JPH057346A - Image pickup device - Google Patents

Image pickup device

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Publication number
JPH057346A
JPH057346A JP3148442A JP14844291A JPH057346A JP H057346 A JPH057346 A JP H057346A JP 3148442 A JP3148442 A JP 3148442A JP 14844291 A JP14844291 A JP 14844291A JP H057346 A JPH057346 A JP H057346A
Authority
JP
Japan
Prior art keywords
image
image pickup
subject
light receiving
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP3148442A
Other languages
Japanese (ja)
Inventor
Tadashi Okino
正 沖野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP3148442A priority Critical patent/JPH057346A/en
Priority to US07/900,471 priority patent/US5386228A/en
Priority to EP92305597A priority patent/EP0519719B1/en
Priority to DE69228629T priority patent/DE69228629T2/en
Publication of JPH057346A publication Critical patent/JPH057346A/en
Withdrawn legal-status Critical Current

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Abstract

PURPOSE:To obtain the photographed picture of high definition and high quality by increasing the number of effective picture elements by using an ordinary image pickup element. CONSTITUTION:Image pickup light L having passed through a lens 1 is divided into plural beams L1, L2 of equal quantity of light by a beam splitter 2, and they are imaged respectively on image formation surfaces A, B at different positions. Then, picture information from each image pickup element 101 to 104 whose light receiving part is arranged at a divided position not neighboring each other when the image of a subject on each image formation surface A, B is divided into plural parts is synthesized by a picture synthesis circuit 3.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、撮像管あるいはCC
D,MOS素子等の撮像板を撮像素子として備えた撮像
装置に関するものである。
BACKGROUND OF THE INVENTION The present invention relates to an image pickup tube or CC.
The present invention relates to an image pickup apparatus including an image pickup plate such as a D or MOS element as an image pickup element.

【0002】[0002]

【従来の技術】被写体からの撮像光をCCD等の撮像素
子により光電変換し、その電気信号を処理して被写体画
像を表示あるいは記録するような撮像装置が知られてい
る。この光電変換素子として用いられる撮像素子には、
近年の集積回路技術の進歩により数十万画素を持つもの
が量産できるようになり、家庭用のビデオカメラにも多
く使用されている。また、使用者の高画質化の要求に応
じて、現行のNSTC規格より高度な所謂ハイビジョン
企画の撮像装置も検討の段階から実用化に移行しつつあ
る。このハイビジョン企画に対応した撮像素子は、20
0万画素程度の高集積度を要し、高度の製造技術を伴
い、非常に高価なものになるとともに、信号の読み出し
周波数も数十メガヘルツと極めて高いものとなり、回路
技術としても高度のものが要求される。
2. Description of the Related Art An image pickup device is known in which image pickup light from a subject is photoelectrically converted by an image pickup device such as a CCD and an electric signal thereof is processed to display or record a subject image. The image sensor used as this photoelectric conversion element,
Recent advances in integrated circuit technology have made it possible to mass produce those having several hundreds of thousands of pixels, and they are often used in home video cameras. Further, in response to the user's demand for higher image quality, an image pickup device for so-called high-definition planning, which is higher than the current NSTC standard, is being put into practical use from the stage of study. There are 20 image sensors compatible with this high-definition project.
It requires a high degree of integration of about 100,000 pixels, is extremely expensive with advanced manufacturing technology, and has a very high signal read frequency of several tens of megahertz, which is a highly advanced circuit technology. Required.

【0003】そこで、一般の家庭用ビデオカメラ等に使
用されている数十万画素の撮像素子を被写体像の結像面
に複数個隣接させて配置することにより、数百万画素相
当の高精細度を得ることが考えられるが、通常撮像素子
はパッケージの中に封入されているので、同一平面上で
密着して隣接させることはできない。したがって、上記
のように高度の技術を要する高価な高集積化した撮像素
子を使用せざるを得ない。
Therefore, by arranging a plurality of image pickup elements of several hundreds of thousands of pixels used in a general home video camera or the like adjacent to the image forming plane of a subject image, a high resolution equivalent to several millions of pixels is obtained. However, since the image pickup device is usually enclosed in a package, it is not possible to make close contact with each other on the same plane. Therefore, it is unavoidable to use the expensive and highly integrated image pickup device that requires high technology as described above.

【0004】[0004]

【発明が解決しようとする課題】従来の撮像装置にあっ
ては、精細度を上げるには、上記のように高集積化した
撮像素子を使用しなければならないので、高価なものに
なるとともに、難しい回路技術を必要とするという問題
点があった。
In the conventional image pickup apparatus, in order to increase the definition, it is necessary to use the highly integrated image pickup element as described above, which is expensive and There was a problem that it required difficult circuit technology.

【0005】本発明は、上記のような問題点に着目して
なされたもので、高集積化した撮像素子を用いることな
く、有効画素数を増加させて高精細度を得ることがで
き、簡単な回路で安価に画質の向上した撮像装置を提供
することを目的としている。
The present invention has been made by paying attention to the above problems, and it is possible to increase the number of effective pixels and obtain a high definition without using a highly integrated image pickup device. It is an object of the present invention to provide an image pickup apparatus with improved image quality at low cost by using various circuits.

【0006】[0006]

【課題を解決するための手段】本発明の撮像装置は、被
写体からの撮像光を等しい光量で複数に分割して各々異
なる位置に被写体像を結像させる分割手段と、各結像面
で被写体像を複数に分割した時に隣接しない分割位置に
受光部を配置した複数の撮像素子と、各撮像素子からの
情報を入力して被写体画像を合成する画像合成回路とを
備えたものであり、また、前記各撮像素子は、単一のク
ロック発生回路からのタイミング信号により制御するよ
うに構成したものである。
The image pickup apparatus of the present invention comprises dividing means for dividing the image pickup light from a subject into a plurality of light rays with the same light quantity and forming the subject image at different positions, and the subject on each image forming surface. When a plurality of images are divided, a plurality of image pickup devices in which light receiving portions are arranged at division positions that are not adjacent to each other, and an image combining circuit that inputs information from each image pickup device and combines the subject images, Each of the image pickup devices is configured to be controlled by a timing signal from a single clock generation circuit.

【0007】[0007]

【作用】本発明の撮像装置においては、被写体からの撮
像光が複数の光路に分割されて導かれ、各々異なる位置
に複数の被写体像が結像される。そして、各被写体像も
複数に分割され、その隣接しない分割位置に配置した撮
像素子から出力された画像情報が画像合成回路に入力さ
れ、ここで全体の被写体画像が合成される。
In the image pickup apparatus of the present invention, the image pickup light from the subject is divided into a plurality of optical paths and guided, and a plurality of subject images are formed at different positions. Then, each subject image is also divided into a plurality of pieces, and the image information output from the image pickup elements arranged at the division positions that are not adjacent to each other is input to the image synthesizing circuit, where the entire subject image is synthesized.

【0008】[0008]

【実施例】図1は本発明の一実施例による撮像装置の主
要構成図である。図中、1は被写体からの撮像光Lが通
る結像用のレンズ、2はその撮像光Lを等しい光量で複
数のビームL1,L2に分割して各々異なる位置に被写
体像を結像させるための分割手段であるビームスプリッ
タで、ハーフミラー等で構成されている。101〜10
4はその被写体像の結像面A,Bに受光部を配置した複
数のCCD等の撮像素子で、各結像面A,Bで被写体像
を複数(ここでは四つ)に分割した時に隣接しない分割
位置に受光部が位置している。すなわち、各撮像素子1
01〜104はパッケージの中に封入されているので、
各結像面A,Bで被写体像を複数に分割し、その隣り合
わない位置に撮像素子101〜104を配置して互いに
ぶつかり合わないようにしている。3は各撮像素子10
1〜104からの画像情報を入力して全体の複写体画像
を合成する画像合成回路である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a main block diagram of an image pickup apparatus according to an embodiment of the present invention. In the figure, 1 is an image-forming lens through which the imaging light L from the subject passes, and 2 is used to divide the imaging light L into a plurality of beams L1 and L2 with the same light amount to form a subject image at different positions. Is a beam splitter which is a splitting means, and is composed of a half mirror or the like. 101-10
Reference numeral 4 denotes an image pickup device such as a plurality of CCDs in which light receiving portions are arranged on the image forming planes A and B of the subject image, which are adjacent to each other when the subject image is divided into a plurality of (four in this case) image forming planes A and B. The light receiving unit is located at the division position. That is, each image sensor 1
01 to 104 are enclosed in the package,
The subject image is divided into a plurality of images on the respective image formation planes A and B, and the image pickup devices 101 to 104 are arranged at positions not adjacent to each other so that they do not collide with each other. 3 is each image sensor 10
An image synthesizing circuit that inputs image information from 1 to 104 and synthesizes an entire copy image.

【0009】上記のような構成の撮像装置において、レ
ンズ1を通過した被写体からの撮像光Lは、ビームスプ
リッタ2によって2分割された各光路に導かれ、各々等
光量のビームL1,L2となって各結像面(焦点面)
A,Bに到達する。これにより、各結像面A,Bに同じ
大きさ及び明るさの被写体像が結像する。図2は各結像
面A,Bの様子を示したもので、(a)は結像面Aの様
子、(b)は結像面Bの様子をそれぞれ示している。
In the image pickup apparatus having the above-mentioned structure, the image pickup light L from the subject that has passed through the lens 1 is guided to each optical path divided into two by the beam splitter 2 and becomes beams L1 and L2 having equal light amounts, respectively. Each image plane (focal plane)
Reach A and B. As a result, subject images of the same size and brightness are formed on the respective image forming surfaces A and B. 2A and 2B show the states of the respective image forming planes A and B. FIG. 2A shows the state of the image forming plane A, and FIG. 2B shows the state of the image forming plane B.

【0010】各結像面A,B上で、被写体像は上述のよ
うに四つに分割され、結像面Aでは隣り合わない1番目
と3番目の分割位置に撮像素子101と103の受光部
a1,a2がそれぞれ位置し、結像面Bでは同じく隣り
合わない2番目と4番目の分割位置に撮像素子102と
104の受光部b1,b2がそれぞれ位置している。そ
して、各撮像素子101〜104で光電変換された画像
情報は画像合成回路3に入力され、ここで図3に示すよ
うに各々画像情報が合成され、全体として完全な被写体
画像が形成される。
On each of the image planes A and B, the subject image is divided into four as described above, and the image pickup devices 101 and 103 receive light at the first and third division positions which are not adjacent to each other on the image plane A. The parts a1 and a2 are located respectively, and the light receiving parts b1 and b2 of the image pickup devices 102 and 104 are located at the second and fourth division positions which are not adjacent to each other on the image plane B, respectively. Then, the image information photoelectrically converted by each of the image pickup devices 101 to 104 is input to the image synthesizing circuit 3, where the image information is synthesized as shown in FIG. 3 to form a complete subject image as a whole.

【0011】ここで、上記各結像面A,Bでの全有効画
素数は単一の撮像素子を使用した場合に比べて4倍とな
り、等価的に4倍の画素数の撮像素子を用いて撮影した
のと同じ精細度が得られ、画質が向上した画像が得られ
る。また、高集積化した撮像素子を使用することなく、
家庭用ビデオカメラ等に使用されている一般的なものを
使用できるので、簡単な回路で、安価に構成することが
できる。
Here, the total number of effective pixels on each of the image planes A and B is four times that in the case of using a single image pickup device, and equivalently, an image pickup device having four times the number of pixels is used. The same fineness as that obtained by shooting is obtained, and an image with improved image quality is obtained. Also, without using a highly integrated image sensor,
Since a general one used for a home video camera or the like can be used, it can be constructed at a low cost with a simple circuit.

【0012】図4は本発明の他の実施例を示す図であ
り、図1と同一符号は同一構成部分を示している。な
お、この図4では撮像光学系のみを示している。図4の
実施例は、撮像光Lの光路の分割数を図1の実施例の場
合と比べて倍の四つにしたものであり、三つのビームス
プリッタ2a,2b,2cを設けている。そして、各ビ
ームスプリッタ2a,2b,2cは、それぞれ反射率が
25%(1/4)、33%(1/3),50%(1/
2)となっており、四つの結像面A,B,C,Dにそれ
ぞれ等光量のビームL1,L2,L3,L4を送り、各
結像面A,B,C,Dに同じ大きさ及び明るさの複写体
像を結像させている。そして、各結像面A,B,C,D
での被写体像を複数に分割し、その隣接しない分割位置
に撮像素子(図示せず)の受光部を配置し、これらの撮
像素子からの画像情報を合成して全体の被写体像を形成
している。
FIG. 4 is a diagram showing another embodiment of the present invention, in which the same symbols as in FIG. 1 indicate the same components. Note that only the image pickup optical system is shown in FIG. In the embodiment of FIG. 4, the number of divisions of the optical path of the imaging light L is four times as large as that of the embodiment of FIG. 1, and three beam splitters 2a, 2b and 2c are provided. Each of the beam splitters 2a, 2b, 2c has a reflectance of 25% (1/4), 33% (1/3), 50% (1 /).
2), the beams L1, L2, L3, and L4 having equal light amounts are respectively sent to the four image forming planes A, B, C, and D, and the image forming planes A, B, C, and D have the same size. And a copy image of brightness is formed. Then, each image plane A, B, C, D
The image of the subject is divided into a plurality of parts, the light receiving parts of the image sensors (not shown) are arranged at the division positions that are not adjacent to each other, and the image information from these image sensors is combined to form the entire object image. There is.

【0013】ここで、図4の実施例の場合、各結像面
A,B,C,Dでの被写体像は図5に示すように16
(横4×縦4)分割しており、その隣り合わない四つの
分割位置に各撮像素子の受光部を配置している。すなわ
ち、図5の(a)に示す結像面Aでは、1番目の位置に
受光部a1、3番目の位置に受光部a2、9番目の位置
に受光部a3、11番目の位置に受光部a4をそれぞれ
配置し、図5の(b)に示す結像面Bでは、2番目の位
置に受光部b1、4番目の位置に受光部b2、10番目
の位置に受光部b3、12番目の位置に受光部b4をそ
れぞれ配置している。また、図5の(c)に示す結像面
Cでは、5番目の位置に受光部c1、7番目の位置に受
光部c2、13番目の位置に受光部c3、15番目の位
置に受光部c4をそれぞれ配置し、図5の(d)に示す
結像面Dでは、6番目の位置に受光部d1、8番目の位
置に受光部d2、14番目の位置に受光部d3、16番
目の位置に受光部d4をそれぞれ配置している。
Here, in the case of the embodiment of FIG. 4, the object images on the respective image forming planes A, B, C and D are 16 as shown in FIG.
It is divided into (horizontal 4 × vertical 4), and the light receiving portions of the respective image pickup elements are arranged at four non-adjacent divided positions. That is, in the image plane A shown in FIG. 5A, the light receiving part a1 is located at the first position, the light receiving part a2 is located at the third position, the light receiving part a3 is located at the ninth position, and the light receiving part is located at the eleventh position. a4 are arranged respectively, and on the image plane B shown in FIG. 5B, the light receiving part b1 is located at the second position, the light receiving part b2 is located at the fourth position, the light receiving part b3 is located at the tenth position, and the 12th position is formed. The light receiving parts b4 are arranged at the respective positions. In the image plane C shown in FIG. 5C, the light receiving section c1 is located at the fifth position, the light receiving section c2 is located at the seventh position, the light receiving section c3 is located at the thirteenth position, and the light receiving section is located at the fifteenth position. In the image plane D shown in FIG. 5D, the light receiving portion d1 is located at the sixth position, the light receiving portion d2 is located at the eighth position, the light receiving portion d3 is located at the fourteenth position, and the light receiving portion d3 is located at the fourteenth position. The light receiving parts d4 are arranged at the respective positions.

【0014】上記のような各結像面A,B,C,Dにお
ける撮像素子の配置状態で、各々の16の受光部a1〜
a4,b1〜b4,c1〜c4,d1〜d4でバラバラ
に撮影された被写体の画像情報は、上述のように画像合
成回路により合成される。図6はその画像情報を合成し
た様子を示したもので、各受光部の被写体像に対する寄
与の状態が示されている。この実施例の場合、各結像面
A,B,C,Dでの有効画素数は単一の撮像素子を使用
した場合に比べて16倍となり、等価的に16倍の画素
数の撮像素子を用いて撮影したのと同じ精細度が得ら
れ、図1の実施例の場合よりさらに高画質の画像が得ら
れる。
In the arrangement state of the image pickup devices on the respective image forming planes A, B, C and D as described above, each of the 16 light receiving portions a1 to a1.
The image information of the subject photographed separately at a4, b1 to b4, c1 to c4, and d1 to d4 is combined by the image combining circuit as described above. FIG. 6 shows a state in which the image information is combined, and shows the state of contribution of each light receiving portion to the subject image. In the case of this embodiment, the number of effective pixels on each of the image forming planes A, B, C and D is 16 times that in the case where a single image pickup element is used, and the image pickup element having 16 times the number of pixels equivalently. The same fineness as that obtained by using the image can be obtained, and an image of higher quality can be obtained as compared with the case of the embodiment of FIG.

【0015】図7は図1の構成の撮像装置の詳細な回路
構成を示すブロック図である。図中、101は図1に示
したCCD等の撮像素子、111はこの撮像素子101
を駆動するためのドライバ、121は撮像素子101の
出力をサンプルホールドするS/H回路、131はサン
プルホールドされたアナログ画像情報をデジタル信号に
変換するA/D変換器、141はそのデジタル画像情報
を記憶する画像メモリで、以上の各部により撮像ユニッ
トX1が構成されている。そして、この撮像ユニットX
1と同構成の撮像ユニットX2,X3,X4が設けられ
ている。すなわち、各撮像ユニットX2,X3,X4に
は撮像ユニットX1と同様、図1に示した撮像素子10
2,103,104、ドライバ112,113,11
4、S/H回路122,123,124、A/D変換器
132,133,134及び画像メモリ142,14
3,144が設けられている。4は単一のクロック発生
回路で、ここから出力されるタイミング信号により各撮
像ユニットX1〜X4のドライバ111〜114、S/
H回路121〜124、A/D変換器131〜134及
び画像メモリ141〜144の作動タイミングが制御さ
れ、撮像素子101〜104の駆動も制御される。ま
た、画像合成回路3の作動もこのクロック発生回路4か
らのタイミング信号によって制御され、出力端子5から
画像信号が図外の表示部あるいは記録部に出力される。
FIG. 7 is a block diagram showing the detailed circuit arrangement of the image pickup apparatus having the arrangement shown in FIG. In the figure, 101 is an image pickup device such as the CCD shown in FIG. 1, 111 is this image pickup device 101.
Driver 121 for driving, S / H circuit for sampling and holding the output of the image sensor 101, 131 for A / D converter for converting the sampled and held analog image information into a digital signal, and 141 for the digital image information. Is an image memory for storing the image pickup unit X1. And this imaging unit X
Image pickup units X2, X3, and X4 having the same configuration as that of No. 1 are provided. That is, each of the image pickup units X2, X3, and X4 includes the image pickup device 10 shown in FIG.
2, 103, 104, drivers 112, 113, 11
4, S / H circuits 122, 123, 124, A / D converters 132, 133, 134 and image memories 142, 14
3, 144 are provided. Reference numeral 4 denotes a single clock generation circuit, which outputs timing signals output from the drivers 111 to 114 and S / S of the imaging units X1 to X4.
The operation timings of the H circuits 121 to 124, the A / D converters 131 to 134, and the image memories 141 to 144 are controlled, and the driving of the image pickup devices 101 to 104 is also controlled. The operation of the image synthesizing circuit 3 is also controlled by the timing signal from the clock generating circuit 4, and the image signal is output from the output terminal 5 to a display unit or a recording unit (not shown).

【0016】上記各撮像ユニットX1〜X4の各撮像素
子101〜104は、図2及び図3に示した各々の受光
部a1,b1,a2,b2を有しており、前述のように
4分割された被写体の画像情報が各々画像メモリ141
〜144に格納される。この画像メモリ141〜144
に格納された画像情報は、クロック発生回路4からの信
号により読み出され、画像合成回路3に入力される。そ
して、この画像合成回路3で全体の被写体の画像情報が
合成され、上記のように出力端子5から被写体を撮影し
た画像信号が出力される。
The image pickup devices 101 to 104 of the image pickup units X1 to X4 have the light receiving portions a1, b1, a2 and b2 shown in FIGS. 2 and 3, and are divided into four as described above. The image information of the captured subject is stored in the image memory 141.
To 144. This image memory 141-144
The image information stored in 1 is read by a signal from the clock generation circuit 4 and input to the image synthesis circuit 3. Then, the image synthesizing circuit 3 synthesizes the image information of the entire subject, and the image signal of the photographed subject is output from the output terminal 5 as described above.

【0017】また、図4の構成の撮像装置の回路構成
は、上記図7に示した撮像ユニットを16個設けること
により実現でき、各撮像ユニットからの画像情報を画像
合成回路に入力して全体の被写体画像を形成するように
すればよい。
The circuit configuration of the image pickup apparatus having the configuration shown in FIG. 4 can be realized by providing 16 image pickup units shown in FIG. 7, and the image information from each image pickup unit is input to the image synthesizing circuit so that the whole image pickup unit can be obtained. The subject image may be formed.

【0018】ここで、上述の画像メモリ141〜144
や画像合成回路3は、一般に使用されている公知のメモ
リ及びその制御技術を用いて容易に実現することができ
る。したがって、その詳細説明は省略する。また、上記
実施例よりさらに多くのビームスプリッタを使用し、各
結像面での被写体像の分割数を多くして、より精細度の
高い画像を得ることも可能である。
Here, the above-mentioned image memories 141 to 144 are used.
The image synthesizing circuit 3 can be easily realized by using a commonly used known memory and its control technology. Therefore, its detailed description is omitted. It is also possible to use a larger number of beam splitters than in the above embodiment and increase the number of divisions of the subject image on each imaging plane to obtain an image with higher definition.

【0019】なお、図1の実施例において、図8の
(a)に示す単位で受光部a1,b1を横に並べること
で、撮像素子は無限に多くすることができる。図8の
(b)は受光部a,bを8個で構成した場合を示してい
る。また、図4の実施例においても、図9の(a)に示
す単位で受光部a1,b1,c1,d1を縦横に並べる
ことで、撮像素子を無限に多くすることができる。図9
の(b)は受光部a,b,c,dを64個で構成した場
合を示している。
In the embodiment of FIG. 1, the number of image pickup elements can be increased infinitely by arranging the light receiving portions a1 and b1 side by side in the unit shown in FIG. 8A. FIG. 8B shows a case where the light receiving portions a and b are composed of eight. Further, also in the embodiment of FIG. 4, by arranging the light receiving portions a1, b1, c1, d1 vertically and horizontally in the unit shown in FIG. 9A, the number of image pickup elements can be increased infinitely. Figure 9
(B) shows a case where the number of light receiving portions a, b, c, d is 64.

【0020】このように、現在業務用の多板式カメラ等
で用いられている結像光路をビームスプリッタにより複
数に分割することで、等価的な画素数を大幅に増加させ
ることができ、高画質の画像を得ることができる。ちな
みに、現在家庭用のビデオカメラに使用されている40
万画素の撮像素子を本発明に適用すると、図1の実施例
では160万画素、図4の実施例では640万画素に達
し、さらに像サイズを大きくすれば無限に実効画素数を
多くすることが可能である。
As described above, by dividing the image forming optical path currently used in a commercial multi-plate camera or the like into a plurality of beams by the beam splitter, the equivalent number of pixels can be greatly increased, and the image quality can be improved. You can get an image of. By the way, 40 currently used in home video cameras
When an image sensor of 10,000 pixels is applied to the present invention, it reaches 1.6 million pixels in the embodiment of FIG. 1 and 6.4 million pixels in the embodiment of FIG. 4, and the number of effective pixels is increased infinitely if the image size is further increased. Is possible.

【0021】[0021]

【発明の効果】以上のように、本発明によれば、被写体
からの撮像光を等しい光量で複数に分割して各々異なる
位置に被写体像を結像させ、各結像面で被写体像を複数
に分割した時に隣接しない分割位置に撮像素子の受光部
を配置し、各撮像素子からの画像情報を後で合成するよ
うにしたので、高集積化した撮像素子を用いることな
く、一般の撮像素子で有効画素数を増加させることがで
き、簡単な構成で安価に画質を向上させることができる
という効果がある。
As described above, according to the present invention, the imaging light from the subject is divided into a plurality of light beams with the same amount of light, and the subject images are formed at different positions. Since the light receiving portions of the image pickup elements are arranged at division positions that are not adjacent to each other when the image is divided into two, and the image information from each image pickup element is combined later, it is possible to use a general image pickup element without using a highly integrated image pickup element. Thus, the number of effective pixels can be increased, and the image quality can be improved at low cost with a simple configuration.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の一実施例の主要構成図FIG. 1 is a main configuration diagram of an embodiment of the present invention.

【図2】 図1の各結像面の様子を示す説明図FIG. 2 is an explanatory diagram showing a state of each image plane in FIG.

【図3】 図2の画像情報を合成した様子を示す説明図FIG. 3 is an explanatory diagram showing a state in which the image information of FIG. 2 is combined.

【図4】 本発明の他の実施例の主要構成図FIG. 4 is a main configuration diagram of another embodiment of the present invention.

【図5】 図4の各結像面の様子を示す説明図FIG. 5 is an explanatory diagram showing the state of each image plane in FIG.

【図6】 図5の画像情報を合成した様子を示す説明図6 is an explanatory diagram showing a state in which the image information of FIG. 5 is combined.

【図7】 図1の構成の撮像装置の詳細な回路構成を示
すブロック図
7 is a block diagram showing a detailed circuit configuration of the image pickup apparatus having the configuration of FIG.

【図8】 図1の実施例で撮像素子を多くする例を示す
説明図
FIG. 8 is an explanatory diagram showing an example of increasing the number of image pickup devices in the embodiment of FIG.

【図9】 図4の実施例で撮像素子を多くする例を示す
説明図
9 is an explanatory diagram showing an example in which the number of image pickup devices is increased in the embodiment of FIG.

【符号の説明】[Explanation of symbols]

2 ビームスプリッタ(分割手段) 3 画像合成回路 4 クロック発生回路 101 撮像素子 102 撮像素子 103 撮像素子 104 撮像素子 141 画像メモリ 142 画像メモリ 143 画像メモリ 144 画像メモリ 2 Beam splitter (splitting means) 3 image synthesis circuit 4 clock generation circuit 101 image sensor 102 image sensor 103 image sensor 104 image sensor 141 image memory 142 image memory 143 image memory 144 image memory

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 被写体からの撮像光を等しい光量で複数
に分割して各々異なる位置に被写体像を結像させる分割
手段と、各結像面で被写体像を複数に分割した時に隣接
しない分割位置に受光部を配置した複数の撮像素子と、
各撮像素子からの情報を入力して被写体画像を合成する
画像合成回路とを備えたことを特徴とする撮像装置。
1. Splitting means for splitting imaging light from a subject into a plurality of equal amounts of light to form a subject image at different positions, and dividing positions that are not adjacent to each other when the subject image is split on each imaging surface. A plurality of image pickup elements each having a light receiving section disposed therein,
An image pickup apparatus comprising: an image synthesizing circuit for synthesizing a subject image by inputting information from each image pickup element.
【請求項2】 前記各撮像素子は、単一のクロック発生
回路からのタイミング信号により制御されることを特徴
とする請求項1記載の撮像装置。
2. The image pickup apparatus according to claim 1, wherein each image pickup element is controlled by a timing signal from a single clock generation circuit.
JP3148442A 1991-06-20 1991-06-20 Image pickup device Withdrawn JPH057346A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP3148442A JPH057346A (en) 1991-06-20 1991-06-20 Image pickup device
US07/900,471 US5386228A (en) 1991-06-20 1992-06-18 Image pickup device including means for adjusting sensitivity of image pickup elements
EP92305597A EP0519719B1 (en) 1991-06-20 1992-06-18 Arrangement of a plurality of image sensors in a video camera
DE69228629T DE69228629T2 (en) 1991-06-20 1992-06-18 Arrangement of several image sensors in one video camera

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3148442A JPH057346A (en) 1991-06-20 1991-06-20 Image pickup device

Publications (1)

Publication Number Publication Date
JPH057346A true JPH057346A (en) 1993-01-14

Family

ID=15452895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3148442A Withdrawn JPH057346A (en) 1991-06-20 1991-06-20 Image pickup device

Country Status (1)

Country Link
JP (1) JPH057346A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10339439A1 (en) * 2003-08-25 2005-03-24 Michael Olders Digital camera for taking pictures or a timed sequence of pictures has a system of mirrors, light-sensitive sensors and a data-processing unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10339439A1 (en) * 2003-08-25 2005-03-24 Michael Olders Digital camera for taking pictures or a timed sequence of pictures has a system of mirrors, light-sensitive sensors and a data-processing unit

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