JPH0579092B2 - - Google Patents
Info
- Publication number
- JPH0579092B2 JPH0579092B2 JP8825085A JP8825085A JPH0579092B2 JP H0579092 B2 JPH0579092 B2 JP H0579092B2 JP 8825085 A JP8825085 A JP 8825085A JP 8825085 A JP8825085 A JP 8825085A JP H0579092 B2 JPH0579092 B2 JP H0579092B2
- Authority
- JP
- Japan
- Prior art keywords
- oil
- phenolic resin
- oiticica oil
- catalyst
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 15
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 13
- 239000003054 catalyst Substances 0.000 claims description 13
- 150000002989 phenols Chemical class 0.000 claims description 9
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims description 6
- 150000003335 secondary amines Chemical class 0.000 claims description 6
- 239000012970 tertiary amine catalyst Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 14
- 239000002966 varnish Substances 0.000 description 10
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 239000002383 tung oil Substances 0.000 description 8
- 239000003921 oil Substances 0.000 description 7
- 235000019198 oils Nutrition 0.000 description 7
- 239000005011 phenolic resin Substances 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 6
- 229920003987 resole Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 229930040373 Paraformaldehyde Natural products 0.000 description 3
- 229920002866 paraformaldehyde Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- CUXYLFPMQMFGPL-UHFFFAOYSA-N (9Z,11E,13E)-9,11,13-Octadecatrienoic acid Natural products CCCCC=CC=CC=CCCCCCCCC(O)=O CUXYLFPMQMFGPL-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- CUXYLFPMQMFGPL-FWSDQLJQSA-N alpha-Eleostearic acid Natural products CCCCC=CC=C\C=C\CCCCCCCC(O)=O CUXYLFPMQMFGPL-FWSDQLJQSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 2
- IXLCRBHDOFCYRY-UHFFFAOYSA-N dioxido(dioxo)chromium;mercury(2+) Chemical compound [Hg+2].[O-][Cr]([O-])(=O)=O IXLCRBHDOFCYRY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- JIRHAGAOHOYLNO-UHFFFAOYSA-N (3-cyclopentyloxy-4-methoxyphenyl)methanol Chemical compound COC1=CC=C(CO)C=C1OC1CCCC1 JIRHAGAOHOYLNO-UHFFFAOYSA-N 0.000 description 1
- RMTXUPIIESNLPW-UHFFFAOYSA-N 1,2-dihydroxy-3-(pentadeca-8,11-dienyl)benzene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1O RMTXUPIIESNLPW-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- NJBCRXCAPCODGX-UHFFFAOYSA-N 2-methyl-n-(2-methylpropyl)propan-1-amine Chemical compound CC(C)CNCC(C)C NJBCRXCAPCODGX-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- QARRXYBJLBIVAK-UEMSJJPVSA-N 3-[(8e,11e)-pentadeca-8,11-dienyl]benzene-1,2-diol;3-[(8e,11e)-pentadeca-8,11,14-trienyl]benzene-1,2-diol;3-[(8e,11e,13e)-pentadeca-8,11,13-trienyl]benzene-1,2-diol;3-[(e)-pentadec-8-enyl]benzene-1,2-diol;3-pentadecylbenzene-1,2-diol Chemical compound CCCCCCCCCCCCCCCC1=CC=CC(O)=C1O.CCCCCC\C=C\CCCCCCCC1=CC=CC(O)=C1O.CCC\C=C\C\C=C\CCCCCCCC1=CC=CC(O)=C1O.C\C=C\C=C\C\C=C\CCCCCCCC1=CC=CC(O)=C1O.OC1=CC=CC(CCCCCCC\C=C\C\C=C\CC=C)=C1O QARRXYBJLBIVAK-UEMSJJPVSA-N 0.000 description 1
- IYROWZYPEIMDDN-UHFFFAOYSA-N 3-n-pentadec-8,11,13-trienyl catechol Natural products CC=CC=CCC=CCCCCCCCC1=CC=CC(O)=C1O IYROWZYPEIMDDN-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 235000019488 nut oil Nutrition 0.000 description 1
- 239000010466 nut oil Substances 0.000 description 1
- -1 octylphenol Chemical compound 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000005671 trienes Chemical group 0.000 description 1
- DQTMTQZSOJMZSF-UHFFFAOYSA-N urushiol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1O DQTMTQZSOJMZSF-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
Description
産業上の利用分野
本発明は、電子機器に使用されるフエノール樹
脂積層板を製造するときに用いるオイチシカ油変
性フエノール樹脂の製造法に関する。
従来の技術
従来、フエノール樹脂積層板あるいは銅張積層
板には、桐油変性のフエノール樹脂が広く用いら
れている。桐油は、共役二重結合を有し、フエノ
ール類との反応性が優れているためその変性フエ
ノール樹脂を用いることにより、優れた電気性能
及び打抜き加工性を有する積層板が得られた。
前記の桐油は、価格が大幅に変動し安定した原
料確保が困難である問題がある。そこで、桐油代
替品として用いられるオイチシカ油は、桐油に比
べて価格的に安定した原料であり、桐油の主成分
α−エレオステアリン酸と同様の共役トリエン構
造を有するα−リカン酸を主成分とするため、桐
油とよく似た反応性を示す。しかし、α−リカン
酸は、α−エレオステアリン酸と異なる点もあ
り、分子鎖中にケト基を有するためフエノール類
との反応性を異にする。また、オイチシカ油は、
桐油に比べ飽和脂肪族の含有量が多い。さらに粘
度が高いなどの相違点があり、フエノール樹脂と
の相溶性も異なる。
発明が解決しようとする問題点
例えば、オイチシカ油−フエノール付加物を塩
基性触媒下でホルムアルデヒドと反応させ、レゾ
ール化したとき、その樹脂組成物の相溶性が劣
り、透明均一な硬化物が得られ難い。また、塩基
性触媒が第3級アミン触媒では、反応性が著しく
劣り、アンモニア触媒等では積層板用基材への含
浸性に劣る欠点がある。
本発明は、積層板の製造に適し、特性の良い積
層板を提供できるオイチシカ油変性フエノール樹
脂を目的とするものである。
問題点を解決するための手段
本発明は、フエノール類とオイチシカ油をまず
酸性触媒存在下で反応させ、オイチシカ油−フエ
ノール類付加物をつくり、次いで第3級アミン触
媒存在下低級脂肪族アルコール溶媒中にてホルム
アルデヒド類と反応させ更に第2級アミン触媒を
添加しレゾール化させることを特徴とするオイチ
シカ油変性フエノール樹脂の製造法である。
作 用
本発明では、レゾール化反応において低級脂肪
族アルコール溶媒により系を均一化すると共に急
激な高分子生成を抑制する。そして、塩基性触媒
として、まず第3級アミン存在下で反応させる事
により、高分子生成が少なくメチロール基の多い
反応系を生成し、次いで第2級アミン触媒存在下
で反応させることにより、硬化速度が速く、架橋
密度の高い樹脂ワニスを得る事ができる。
実施例
本発明に用いるフエノール類には、石炭酸、ク
レゾール、キシレノール、ブチルフエノール、オ
クチルフエノール、ノニルフエノール、カシユナ
ツトオイル、ウルシオール、レゾルシン、ナフト
ール或は前記フエノール類のノボラツクビスフエ
ノールAなどがある。また、本発明に用いる酸性
触媒には、塩酸、硫酸、燐酸などの無機酸、トル
エンスルホン酸、キシレンスルホン酸などの有機
酸あるいはルイス酸などがある。
酸性触媒存在下で得られたオイチシカ油−フエ
ノール類付加物は、次いで第3級アミン触媒存在
下低級脂肪族アルコール溶媒中にてホルムアルデ
ヒド類と反応させ更に第2級アミン触媒下で反応
を進めレゾール化する。
本発明に用いる第3級アミンとしては、トリメ
チルアミン、トリエチルアミン、ベンジルジメチ
ルアミン、2,4,6−トリス(ジメチルアミノ
メチル)フエノール、2−メチルイミダゾール、
2−フエニルイミダゾール、2−エチル4−メチ
ルイミダゾールなどが適当である。また、本発明
に用いる第2級アミンとしては、ジメチルアミ
ン、ジプロピルアミン、ジエチルアミン、ジイソ
ブチルアミンなどが適当である。ホルムアルデヒ
ド類としては、反応系を均一化しレゾール化反応
後の減圧脱水工程を省略でき、更に塩基性触媒の
添加量を少なくできるなどの利点から高濃度の80
〜90%パラホルムアルデヒトを用いるのが好まし
い。ホルムアルデヒド類のモル比は、フエノール
類に対し1.1〜1.3モルが適当である。
尚、第3級アミン触媒下低級脂肪族アルコール
溶媒中のレゾール化反応の際、必要に応じて前記
フエノール類を追加しても差し支えない。
また、本発明に用いる低級脂肪族アルコール
は、、メタノール、エタノール、プロピルアルコ
ールなど炭素数3以下のものが好ましい。
本発明によるオイチシカ油変性フエノール樹脂
は、コツトンリンター紙、クラフト紙などの基材
に含浸させた後所要枚数を重ね合わせ、必要に応
じてさらに片面または両面に銅箔を重ねて加熱加
圧して積層板あるいは銅張積層板を得る。また本
発明によるオイチシカ油変性フエノール樹脂を基
材に含浸する時、水溶性フエノール樹脂初期縮合
物を混合するかもしくは前記初期縮合物を予め含
浸した基材を用いることも可能である。
実施例 1
フエノール500g、オイチシカ油500g、パラト
ルエンスルホン酸0.5gを加え、95〜100℃にて
120分間反応し、オイチシカ油−フエノール付加
物を得た。引続き、メタノール68g、トリエチル
アミン27g、85%パラホルムアルデヒド220gを
加え95〜100℃で3時間反応した後ジエチルアミ
ンを7g添加し95〜100℃で更に4時間反応しゲ
ルタイム(160℃)3分のレゾールワニスを得た。
このワニスをメタノールで希釈し50%濃度のオ
イチシカ油変形フエノール樹脂ワニスを得た。ク
ラフト紙に前記オイチシカ油変性フエノール樹脂
ワニスを含浸乾燥して樹脂付着分48重量%の塗工
紙を得た。前記塗工紙8プライとその片面に接着
剤付き35μ厚銅箔を重ね、160℃、100Kgf/cm3の
条件にて60分間加熱加圧して厚さ1.6mmの銅張積
層板を得た。その性能を第1表に示す。
比較例 1
フエノール500g、オイチシカ油500g、パラト
ルエンスルホン酸0.5gを加え、95〜100℃にて
120分間反応し、オイチシカ油−フエノール付加
物を得た。引続き、メタノール68g、トリエチル
アミン27g、85%パラホルムアルデヒド220gを
加え95〜100℃で8時間反応しゲルタイム3分40
秒のレゾールワニスを得た(ゲル化は6時間後よ
り進まず系中粘度が高くなり、8時間以上は反応
継続不可であつた)。
上記ワニスを用い、実施例1と同様にして厚さ
1.6mmの銅張積層板を得た。その性能を第1表に
示す。
INDUSTRIAL APPLICATION FIELD The present invention relates to a method for producing a phenolic resin modified with Oiticica oil, which is used when producing a phenolic resin laminate used in electronic equipment. Prior Art Conventionally, phenolic resin modified with tung oil has been widely used for phenolic resin laminates or copper-clad laminates. Tung oil has a conjugated double bond and has excellent reactivity with phenols, so by using the modified phenolic resin, a laminate with excellent electrical performance and punching workability was obtained. The above-mentioned tung oil has a problem in that the price fluctuates significantly and it is difficult to secure a stable raw material. Therefore, Oiticica oil, which is used as a substitute for tung oil, is a raw material that is more stable in price than tung oil, and its main component is α-lycanic acid, which has a conjugated triene structure similar to α-eleostearic acid, the main component of tung oil. Therefore, it exhibits reactivity very similar to tung oil. However, α-lycanic acid differs from α-eleostearic acid in that it has a keto group in its molecular chain, which makes it different in its reactivity with phenols. In addition, Oiticica oil is
It has a higher content of saturated aliphatics than tung oil. Furthermore, there are differences such as higher viscosity, and compatibility with phenolic resins is also different. Problems to be Solved by the Invention For example, when an oiticica oil-phenol adduct is reacted with formaldehyde under a basic catalyst to form a resol, the compatibility of the resin composition is poor and a transparent and uniform cured product cannot be obtained. hard. Further, when the basic catalyst is a tertiary amine catalyst, the reactivity is extremely poor, and when an ammonia catalyst or the like is used, there is a drawback that the impregnating property into the base material for the laminate is poor. The object of the present invention is to obtain an Oiticica oil-modified phenolic resin that is suitable for manufacturing laminates and can provide laminates with good properties. Means for Solving the Problems The present invention involves first reacting phenols and Oiticica oil in the presence of an acidic catalyst to produce an Oiticica oil-phenol adduct, and then using a lower aliphatic alcohol solvent in the presence of a tertiary amine catalyst. This is a method for producing Oiticica oil-modified phenol resin, which is characterized by reacting it with formaldehyde in the reactor and further adding a secondary amine catalyst to form a resol. Effects In the present invention, in the resolization reaction, the lower aliphatic alcohol solvent homogenizes the system and suppresses rapid polymer production. Then, by first reacting in the presence of a tertiary amine as a basic catalyst, a reaction system with less polymer formation and many methylol groups is generated, and then by reacting in the presence of a secondary amine catalyst, curing is performed. A resin varnish with high crosslinking density can be obtained at a high speed. Examples Phenols used in the present invention include carbolic acid, cresol, xylenol, butylphenol, octylphenol, nonylphenol, oak nut oil, urushiol, resorcinol, naphthol, and novolak bisphenol A of the above phenols. . Further, the acidic catalyst used in the present invention includes inorganic acids such as hydrochloric acid, sulfuric acid, and phosphoric acid, organic acids such as toluenesulfonic acid and xylenesulfonic acid, and Lewis acids. The Oiticica oil-phenol adduct obtained in the presence of an acidic catalyst is then reacted with formaldehyde in a lower aliphatic alcohol solvent in the presence of a tertiary amine catalyst, and the reaction further proceeds under a secondary amine catalyst to form a resol. become Examples of the tertiary amine used in the present invention include trimethylamine, triethylamine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, 2-methylimidazole,
2-phenylimidazole, 2-ethyl 4-methylimidazole, etc. are suitable. Further, as the secondary amine used in the present invention, dimethylamine, dipropylamine, diethylamine, diisobutylamine, etc. are suitable. For formaldehyde, high concentration 80
Preferably, ~90% paraformaldehyde is used. The appropriate molar ratio of formaldehyde to phenols is 1.1 to 1.3 moles. Incidentally, during the resolization reaction in a lower aliphatic alcohol solvent under a tertiary amine catalyst, the above-mentioned phenols may be added as necessary. Further, the lower aliphatic alcohol used in the present invention preferably has 3 or less carbon atoms, such as methanol, ethanol, and propyl alcohol. The Oiticica oil-modified phenolic resin according to the present invention is obtained by impregnating a base material such as cotton linter paper or kraft paper, then stacking the required number of sheets, and if necessary, further layering copper foil on one or both sides and heating and pressing. Obtain a laminate or copper-clad laminate. Furthermore, when impregnating a substrate with the Oiticica oil-modified phenolic resin according to the present invention, it is also possible to mix a water-soluble phenolic resin initial condensate or to use a substrate pre-impregnated with the aforementioned initial condensate. Example 1 Add 500 g of phenol, 500 g of oiticica oil, and 0.5 g of paratoluenesulfonic acid, and heat at 95 to 100°C.
The reaction was carried out for 120 minutes to obtain an oiticica oil-phenol adduct. Subsequently, 68 g of methanol, 27 g of triethylamine, and 220 g of 85% paraformaldehyde were added and reacted for 3 hours at 95 to 100°C, then 7 g of diethylamine was added and reacted for another 4 hours at 95 to 100°C, resulting in a resol varnish with a gel time (160°C) of 3 minutes. Obtained. This varnish was diluted with methanol to obtain a 50% concentration oiticica oil modified phenolic resin varnish. Kraft paper was impregnated with the Oiticica oil-modified phenolic resin varnish and dried to obtain coated paper with a resin adhesion content of 48% by weight. Eight plies of the coated paper and a 35μ thick copper foil coated with adhesive were layered on one side of the coated paper, and heated and pressed at 160° C. and 100 kgf/cm 3 for 60 minutes to obtain a 1.6 mm thick copper clad laminate. Its performance is shown in Table 1. Comparative Example 1 Add 500 g of phenol, 500 g of oiticica oil, and 0.5 g of paratoluenesulfonic acid, and heat at 95 to 100℃.
The reaction was carried out for 120 minutes to obtain an oiticica oil-phenol adduct. Subsequently, 68 g of methanol, 27 g of triethylamine, and 220 g of 85% paraformaldehyde were added and reacted at 95 to 100°C for 8 hours to give a gel time of 3 minutes 40
A second resol varnish was obtained (gelation did not proceed after 6 hours and the viscosity in the system increased, making it impossible to continue the reaction for more than 8 hours). Using the above varnish, the thickness was determined in the same manner as in Example 1.
A 1.6 mm copper clad laminate was obtained. Its performance is shown in Table 1.
【表】【table】
【表】
発明の効果
本発明によるオイチシカ油変性フエノール樹脂
は、第3級アミン触媒を用いレゾール化して系中
にメチロール基の多いワニスを得、次いで第2級
アミン触媒を用いてワニスを高分子化することに
より、得られたワニスは基材に対する含浸性が向
上するとともに架橋密度の高い硬化物を得ること
ができ、電気特性、耐水性に優れかつ打抜き加工
時の層間密着性良好な積層板を得ることができ
る。また、第1表に示すようにワニス揮散率が低
いことから、材料歩留り等の生産性に優れてお
り、工業的価値極めて大なるものである。[Table] Effects of the Invention The Oiticica oil-modified phenolic resin according to the present invention is converted into a resol using a tertiary amine catalyst to obtain a varnish with a large number of methylol groups in the system, and then converted into a polymer using a secondary amine catalyst. The resulting varnish has improved impregnating properties with respect to the base material, and a cured product with high crosslinking density can be obtained, resulting in a laminate with excellent electrical properties, water resistance, and good interlayer adhesion during punching. can be obtained. In addition, as shown in Table 1, since the varnish volatilization rate is low, it has excellent productivity such as material yield, and has extremely great industrial value.
Claims (1)
在下で反応させた後、第3級アミン触媒存在下、
低級脂肪族アルコール溶媒中でホルムアルデヒド
類と反応させ更に第2級アミン触媒下で反応させ
ることを特徴とするオイチシカ油変性フエノール
樹脂の製造法。1. After reacting phenols and oiticica oil in the presence of an acidic catalyst, in the presence of a tertiary amine catalyst,
A method for producing an oil-modified phenolic resin, which comprises reacting with formaldehyde in a lower aliphatic alcohol solvent and further reacting under a secondary amine catalyst.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8825085A JPS61246220A (en) | 1985-04-24 | 1985-04-24 | Production of oiticica oil-modified phenolic resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8825085A JPS61246220A (en) | 1985-04-24 | 1985-04-24 | Production of oiticica oil-modified phenolic resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61246220A JPS61246220A (en) | 1986-11-01 |
JPH0579092B2 true JPH0579092B2 (en) | 1993-11-01 |
Family
ID=13937610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8825085A Granted JPS61246220A (en) | 1985-04-24 | 1985-04-24 | Production of oiticica oil-modified phenolic resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61246220A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3141745A1 (en) | 2015-09-11 | 2017-03-15 | Mitsubishi Heavy Industries, Ltd. | Wind turbine power generating apparatus and method of connecting the same |
EP3141744A1 (en) | 2015-09-11 | 2017-03-15 | Mitsubishi Heavy Industries, Ltd. | Wind turbine power generating apparatus and method of starting the same |
-
1985
- 1985-04-24 JP JP8825085A patent/JPS61246220A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3141745A1 (en) | 2015-09-11 | 2017-03-15 | Mitsubishi Heavy Industries, Ltd. | Wind turbine power generating apparatus and method of connecting the same |
EP3141744A1 (en) | 2015-09-11 | 2017-03-15 | Mitsubishi Heavy Industries, Ltd. | Wind turbine power generating apparatus and method of starting the same |
Also Published As
Publication number | Publication date |
---|---|
JPS61246220A (en) | 1986-11-01 |
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