JPH0576428B2 - - Google Patents
Info
- Publication number
- JPH0576428B2 JPH0576428B2 JP21112586A JP21112586A JPH0576428B2 JP H0576428 B2 JPH0576428 B2 JP H0576428B2 JP 21112586 A JP21112586 A JP 21112586A JP 21112586 A JP21112586 A JP 21112586A JP H0576428 B2 JPH0576428 B2 JP H0576428B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chlorine
- acid
- antistatic
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 77
- 239000011347 resin Substances 0.000 claims description 77
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 38
- 239000000460 chlorine Substances 0.000 claims description 38
- 229910052801 chlorine Inorganic materials 0.000 claims description 38
- 239000003381 stabilizer Substances 0.000 claims description 27
- -1 hydrazides Substances 0.000 claims description 21
- 239000010410 layer Substances 0.000 claims description 21
- 150000001875 compounds Chemical class 0.000 claims description 19
- 239000011247 coating layer Substances 0.000 claims description 14
- 239000004593 Epoxy Substances 0.000 claims description 9
- 229920001971 elastomer Polymers 0.000 claims description 9
- 229920000578 graft copolymer Polymers 0.000 claims description 9
- 239000005060 rubber Substances 0.000 claims description 9
- 229920005992 thermoplastic resin Polymers 0.000 claims description 9
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims description 8
- 239000000057 synthetic resin Substances 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 claims description 4
- 239000011342 resin composition Substances 0.000 claims description 3
- 229920005601 base polymer Polymers 0.000 claims description 2
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 claims description 2
- 150000008301 phosphite esters Chemical class 0.000 claims description 2
- 230000000379 polymerizing effect Effects 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 22
- 239000002184 metal Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 238000000465 moulding Methods 0.000 description 9
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical class OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 239000002216 antistatic agent Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 235000013305 food Nutrition 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 229910052718 tin Inorganic materials 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 229910052745 lead Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 150000005846 sugar alcohols Polymers 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 239000011593 sulfur Substances 0.000 description 5
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000010828 elution Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 125000000468 ketone group Chemical group 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- UKVYVZLTGQVOPX-IHWYPQMZSA-N (z)-3-aminobut-2-enoic acid Chemical compound C\C(N)=C\C(O)=O UKVYVZLTGQVOPX-IHWYPQMZSA-N 0.000 description 2
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 2
- OYIFNHCXNCRBQI-UHFFFAOYSA-N 2-aminoadipic acid Chemical compound OC(=O)C(N)CCCC(O)=O OYIFNHCXNCRBQI-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229930195725 Mannitol Natural products 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 239000002174 Styrene-butadiene Substances 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000001334 alicyclic compounds Chemical class 0.000 description 2
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 2
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 2
- 125000003277 amino group Chemical class 0.000 description 2
- 239000010775 animal oil Substances 0.000 description 2
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 description 2
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- PGRHXDWITVMQBC-UHFFFAOYSA-N dehydroacetic acid Chemical compound CC(=O)C1C(=O)OC(C)=CC1=O PGRHXDWITVMQBC-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 2
- 229960004488 linolenic acid Drugs 0.000 description 2
- 239000000944 linseed oil Substances 0.000 description 2
- 235000021388 linseed oil Nutrition 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 239000000594 mannitol Substances 0.000 description 2
- 235000010355 mannitol Nutrition 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 125000005461 organic phosphorous group Chemical group 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002367 phosphate rock Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 235000010356 sorbitol Nutrition 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 239000011115 styrene butadiene Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- HLZKNKRTKFSKGZ-UHFFFAOYSA-N tetradecan-1-ol Chemical compound CCCCCCCCCCCCCCO HLZKNKRTKFSKGZ-UHFFFAOYSA-N 0.000 description 2
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 235000015112 vegetable and seed oil Nutrition 0.000 description 2
- 239000008158 vegetable oil Substances 0.000 description 2
- 239000000811 xylitol Substances 0.000 description 2
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 description 2
- 235000010447 xylitol Nutrition 0.000 description 2
- 229960002675 xylitol Drugs 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- KFSWZAIFJAKGSH-UHFFFAOYSA-N (4-nonyl-2-phenylphenyl) dihydrogen phosphite Chemical compound CCCCCCCCCC1=CC=C(OP(O)O)C(C=2C=CC=CC=2)=C1 KFSWZAIFJAKGSH-UHFFFAOYSA-N 0.000 description 1
- HACMXPVQBHWNHX-VKHMYHEASA-N (4s)-4-amino-5-hydrazinyl-5-oxopentanoic acid Chemical compound NNC(=O)[C@@H](N)CCC(O)=O HACMXPVQBHWNHX-VKHMYHEASA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- MTANTOSWGQDIGK-NSCUHMNNSA-N (e)-but-2-enehydrazide Chemical compound C\C=C\C(=O)NN MTANTOSWGQDIGK-NSCUHMNNSA-N 0.000 description 1
- GEYKZYNEWQWLTF-KTKRTIGZSA-N (z)-octadec-9-enehydrazide Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)NN GEYKZYNEWQWLTF-KTKRTIGZSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- KHUFHLFHOQVFGB-UHFFFAOYSA-N 1-aminoanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2N KHUFHLFHOQVFGB-UHFFFAOYSA-N 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- HAZJTCQWIDBCCE-UHFFFAOYSA-N 1h-triazine-6-thione Chemical compound SC1=CC=NN=N1 HAZJTCQWIDBCCE-UHFFFAOYSA-N 0.000 description 1
- VJEZYZLITKUTFH-UHFFFAOYSA-N 2-(hydrazinecarbonyl)benzoic acid Chemical compound NNC(=O)C1=CC=CC=C1C(O)=O VJEZYZLITKUTFH-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- DZYHJDLBFUOKBD-UHFFFAOYSA-N 2-amino-2-hydroxybutanedioic acid Chemical compound OC(=O)C(O)(N)CC(O)=O DZYHJDLBFUOKBD-UHFFFAOYSA-N 0.000 description 1
- QRKJNCRCYBKANP-UHFFFAOYSA-N 2-amino-n-phenylacetamide Chemical compound NCC(=O)NC1=CC=CC=C1 QRKJNCRCYBKANP-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- KLLLJCACIRKBDT-UHFFFAOYSA-N 2-phenyl-1H-indole Chemical compound N1C2=CC=CC=C2C=C1C1=CC=CC=C1 KLLLJCACIRKBDT-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- FLROJJGKUKLCAE-UHFFFAOYSA-N 3-amino-2-methylphenol Chemical compound CC1=C(N)C=CC=C1O FLROJJGKUKLCAE-UHFFFAOYSA-N 0.000 description 1
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 1
- ODHCTXKNWHHXJC-VKHMYHEASA-N 5-oxo-L-proline Chemical compound OC(=O)[C@@H]1CCC(=O)N1 ODHCTXKNWHHXJC-VKHMYHEASA-N 0.000 description 1
- ODHCTXKNWHHXJC-UHFFFAOYSA-N 5-oxoproline Chemical compound OC(=O)C1CCC(=O)N1 ODHCTXKNWHHXJC-UHFFFAOYSA-N 0.000 description 1
- ALEBYBVYXQTORU-UHFFFAOYSA-N 6-hydrazinyl-6-oxohexanoic acid Chemical compound NNC(=O)CCCCC(O)=O ALEBYBVYXQTORU-UHFFFAOYSA-N 0.000 description 1
- BWDBEAQIHAEVLV-UHFFFAOYSA-N 6-methylheptan-1-ol Chemical compound CC(C)CCCCCO BWDBEAQIHAEVLV-UHFFFAOYSA-N 0.000 description 1
- QDTDKYHPHANITQ-UHFFFAOYSA-N 7-methyloctan-1-ol Chemical compound CC(C)CCCCCCO QDTDKYHPHANITQ-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-N Acetoacetic acid Natural products CC(=O)CC(O)=O WDJHALXBUFZDSR-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical group C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 239000004287 Dehydroacetic acid Substances 0.000 description 1
- UQBOJOOOTLPNST-UHFFFAOYSA-N Dehydroalanine Chemical compound NC(=C)C(O)=O UQBOJOOOTLPNST-UHFFFAOYSA-N 0.000 description 1
- 241000490229 Eucephalus Species 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 1
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 description 1
- QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- BGRDGMRNKXEXQD-UHFFFAOYSA-N Maleic hydrazide Chemical compound OC1=CC=C(O)N=N1 BGRDGMRNKXEXQD-UHFFFAOYSA-N 0.000 description 1
- FCSHMCFRCYZTRQ-UHFFFAOYSA-N N,N'-diphenylthiourea Chemical compound C=1C=CC=CC=1NC(=S)NC1=CC=CC=C1 FCSHMCFRCYZTRQ-UHFFFAOYSA-N 0.000 description 1
- RFMMMVDNIPUKGG-YFKPBYRVSA-N N-acetyl-L-glutamic acid Chemical compound CC(=O)N[C@H](C(O)=O)CCC(O)=O RFMMMVDNIPUKGG-YFKPBYRVSA-N 0.000 description 1
- XUYPXLNMDZIRQH-LURJTMIESA-N N-acetyl-L-methionine Chemical compound CSCC[C@@H](C(O)=O)NC(C)=O XUYPXLNMDZIRQH-LURJTMIESA-N 0.000 description 1
- CBQJSKKFNMDLON-JTQLQIEISA-N N-acetyl-L-phenylalanine Chemical compound CC(=O)N[C@H](C(O)=O)CC1=CC=CC=C1 CBQJSKKFNMDLON-JTQLQIEISA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- BHHGXPLMPWCGHP-UHFFFAOYSA-N Phenethylamine Chemical compound NCCC1=CC=CC=C1 BHHGXPLMPWCGHP-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 235000019485 Safflower oil Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 235000019486 Sunflower oil Nutrition 0.000 description 1
- 239000003490 Thiodipropionic acid Substances 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 125000000738 acetamido group Chemical group [H]C([H])([H])C(=O)N([H])[*] 0.000 description 1
- OFLXLNCGODUUOT-UHFFFAOYSA-N acetohydrazide Chemical compound C\C(O)=N\N OFLXLNCGODUUOT-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 235000004279 alanine Nutrition 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- WARCRYXKINZHGQ-UHFFFAOYSA-N benzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1 WARCRYXKINZHGQ-UHFFFAOYSA-N 0.000 description 1
- HCOMFAYPHBFMKU-UHFFFAOYSA-N butanedihydrazide Chemical compound NNC(=O)CCC(=O)NN HCOMFAYPHBFMKU-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- FCCCRBDJBTVFSJ-UHFFFAOYSA-N butanehydrazide Chemical compound CCCC(=O)NN FCCCRBDJBTVFSJ-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229960000541 cetyl alcohol Drugs 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRGNPJFAKZHQPS-UHFFFAOYSA-N chloroethene;ethene Chemical compound C=C.ClC=C KRGNPJFAKZHQPS-UHFFFAOYSA-N 0.000 description 1
- 235000012343 cottonseed oil Nutrition 0.000 description 1
- 239000002385 cottonseed oil Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical class OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 235000019258 dehydroacetic acid Nutrition 0.000 description 1
- 229940061632 dehydroacetic acid Drugs 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 238000007922 dissolution test Methods 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- YTQHSQQSLTYMSL-UHFFFAOYSA-N dodecanohydrazide Chemical compound CCCCCCCCCCCC(=O)NN YTQHSQQSLTYMSL-UHFFFAOYSA-N 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 229940093476 ethylene glycol Drugs 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- SSVSELJXJJCANX-UHFFFAOYSA-N hexadecanehydrazide Chemical compound CCCCCCCCCCCCCCCC(=O)NN SSVSELJXJJCANX-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- QKWRNBNHSRYCOE-UHFFFAOYSA-N hexanehydrazide Chemical compound CCCCCC(=O)NN QKWRNBNHSRYCOE-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229960001855 mannitol Drugs 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229940043348 myristyl alcohol Drugs 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- VMFUMDXVTKTZQY-UHFFFAOYSA-N naphthalene-1-carbohydrazide Chemical compound C1=CC=C2C(C(=O)NN)=CC=CC2=C1 VMFUMDXVTKTZQY-UHFFFAOYSA-N 0.000 description 1
- BYTFESSQUGDMQQ-UHFFFAOYSA-N octadecanehydrazide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NN BYTFESSQUGDMQQ-UHFFFAOYSA-N 0.000 description 1
- IIGMITQLXAGZTL-UHFFFAOYSA-N octyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCCCCC IIGMITQLXAGZTL-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- PSIKPHJLTVSQFO-UHFFFAOYSA-N propanedihydrazide Chemical compound NNC(=O)CC(=O)NN PSIKPHJLTVSQFO-UHFFFAOYSA-N 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- 229940079889 pyrrolidonecarboxylic acid Drugs 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000003813 safflower oil Substances 0.000 description 1
- 235000005713 safflower oil Nutrition 0.000 description 1
- 229960002920 sorbitol Drugs 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 229940012831 stearyl alcohol Drugs 0.000 description 1
- 239000002600 sunflower oil Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 235000019303 thiodipropionic acid Nutrition 0.000 description 1
- QERYCTSHXKAMIS-UHFFFAOYSA-N thiophene-2-carboxylic acid Chemical compound OC(=O)C1=CC=CS1 QERYCTSHXKAMIS-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- XUHUMYVYHLHMCD-UHFFFAOYSA-N tris(2-cyclohexylphenyl) phosphite Chemical compound C1CCCCC1C1=CC=CC=C1OP(OC=1C(=CC=CC=1)C1CCCCC1)OC1=CC=CC=C1C1CCCCC1 XUHUMYVYHLHMCD-UHFFFAOYSA-N 0.000 description 1
- MGMXGCZJYUCMGY-UHFFFAOYSA-N tris(4-nonylphenyl) phosphite Chemical compound C1=CC(CCCCCCCCC)=CC=C1OP(OC=1C=CC(CCCCCCCCC)=CC=1)OC1=CC=C(CCCCCCCCC)C=C1 MGMXGCZJYUCMGY-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
(産業上の利用分野)
本発明は塩素含有樹脂の成型品に関し、特に半
導体等の電子部品の製造設備、梱包容器、その機
器ケース、更には生化学、医療、医薬、食品関連
の用途等に好適に用いられる新規な塩素含有樹脂
成型品に関する。
(従来の技術)
塩素含有樹脂の代表例である塩化ビニル(以
下、PVCと照称する)樹脂は安価・強靭且つ耐
薬品性、二次加工性に優れていることから合成樹
脂成型品として広く用いられている。該PVC樹
脂は樹脂構造の特性から、成型時の温度によりH
およびCI元素が遊離して脱塩酸し、成型品が黄
変乃至黒変する為、樹脂原料中に事前にPVC樹
脂用安定剤を添加させておくのが一般的である。
斯かる安定剤としてはPb或はSn系金属化合物の
安定剤が主に用いられており、PVC以外の他の
塩素含有樹脂においても同様の金属系安定剤が用
いられていた。
(発明が解決しようとする問題点)
ところで、近時半導体を主体とした電子部品の
発展は目覚ましいものがあるが、斯かる半導体の
製造設備や半導体部品の梱包容器、該半導体を用
いた機器のケースなどの関連機器にも合成樹脂成
型品が用いられるようになつたことは周知の通り
である。このような製造設備を用いた電子部品の
製造工程において水洗・酸洗等の種々の処理をし
なければならず、また梱包容器、機器ケース等も
酸洗い或は水洗等の処理をしなければならず、上
記のごとくPb或はSnなどの金属化合物を安定剤
として含む塩素含有樹脂は、上記処理の際にこれ
らの金属元素が溶出し、電子部品等に悪影響を及
ぼすことになる為、高品質の半導体、例えば1メ
ガビツトの半導体用の部材としては使用出来なか
つた。この他、生化学、医療、医薬、食品関連の
用途においても金属の溶出が種々のトラブルの原
因となつていた。このような実情から上記のごと
き用途に適用される合成樹脂としては熱安定性に
極めて優れたフツ素樹脂が用いられる場合もある
が、該フツ素樹脂は高価であり且つ溶接などの二
次加工がしにくいと云う欠点を有しているため汎
用性に乏しかつた。従つてこのような欠点を有さ
ずしかも安価・強靭且つ耐薬品性に優れた塩素含
有樹脂での上記用途への適正化が強く望まれると
こであつた。
亦、一般に合成樹脂成型品は電気抵抗率が大き
く(上記塩素含有樹脂も例外ではない)、摩擦や
剥離によつて容易に帯電し、雰囲気中のゴミや埃
りを吸着するため、上記用途に供した場合電子部
品等の性能に悪影響を及ぼす。
本発明は叙上に鑑みなされたもので、PbやSn
などの金属元素を含まない安定剤にて安定化され
た塩素含有樹脂と制電性若しくは導電性材料とを
組み合わせることにより、金属元素が溶出せずし
かもゴミや埃り等の付着がなく、上記半導体関連
等の用途に極めて有効且つ安価で新規な塩素含有
樹脂成型品を提供せんとするものである。
(問題点を解決する為の手段)
上記目的を達成するための本発明塩素含有樹脂
成型品の構成を添付の実施例図に基づき説明する
と、第1図は本発明成型品の一実施例を示す部分
切欠縦断面図、第2図はその適用例を示す部分拡
大斜視図である。即ち、本発明の塩素含有樹脂成
型品は、アミノカルボン酸、ヒドラジド、エポキ
シ化合物及び有機亜燐酸エステル等の非金属系安
定剤より選ばれたいずれか一種若しくは数種によ
り安定化された塩素含有樹脂の基層部1の少なく
とも片面に、制電性若しくは導電性被覆層2が積
層一体とされ且つ全体が所望形状に成径されて成
ることを要旨とするものである。
ここで基層部1を構成する塩素含有樹脂とは、
前記のPVC樹脂の他に塩素化塩化ビニル樹脂、
エチレン化塩化ビニル樹脂、他の樹脂とのアロイ
など、塩化ビニルを主体とする樹脂を云う。斯か
る塩素含有樹脂の重合度は種々選定されるが、加
工温度を低く出来、耐熱性をさほど要求しない低
重合度、例えば平均重合度700〜800のものを用い
ると加工範囲が広げられ高品質の成型品が得られ
る。この低重合度の樹脂は特に透明成型品を得る
場合に好ましく採用される。
基層部1を構成する塩素含有樹脂は、上記の如
き非金属系の安定剤にて安定化されるが、この非
金属系安定剤のうち、アミノカルボン酸は、アミ
ノ基とカルボン酸基とを有する化合物の総称であ
り、このアミノ基を有する化合物としては、アン
モニア、尿素、アクリロニトリル、アミノアセト
アニリド、アミノアントラキノン、アミノエタノ
ール、アミノエチレン、アミノエチルベンゼン、
アミノクレゾール、アミノフエノール、カプロラ
クタム、等が挙げられ、一方カルボン酸基を有す
る化合物としては、酪酸、カプロン酸、ラウリン
酸、パルミチン酸、ステアリン酸、クロトン酸、
オレイン酸、リノレン酸、安息香酸、ナフトル
酸、マロン酸、コハク酸、アジピン酸、マレイン
酸、フタル酸等を挙げることが出来る。また、こ
れらの化合物であるアミノカルボン酸の代表的な
ものとしては、アセチルグルタミン酸、グリシ
ン、アラニン、ピロリドンカルボン酸、リジン、
アルキニン、トリプトフアン、アントラニル酸、
安息香酸、β−アミノクロトン酸、α−アミノア
クリル酸、α−アミノアジピン酸、アミノマロイ
ン酸、アセチルフエニルアラニン、アセチルメチ
オニン及びこれらのエステル化合物、更にアセチ
ルアミノ酸とペンタエリスリトール又はジペンタ
エリスリトールとのエステル化合物、2−ピロリ
ドン−5−カルボン酸とペンタエリスリトールと
のエステル化合物等が挙げられる。これらのアミ
ノカルボン酸のうち、β−アミノクロトン酸エス
テルは、一般式
(Field of Industrial Application) The present invention relates to molded products made of chlorine-containing resin, and is particularly applicable to manufacturing equipment for semiconductors and other electronic components, packaging containers, equipment cases thereof, and biochemical, medical, pharmaceutical, and food-related applications. The present invention relates to a novel chlorine-containing resin molded product that can be suitably used. (Prior art) Vinyl chloride (hereinafter referred to as PVC) resin, which is a typical example of chlorine-containing resin, is widely used as synthetic resin molded products because it is inexpensive, tough, chemical resistant, and has excellent secondary processability. It is being Due to the characteristics of the PVC resin structure, H
and CI elements are liberated and dehydrochlorinated, causing yellowing or blackening of the molded product, so it is common to add a stabilizer for PVC resin to the resin raw material in advance.
As such stabilizers, stabilizers of Pb or Sn-based metal compounds are mainly used, and similar metal-based stabilizers have been used in other chlorine-containing resins other than PVC. (Problems to be Solved by the Invention) Incidentally, the recent development of electronic components based on semiconductors has been remarkable. It is well known that synthetic resin molded products have come to be used for related equipment such as cases. In the manufacturing process of electronic components using such manufacturing equipment, various treatments such as washing with water and pickling must be performed, and packaging containers, equipment cases, etc. must also be treated with pickling or washing with water. However, as mentioned above, chlorine-containing resins containing metal compounds such as Pb or Sn as stabilizers are not suitable for high-temperature resins, as these metal elements will be eluted during the above treatment and have an adverse effect on electronic components. It could not be used as a component for high-quality semiconductors, for example, 1 megabit semiconductors. In addition, metal elution has caused various troubles in biochemical, medical, pharmaceutical, and food-related applications. Under these circumstances, fluororesin, which has extremely high thermal stability, is sometimes used as a synthetic resin for the above applications, but fluororesin is expensive and requires secondary processing such as welding. It has the disadvantage of being difficult to remove, so it lacks versatility. Therefore, there has been a strong desire for a chlorine-containing resin that does not have these drawbacks and is inexpensive, strong, and has excellent chemical resistance and is suitable for the above-mentioned uses. In addition, synthetic resin molded products generally have a high electrical resistivity (the above-mentioned chlorine-containing resin is no exception), easily become charged due to friction or peeling, and attract dirt and dust in the atmosphere, so they are not suitable for the above applications. If exposed, it will adversely affect the performance of electronic components, etc. The present invention was made in view of the above, and
By combining a chlorine-containing resin stabilized with a stabilizer that does not contain metal elements, such as antistatic or conductive material, metal elements do not elute, and there is no adhesion of dirt or dust. The present invention aims to provide a novel chlorine-containing resin molded product that is extremely effective and inexpensive for semiconductor-related applications. (Means for Solving the Problems) The structure of the chlorine-containing resin molded product of the present invention to achieve the above object will be explained based on the attached example drawings. Figure 1 shows an example of the molded product of the present invention. FIG. 2 is a partially enlarged perspective view showing an example of its application. That is, the chlorine-containing resin molded product of the present invention is a chlorine-containing resin stabilized with one or more nonmetallic stabilizers such as aminocarboxylic acids, hydrazides, epoxy compounds, and organic phosphite esters. The main feature is that an antistatic or conductive coating layer 2 is integrally laminated on at least one side of a base layer 1, and the entire body is formed into a desired shape. Here, the chlorine-containing resin that constitutes the base layer portion 1 is:
In addition to the above PVC resin, chlorinated vinyl chloride resin,
Refers to resins mainly composed of vinyl chloride, such as ethylene vinyl chloride resins and alloys with other resins. Various degrees of polymerization can be selected for such chlorine-containing resins, but if you use a low degree of polymerization that allows for low processing temperatures and does not require much heat resistance, for example, an average degree of polymerization of 700 to 800, the processing range will be expanded and high quality will be achieved. A molded product is obtained. This low degree of polymerization resin is preferably employed especially when obtaining transparent molded products. The chlorine-containing resin constituting the base layer portion 1 is stabilized with a non-metallic stabilizer such as those mentioned above. This is a general term for compounds that have this amino group, and examples of compounds that have this amino group include ammonia, urea, acrylonitrile, aminoacetanilide, aminoanthraquinone, aminoethanol, aminoethylene, aminoethylbenzene,
Examples include aminocresol, aminophenol, caprolactam, etc., while compounds having carboxylic acid groups include butyric acid, caproic acid, lauric acid, palmitic acid, stearic acid, crotonic acid,
Examples include oleic acid, linolenic acid, benzoic acid, naphthoric acid, malonic acid, succinic acid, adipic acid, maleic acid, and phthalic acid. In addition, typical aminocarboxylic acids that are these compounds include acetylglutamic acid, glycine, alanine, pyrrolidonecarboxylic acid, lysine,
alkynine, tryptophan, anthranilic acid,
Benzoic acid, β-aminocrotonic acid, α-aminoacrylic acid, α-aminoadipic acid, aminomaloic acid, acetylphenylalanine, acetylmethionine, and ester compounds thereof, as well as esters of acetylamino acid and pentaerythritol or dipentaerythritol. compounds, ester compounds of 2-pyrrolidone-5-carboxylic acid and pentaerythritol, and the like. Among these aminocarboxylic acids, β-aminocrotonic acid ester has the general formula
【化】
但し、n;1〜6
R;1〜6価のアルコールの残基
で示されるものである。また、このエステルを構
成するR(―OH)nの具体例としては、メタノー
ル、エタノール、プロパノール、イソプロパノー
ル、ブタノール、2−エチルヘキサノール、イソ
オクタノール、オクタノール、イソノナノール、
デカノール、ラウリルアルコール、ミリスチルア
ルコール、パルミチルアルコール、ステアリルア
ルコール、エチレングリコール、プロピレングリ
コール、1,3−ブタンジオール、1,4−ブタ
ンジオール、1,6−ヘキサンジオール、1,10
−デカンジオール、ジエチレングリコール、チオ
ジエタノール、トリメチロールプロパン、グリセ
リン、トリス(2−ヒドロキシエチル)イソシア
ヌレート、トリエタノールアミン、ペンタエリス
リトール、ジトリメタノールプロパン、ジグリセ
リン、ソルビトール、マンニトール、キシリトー
ル、ジペンタエリスリトールなどが挙げられる。
そしてこれらのアルコールとβ−アミノクロトン
酸とが縮重合して上記エステルが得られるが、該
エステルの望ましい具体例として、ステアリルア
ルコールβ−アミノクロトン酸エステル、1,4
−ブタンジオールジβ−アミノクロトン酸エステ
ル、チオジエタノールジβ−アミノクロトン酸エ
ステル、トリメチロールプロパントリβ−アミノ
クロトン酸エステル、ペンタエリスリトールテト
ラβ−アミノクロトン酸エステル、ジペンタエリ
スリトールヘキサβ−アミノクロトン酸エステル
などが挙げられる。
亦、ヒドラジドは、一般式、
RCONHNH2(Rはアルキル基又はアリール基)
で示され、その具体例としては、アセトヒドラジ
ド、酪酸ヒドラジド、カプロン酸ヒドラジド、ラ
ウリン酸ヒドラジド、パルミチン酸ヒドラジド、
ステアリン酸ヒドラジド、クロトン酸ヒドラジ
ド、オレイン酸ヒドラジド、リノレン酸ヒドラジ
ド、安息香酸ヒドラジド、ナフトル酸ヒドラジ
ド、マロン酸ヒドラジド、コハク酸ヒドラジド、
グルタミン酸ヒドラジド、アジピン酸ヒドラジ
ド、マレイン酸ヒドラジド、フタル酸ヒドラジド
等が用いられる。
更にエポキシ化合物としては、エポキシ化動植
物油、エポキシ化脂肪酸エステル、エポキシ化脂
環化合物、グリシジルエーテル又はグリシジルエ
ステル化合物、エポキシ化高分子化合物等のエポ
キシ化合物等が挙げられる。具体的には、エポキ
シ化動植物油として、エポキシ化大豆油、エポキ
シ化アマニ油、エポキシ化サフラワー油、エポキ
シ化ひまわり油、エポキシ化綿実油等が、エポキ
シ化脂肪酸エステルとして、エポキシ化ステアリ
ン酸ブチル、エポキシ化ステアリン酸オクチル、
エポキシ化アマニ油脂肪酸ブチル等が、エポキシ
化脂環化合物として、エポキシ化テトラヒドロフ
タル酸エステル(アルコールとしてはブタノー
ル、オクタノール、デカノール等)が、グリシジ
ルエーテル又はグリシジルエステル化合物として
ビスフエノールAグリシジルエーテル、グリシジ
ルメタクリレート及びその重合体が、エポキシ化
高分子化合物として、エポキシ化ポリブタジエ
ン、エポキシ化アクリロニトリル・ブタジエンゴ
ム等が夫々挙げられる。
有機亜燐酸エステルとしては、トリフエニルフ
オスフアイト、トリス(p−フエニルフエニル)
フオスフアイト、トリス(o−シクロヘキシルフ
エニル)フオスフアイト、トリス(p−ノニルフ
エニル)フオスフアイト、フエニル−p−ノニル
フエニルフオスフアイト、トリス(2,4ジtブ
チルフエニル)フオスフアイト等のトリアリール
フオスフアイト、モノアルキルジフエニルフオス
フアイトやジアルキルモノフエニルフオスフアイ
ト等のアルキル・アリールフオスフアイト、グリ
コールやポリオールやビスフエニールやトリスフ
エノール等がオリゴ化されたオリゴフオスフアイ
トやジフエル・アミド・フオスフアイトやジラウ
リル・アミド・フオスフアイト等のアシドフオス
フアイト等が用いられる。
他の非金属安定剤としては、フエノール誘導
体、多価アルコール、含窒素化合物、含イオウ化
合物、ケト化合物が用いられる。フエノール誘導
体としては、ヒンダードフエノール、ヒンダード
ビスフエノール等が用いられ、多価アルコールと
してはグリセリン、マンニトール、キシリトー
ル、トリメチロールプロパン、ペンタエリスリト
ール、ソルビトール、ポリエチレングリコール、
ソルビタンモノラウリレート、グリセリンモノス
テアレート及びカルボン酸との部分エステル化
物、含窒素多価アルコール、含イオウ多価アルコ
ール等が用いられ、含窒素化合物としては、2−
フエニールインドール、ジフエニルチオ尿素、ト
リアジン等が用いられ、含イオウ化合物として
は、チオジプロピオン酸エステル、トリアジンチ
オール、チオールカルボン酸無水物等が、ケト化
合物としては、アセト醋酸エステル、デヒドロ醋
酸、β−ジケトン等が採用される。
これらの安定剤は、塩素含有樹脂100重量部に
対し合計で0.5乃至7.0重量部添加され塩素含有樹
脂を主に安定化するが、これらの安定剤にはPb
やSnなどの金属元素が何等含まれないことで特
徴づけられる。該安定剤の塩素含有樹脂に対する
適正な添加量は上記の通りであるが、0.5重量部
未満の場合熱安定性が充分に得られず、一方、
7.0重量部を超えると熱安定性はそれだけ向上す
るが経済的に不利となる。尚、これらの安定剤の
うち、アミノカルボン酸、ヒドラジド、エポキシ
化合物、有機亜燐酸アステルを単独又は組合せて
用いる場合には0.5乃至5重量部、望ましくは1.0
乃至3.0重量部の範囲で、またフエノール誘導体、
多価アルコール、含窒素化合物、含イオウ化合
物、ケト化合物を単独又は上記安定剤と組み合わ
せて用いる場合には2乃至7重量部、望ましくは
3乃至5重量部の範囲で用いられる。これらの安
定剤は、夫々単独若しくは組み合わせて用いられ
るが、組み合わせる場合には、アミノカルボン酸
及びエポキシ化合物の組合せ、アミノカルボン
酸、エポキシ化合物及び有機亜燐酸エステルの組
合せ、ヒドラジド、エポキシ化合物及び有機亜燐
酸エステルの組合せ、そしてエポキシ化合物及び
有機亜燐酸エステルの組合せ等が望ましく採用さ
れる。
亦、上記塩素含有樹脂には、成型時の金型から
の離型を良くする為及び成型品の仕上り外観(特
に、艶、光沢等)を良くする為、ステアリン酸で
代表される高級脂肪酸や、軟化温度を低下させな
いアクリル系滑剤が用いられる。
前記のような安定剤は主安定剤として塩素含有
樹脂の熱安定性に寄与し、また滑剤は樹脂に滑性
を付与するが、その他の金属を含まない添加剤、
例えば、アミン系、フエノール系、イオウ系、燐
系等の抗酸化剤、紫外線吸収剤等の光安定剤、フ
タル酸エステル、芳香族カルボン酸エステル、脂
肪族二塩基エステル等の可塑剤、透明用の
ABS・MBS等の補強剤、顔料、助剤、防黴剤、
発泡剤等の添加剤を添加して、塩素含有樹脂の安
定化を助長し、加工性を良くし、耐候性を向上さ
せ、機械的特性を向上させたり或は可塑化し、発
泡させたりすることができる。更に、本発明の成
形品は、その用途に応じて透明、半透明及び不透
明の成型品として供給され、半透明乃至不透明性
(以下、これらを総称して半透光性と云う)とす
るには基層部1の塩素含有樹脂に非金属系の各種
着色剤、例えば、有機顔料、アクリル変性改質
剤、ABS樹脂、MBS樹脂、AAS樹脂、AES樹
脂、ACS樹脂、AS樹脂、EVA樹脂、フツ素樹脂
及びカーボンブラツク等が適宜添加される。
亦、被覆層2には制電性若しくは導電性材料を
塗布又はラミネートすることで形成される。制電
性材料としては制電性能を有する有機化合物、導
電性カーボン、グラフアイト、カーボン繊維、金
属繊維及び金属粉等の制電若しくは導電性フイラ
ーを適量添加して電気抵抗率を1011〜103Ω−cm
としたもので、特に金属を含有しない有機化合物
が好ましく採用される。この有機化合物として
は、体積固有抵抗率の小なるゴム幹重合体にビニ
ル単量体又はビニリデン単量体をグラフト重合す
ることによつて得られたグラフト共重合体又はこ
のグラフト共重合体にこれと相溶性のある熱可塑
性樹脂を相溶させて得た制電性樹脂組成物が採用
される。此処におけるゴム幹重合体は、4〜500
個のアルキレンオキサイド基を有する単量体10〜
50重量%と共役ジエン及びアクリル酸エステルか
ら選ばれた1種以上の単量体50〜90重量%から成
る共重合体であり、このゴム幹重合体の相が加工
時に技重合体相中に互いにブリツジ状態をなして
分散しており、電荷が主としてこのゴム幹重合体
相中を通つて拡散、減衰することにより制電効果
を有し、しかもポリアルキレンオキサイド基はゴ
ム幹重合体に化学的に結合しているので過酷な水
洗等によつても制電性が低下することがなくこれ
により永久的な帯電防止効果をも保有するもので
ある。上記グラフト共重合体は単独でも使用可能
であるが、基層部1との積層性、被覆層2の表面
硬度を向上させる為にこれと相溶性のある熱可塑
性樹脂を相溶させて用いることが好ましい。該熱
可塑性樹脂は、グラフト共重合体と相溶性のある
樹脂であれば特に限定されないが、基層部1の塩
素含有樹脂に対し積層性の良いPVC樹脂、ポリ
塩化ビニリデン樹脂、ニトリル樹脂、表面硬度に
優れるポリメチルメタクリレート樹脂及びその共
重合体、アクリル−スチレン−ブタジエン樹脂等
が好ましく、とりわけ上記基層部1で採用された
非金属系安定剤で安定化された塩素含有樹脂は、
金属が含有していないこと、積層性が良好なこ
と、耐薬品性に優れていることなどにより最も好
ましく採用され、その結果基層部1及び被覆層2
が共に金属を含有しない塩素含有樹脂成型品が得
られる。この熱可塑性樹脂とグラフト共重合体と
の配合割合は、グラフト共重合体10〜99重量部に
対し、熱可塑性樹脂は90〜1重量部が適当である
が、グラフト共重合体と熱可塑性樹脂との合計量
に対して上記ゴム幹重合体が5〜80重量%、好ま
しくは8〜60重量%含まれるように配合すること
が肝要である。
更に被覆層2として導電性材料が採用可能であ
るが、この導電性材料としては、PVC樹脂、ポ
リ塩化ビニリデン樹脂、ニトリル樹脂、ポリメチ
ルメタクリレート樹脂及びその共重合体、アクリ
ル−スチレン−ブタジエン樹脂等の合成樹脂に導
電性カーボン、グラフアイト、カーボン繊維、金
属繊維及び金属粉等の導電性フイラーを単独若し
くは適宜組み合わせてブレンドし、電気抵抗率を
102Ω−cm以下にしたものが採用され、更に、導
電性カーボン、グラフアイト、カーボン繊維に対
するこの被ブレンド用の合成樹脂として、上記同
様非金属系安定剤により安定化された塩素含有樹
脂を用いると、基層部1と被覆層2が共に金属を
含有しない成型品が得られ、特に好ましく採用さ
れる。
上述の如く基層部1及び被覆層2用に調製され
た材料は、成型時に積層一体化され所望の形状に
成型される。ここで所望形状とは、第1図に示す
如き板状体、或は第2図に示す如き箱型ケース、
その他アングルやブロツク状のものなど上記用途
に供される全ての部材の形状を含むものである。
第1図及び第2図では、基層部1の片面にのみ被
覆層2を積層一体とした例を示しているが、これ
を両面に形成することも除外するものではない。
この場合、その用途にもよるが、少なくとも前記
薬液或は食品等に接触する側には、上記制電性材
料に用いられる熱可塑性樹脂及び導電性材料の被
ブレンド樹脂として上記非金属系の安定剤で安定
かされた塩素含有樹脂を用い且つ制電性又は導電
性フイラーとして非金属系のものを用いることが
必要である。そしてその成型方法は、上記2種の
材料のシート若しくは板状体を熱プレス若しくは
カレンダーロール等にて融着一体とする方法、或
は両材料を同時に押出し、その固化と共に両者を
一体化する方法、更には別々の射出ノズルより同
一金型に射出して両者を一体化させる射出成型方
法など従来の合成樹脂積層技術がそのまま採用さ
れる。
(作用)
上記の如く得られた本発明成型品は、その成型
時に塩素含有樹脂の温度が150−200℃になる為、
樹脂中に安定剤が含まれていないと樹脂構造のH
とCIとが遊離して脱塩酸し、樹脂が黄変乃至黒
変する。しかし本発明成型品の基層部1を構成す
る塩素含有樹脂は、上記夫々の安定剤により熱安
定性が付与されているから、成型時の温度上昇に
よつても変色することがない。
そして基層部1を構成する塩素含有樹脂には、
実質的に金属元素が含まれないから、前記用途に
用いる場合、薬液や食品等に対し基層部1が接触
するようにこれを用いれば、これら薬液若しくは
食品等にPbやSnなどの有害な金属元素が溶出す
ることがなく、これによる種々の悪影響も懸念さ
れることがないのである。
尚、ここで実質的に金属を含まないと云う表現
を用いたのは、塩素含有樹脂、安定剤、滑剤或は
着色剤等を製造する際、及び上記成型の際に意図
的ではなく不可避的な範囲で微量の金属が混入す
ることがあり、最終成型品中に金属が皆無とは言
えないからである。
亦、被覆層2は制電性若しくは導電性材料より
成るから、帯電防止機能を有し、雰囲気中のゴミ
や埃り等を吸着する懸念がなく、上記基層部1の
非金属である特性と相俟つて前記半導体関連等の
用途に極めて好適である。特に制電性材料として
前記グラフト共重合体を用いた場合、水洗等の過
酷な条件で用いても永久的に帯電防止機能が損わ
れることがなく、更に該グラフト共重合体に熱可
塑性樹脂を併用すれば、ゴム幹重合体が熱可塑性
樹脂に埋め込まれるようになり、帯電防止機能の
永久的な持続性がより確実なものとなる。
(実施例)
次に実施例について述べる。
(i) テストピースの調製
(−1)基層部用の塩素含有樹脂を第1表の配
合で調製した。[Chemical formula] However, n: 1-6 R: residue of mono- to hexavalent alcohol. Further, specific examples of R(-OH)n constituting this ester include methanol, ethanol, propanol, isopropanol, butanol, 2-ethylhexanol, isooctanol, octanol, isononanol,
Decanol, lauryl alcohol, myristyl alcohol, palmityl alcohol, stearyl alcohol, ethylene glycol, propylene glycol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, 1,10
-Decanediol, diethylene glycol, thiodiethanol, trimethylolpropane, glycerin, tris(2-hydroxyethyl)isocyanurate, triethanolamine, pentaerythritol, ditrimethanolpropane, diglycerin, sorbitol, mannitol, xylitol, dipentaerythritol, etc. Can be mentioned.
The above esters are obtained by condensation polymerization of these alcohols and β-aminocrotonic acid. Preferred specific examples of the esters include stearyl alcohol β-aminocrotonic acid ester, 1,4
-butanediol diβ-aminocrotonic acid ester, thiodiethanol diβ-aminocrotonic acid ester, trimethylolpropane triβ-aminocrotonic acid ester, pentaerythritol tetraβ-aminocrotonic acid ester, dipentaerythritol hexaβ-aminocrotonic acid ester Examples include acid esters. In addition, hydrazide has the general formula, RCONHNH 2 (R is an alkyl group or an aryl group)
Specific examples include acetohydrazide, butyric acid hydrazide, caproic acid hydrazide, lauric acid hydrazide, palmitic acid hydrazide,
Stearic acid hydrazide, crotonic acid hydrazide, oleic acid hydrazide, linolenic acid hydrazide, benzoic acid hydrazide, naphthoic acid hydrazide, malonic acid hydrazide, succinic acid hydrazide,
Glutamic acid hydrazide, adipic acid hydrazide, maleic acid hydrazide, phthalic acid hydrazide, etc. are used. Furthermore, examples of the epoxy compound include epoxidized animal and vegetable oils, epoxidized fatty acid esters, epoxidized alicyclic compounds, glycidyl ether or glycidyl ester compounds, and epoxidized polymer compounds. Specifically, epoxidized animal and vegetable oils include epoxidized soybean oil, epoxidized linseed oil, epoxidized safflower oil, epoxidized sunflower oil, and epoxidized cottonseed oil, and epoxidized fatty acid esters include epoxidized butyl stearate, epoxidized butyl stearate, and epoxidized fatty acid esters. epoxidized octyl stearate,
Epoxidized linseed oil fatty acid butyl etc. are used as epoxidized alicyclic compounds, epoxidized tetrahydrophthalate esters (alcohols include butanol, octanol, decanol, etc.), glycidyl ether or glycidyl ester compounds such as bisphenol A glycidyl ether, glycidyl methacrylate. Examples of the epoxidized polymer compound include epoxidized polybutadiene, epoxidized acrylonitrile-butadiene rubber, and the like. Examples of organic phosphorous esters include triphenyl phosphite and tris(p-phenyl phenyl).
Triaryl phosphorites such as phosphorite, tris(o-cyclohexylphenyl) phosphorite, tris(p-nonylphenyl) phosphorite, phenyl-p-nonylphenyl phosphorite, tris(2,4 di-t-butylphenyl) phosphorite, monoalkyl diphite Alkyl/aryl phosphite such as enyl phosphite and dialkylmonophenyl phosphite, oligophosphite oligomerized with glycol, polyol, bisphenol, trisphenol, etc., and acidophosphite such as diphel amide phosphite and dilauryl amide phosphite. Fuite etc. are used. As other nonmetallic stabilizers, phenol derivatives, polyhydric alcohols, nitrogen-containing compounds, sulfur-containing compounds, and keto compounds are used. As phenol derivatives, hindered phenol, hindered bisphenol, etc. are used, and as polyhydric alcohols, glycerin, mannitol, xylitol, trimethylolpropane, pentaerythritol, sorbitol, polyethylene glycol,
Sorbitan monolaurylate, glycerin monostearate and partially esterified products with carboxylic acids, nitrogen-containing polyhydric alcohols, sulfur-containing polyhydric alcohols, etc. are used, and as nitrogen-containing compounds, 2-
Phenyl indole, diphenylthiourea, triazine, etc. are used, sulfur-containing compounds include thiodipropionic acid ester, triazinethiol, thiol carboxylic acid anhydride, etc., and keto compounds include acetoacetic acid ester, dehydroacetic acid, β- Diketones and the like are used. These stabilizers are added in a total of 0.5 to 7.0 parts by weight per 100 parts by weight of chlorine-containing resin, and mainly stabilize the chlorine-containing resin, but these stabilizers also contain Pb.
It is characterized by the fact that it does not contain any metal elements such as or Sn. The appropriate amount of the stabilizer added to the chlorine-containing resin is as described above, but if it is less than 0.5 parts by weight, sufficient thermal stability will not be obtained;
If it exceeds 7.0 parts by weight, the thermal stability will improve accordingly, but it will be economically disadvantageous. Among these stabilizers, when aminocarboxylic acids, hydrazides, epoxy compounds, and organic phosphite aster are used alone or in combination, the amount is 0.5 to 5 parts by weight, preferably 1.0 parts by weight.
and 3.0 parts by weight, and also phenol derivatives,
When polyhydric alcohols, nitrogen-containing compounds, sulfur-containing compounds, and keto compounds are used alone or in combination with the above stabilizers, they are used in an amount of 2 to 7 parts by weight, preferably 3 to 5 parts by weight. These stabilizers can be used alone or in combination, but when used in combination, a combination of an aminocarboxylic acid and an epoxy compound, a combination of an aminocarboxylic acid, an epoxy compound and an organic phosphite, a hydrazide, an epoxy compound and an organic phosphite are used. Combinations of phosphoric acid esters, and combinations of epoxy compounds and organic phosphorous esters are preferably employed. In addition, the chlorine-containing resin mentioned above may contain higher fatty acids such as stearic acid to improve release from the mold during molding and to improve the finished appearance of the molded product (especially luster, luster, etc.). , an acrylic lubricant that does not lower the softening temperature is used. The above-mentioned stabilizers contribute as main stabilizers to the thermal stability of chlorine-containing resins, and lubricants provide lubricity to resins, but other metal-free additives,
For example, antioxidants such as amine, phenol, sulfur, and phosphorus, light stabilizers such as ultraviolet absorbers, plasticizers such as phthalate esters, aromatic carboxylic acid esters, aliphatic dibasic esters, and transparent of
Reinforcing agents such as ABS/MBS, pigments, auxiliary agents, antifungal agents,
Adding additives such as foaming agents to help stabilize chlorine-containing resins, improve processability, improve weather resistance, improve mechanical properties, or plasticize and foam. I can do it. Furthermore, the molded product of the present invention is supplied as a transparent, translucent, or opaque molded product depending on its use, and the molded product may be semitransparent or opaque (hereinafter collectively referred to as semitransparent). The chlorine-containing resin of the base layer 1 is coated with various non-metallic colorants, such as organic pigments, acrylic modification modifiers, ABS resin, MBS resin, AAS resin, AES resin, ACS resin, AS resin, EVA resin, and foam. Base resin, carbon black, etc. are added as appropriate. Additionally, the coating layer 2 is formed by applying or laminating an antistatic or conductive material. As an antistatic material, an appropriate amount of an antistatic or conductive filler such as an organic compound having antistatic performance, conductive carbon, graphite, carbon fiber, metal fiber, or metal powder is added to increase the electrical resistivity to 10 11 to 10. 3 Ω-cm
In particular, organic compounds containing no metal are preferably employed. This organic compound may be a graft copolymer obtained by graft polymerizing a vinyl monomer or a vinylidene monomer to a rubber backbone polymer having a low specific volume resistivity, or An antistatic resin composition obtained by dissolving a thermoplastic resin that is compatible with the antistatic resin composition is used. The rubber backbone polymer here is 4 to 500
Monomers with alkylene oxide groups 10~
It is a copolymer consisting of 50% by weight and 50 to 90% by weight of one or more monomers selected from conjugated dienes and acrylic esters, and this rubber backbone polymer phase is incorporated into the technical polymer phase during processing. They are dispersed in a bridge state, and have an antistatic effect as the charge mainly diffuses and attenuates through the rubber core polymer phase.Moreover, the polyalkylene oxide group has a chemical effect on the rubber core polymer. Since the antistatic property is bonded to the antistatic property of the antistatic property, it does not deteriorate even after severe washing with water, and thus maintains a permanent antistatic effect. The above graft copolymer can be used alone, but in order to improve the lamination properties with the base layer 1 and the surface hardness of the coating layer 2, it may be used in combination with a thermoplastic resin that is compatible with the graft copolymer. preferable. The thermoplastic resin is not particularly limited as long as it is compatible with the graft copolymer, but includes PVC resin, polyvinylidene chloride resin, nitrile resin, and surface hardness resin that has good lamination properties with respect to the chlorine-containing resin of the base layer 1. Polymethyl methacrylate resin and its copolymer, acrylic-styrene-butadiene resin, etc., which are excellent in
It is most preferably adopted because it does not contain metal, has good lamination properties, and has excellent chemical resistance.
A chlorine-containing resin molded product containing no metal can be obtained. The appropriate blending ratio of the thermoplastic resin and the graft copolymer is 90 to 1 part by weight of the thermoplastic resin to 10 to 99 parts by weight of the graft copolymer. It is important to blend the rubber backbone polymer in an amount of 5 to 80% by weight, preferably 8 to 60% by weight, based on the total amount of the rubber base polymer. Further, a conductive material can be used as the coating layer 2, and examples of the conductive material include PVC resin, polyvinylidene chloride resin, nitrile resin, polymethyl methacrylate resin and its copolymer, acrylic-styrene-butadiene resin, etc. The synthetic resin is blended with conductive fillers such as conductive carbon, graphite, carbon fiber, metal fiber, and metal powder, either alone or in appropriate combinations, to improve the electrical resistivity.
10 2 Ω-cm or less, and a chlorine-containing resin stabilized with a non-metallic stabilizer as described above is used as a synthetic resin to be blended with conductive carbon, graphite, and carbon fiber. When used, a molded product in which both the base layer portion 1 and the coating layer 2 do not contain metal can be obtained, and is particularly preferably employed. The materials prepared for the base layer portion 1 and the covering layer 2 as described above are laminated and integrated during molding and molded into a desired shape. Here, the desired shape is a plate-like body as shown in FIG. 1, or a box-shaped case as shown in FIG.
It also includes all shapes of members used for the above purpose, such as angle and block shapes.
Although FIGS. 1 and 2 show an example in which the covering layer 2 is integrally laminated on only one side of the base layer portion 1, it is not excluded that the covering layer 2 may be formed on both sides.
In this case, although it depends on the application, at least the side that comes into contact with the chemical solution or food, etc. has the thermoplastic resin used in the antistatic material and the stable non-metallic resin used as the blended resin of the conductive material. It is necessary to use a chlorine-containing resin stabilized with an agent and to use a non-metallic filler as an antistatic or conductive filler. The molding method is to fuse and integrate sheets or plate-shaped bodies of the above two types of materials using a heat press or calendar roll, or to extrude both materials at the same time and integrate them as they solidify. Furthermore, conventional synthetic resin lamination techniques such as an injection molding method in which the two are injected into the same mold from separate injection nozzles to integrate the two can be used as is. (Function) The molded product of the present invention obtained as described above has a temperature of 150-200°C of the chlorine-containing resin during molding.
If a stabilizer is not included in the resin, the H of the resin structure
and CI are liberated and dechlorinated, causing the resin to turn yellow or black. However, since the chlorine-containing resin constituting the base layer 1 of the molded product of the present invention is given thermal stability by the above-mentioned stabilizers, it will not change color even when the temperature rises during molding. The chlorine-containing resin that makes up the base layer 1 includes:
Since it does not substantially contain metal elements, when used for the above-mentioned purpose, if it is used in such a way that the base layer 1 comes into contact with chemical solutions or foods, harmful metals such as Pb and Sn will be removed from these chemical solutions or foods. Elements do not elute, and there are no concerns about various adverse effects caused by this. The expression "substantially free of metal" is used here because it is unintentional but unavoidable when manufacturing chlorine-containing resins, stabilizers, lubricants, colorants, etc., and during the above molding. This is because trace amounts of metal may be mixed in within a certain range, so it cannot be said that there is no metal in the final molded product. In addition, since the coating layer 2 is made of an antistatic or conductive material, it has an antistatic function, and there is no concern that it will attract dirt or dust in the atmosphere. Together, they are extremely suitable for applications such as those related to semiconductors. In particular, when the above-mentioned graft copolymer is used as an antistatic material, the antistatic function will not be permanently impaired even when used under harsh conditions such as washing with water. When used in combination, the rubber backbone polymer becomes embedded in the thermoplastic resin, and the antistatic function becomes more permanent. (Example) Next, an example will be described. (i) Preparation of test piece (-1) A chlorine-containing resin for the base layer was prepared according to the formulation shown in Table 1.
【表】
但し、表中の数値は重量部を表す。
(−2)被覆層用の材料を第2表の配合で調製
した。[Table] However, the numbers in the table represent parts by weight.
(-2) Materials for the coating layer were prepared according to the formulations shown in Table 2.
【表】
(−3)、(−1)の配合樹脂を夫々カレンダ
ーロール(160℃×5分)で0.5mmのシート状とな
し、これを18枚重ね、その両面に(−2)の材
料を夫々カレンダーロール(160℃×5分)処理
して得た厚さ0.5mmのシートを1枚づつ重ねてプ
レス(160℃×5分)にて加熱・加圧成型して厚
さ10mmのテストピースとし、これらを夫々(−
1)の乃至及び(−2)の(イ)(ロ)(ハ)に対応し
て実施例(1−イ)、(1−ロ)、(1−ハ)乃至実
施例(7−イ)、(7−ロ)、(7−ハ)とした。
(−4)、第3表の配合樹脂をカレンダーロー
ル(160℃×5分)で0.5mmのシート状となし、こ
のシートを20枚重ね合わせ、これを(−3)と
同様に加熱・加圧成型して厚さ10mmのテストピー
スとし、これを比較例(1)とした。[Table] The blended resins of (-3) and (-1) were made into a 0.5 mm sheet using a calendar roll (160℃ x 5 minutes), and 18 sheets were stacked on top of each other, and the material of (-2) was placed on both sides. 0.5mm thick sheets obtained by calender roll treatment (160℃ x 5 minutes) were stacked one by one and heated and pressure molded using a press (160℃ x 5 minutes) to form a 10mm thickness test. pieces, and each of these (−
Examples (1-A), (1-B), (1-C) to Example (7-A) correspond to (A), (B), and (C) of 1) to (-2). , (7-b), and (7-c). (-4), the blended resin in Table 3 was made into a 0.5 mm sheet using a calendar roll (160°C x 5 minutes), 20 of these sheets were stacked, and this was heated and heated in the same way as in (-3). A test piece with a thickness of 10 mm was obtained by pressure molding, and this was used as Comparative Example (1).
【表】
(ii) 熱安定性の測定
上記(−3)及び(−4)の加熱成型によ
つて得たテストピースについてその外表面の色相
変化を観察した。結果を第4表に示す。[Table] (ii) Measurement of thermal stability The test pieces obtained by heat molding in (-3) and (-4) above were observed for changes in hue on their outer surfaces. The results are shown in Table 4.
【表】【table】
【表】
この第4表で理解される通り、実施例(1−
イ)(1−ロ)(2−イ)(2−ロ)(3−ハ)(3
−ハ)及び(5−イ)乃至(7−ロ)において
は、いずれも熱圧成型による色相変化は見られ
ず、比較例(1)と同様の熱安定性を示した。実施例
(3−イ)(3−ロ)(4−イ)及び(4−ロ)は
比較例(1)より若干熱安定性に劣るものの、実用上
問題になる程度の変化ではなかつた。亦、何れの
テストピースも成型性に優れていた。
(iii) 一般物性の測定
上記実施例(6−イ)(6−ロ)(6−ハ)及び
比較例(1)のテストピースについて一般物性を測定
した結果を第5表に示す。但し、(6−ハ)につ
いては表面抵抗率のみを測定した。[Table] As understood from this Table 4, Examples (1-
a) (1-b) (2-a) (2-b) (3-c) (3
In -c) and (5-i) to (7-b), no change in hue was observed due to hot pressure molding, and they showed the same thermal stability as Comparative Example (1). Examples (3-i), (3-b), (4-i), and (4-b) were slightly inferior in thermal stability to comparative example (1), but the change was not significant enough to cause a practical problem. In addition, all test pieces had excellent moldability. (iii) Measurement of general physical properties Table 5 shows the results of measuring the general physical properties of the test pieces of Examples (6-a), (6-b), and (6-c) and Comparative Example (1). However, for (6-c), only the surface resistivity was measured.
【表】
この第5表中“実”及び“比”は夫々実施例及
び比較例を表す。
上記第5表で理解される通り、何れの実施例も
比較例(1)と比べてほぼ同等の物性値を示し、従来
のPVC板と同じように使用出来ることがわかる。
亦、実施例(6−イ)(6−ロ)の表面抵抗率は
いずれも1011Ωcmであり、ゴミや埃りを吸着しな
い程度の制電機能を有している。更に、実施例
(6−ハ)の表面抵抗率は102Ω−cmであり、導電
機能を有していることがわかる。
(v) 溶出テスト
上記実施例(6−イ)、(6−ロ)、(6−ハ)、
比較例(1)及びPbを主安定剤とするPVC樹脂にて
比較例(1)と同様に別途調製した〔比較例(2)とす
る〕サンプルについてJISK6743に基づいて純水
中に浸し、溶出した微量金属を原子吸光法及び
ICP発光分析法にて分析した。その結果を第6表
に示す。[Table] In this Table 5, "actual" and "ratio" represent Examples and Comparative Examples, respectively. As can be seen from Table 5 above, all of the Examples showed substantially the same physical property values as Comparative Example (1), and it can be seen that they can be used in the same way as conventional PVC boards.
In addition, the surface resistivities of Examples (6-a) and (6-b) are all 10 11 Ωcm, and have an antistatic function to the extent that they do not attract dirt or dust. Furthermore, the surface resistivity of Example (6-c) was 10 2 Ω-cm, indicating that it had a conductive function. (v) Dissolution test Above examples (6-a), (6-b), (6-c),
Samples of Comparative Example (1) and PVC resin containing Pb as the main stabilizer were separately prepared in the same manner as Comparative Example (1) [referred to as Comparative Example (2)], and immersed in pure water based on JISK6743 for elution. trace metals were analyzed using atomic absorption spectroscopy and
Analyzed by ICP emission spectrometry. The results are shown in Table 6.
【表】
この第6表から理解される通り、実施例(6−
イ)、(6−ロ)、(6−ハ)からは金属が溶出され
なかつた。また、比較例(1)(2)からはその安定剤に
含まれるSn或はPbが溶出した。更にこの溶出テ
スト済の実施例(1−イ)、(1−ロ)のサンプル
について再度上記表面抵抗率を測定したが変化は
なかつた。
尚、上記実施例以外の安定剤を用いたPVC樹
脂についても上記と同様の試験をしたところ略同
様の結果を得た。
(発明の効果)
叙上のごとく、本発明の塩素含有樹脂成型品は
PbやSnなどの金属化合物を安定剤として含まな
い塩素含有樹脂の基層部と、その少なくとも片面
に積層一体とされた制電性若しくは導電性被覆層
とより成るから、これを半導体、生化学、医療、
医薬、食品等の関連機器等の用途に用いる場合
に、上記基層部又は金属非含有被覆層を酸や純水
と接する側に、即ち酸や純水による処理面になる
よう用いれば、これら処理液等に金属元素が溶出
する懸念がない。また塩素含有樹脂が本来有する
安価で強靭な特性及び耐薬品性・二次加工性に優
れた特性が維持されるから上記用途関連の機器等
に極めて好適に用いられる。更に、被覆層の帯電
防止機能により雰囲気中のゴミや埃り等が吸着さ
れず、上記用途への適正が一層増大することにも
なる。
斯かる優れた性能を有する本発明塩素含有樹脂
成型品は有用性極めて大である。[Table] As understood from this Table 6, Example (6-
No metal was eluted from a), (6-b), and (6-c). In addition, Sn or Pb contained in the stabilizer was eluted from Comparative Examples (1) and (2). Further, the surface resistivity of the samples of Examples (1-a) and (1-b) which had been subjected to the elution test was measured again, but there was no change. Incidentally, when PVC resins using stabilizers other than those in the above examples were also tested in the same manner as above, substantially the same results were obtained. (Effect of the invention) As mentioned above, the chlorine-containing resin molded product of the present invention has
It consists of a base layer of chlorine-containing resin that does not contain metal compounds such as Pb or Sn as a stabilizer, and an antistatic or conductive coating layer that is integrally laminated on at least one side of the base layer. medical care,
When used for pharmaceutical, food, etc.-related equipment, if the base layer or metal-free coating layer is used on the side that comes into contact with acid or pure water, that is, on the side that is treated with acid or pure water, these treatments can be avoided. There is no concern that metal elements will be leached into liquids, etc. Furthermore, since the inherent properties of chlorine-containing resins, such as being inexpensive and strong, as well as having excellent chemical resistance and secondary processability, are maintained, it is extremely suitable for use in equipment related to the above-mentioned applications. Furthermore, the antistatic function of the coating layer prevents the adsorption of dirt and dust in the atmosphere, further increasing suitability for the above-mentioned uses. The chlorine-containing resin molded product of the present invention having such excellent performance is extremely useful.
第1図は本発明成型品の一実施例を示す部分切
欠縦断面図、第2図はその適用例を示す部分拡大
斜視図である。
(符号の説明)、1……基層部、2……表層部。
FIG. 1 is a partially cutaway vertical sectional view showing an embodiment of the molded product of the present invention, and FIG. 2 is a partially enlarged perspective view showing an example of its application. (Explanation of symbols), 1...base layer part, 2...surface layer part.
Claims (1)
合物及び有機亜燐酸エステル等の非金属系安定剤
より選ばれたいずれか一種若しくは数種により安
定化された塩素含有樹脂の基層部の少なくとも片
面に、制電性若しくは導電性被覆層が積層一体と
され且つ全体が所望形状に成型されて成る塩素含
有樹脂成型品。 2 上記制電性被覆層が、体積固有抵抗率の小な
るゴム幹重合体にビニル単量体又はビニリデン単
量体をグラフト重合することによつて得られたグ
ラフト共重合体よる成る特許請求の範囲第1項記
載の成型品。 3 上記制電性被覆層が、上記グラフト共重合体
に更に該共重合体と相溶性のある熱可塑性樹脂を
相溶させた制電性樹脂組成物より成る特許請求の
範囲第1項又は第2項記載の成型品。 4 上記熱可塑性樹脂が、アミノカルボン酸、ヒ
ドラジド、エポキシ化合物及び有機亜燐酸エステ
ル等の非金属系安定剤より選ばれたいずれか一種
若しくは数種により安定化された塩素含有樹脂で
ある特許請求の範囲第3項記載の成型品。 5 上記導電性被覆層が、合成樹脂に導電性フイ
ラーをブレンドして成るものである特許請求の範
囲第1項記載の成型品。[Scope of Claims] 1. At least the base layer portion of a chlorine-containing resin stabilized with one or more non-metallic stabilizers such as aminocarboxylic acids, hydrazides, epoxy compounds, and organic phosphite esters. A chlorine-containing resin molded product having an antistatic or conductive coating layer integrally laminated on one side and molded into a desired shape as a whole. 2. The above-mentioned antistatic coating layer is made of a graft copolymer obtained by graft polymerizing a vinyl monomer or a vinylidene monomer to a rubber base polymer having a small specific volume resistivity. Molded products described in scope 1. 3. The antistatic coating layer comprises an antistatic resin composition comprising the graft copolymer and a thermoplastic resin compatible with the copolymer. Molded product described in Section 2. 4. The above-mentioned thermoplastic resin is a chlorine-containing resin stabilized with one or more non-metallic stabilizers such as aminocarboxylic acids, hydrazides, epoxy compounds, and organic phosphites. Molded products described in scope 3. 5. The molded product according to claim 1, wherein the conductive coating layer is made of a synthetic resin blended with a conductive filler.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21112586A JPS6364743A (en) | 1986-09-08 | 1986-09-08 | Resin molded form containing chlorine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21112586A JPS6364743A (en) | 1986-09-08 | 1986-09-08 | Resin molded form containing chlorine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6364743A JPS6364743A (en) | 1988-03-23 |
JPH0576428B2 true JPH0576428B2 (en) | 1993-10-22 |
Family
ID=16600804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21112586A Granted JPS6364743A (en) | 1986-09-08 | 1986-09-08 | Resin molded form containing chlorine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6364743A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2677431B2 (en) * | 1989-10-26 | 1997-11-17 | 積水化学工業株式会社 | Hard vinyl chloride resin composition |
CN103865197B (en) * | 2014-03-18 | 2016-06-01 | 山东企鹅塑胶集团有限公司 | Based on antistatic laminated film and the preparation method of polyvinyl chloride and Graphene |
-
1986
- 1986-09-08 JP JP21112586A patent/JPS6364743A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6364743A (en) | 1988-03-23 |
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