JPH0575788A - Multi-chip type image sensor - Google Patents

Abstract

PURPOSE:To the multi-chip type image sensor by which plural sensor chips are easily arranged onto a board with high accuracy. CONSTITUTION:A groove 2 is provided to a position at which sensor chips are arranged on a board 1 in the multi-chip type image sensor comprising plural sensor chips 3-6 and the sensor chips 3-6 are fitted to the groove for the mount.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip arrangement method for a multi-chip type image sensor composed of a plurality of sensor chips.

[0002]

2. Description of the Related Art Conventionally, a multi-chip type image sensor has been proposed in which one image sensor is composed of a plurality of sensor chips. 6 and 7 are views showing the chip arrangement of such a conventional multi-chip type image sensor. FIG. 6 is a plan view and FIG. 7 is a perspective view. In the figure, 3 to 6 are sensor chips constituting a multi-chip type image sensor, and 7 is a sensor chip 3.
It is a substrate for arranging ~ 6. In this way, a plurality of sensor chips 3 to 6 are arranged and configured on the substrate 7, and the outputs of the sensor chips 3 to 6 are sequentially output from the multi-chip image sensor.

[0003]

However, in the above-mentioned conventional example, when the sensor chips 3 to 6 are arranged on the substrate 7, as shown in the plan view of FIG. 6, dx _i (i = 1 to 3), a joint margin between chips is required, and an arrangement deviation of dy _i (i = 1 to 3) may occur in the sub-scanning direction.

FIG. 8 is an enlarged plan view of a joint portion between the sensor chips 3 and 4 of FIG. 6, and 8 to 13 are openings of pixels near the ends of the sensor chips 3 to 4, respectively.
Further, in the figure, a is a pitch between pixels.

If the deviation dy _{i in the} sub-scanning direction occurs, the pixel openings are misaligned between the chips, and there is a problem that the resolution in the sub-scanning direction is lowered.

Since the inter-chip joint margin dx _i exists, if the pixel pitch is made to be the same as that of the other portion even in the inter-chip joint portion, the opening area of the pixel is narrowed by the inter-chip joint margin dx _i. Therefore, there is a problem that sensitivity is lowered.

[0007]

According to the present invention, a groove for arranging a sensor chip is provided on a substrate on which a sensor chip is arranged, and the sensor chip is fitted into the groove so that the sensor chip can be arranged with high accuracy. It was done.

According to the present invention, by arranging along the groove, the deviation dy _{i in the} sub-scanning direction can be almost eliminated, and the inter-chip joint margin dx _i can be made extremely small.

Further, it becomes possible to easily perform high-precision arrangement.

[0010]

1 to 3 are drawings which best show the features of the present invention. FIG. 1 is a plan view, FIG. 2 is a perspective view, and FIG. 3 is a front view. In FIG. 1, 1 is a substrate on which the sensor chips 3 to 6 are arranged, and 2 is a groove for fitting the sensor chips 3 to 6 provided on the substrate 1. Further, FIG. 4 shows the substrate 1 before the sensor chips 3 to 6 are arranged.

In the above structure, considering the workability, if the groove 2 is made slightly larger than the sensor chips 3 to 6,
By dropping the sensor chips 3 to 6 into the groove 2, the sensor chips 3 to 6 can be easily and accurately arranged on the substrate 1.

The chip-to-chip joint margin dx _i (i = 1 to 3) and the chip shift dy _{i in the} sub-scanning direction that occur at this time
Although (i = 1 to 3) depends on the dicing accuracy of the sensor chip and the processing accuracy of the groove 2, the dicing accuracy of the sensor chip is about several μm and the processing accuracy of the groove 2 is 1 μm or less. Conventional dx _i , dy _i (i = 1 to 3) is several tens μm
Therefore, according to the present invention, the chip placement accuracy can be improved.

(Other Embodiments) FIG. 5 is a perspective view showing a substrate of another embodiment of the present invention. In FIG. 5, 21 is a substrate on which a sensor chip is arranged, and 23 to 26 are respectively. The groove is the size of one sensor chip for fitting the sensor chips 3 to 6. Further, d is the length of the separation region between two adjacent grooves of the grooves 23 to 26.

Also in this embodiment, as in the above-described embodiments, the effect that the sensor chip can be accurately arranged is easily obtained, and the deviation dy _i in the sub-scanning direction can be easily prevented.

Further, in the above structure, when the grooves 23 to 26 are formed slightly larger than the size of the sensor chip in consideration of the dicing margin of the chip, the joint margin dx _i between chips is dx ₁ = dx ₂ = dx ₃ = d and the chip size can be kept constant irrespective of the variation in chip size that occurs during dicing, so that the accuracy of the pixel pitch at the joint can be improved, and the chips can be easily arranged in the main scanning direction.

[0016]

As described above, in the multi-chip type image sensor, by providing the groove on the substrate on which the sensor chip is arranged and mounting the sensor chip by fitting the groove into the groove, the positional accuracy of the sensor chip can be improved. it can.

As a result, the pixel pitch can be made small and constant even at the chip joint portion, and the pixel opening area can be increased.

Further, by improving the positional accuracy of the chip in the sub-scanning direction, it is possible to prevent the positional deviation in the sub-scanning direction and improve the resolution.

[Brief description of drawings]

FIG. 1 is a plan view of a multi-chip type image sensor embodying the present invention.

FIG. 2 is a perspective view of a multi-chip type image sensor embodying the present invention.

FIG. 3 is a front view of a multi-chip image sensor embodying the present invention.

FIG. 4 is a perspective view of a substrate of a multi-chip type image sensor embodying the present invention.

FIG. 5 is a perspective view of a substrate according to another embodiment of the present invention.

FIG. 6 is a plan view of a conventional multi-chip image sensor.

FIG. 7 is a perspective view of a conventional multi-chip image sensor.

FIG. 8 is a diagram showing a pixel opening and a pixel pitch in a joint portion between sensor chips in a conventional example.

[Explanation of symbols]

 1, 7, 21 Substrate 2, 23-26 Groove 3-6 Sensor chip 8-13 Pixel opening

Claims (1)

[Claims] 1. In a multi-chip type image sensor composed of a plurality of sensor chips, a groove is provided on a substrate at a position where the sensor chip is arranged, and the sensor chip is fitted into the groove for mounting. Characteristic multi-chip type image sensor.