whose longitudinal direction is aligned with the arrangement direction of the rotary cutting blade rows is put into the material hopper, and one and the other rotary cutting blade rows are rotated, and at the same time, the material hopper and the vibrating sieve are vibrated. The small-diameter material in the material hopper is supplied in a substantially horizontal state from the supply port to the rotary cutting blade array engagement portion by vibration of the hopper (specifically, vibration of the vibrating bottom plate). At the same time, small-diameter materials are successively supplied to the meshing part of the rotary blade array in a substantially horizontal state by the material drawing part of each rotary cutting blade facing into the material hopper from the comb bottom of the material hopper, and are deposited in the meshing part. The material is then held down by the material holding device to prevent it from jumping up. The small-diameter materials deposited in the engaging part of the rotating cutting blade row are drawn into the engaging part of the cutting blade row sequentially from the lower layer by the material drawing part, and the material has a length that is approximately the same as the wall thickness of each rotating cutting blade. The processed product is cut to a fixed size and falls onto the workpiece receiving side of the vibrating sieve. The processed products that have fallen onto the vibrating sieve are sieved into long chips of a fixed size or larger (upper screen material) and standard chips of the fixed size (lower screen material).

Embodiment The rotary cutting blade 1 has a disk whose peripheral surface is approximately U-shaped and approximately V-shaped.
It is formed by forming a concave surface such as a letter shape and forming a sharp cutting edge 8 on the periphery, and forming a large number of material drawing parts 2 at equal intervals in the circumferential direction of the cutting edge into a substantially L-shape, a substantially U-shape, etc. do. A large number of rotary cutting blades 1 are arranged parallel to each other at equal intervals on the upper part of a machine frame 3 with a large number of material drawing parts 2 aligned in a straight line on a plane, and one rotary cutting blade row is formed.
At the same time, the other rotary cutting blade row C ₂ is constructed on the upper part of the machine frame 3, and both of the rotary cutting blade rows C ₁ and C ₂ face _each other at the same height position on the machine frame 3. The rotary cutting blades 1 _, 1, . The structure is such that small diameter materials (such as disposable chopstick scraps, small diameter wood, and other small diameter materials) are drawn one after another into the rotary cutting blade array engagement section _C3 by a large number of material drawing sections 2. The machine frame 3 has one and the other rotating cutting blade rows.
A motor M ₁ and a reducer 12 for C _{1 and} C 2 are provided at the bottom, and motors M ₂ for the material hopper 4 and the vibrating sieve 7 are provided at the bottom, and one and The other rotating cutting blade rows C ₁ and C ₂ are arranged opposite to each other, above either one or the other rotating cutting blade row (the figure shows one rotating cutting blade row C ₁
A material hopper 4 is disposed so as to be able to vibrate freely in the hopper (the upper example is shown), and is placed above the remaining rotating cutting blade row C 2 at the opposing portion of the hopper (above the other rotating cutting blade row C ₂ in the figure). A material holding device composed of a movable rod 10 and a idler wheel 11 is rotatably arranged. A vibrating sieve 7 is disposed below one row of rotary cutting blades on one side or the other of the machine frame 3, and all mechanisms for turning small-diameter materials into products are disposed therein. The material hopper 4 has a supply port 5 at the lower part of one side wall which is the highest among the surrounding walls, and a vibrating bottom plate 9 which is gradually inclined higher from the lower part of the side wall where the supply port is opened to the lower part of the other side wall on the opposite side. A part of the supply port side portion of the bottom plate is formed into a comb-shaped comb bottom 6, and one or the other rotary cutting blade row is formed from the comb bottom.
The rotary cutting blade 1 of C ₁ or C ₂ is configured to face the inside of the hopper. Material hopper 4 has motor _M2
The rod 14 has one end pivoted on the eccentric part of the pulley 13 that rotates in conjunction with the start of the pulley or the eccentric part of the rotating shaft of the pulley, and the other end of the rod 14 is pivoted on the lower surface of the vibrating base plate 9, and the vibrating base plate It is supported by rotatable rollers 15 installed on the machine frame 3, and is configured so that the vibrating bottom plate 9 vibrates back and forth when the motor _M2 starts, and the small diameter material is fed by the vibration. Configure. When the material hopper 4 is installed in the machine frame 3, the supply port ₅ is directed toward the rotary cutting blade row meshing part _C3 above one or the other of the rotating cutting blade rows C1 or _C2 . ,
One of the rows of rotary cutting blades C ₁ or C ₂ is made to face the material hopper 4 from the comb bottom 6, and the vibrating bottom plate 9 is arranged so as to be capable of reciprocating vibration as described above. At the same time, the small-diameter material is supplied in a horizontal state from the supply port 5 toward the rotary cutting blade array engagement part _C3 , and at the same time, one of the rotary cutting parts facing into the material hopper 4 from the comb bottom 6 blade row
The small diameter material in the material hopper 4 is transferred to the rotary cutting blade row meshing part by the large number of material drawing parts 2 of _C1 or _C2 .
Make sure that it is supplied parallel to C ₃ . Therefore, when introducing small-diameter materials such as disposable chopstick waste (defective disposable chopsticks that cannot be used as products), small-diameter wood (Karamatsu, other small-diameter wood), and other small-diameter materials (waste wood) into the material hopper 4, The material is fed with its longitudinal direction aligned with the arrangement direction of the rotary cutting blade row C ₁ or C ₂ , and when the small diameter material is supplied to the rotary cutting blade row meshing part C ₃ , it is laid down and piled up, and the movable rod 10 and Jumping up is prevented by a material holding device consisting of a idler wheel 11. The vibrating sieve 7 has a sieve screen 16 stretched at an appropriate height within the approximately concave main body, and a plate spring 17 attached to the bottom plate.
The rod 19 is supported by the machine frame ₃ , and the other end of the rod 19 is attached to the lower surface of the bottom plate. It is configured so that it can be mounted on a shaft and vibrated. When installing the vibrating sieve 7 in the machine frame 3, the workpiece receiving side, which is located below the rotary cutting blade row engagement part _C3 , should be placed high, and the opposite discharge port side should be sloped low. , and is arranged so as to be able to vibrate as described above, and the workpiece processed at the meshing portion _C3 falls onto the sieve screen 16, and is moved toward the discharge port side by the vibration of the vibrating sieve 7. The chips are sieved into long chips (upper sieve) and standard chips of the same size (lower sieve), the long chips are sent to a reprocessing process, and the standard chips are shipped as products. I'll do what I do. The movable rod 10 has an idler wheel 11 pivotally attached to its tip, a base end pivotally attached to the machine frame 3 at a portion opposite the material hopper 4, and a tip protruding toward the material hopper side, so that the idler wheel 11 can be used as a rotary cutting blade. A material holding device is arranged above the row meshing part _C3 to hold down the small diameter material accumulated on the cutting blade row meshing part, and prevents the small diameter material deposited in a horizontal state from jumping up during machining. Make sure that it is processed to the specified length.

Effects of the Invention Since the present invention is configured as described above, a large amount of small diameter material can be fed into the material hopper with its longitudinal direction aligned with the arrangement direction of the rotary cutting blade rows, and one and the other rotary cutting blade rows can be rotated at the same time. When the material hopper and the vibrating sieve are vibrated, the material in the material hopper is supplied from the supply port to the rotary cutting blade row engaging portion in a substantially horizontal state. At the same time, small-diameter materials are successively supplied to the engaging part of the rotary cutting blade array in a substantially horizontal state by the material drawing part of each rotary cutting blade facing into the material hopper from the comb bottom of the material hopper. It accumulates on the cutting blade row meshing part and is held down by the material holding device so that it does not jump up. The small-diameter materials deposited in the engaging part of the rotating cutting blade row are drawn into the engaging part of the cutting blade row sequentially from the lower layer by the material drawing part, and the material has a length that is approximately the same as the wall thickness of each rotating cutting blade. The processed product is cut to a fixed size and falls onto the processed product receiving side of the vibrating sieve. The processed products that have fallen onto the vibrating sieve are sieved into long chips of a fixed size or larger (upper screen material) and standard chips of the fixed size (lower screen material).

Therefore, while automatically and continuously feeding small-diameter materials into the material hopper, continuous processing can be performed by operating one and the other rotating cutting blade rows, and the continuously processed workpieces can be processed by the vibration of the vibrating sieve. This allows for continuous sieving into non-standard sieves and acceptable sieves, and allows the entire manufacturing process to be carried out efficiently in a consistent assembly line. The rotary cutting blade having the material drawing part can reliably supply small-diameter materials from the material hopper to the rotating cutting blade row meshing part, and also remove small-diameter materials accumulated in the cutting blade row meshing part from the lower layer. It has the advantage of being able to be pulled in and cut sequentially and reliably. In addition, by the vibration of a vibrating material hopper having a supply port, a comb bottom for a rotary cutting blade, etc., it is possible to feed small-diameter material in a horizontal state to the rotary cutting blade row meshing part, and at the same time, the material can be fed from the comb bottom to the rotating cutting blade row engagement part. The material drawing part of the rotary cutting blade facing into the hopper can also supply the small-diameter material in a horizontal state to the rotary cutting blade array engagement part, and has the effect that the small-diameter material can be continuously supplied without fear of interruption. Furthermore, the base end of the movable rod is pivoted to the part of the machine frame facing the material hopper, the idler is pivoted to the tip that protrudes toward the material hopper, and the idler is placed above the rotary cutting blade row engagement part. The material holding device configured with this structure prevents the material fed to the rotary cutting blade row meshing part from jumping up and maintains the material in an orderly state. This allows small diameter materials to be cut to the same length and reduces the number of defective products. It can be reduced.

[Brief explanation of the drawing]

Figure 1 is a longitudinal sectional front view of the manufacturing device of the present invention, Figure 2
The figure is a partially cutaway plan view, and FIG. 3 is a schematic perspective view of the prior art. In the figure, 1... Rotating cutting blade, 2... Material drawing part,
3... Machine frame, C ₁ ... One rotating cutting blade row, C ₂ ...
...Other rotating cutting blade row, C ₃ ... Rotating cutting blade row meshing part, 4... Material hopper, 5... Supply port, 6...
... Comb bottom, 7... Vibrating sieve, 8... Blade tip, 9... Vibrating bottom plate, 10... Movable rod, 11... Play wheel.

Claims (1)

[Claims for Utility Model Registration] (1) A large number of material drawing parts are formed in the circumferential direction at the cutting edge of the rotary cutting blade, and the large number of material drawing parts are aligned on a straight plane, and the large number of rotating cutting blades are connected to the machine frame. One row of rotating cutting blades is arranged in parallel at equal intervals, and the other row of rotating cutting blades is arranged in the same manner as the one row of rotating cutting blades. The rotary cutting blades of both rotary cutting blade rows are arranged at a height position, and the rotary cutting blades of both rotary cutting blade rows are engaged with each other, and a vibrating material hopper is connected to a supply port above one or the other rotary cutting blade row in the machine frame. The one or the other rotary cutting blade row in the machine frame is arranged so that the one or the other rotary cutting blade row faces into the material hopper from the comb bottom configured at the supply port side portion of the material hopper. A sizing chip manufacturing device with a vibrating sieve installed at the bottom with the processed product receiving side placed below the engagement of the rotary cutting blade rows. (2) A claim in which the circumferential surface of the disc is formed into a concave surface, a cutting edge is formed on the periphery, and a large number of material lead-in portions are formed at equal intervals in the circumferential direction of the cutting edge.
The rotary cutting blade described in (1). (3) The material hopper according to claim (1), wherein a supply port is provided at the lower part of one side wall of the peripheral wall, and a portion of the vibrating bottom plate provided on the peripheral wall on the supply port side is configured as a comb bottom for a rotary cutting blade. (4) The proximal end of the movable rod is located at the part of the machine frame facing the material hopper, in which one and the other rotating cutting blade rows are arranged to face each other and interlock with each other, and a material hopper is provided above one or the other rotating cutting blade row. A material holding device for a sizing chip manufacturing device, in which a movable rod has a movable rod which is pivoted so that its tip protrudes toward the material hopper side, and a idler wheel is pivoted to the tip of the movable rod and arranged above a rotary cutting blade array engagement part.