JPH0579973U - Board connection structure - Google Patents

Abstract

(57) [Abstract] [Purpose] The shape of the connecting conductor and wiring board has been improved,
(EN) Provided is a board connection structure capable of surely performing superposed connection between wiring boards at the time of reflow. [Structure] The bottom surface of a connection conductor 10 having a projection 8 on its upper surface is connected to a conductive pattern 9 on a first wiring board 6 by soldering, and the projection 8 is fitted into a through hole 3 of a second wiring board 15. The two substrates 6 and 15 were overlapped and connected by soldering.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a board connection structure in which wiring boards made of resin, metal, ceramic or the like are vertically stacked and connected.

[0002]

[Prior Art]

 As shown in the vertical sectional views of FIGS. 3 and 4, conventionally, the wiring board 5 and the wiring board 6 on which the circuit components such as the thick film resistor 1 and the chip component 2 are mounted are vertically stacked and soldered. When connecting the boards, the connection conductor 4 is arranged on the conductive pattern 9 of the wiring board 6 and fixed by soldering, as shown in FIG. Then, a solder paste is applied to the upper part of the connection conductor 4 fixed on the wiring board 6 and brought into contact with the conductive pattern 7 of the wiring board 5, and by reflowing in this state, the connection conductor 4 and each conductive pattern 7 are 9 is solder-joined to form an overlapping connection between the wiring boards 5 and 6.

[0003]

[Problems to be solved by the device]

 However, in the conventional board connection structure, it is not possible to clearly discriminate whether or not the overlapping connection between the wiring boards after the reflow has been made surely, and since the inspection is performed by an electrical means, the connection failure part of the solder Only when corrosion occurred, it was found that the lap connection between the wiring boards was defective, so improvement was desired.

Therefore, an object of the present invention is to provide a board connection structure in which the shapes of the connection conductor and the wiring board are improved so that the overlapping connection between the wiring boards can be surely performed at the time of reflow.

[0005]

[Means for Solving the Problems]

 In the present invention, the bottom surface of the connecting conductor having the protrusion on the upper surface is connected to the conductive pattern on the first wiring board by soldering, and the protrusion is fitted into the through hole of the second wiring board to connect the both boards. The structure is such that they are stacked and connected by soldering.

[0006]

[Action]

 In the present invention, since the connection conductor is provided with the projection and the through hole is provided in the wiring board to be soldered to the connection conductor, the bottom surface of the connection conductor is connected to the conductive pattern on the wiring board by soldering, and the connection is made. With the conductor protrusions fitted in the through holes of the wiring boards, reflow using solder paste, for example, and soldering the connecting conductors and the sulfur to connect each wiring board The connection is reflowed securely.

[0007]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a vertical sectional view of a board connecting structure of the present invention, and FIG. 2 is a perspective view of a joining conductor used in FIG.

As shown in FIG. 1, circuit components such as the thick film resistor 1 and the chip component 2 are fixedly arranged by soldering on both surfaces of the wiring substrate 15 and the wiring substrate 6. Through holes 3 are provided in the wiring board 15, and the through holes 3 are electrically connected to the upper and lower conductive pattern plates 11 and 12 of the wiring board 15. Reference numeral 10 is a connection conductor for connecting the wiring boards 15 and 6 by soldering, and is fixedly arranged on the wiring board 6 by soldering. Then, the protrusions 8 of the connection conductors 10 arranged on the wiring board 6 and the through holes 3 provided on the wiring board 15 are aligned and fitted. Then, the solder paste 13 (eg, melting temperature 150 ° C.) having a lower melting temperature than the solder (eg, melting temperature 185 ° C.) used for the circuit components mounted on the wiring boards 15 and 6 is placed in the through hole 3. Apply. When reflowing in this state, as shown in FIG. 1, the through holes 3 are soldered to the projections 8 of the connection conductors 10, and the wiring board 15 and the wiring board 6 are connected in a superposed state.

[0009]

[Effect of the device]

 As described above, in the present invention, the connection conductor is provided with the projection and the through hole is provided on the wiring board to be soldered to the connection conductor, so that the bottom surface of the connection conductor is connected to the conductive pattern on the wiring board by soldering. Since the protrusions of the connecting conductor are fitted in the through holes of the wiring board, reflow using solder paste is used to connect the connecting conductors and through holes by soldering to connect the wiring boards. , The overlapping connection between the wiring boards is reflowed in a reliable state. Moreover, after reflow, the through holes are blocked with solder, so if you visually check the through holes after reflow, or if you check with an optical means such as an image from a TV camera, etc., after the reflow, the wiring boards will not overlap. It is easy to determine whether or not the mating connection is being made reliably, and the practical effect is great.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing a connection conductor used in FIG.

FIG. 3 is a vertical cross-sectional view showing a conventional example of the present invention.

FIG. 4 is a vertical cross-sectional view of two wiring boards in a state before they are connected to each other in an overlapping manner in the state of FIG.

[Explanation of symbols]

 1, 2 Circuit parts 3 Through hole 5, 6 Wiring board 8 Protrusions 9, 11, 12 Conductive pattern 10 Connection conductor 13 Solder paste

Claims (1)

[Scope of utility model registration request] 1. A bottom surface of a connection conductor having a projection on its upper surface is connected to a conductive pattern on a first wiring board by soldering, and the projection is fitted into a through hole of a second wiring board to connect both boards. A board connection structure characterized in that they are stacked and connected by soldering.