JPH0567690A - Capping device - Google Patents

Abstract

PURPOSE:To enable a cap and a semiconductor chip to be enhanced in relative positional accuracy by a method wherein the position adjustment of parts is automatically carried out taking advantage of the image data of the parts. CONSTITUTION:When an optical semiconductor element 3 is capped, the images of the optical semiconductor element 3 and a cap 1 are picked up by a camera 9 through a window glass 2, and the images are displayed on a CRT display 10. Then, the displayed image is processed into signals through an image processing device 11, and data that tell how distant time optical semiconductor chip 3 is located from the cap 1 on the basis of the outer periphery of the cap 1 are outputted. A control device 12 drives an upper electrode 4 receiving the data concerned so as to pout the cap 1 in position. After the cap 1 is located at an optimal position, and the cap 1 is welded at a welding point 7. As mentioned above, the position adjustment of the cap 3 is automatically carried out basing on the relative position data of the cap 1 and the optical semiconductor chip 3, so that a capping operation excellent in position accuracy can be easily executed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capping device, and more particularly to a mechanism of a capping device which is one of manufacturing devices for optical semiconductor elements and the like.

[0002]

2. Description of the Related Art FIG. 2 is a view showing the structure of a conventional capping device. In the figure, 1 is a cap which is a welding part in this capping, 2 is a window glass, 8 is a stem which is a part to be welded, 3 Is an optical semiconductor chip assembled on the stem 8, 4 is an upper electrode for holding the cap 1,
Reference numeral 5 is a lower electrode that holds the stem 8, 6 is a guide for fixing the position of the stem 8 with respect to the lower electrode 5, and 7 is a welded portion.

Next, the operation will be described. First, the stem 8 is set on the lower electrode 5, and the cap 1 is set on the upper electrode 4, and the stem 8 and the cap 1 are brought into contact with each other via the welded portion 7.
Thereafter, pressure is applied between the upper electrode 4 and the lower electrode 5 by using compressed air or the like, and a large current is applied by capacitor discharge or the like.

By applying pressure and current to the welded portion 7 according to the above procedure, the welded portion 7 is welded and the optical semiconductor chip 3
Capping.

What is important when capping the optical semiconductor chip as described above is the positional accuracy of the optical semiconductor chip 3 and the cap 1, that is, the cap 1 is the optical semiconductor chip 3
In contrast, whether or not it is in the desired position. Here, since the optical semiconductor chip 3 has already been assembled at a predetermined position on the stem 8 before capping, the position accuracy of the cap 1 is high when the capping is performed. Determined by the dimensional accuracy of the guide 6 and the relative positional accuracy of the upper electrode 4 and the lower electrode 5, that is,
The accuracy is controlled based on the stem 8.

[0006]

Since the conventional capping device is constructed as described above, the relative positional accuracy of the cap 1 and the optical semiconductor chip 3 is controlled with the stem 8 as a reference. Due to the variation in the positional accuracy between the optical semiconductor chip 3 and the stem 8 caused when the optical semiconductor chip 3 is assembled, the stem 8
Even if the position accuracy of the cap 1 is controlled on the basis of, the position accuracy of the essential optical semiconductor chip 3 and the cap 1 is low, and there is variation in position, and the position accuracy can be directly controlled. However, there is a problem in that the position accuracy cannot be controlled with reference to a part of the processed part such as the stem 8 or the like.

The present invention has been made in order to solve the above problems, and it includes a cap 1 and an optical semiconductor chip 3.
It is an object of the present invention to obtain a capping device capable of controlling and improving the relative position accuracy of.

[0008]

A capping device according to the present invention includes a stem on which an optical semiconductor element is mounted, a lower electrode for holding the stem, an upper electrode for holding a cap, an optical semiconductor element and a cap. It further comprises a display device for displaying an image of a camera for further photographing, and an adjusting means for receiving the image information of the display device and adjusting the relative position between the optical semiconductor element and the cap.

[0009]

The capping device according to the present invention automatically adjusts the position by utilizing the image information of the processed parts.
Position accuracy can be improved and controlled.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a configuration of a capping device according to an embodiment of the present invention. In FIG. 1, 9 is a camera provided on the concentric axis of a stem 8 and a cap 1, 10 is a CRT display, 11 is an image processing device, Reference numeral 12 is an adjusting device for driving and adjusting the position of the upper electrode 4 in accordance with a command determined by the image processing device 11.

Next, the operation will be described. When capping the optical semiconductor element 3, first, the camera 9 captures an image of the optical semiconductor chip 3 and the cap 1 which have passed through the window glass 2, so that the image is displayed on the CRT display 1.
It is projected to 0. Next, the image displayed on the CRT display 10 is subjected to signal processing by the image processing device 11, and information about how far the optical semiconductor chip 3 is located with respect to the outer periphery of the cap 1 is output.

The adjusting device 12 receives this information and drives the upper electrode 4 to bring the cap 1 to a desired position. In this way, after adjusting the cap 1 to the optimum position for capping the optical semiconductor chip 3, the welded portion 7 is welded and the optical semiconductor chip 3 is capped in that position in the same manner as in the conventional example. ..

As described above, in the capping device of the above embodiment, the images of the cap 1 and the optical semiconductor chip 3 are image-processed and the relative positions of the two are obtained as information. The position can be automatically adjusted, and capping with high position accuracy can be easily performed.

In the above embodiment, the position of the cap 1 is adjusted by the image information of the cap 1 and the optical semiconductor chip 3. However, if the optical semiconductor element is a light emitting element, the chip should emit light. Thus, it is also possible to perform image processing using the image information of the cap and light and adjust the position of the light emitting point with the cap as a reference.

[0015]

As described above, according to the capping device of the present invention, the image information of the part to be machined is utilized,
Since the position adjustment of each component is automatically performed, there is an effect that a capping device capable of easily performing capping with high positional accuracy can be obtained.

[Brief description of drawings]

FIG. 1 is a diagram showing a structure of a capping device according to an embodiment of the present invention.

FIG. 2 is a diagram showing a structure of a conventional capping device.

[Explanation of symbols]

 1 Cap 2 Window Glass 3 Chip 4 Upper Electrode 5 Lower Electrode 6 Guide 7 Welding Part 8 Stem 9 Camera 10 CRT Display 11 Image Processing Device 12 Adjustment Device

Claims (1)

[Claims] 1. A capping device for capping an optical semiconductor element with a cap, a stem on which the optical semiconductor element is mounted, a lower electrode holding the stem, an upper electrode holding the cap, and the optical semiconductor element. A display device that displays an image of a camera that captures the cap from above; and an adjusting unit that receives image information of the display device and adjusts a relative position between the optical semiconductor element and the cap. Capping device.