JPH0574923A - Retainer apparatus for wafer holder - Google Patents

Retainer apparatus for wafer holder

Info

Publication number
JPH0574923A
JPH0574923A JP23811591A JP23811591A JPH0574923A JP H0574923 A JPH0574923 A JP H0574923A JP 23811591 A JP23811591 A JP 23811591A JP 23811591 A JP23811591 A JP 23811591A JP H0574923 A JPH0574923 A JP H0574923A
Authority
JP
Japan
Prior art keywords
wafer holder
guide
semiconductor manufacturing
holding device
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23811591A
Other languages
Japanese (ja)
Other versions
JP3191338B2 (en
Inventor
Hiroshi Hoshikawa
広志 星川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP23811591A priority Critical patent/JP3191338B2/en
Publication of JPH0574923A publication Critical patent/JPH0574923A/en
Application granted granted Critical
Publication of JP3191338B2 publication Critical patent/JP3191338B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To provide a retainer apparatus which is simple in structure without troublesome adjustments, which is capable of coping with a deformed wafer holder, and which facilitates the insertion and removal of the wafer holder. CONSTITUTION:In a wafer holder housing which is disposed on the machine body of a semiconductor manufacturing machine, a retainer member 2 which is composed of two leaf springs 3 presses the side walls of a wafer holder from two opposite directions.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は半導体製造装置における
ウェハ保持器の保持構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer holder holding structure in a semiconductor manufacturing apparatus.

【0002】[0002]

【従来の技術】従来、半導体製造装置におけるウェハ保
持器の保持方法としては、固定された4方向のガイド8
により決められた位置で保持するか(図2に示す)、あ
るいは他方向を固定し、シリンダなどの駆動装置9によ
りウェハ保持器を挟持している(図3に示す)。
2. Description of the Related Art Conventionally, as a method of holding a wafer holder in a semiconductor manufacturing apparatus, a fixed four-direction guide 8 is used.
The wafer holder is held at a position determined by (see FIG. 2) or fixed in the other direction, and the wafer holder is held by a drive device 9 such as a cylinder (shown in FIG. 3).

【0003】[0003]

【発明が解決しようとする課題】しかしながら、ウェハ
保持器を固定されたガイドにより決められた位置で保持
する前者の構成にあっては、位置決めの調整が非常に不
便であり、ウェハ保持器の変形には対応できず隙間等が
発生してしまうという不具合があった。
However, in the former configuration in which the wafer holder is held at the position determined by the fixed guide, it is very inconvenient to adjust the positioning, and the wafer holder is deformed. However, there was a problem that gaps and the like could not be dealt with.

【0004】また、ウェハ保持器をシリンダで押え込む
後者の構成においては、構造が複雑になりシリンダを駆
動させる動力源が必要となる。更に、ウェハ保持器を数
個並べる場合にはスペースを多く取ってしまう問題もあ
った。
Further, in the latter structure in which the wafer holder is pressed by the cylinder, the structure becomes complicated and a power source for driving the cylinder is required. Further, there is a problem that a lot of space is taken when arranging several wafer holders.

【0005】本発明の目的はかかる従来技術の欠陥をな
くして、ウェハ保持器の出し入れを容易にする装置を提
供するものである。
It is an object of the present invention to provide an apparatus that eliminates the deficiencies of the prior art and facilitates loading and unloading of wafer holders.

【0006】[0006]

【課題を解決するための手段】本発明によるウェハ保持
器の保持装置は、ウェハ保持器を使用する半導体製造装
置の保持装置において、前記装置の機械体に設けたウェ
ハ保持器収納部に2枚の板バネによって構成される弾性
を有する保持部材により、2方向から側面を押しつける
ことを特徴とする。
A wafer holder holding device according to the present invention is a holding device for a semiconductor manufacturing apparatus using a wafer holder. It is characterized in that the side surface is pressed from two directions by the elastic holding member constituted by the leaf spring.

【0007】[0007]

【実施例】本発明の実施例を半導体製造装置の例を用い
て説明する。
Embodiments of the present invention will be described using an example of a semiconductor manufacturing apparatus.

【0008】図1(a)はウェハ保持器の保持装置の平
面図であり、図1(b)は図1(a)の断面図である。
FIG. 1A is a plan view of a holding device for a wafer holder, and FIG. 1B is a sectional view of FIG. 1A.

【0009】図面中、1はウェハ保持器、2はウェハ保
持器を固定するための移動ガイド、3は板バネで弾性を
有する。4は板バネ3を固定するブロック、5は板バネ
3を固着するネジ、6は移動ガイド2の移動量を決める
ストッパ、7はウェハ保持器の位置決めをするための固
定ガイドである。
In the drawings, 1 is a wafer holder, 2 is a moving guide for fixing the wafer holder, and 3 is a leaf spring having elasticity. Reference numeral 4 is a block for fixing the leaf spring 3, 5 is a screw for fixing the leaf spring 3, 6 is a stopper for determining the movement amount of the movement guide 2, and 7 is a fixing guide for positioning the wafer holder.

【0010】図1(a)において、ウェハ保持器1は保
持器収納部に挿入され、その側面が移動ガイド2及び固
定ガイド7に接触している。
In FIG. 1A, the wafer holder 1 is inserted into the holder housing, and the side surface of the wafer holder 1 is in contact with the moving guide 2 and the fixed guide 7.

【0011】板バネ3は弾性を有して移動ガイド2を移
動させ、ウェハ保持器1の側面を弾圧しながら保持され
る。
The leaf spring 3 has elasticity to move the movement guide 2 and hold the wafer holder 1 while elastically pressing the side surface thereof.

【0012】更に、ウェハ保持器1の出し入れは2枚の
板バネ3により移動ガイド2が平行移動されるため、移
動ガイド2の平端部全体に力が加わり部分的に力が加わ
ることを防いでいる。このため無理な力を加えずとも出
し入れが可能となる。
Further, when the wafer holder 1 is taken in and out, the movement guide 2 is moved in parallel by the two leaf springs 3, so that a force is applied to the entire flat end portion of the movement guide 2 and a partial force is prevented. There is. For this reason, it is possible to take in and out without applying excessive force.

【0013】また、ウェハ保持器1の変形に対しても、
移動ガイド2に取り付いている板バネ3のスプリング力
により、その形状にあった位置で押え込むので保持器の
変形には追随するようにしてある。
Further, even if the wafer holder 1 is deformed,
Due to the spring force of the leaf spring 3 attached to the moving guide 2, the spring is pressed in a position suitable for the shape, so that the cage is deformed.

【0014】図1(b)においては、位置出し調整を行
なう際、固定ガイド7の2方向の位置を決めるだけでよ
く、調整作業が簡易的に行うことができる。しかも、最
初の組み付け時に調整するだけで、多少の位置ずれが発
生しても移動ガイド2がずれを解消してしまうため再調
整する必要がなくなる。
In FIG. 1 (b), when performing positioning adjustment, it is only necessary to determine the position of the fixed guide 7 in two directions, and the adjustment work can be performed easily. In addition, since the movement guide 2 eliminates the misalignment even if a slight misalignment occurs, it is not necessary to readjust it only by making an adjustment at the time of first assembling.

【0015】更に、移動ガイド2の弾圧力の調整に関し
ても、ブロック4がストッパ6に取り付いているためス
トッパ6自体を調整することにより、押え込む弾圧力を
変化させることが可能となる。このことより、出し入れ
時の弾圧力を作業状態にあった圧力に変更できる。
Further, regarding the adjustment of the elastic force of the moving guide 2, since the block 4 is attached to the stopper 6, it is possible to change the elastic pressure to be held by adjusting the stopper 6 itself. From this, the elastic pressure at the time of taking in and out can be changed to the pressure suitable for the working state.

【0016】しかしながら、半導体製造装置本体におけ
る振動、ショックに対しては、1方向からのみの保持で
は充分でない場合もあるため、2方向からウェハ保持器
1を保持する構造にしてある。
However, with respect to vibration and shock in the main body of the semiconductor manufacturing apparatus, it may not be sufficient to hold the wafer holder 1 in only one direction, so the wafer holder 1 is held in two directions.

【0017】尚、本発明の保持方法は構造が単純で、し
かも、調整が非常に簡単に出来ることから、半導体製造
装置におけるウェハ保持器の保持装置としては高い実施
効果が得られる。
Since the holding method of the present invention has a simple structure and can be adjusted very easily, it is highly effective as a holding device for a wafer holder in a semiconductor manufacturing apparatus.

【0018】[0018]

【発明の効果】以上の如く本発明によれば、ウェハ保持
器を機械体に保持するに際し、弾性を有する保持部材に
より側面からウェハ保持器を弾圧して機械体に保持する
構成なので、ウェハ保持器の出し入れを簡単にするとと
もに、位置出し調整が組み付け時だけで済み、ウェハ保
持器の変形に対しても追随できるというメリットを有す
る。
As described above, according to the present invention, when the wafer holder is held on the mechanical body, the wafer holder is elastically pressed from the side by the holding member having elasticity to hold the wafer holder on the mechanical body. This has the advantages of simplifying the loading and unloading of the container, adjusting the positioning only at the time of assembly, and being able to follow the deformation of the wafer holder.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)は本発明の実施例におけるウェハ保持器
の保持装置正面図。(b)は図1(a)の断面図。
FIG. 1A is a front view of a holding device for a wafer holder according to an embodiment of the present invention. 1B is a sectional view of FIG.

【図2】本発明の他の実施例におけるウェハ保持器の保
持装置正面図。
FIG. 2 is a front view of a holding device for a wafer holder according to another embodiment of the present invention.

【図3】本発明の他の実施例における駆動系を用いた保
持装置側面図。
FIG. 3 is a side view of a holding device using a drive system according to another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1・・・・・ウェハ保持器 2・・・・・移動ガイド 3・・・・・板バネ 4・・・・・固定用ブロック 5・・・・・止めネジ 6・・・・・ストッパ 7・・・・・固定ガイド 8・・・・・固定ガイド(従来タイプ) 9・・・・・シリンダ(駆動装置) 1-Wafer holder 2--Movement guide 3--Leaf spring 4--Fixing block 5--Set screw 6-Stopper 7・ ・ ・ ・ ・ Fixed guide 8 ・ ・ ・ ・ ・ Fixed guide (conventional type) 9 ・ ・ ・ ・ ・ Cylinder (drive device)

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 半導体製造装置におけるウェハ保持器の
保持装置において、前記装置の機械体に設けられたウェ
ハ保持器収納部に2枚の板バネによって構成される弾性
を有する保持部材により、2方向から側面を押さえ付け
ることを特徴とするウェハ保持器の保持装置。
1. A holding device for a wafer holder in a semiconductor manufacturing apparatus, wherein a wafer holder housing portion provided in a mechanical body of the apparatus has a two-way elastic holding member formed by two leaf springs. A holding device for a wafer holder, characterized in that the side surface of the wafer holder is pressed.
JP23811591A 1991-09-18 1991-09-18 Wafer holder holding device Expired - Fee Related JP3191338B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23811591A JP3191338B2 (en) 1991-09-18 1991-09-18 Wafer holder holding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23811591A JP3191338B2 (en) 1991-09-18 1991-09-18 Wafer holder holding device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2000302724A Division JP2001102422A (en) 2000-10-02 2000-10-02 Wafer holder holding device

Publications (2)

Publication Number Publication Date
JPH0574923A true JPH0574923A (en) 1993-03-26
JP3191338B2 JP3191338B2 (en) 2001-07-23

Family

ID=17025405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23811591A Expired - Fee Related JP3191338B2 (en) 1991-09-18 1991-09-18 Wafer holder holding device

Country Status (1)

Country Link
JP (1) JP3191338B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710943U (en) * 1993-07-07 1995-02-14 住友精密工業株式会社 Wafer carrier positioning mechanism
US5655869A (en) * 1994-07-16 1997-08-12 Jenoptik Technologie Gmbh Device for coupling loading and unloading devices with semiconductor processing machines
US6883770B1 (en) * 1999-05-18 2005-04-26 Tdk Corporation Load port mounting mechanism

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710943U (en) * 1993-07-07 1995-02-14 住友精密工業株式会社 Wafer carrier positioning mechanism
US5655869A (en) * 1994-07-16 1997-08-12 Jenoptik Technologie Gmbh Device for coupling loading and unloading devices with semiconductor processing machines
US6883770B1 (en) * 1999-05-18 2005-04-26 Tdk Corporation Load port mounting mechanism

Also Published As

Publication number Publication date
JP3191338B2 (en) 2001-07-23

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