JPH0570253A - Joining method for ceramics with each other and thermal joining insert material - Google Patents

Abstract

PURPOSE:To effectively, firmly join ceramics with each other in a short time by energizing an induction heating coil to induction-heat heating ceramics interposed between low conductive ceramics members abutted on each other. CONSTITUTION:Between ceramics members to be jointed 1a, 1b consisting of low conductive SiC, etc., are disposed heating ceramics 2 made of high conductive SiC, etc., through a joining agent to abut them on each other. At this time, the abutted surface is preferably cleaned by specular polishing. The constituted body to be jointed is fixed by applying pressure P of about 100 MPa in the abutted direction. Next, at induction heating coil 4 disposed near the outer circumference of the abutted part is energized by a high frequency power unit 5, causing the heating ceramics 2 to be induction-heated. On the heating, the abutted part is heated to the joining formed temp. to join the ceramics members with each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inducing and heating a butt portion when joining ceramic members having low electric conductivity, and an insert material for heating and joining.

[0002]

2. Description of the Related Art When ceramic members are joined together or ceramic members and metal members are joined together by induction heating, for example, high frequency heating, a suitable bonding agent is interposed between these members and the outer periphery of the butted portion is wound in a cylindrical shape. Energize the rotated induction heating coil. At this time, an induction current flows through the ceramic member or metal member having high conductivity, and the butt portion is heated by induction heating at this time to join the ceramics. Further, for a ceramic member or a metal member having conductivity at high temperature, a conductive material such as metal is coated on the abutting surface of the member, and the coating is induction-heated so that the conductive material is conductive. A method has been proposed in which an induced current also flows through a ceramic member having improved properties, and the butt portion is heated by induction heating of both members to join the ceramics (JP-A-61-3).
6180). Further, when joining the insulating ceramic members together, a method of interposing a conductive joining agent and inductively heating the joining agent is also conceivable.

[0003]

However, in the conventional joining, ceramic members such as Si ₃ N ₄ and Al ₂ O ₃ which are insulative even at a high temperature are joined together by using an insulative joining agent. There is a problem that it cannot be applied in some cases. Further, when joining ceramics having conductivity at a high temperature such as ZrO ₂ or joining using a conductive bonding agent, a means for coating a conductive material has been taken, but generally, -Because the thickness of the coating is very small, it is difficult to effectively heat the members to be welded having an overwhelmingly large volume to a high temperature only by induction heating in this portion. That is, there is a problem that the joining requires a long time, a large amount of electric power is required, and the size of the member to be joined is small.

[0004]

According to the present invention, in order to solve the above-mentioned problems, in Claim 1, a part or all of the members to be joined are larger than the members to be joined. Conducting heating ceramics having conductivity to butt the ceramic members to be joined together to form a structure to be joined, pressurize the structure to be joined in the butt direction, and energize the induction heating coil provided near the butt portion. By doing so, the heating ceramics is mainly induction-heated, and the butt portion is heated to the bonding formation temperature by the induction heating to bond. Further, in claim 2, the ceramics for heating, which are partially or wholly larger in electrical conductivity than the ceramics to be joined, are interposed between the ceramics to be joined, and the ceramics to be joined are butted. By constructing a structure to be joined and energizing the induction heating coil provided in the vicinity of the butt portion, mainly the heating ceramics or the heating ceramics and the bonding agent are induction-heated, and the butt portion is joined by induction heating. It is characterized by heating to the forming temperature and joining. Further, in claim 3, from before the main heating by the induction heating is started to after the main heating is finished,
Part or all of the structure to be joined by the auxiliary heating means,
It is characterized by heating to a temperature lower than the junction formation temperature. According to a fourth aspect of the present invention, there is provided an insert material for heating and joining which is interposed between ceramic members to be joined, wherein a joining agent layer is formed on a butting surface of the heating ceramics and integrated. There is.

[0005]

By using the above-described method and the insert material for heat bonding, the heating ceramics interposed between the ceramic members to be bonded are mainly induction-heated and the butt portions thereof are intensively heated. Therefore, the present invention can be maximally exhibited when joining ceramics having a low electric conductivity, particularly insulating ceramics.

[0006]

EXAMPLE 1 FIG. 1 is a schematic constitutional view of a first example showing a joining method of the present invention, showing a case where low-conductivity ceramics are joined together without using a joining agent. First, a round pipe-shaped low-conductivity SiC having an electric conductivity of 10 ^-2 [Ω · cm] ^-1.
Ceramic (φ12 × φ5 × 50) bonded member 1
A heating ceramics 2 (φ12 × φ5 × 5) made of a ring-shaped high-conductivity SiC ceramics having an electric conductivity of about 10 ² [Ω · cm] ⁻¹ is disposed between a and 1b and abutted. At this time, the abutting surfaces of the members to be joined and the heating ceramics should be mirror-polished and clean surfaces in advance. Next,
The structure to be joined is fixed by applying a pressure P of about 100 MPa in the butt direction by a pressure device (not shown). Further, in order to mainly heat the abutting portion of the above-mentioned structure, a water-cooled induction heating coil 4 wound in a circular coil shape of an appropriate length is arranged on the outer circumference of the abutting portion, and both ends of the coil 4 are arranged. The high frequency power supply device 5 is connected to. In such a structure, the joining atmosphere is made vacuum, and the high-frequency power supply device 5 causes a high-frequency current of 50 KHz to pass through the coil 4 to induction-heat the heating ceramics 2, and the heat conduction of the induction heats the member 1 to be joined.
When the temperatures of a and 1b rise, their resistance decreases, and an induced current also flows in this portion, and all of these heat generations combine to heat the entire butt portion. In this case, since the heating ceramics 2 generate the largest amount of heat, effective heating centering on the butted portion can be performed. The input power was automatically adjusted by the signal from the radiation thermometer so that the temperature at the butt section was about 1900 ° C. About 19
After holding at 00 ° C. for 1 hour, it was cooled to room temperature to complete the joining. The airtightness of this bonded body is determined by the He leak detector.
As a result of the evaluation, it was shown that the airtightness was below the detection limit, and the joint structure was observed after cutting to find that good joining was obtained.

Embodiment 2 FIG. 2 is a schematic constitutional view of a second embodiment showing a joining method of the present invention, showing a case where insulating ceramics are joined together using a conductive joining agent. First, the conductivity is 10
^-13 [Ω · cm] ^-1 or less circular pipe-shaped Si ₃ N ₄ ceramics (φ20 × φ15 × 100) to-be-joined member 1
Between a and 1b, on both abutting surfaces of heating ceramics 2 (φ20 × φ15 × 5) made of ring-shaped TiN-containing Si ₃ N ₄ ceramics having a conductivity of about 10 ² [Ω · cm] ^-1 or less. , Ti-based active metal brazing agents 3a, 3b (20
0 μm) is provided. Next, as in the first embodiment, a pressure device (not shown) is applied to the structure to be joined to fix the structure, and the induction heating coil is attached to the outer periphery of the butt portion of the structure. 4 is arranged,
The high frequency power supply device 5 is connected to both ends of the coil 4. In such a configuration, the heating atmosphere 2 and the bonding agents 3a and 3b are applied to the heating ceramic 2 and the bonding agents 3a and 3b by applying a high-frequency current of 50 KHz to the coil 4 by the high-frequency power supply device 5 while making the bonding atmosphere a vacuum and rotating the above-described structure around the central axis. Induction heating was performed, and the generated heat was used to heat the butt section and its vicinity. The input power was adjusted while monitoring with a radiation thermometer so that the temperature at the butt section was about 900 ° C. About 900 ° C
After holding for 5 minutes, it was cooled to room temperature to complete the bonding. When the airtightness of this joined body was evaluated by a He leak detector, it showed a high airtightness below the detection limit, and when the joint structure was observed by cutting, a uniform joining layer of about 15 μm was formed. It was found that good bonding was obtained.

Example 3 The third example of the present invention is shown in the schematic configuration diagram of the second example (see FIG. 2), and an example in which insulating ceramics are bonded to each other using an insulating bonding agent. Is. Conductivity is 10
^-13 [Ω · cm] ^-1 or less circular pipe-shaped Al ₂ O ₃ ceramics (φ20 × φ15 × 100) to be joined member 1
Between a and 1b, on both abutting surfaces of heating ceramics 2 (φ20 × φ15 × 5) made of ring-shaped TiN-containing Al ₂ O ₃ ceramics having a conductivity of about 10 ² [Ω · cm] ⁻¹ , B ₂ O ₃ -based oxide solder bonding agent 3 a, 3 b (4
00 μm) is provided and fixed, and an appropriate pressure P is applied and fixed. The induction heating coil 4 and the high frequency power supply device 5
Is the same as in the first embodiment. In such a structure, the bonding atmosphere is set to the atmosphere, and the high-frequency power supply device 5 applies a high-frequency current of 50 KHz to the coil 4 to cause the heating ceramics 2 to be induction-heated while rotating the structure to be bonded around the central axis. The butt and its vicinity were heated by the generated heat. The input power was automatically adjusted by the signal from the radiation thermometer so that the temperature of the butt section was about 750 ° C. After holding at about 750 ° C. for 5 minutes, it was cooled to room temperature to complete the bonding. As a result of performing the same evaluation as that of the above-mentioned example, it was found that good bonding was obtained.

Embodiment 4 The fourth embodiment of the present invention is shown in the schematic configuration diagram of the second embodiment (see FIG. 2), in which low-conductivity ceramics are bonded together using a conductive bonding agent. Here is an example. Conductivity is 1
Round pipe-shaped low-conductivity SiC ceramics (φ20 × φ15 × 100), which is 0 ⁻² [Ω · cm] ⁻¹ , to be joined 1
Between a and 1b, the two butting surfaces of the heating ceramics 2 (φ20 × φ15 × 5) made of ring-shaped highly conductive SiC ceramics having a conductivity of about 10 ² [Ω · cm] ⁻¹ , Ti
The bonding agents 3a and 3b (200 μm) of the system active metal brazing agent are provided and arranged, and fixed by applying an appropriate pressure P. In addition,
The induction heating coil 4 and the high frequency power supply device 5 are the same as those in the first embodiment. In such a structure, the bonding atmosphere is set to be vacuum, and the high frequency power supply device 5 rotates the coil 4 to 50 KH while rotating the structure to be bonded around the central axis.
When the heating ceramics 2 and the bonding agents 3a and 3b are induction-heated by the high frequency current of z and the temperature of the members 1a and 1b to be bonded rises due to the heat conduction, the resistance decreases, and the induction current is also applied to this part. It flows and all of these heat generations are combined to heat the entire butt section. In this case, the heating ceramics 2 and the bonding agent 3
Since a and 3b generate the largest amount of heat, effective heating can be performed centering on the butted portion. Butt temperature is about 900
The input power was adjusted while monitoring with a radiation thermometer so that the temperature became 0 ° C. After holding at about 900 ° C. for 5 minutes, it was cooled to room temperature to complete the joining. When the airtightness of this joined body was evaluated by a He leak detector, it showed a high airtightness below the detection limit, and when the joint structure was observed by cutting, a uniform joining layer of about 15 μm was formed. It was found that good bonding was obtained. SiC ceramics is a material whose conductivity changes greatly depending on the raw material, impurities, firing conditions, structure, etc., and is 10 ² [Ω · cm].
Various products ranging from ^-1 to 10 ^-13 [Ω · cm] ^-1 are commercially available. Further, the temperature characteristics are also various, and there is a case where the conductivity increases at first as the temperature rises, but then decreases conversely. Needless to say, the joining method of the present invention can be applied to such materials having various conductive properties.

Fifth Embodiment A fifth embodiment of the present invention is shown in a schematic configuration diagram of the second embodiment (see FIG. 2), in which low-conductivity ceramics are bonded to each other using an insulating bonding agent. Here is an example. Conductivity is 1
Round pipe-shaped low-conductivity SiC ceramics (φ20 × φ15 × 100), which is 0 ⁻² [Ω · cm] ⁻¹ , to be joined 1
Between the a and the 1b, Ca is applied to both abutting surfaces of the heating ceramics 2 (φ20 × φ15 × 5) made of a ring-shaped highly conductive SiC ceramics having a conductivity of about 10 ² [Ω · cm] ^−1.
The F ₂ -based bonding agents 3a and 3b (400 μm) are provided and disposed, and an appropriate pressure P is applied and fixed. The induction heating coil 4 and the high frequency power supply device 5 are the same as those in the first embodiment. In such a structure, the bonding atmosphere is set to the atmosphere, and the high-frequency power supply device 5 applies a high-frequency current of 50 KHz to the coil 4 to cause the heating ceramics 2 to be induction-heated while rotating the structure to be bonded around the central axis. ,
When the temperature of the members to be joined 1a, 1b rises due to the heat conduction, the resistance thereof decreases, and the induced current also flows in this portion, and all of these heat generations combine to heat the entire butt portion. In this case, since the heating ceramics 2 generate the largest amount of heat, effective heating centering on the butted portion can be performed. Butt temperature is about 150
The input power was automatically adjusted by the signal from the radiation thermometer so that the temperature became 0 ° C. After holding at about 1500 ° C. for 10 minutes, it was cooled to room temperature to complete the bonding. As a result of performing the same evaluation as that of the above-mentioned example, it was found that good bonding was obtained.

Embodiment 6 FIG. 3 is a schematic constitutional view of a sixth embodiment of the joining method of the present invention, showing the case where joining is carried out together with auxiliary heating means. Its purpose is to have low conductivity at room temperature,
For materials for which high frequency induction heating cannot be expected, it is necessary to raise the bonding temperature in order to increase the heat resistance of the joint, and to improve productivity and minimize deterioration of the joint. When it is desired to shorten the joining time extremely for the purpose, the above-mentioned methods alone may damage the ceramic members to be joined or the heating ceramics due to thermal stress at the time of joining. In such a case, auxiliary heating means preliminarily heats the vicinity of the abutting portion of the structure to be bonded or the entire structure to a certain temperature in advance, and thereafter the high frequency heating rapidly heats the heating ceramics to the bonding temperature. It is possible to make the thermal gradient gentle and prevent damage to the member due to thermal shock. Round pipe-shaped low-conductivity porous SiC ceramics with a conductivity of 10 ⁰ [Ω · cm] ^-1 (φ20 x
A ring-shaped highly conductive Si having a conductivity of about 10 ² [Ω · cm] ⁻¹ between the bonded members 1 a and 1 b of φ15 × 100)
The heating ceramics 2 (φ20 × φ15 × 5) made of the impregnation reaction sintered SiC ceramics are provided with the bonding agents 3a and 3b (200 μm) of the Si-based brazing agent on both abutting surfaces, and an appropriate pressure P is applied. In addition, fix. The induction heating coil 4 and the high frequency power supply device 5 are the same as those in the first embodiment. Further, in this embodiment, in order to preheat the butt portion to a certain temperature before the main heating by the induction heating is started, the auxiliary heating means 6a, which includes two sets of lamp heating devices,
6a and 6b, 6b are provided. In such a structure, the bonding atmosphere is Ar gas, and the auxiliary heating means 6a and 6b are rotated while rotating the structure to be bonded around the central axis.
After preheating the ceramic members to be bonded 1a, 1b in the vicinity of the induction heating coil 4 to about 1000 ° C., the induction heating for about 1 minute causes the heating ceramics and the bonding agent to generate heat, and the entire butt portion is heated to about 1450. The bonding agent was reacted with the ceramic member and the heating ceramics by heating to ℃. Then, it cooled to room temperature and completed joining. As a result of slicing this bonded body and observing the bonded structure, it was found that a uniform bonded layer of about 30 μm was formed and good bonding was obtained. For comparison, an attempt was made to join only by high-frequency induction heating without performing preheating by the auxiliary heating means, but a crack was generated in the ceramic member to be joined during heating, and the portion was broken.

[0012]Example 7 7th Example of this invention is a schematic block diagram of 6th Example.
(See Fig. 3).
It is another example of combining. Conductivity is 10⁰[Ω · cm]^-1And
Round pipe-shaped low conductive porous SiC ceramics (φ
20 × φ15 × 100) between the members 1a and 1b to be joined,
Conductivity is about 10²[Ω · cm]^-1Ring-shaped high conductivity
Heating impregnation made of reactive Si-impregnated reaction-sintered SiC ceramics
S on both butting surfaces of Mix 2 (φ20 × φ15 × 5)
i / C / organic binder bonding agent 3a, 3b (1
00 μm) is installed and fixed, and an appropriate pressure P is applied and fixed.
To do. The induction heating coil 4 and the high frequency power supply device 5
Is the same as in the first embodiment, and the auxiliary heating means 6
a, 6a and 6b, 6b are the same as in the sixth embodiment. this
In such a structure, the bonding atmosphere is Ar gas, and
While rotating the structure to be joined around the central axis,
Contact by the heating means 6a, 6b near the induction heating coil 4
Preliminarily prepare composite ceramic members 1a and 1b up to about 1000 ° C
After heating, apply induction heating for about 1 minute, and
Heats the mix and bonding agent to about 1
When heated to 500 ° C, Si in heating ceramics
By reacting with carbon in the bonding agent to form SiC
The ceramic member and heating ceramics
Let Then, it cooled to room temperature and completed joining. This
As a result of observing the joint structure by cutting the joint body of about 10
A uniform bonding layer of 0 μm is formed, and good bonding is achieved.
It turned out to be obtained. Auxiliary of Examples 6 and 7 above
A lamp heating device was used as the heating means, but other heating
Thermal methods such as normal electrical resistance heating, indirect high frequency induction
Conductive heating, gas flame heating, laser heating, etc.
It can be used. The higher the auxiliary heating temperature, the higher the post-process.
Although the thermal shock during frequency heating is suppressed, the above auxiliary heating
Since the step is heating from the surface and indirect heating,
Since the energy efficiency is poor, the size, shape, and
Thermal shock as much as possible depending on the bonding temperature and thermal shock resistance
The minimum heating that can prevent the adverse effects of
Is desirable. In addition, the heating area also heats the entire sample.
Although good, the original purpose of the present invention (joining by local heating)
Therefore, it is possible to prevent the adverse effects of thermal shock.
In order to form a temperature distribution like
It is desirable to perform auxiliary heating. It should be noted that the samples of Examples 1 to 5 were
The method of Examples 6 and 7 can also be applied to the bonded structure.
Noh. In the above examples, the ceramics to be bonded
As the members 1a and 1b, Si shown in the embodiment is used.₃N_Four，
Al₂O₃, Insulating ceramics other than SiC (eg
For example, AlN, sialon, mullite, etc.) and low conductivity cell
Ramix (eg ZrO ₂, Low conductivity composite ceramic
Kusu) is applicable. Also the same kind of ceramic
Not only the joining of two ceramics
It can also be applied to joining. As heating ceramics 2
Is a carbide such as SiC or WC, or TiN or TaN
Nitride, ZrO₂, LaCrO₂Oxides such as MoS
i₂, Silicides such as MoSi, TiB₂Boring such as
And Si containing a conductivity-imparting substance such as TiN or SiC₃
N_FourCeramics such as and sialon, ceramics
All conductive cermets such as cermets consisting of
Lamix can be used as an example, but it has the same performance as the materials to be joined.
In order to obtain
It is desirable to select one that does. Also, its thickness is
Thermal properties such as heat capacity and thermal conductivity of the materials to be joined and the joining temperature
It is selected so that the required heating can be obtained from the degree. Well
In addition, due to the temperature distribution during joining, the residual reaction that occurs at room temperature
In order to reduce the effect of force, the temperature distribution and
Depending on the coefficient of thermal expansion of the bonding agent,
Select a material with an appropriate coefficient of thermal expansion and thickness
Is desirable. Furthermore, the surface of the joint also has electrical insulation.
Surrounding conductive ceramics for required applications
Insulating ceramic
It is also possible to have a structure with a box. As in Example 1
In addition, the method of directly joining without using a bonding agent is
Since a joint part equivalent to a composite member is formed,
Ideal, but requires high temperature and pressure, and is simple
I can't say that. In that respect, the method using a bonding agent
Can be said to be a simple method. Examples of the bonding agent are Examples 2 and 4.
And active metal brazing filler metals such as 6 and metal-based contacts such as precious metals
Mixture or oxide or fluoride as in Examples 3 and 5
Inorganic bonding agent consisting of
Reactivity with steel members and required performance (for example, heat resistance, corrosion resistance
For example, the inorganic binder is superior. ) Most suitable
You can select the right one. Of the inorganic binders, the insulating
When using a bonding agent, heat is generated only by the heating ceramics.
Will occur. In addition, the bonding agent as in the above example
Other than the method of melting and reacting with the ceramic member
In addition, bonding such as reaction sintering method or solid phase diffusion method as in Example 7 is performed.
The present invention can be applied to a method in which the agent is not melted. Bonding agent
The method of melting is the simplest and the airtightness is easily obtained.
However, the heat resistance is generally low. On the other hand, other methods
Although it is possible to bond with heat and high strength, high temperature and high pressure are required.
However, it is not convenient. Therefore necessary
Which bonding agent to use according to the desired bonding performance
Alternatively, it may be applied to the present invention. Of induction heating coil
Shapes, dimensions, power supply frequency, etc.
More efficient than the physical properties such as shape, size and conductivity
Is selected. This induction heating coil is usually a pipe
Although it is installed on the outer peripheral side of the members to be joined,
Good. However, the coil is a conductive part of the structure to be joined.
It is necessary to provide it so that it does not come into contact with. Also, the energizing current
The frequency is not limited to 50KHz,
Frequencies between 300Hz and 500KHz can be used. To be joined
The structure is rotated in the circumferential direction of the abutting part.
This is because the heating temperature is made uniform and the heating ceramics
, Etc. are electrically uniform in the circumferential direction, and
If the positional relationship with the
If the degree distribution does not affect the state of static
You may join in a state. The heating / cooling rate is
The speed must be such that it will not be damaged by thermal shock. Joining
The atmosphere is made up of the bonding agent, the members to be bonded,
It is necessary to choose an atmosphere that does not impair the function. this
As a method of adjusting the atmosphere, the entire structure to be joined can be
Or the coil in the chamber only near the butt
Place and perform vacuum replacement or gas flow in the chamber
Method, the entire structure to be bonded between the coil and the structure to be bonded
Heat resistance to cover only the body or the vicinity of the butt,
An insulating tubular reaction tube is provided, and the inside of the reaction tube is vacuum replaced or
How to do gas flow, just spray gas on the butt
There are ways to

Embodiment 8 FIGS. 4 (A) and 4 (B) are a schematic sectional view and a perspective view showing a first embodiment of the insert material for heating and joining of the present invention, respectively. A preferred example of joining using a method is shown. For example, when joining members to be joined in the shape of a round pipe, the joining agents 3a and 3b are previously formed on both abutting surfaces of the ring-shaped conductive ceramics for heating 2 to be integrated. Ceramics for heating 2 of this embodiment
As for the shape, the dimensions of the members to be joined are φ20 × φ15 ×
If it is 100, a simple ring shape of φ20 × φ15 × 5 is formed so as to match the shape of the abutting surface of the members to be joined. In addition, as a method of forming the bonding agent, vacuum deposition, ion plating, sputtering, CVD, dipping,
Known thin film or thick film forming techniques such as metallizing and thermal spraying can be applied. When such an insert material for heat bonding is used, handling at the time of bonding becomes easy.

Embodiment 9 FIGS. 5 (A) and 5 (B) are a schematic sectional view and a perspective view, respectively, showing a second embodiment of the insert material for heat bonding of the present invention. The heating ceramics 2 having electroconductivity is manufactured in a shape in which a brim structure is provided on both abutting surfaces of the abutting surfaces so that the members to be joined can be fitted easily.
Similarly, the bonding agents 3a and 3b are previously formed and integrated. The method for forming the bonding agent is the same as in Example 8 and will not be described. When such an insert material is used, the alignment at the time of joining becomes easier and the joining performance is improved.

Embodiment 10 FIG. 6 is a schematic cross-sectional view showing a third embodiment of the insert material for heating and joining of the present invention, in which the inner and outer circumferences of the ring-shaped conductive ceramics 2 for heating. Insulating ceramics 21 and 22 are provided on the entire surface, respectively. Next, the heating ceramics 2 and the insulating ceramics 2
Bonding agents 3a and 3b are previously formed on both abutting surfaces of 1 and 22 to be integrated. In addition, conductive heating ceramics 2
The bonding agents 3a, 3
b can be formed and integrated. This insulating ceramic is formed by a method such as simultaneous sintering during coating on conductive ceramics by the thin film or thick film forming technique which is the method of forming the bonding agent of Example 4, or simultaneous production of the conductive ceramics. To be done. The method for forming the bonding agent is the same as in Example 8 and will not be described.
By using such an insert material for heat bonding, it is possible to meet applications in which electrical insulation is required even on the surface of the bonding portion.

[0016]

The effect of claim 1 of the present invention is that ceramics having a low electric conductivity, particularly insulating ceramics,
Local heating by high-frequency heating makes it possible to improve the heating efficiency and significantly reduce the joining time to achieve low-cost joining, and also to cope with large-sized members to be joined. The effect of claim 2 is, in addition to the effect of claim 1, that it is possible to perform bonding at low pressure and low temperature by interposing a bonding agent.
A simple joining method can be provided. In addition to the effects of claims 1 and 2, the effect of claim 3 prevents damage to the ceramic member due to thermal shock when bonding for a short time, high temperature bonding or a member vulnerable to thermal shock. be able to. The effect of claim 4 is that the handling and the alignment at the time of joining are easy, the joining process can be simplified, and the on-site work becomes easy.

[0017]

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a first embodiment showing a joining method of the present invention.

FIG. 2 is a schematic configuration diagram of second to fifth embodiments showing a joining method of the present invention.

FIG. 3 is a schematic configuration diagram of sixth and seventh embodiments showing a joining method of the present invention.

4 (A) and 4 (B) are respectively a schematic sectional view and a perspective view showing a first embodiment of the insert material for heat bonding of the present invention.

5 (A) and 5 (B) are respectively a schematic sectional view and a perspective view showing a second embodiment of the insert material for heat bonding of the present invention.

FIG. 6 is a schematic sectional view showing a third embodiment of the insert material for heat bonding of the present invention.

[Explanation of symbols]

 1a, 1b Ceramic member to be bonded 2 Ceramics for heating 3a, 3b Bonding agent 4 Coil for induction heating 6a, 6b Auxiliary heating means

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hisashiki Hoshino 2-1-11, Tagawa, Yodogawa-ku, Osaka City Daihen Stock Company

Claims (4)

[Claims] 1. A ceramic body for heating, which is partially or wholly larger in electrical conductivity than the ceramic body to be joined, is interposed between the ceramic body to be joined, and the ceramic body to be joined is abutted to form a structural body to be joined. The heating ceramics are mainly heated by induction heating the induction heating coil provided in the vicinity of the butting portion by pressurizing the structure to be joined in the butting direction, and the butting is performed by the induction heating. A method for joining ceramics to each other by heating the parts to the joining temperature. 2. A ceramics for heating, which is partially or wholly larger in electrical conductivity than the ceramics to be bonded, is interposed between the ceramics to be bonded, and the ceramics to be bonded are butted to each other. By constructing a structure to be joined and energizing the induction heating coil provided in the vicinity of the butt portion, mainly the heating ceramics or the heating ceramics and the bonding agent are induction-heated, and the induction heating is performed to A method for joining ceramics in which the abutting portions are heated to a joint forming temperature and joined. 3. From before the main heating by the induction heating according to claim 1 or 2 is started to after the main heating is completed, part or all of the constituents to be bonded are lower than the bonding formation temperature by auxiliary heating means. A method of joining ceramics that are heated to a temperature. 4. An insert material for heating and joining, wherein a joining agent layer is formed on the abutting surface of the heating ceramics according to claim 2 and integrated.