JPH0567071B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for creating a thin film resistor pattern.
In particular, it relates to a method for creating thin film resistor patterns using a CAD system.

[Conventional technology]

Conventionally, this type of thin film resistor pattern creation method automatically creates a pattern shape such as a rectangle, L shape, or hat shape based on input parameters. For patterns with complex shapes, the designer specified all the coordinates of each bending point of the pattern.

FIG. 3 is a work flow diagram of a conventional thin film pattern forming method. First, in step 21, perform a rough preliminary calculation of resistance to get a rough idea of the shape, size, etc., and then, in step 22, create a pattern layout that involves specifying the coordinates of all bending points of the pattern. Let's do it. Next, the resistance value is calculated for the pattern drawn in step 23, and compared with the target value in step 24. If it matches the target value, it ends; if it differs from the target value,
The operation of making the correction in step 25 can be repeated. In other words, although CAD is basically used,
The pattern is not automatically created, and the resistance value of the created pattern is unknown until a separate calculation is performed.

[Problem that the invention seeks to solve]

However, in the conventional pattern forming method described above, the step 22 in which the resistor pattern shape is created is
At this stage, it is necessary to separately calculate the range of resistance values that this resistance pattern can have, and the process of pattern modification and resistance calculation must be repeated until the target value range is achieved. However, this method requires a large number of man-hours and is prone to errors.

The purpose of the present invention is to eliminate such drawbacks and to simplify the detailed and complicated design work of thin film resistor patterns.
It is an object of the present invention to provide a thin film resistor pattern creation method that dramatically improves workability by replacing the simple work of repeatedly specifying two diagonal points.

[Means for solving problems]

The method for creating a thin film resistance pattern shape of the present invention is as follows:
Using the coordinate input device of the CAD system, set a virtual rectangular area given by specifying two diagonal points on a predetermined plane of the display, and create waveforms, zigzags, etc. that fill this virtual rectangular area. A resistance pattern shape such as a shape, a ladder shape, or a rectangle is generated, and the resistance pattern on the lowest side that is closest to a predetermined value is specified among the resistance values of these resistance patterns, and the residual resistance value is determined at the two diagonal points. Indicate a similar resistance pattern at the next two diagonal points,
It is characterized in that the entire resistance shape is created by sequentially repeating the process until the resistance value of the sum of these resistance patterns reaches a desired resistance value.

〔Example〕

Next, the present invention will be explained in detail with reference to the drawings.

FIG. 1 is a flowchart for explaining one embodiment of the present invention, and FIG. 2 is a plan view of an example of the thin film resistor pattern 6 of this embodiment. The pattern of this example is the second
As shown in the figure, a desired resistance value can be obtained by specifying the type of each pattern A to D and its diagonal coordinates ce1 to ce5. Pattern A ₁ ,
A ₂ is a horizontal zigzag pattern that sets the resistance value in steps, patterns B ₁ to _{B 3} are vertical zigzag patterns made of similar steps, and pattern C ₁
~ _C3 represents a ladder pattern, patterns _D1 ~ _D4 represent solid (plane) patterns, and patterns _A1 , _B1 ,
The objective is to obtain a desired resistance value between C ₁ and D ₁ . Ladder pattern C, solid pattern D
This is where laser trimming can be used to cut steps or flat areas of the ladder to fine tune the resistance value. Also, pattern A ₂ ,
B ₂ , B ₃ , C ₂ , C ₃ , D ₂ to _{D 4} are resistance patterns shown as dummy patterns, but they may be other than resistance patterns.

In the flowchart shown in Figure 1, step 11 is the first step.
Then, input the required pattern such as resistance value, sheet resistance value range, accuracy, wattage, pattern width, etc., and in the next step 12, input the coordinates ce1, ce2, for example, from a coordinate input device such as a tablet (Fig. 2). Specify two diagonal points as shown below. Step 13
Then, a resistance pattern shape is automatically created to fill the virtual rectangular area determined thereby, and in step 14, the shape ratio (NS) for the residual resistance value is calculated.
Then, in step 15, it is determined whether the target value has been reached. If the target value has been reached, the process ends, and if the target value has not been reached, the process returns to step 1.
Returning to step 2, the two diagonal points including the end point of the resistance pattern created up to that point are designated again.

As described above, in this embodiment, a resistance pattern is created by repeating the operation of specifying two diagonal points.At this time, the pattern is automatically created by creating a waveform or zigzag shape for the pattern part. ,
Alternatively, it is possible to select a ladder shape, and furthermore, this entire work can be done through interaction with the system.

〔Effect of the invention〕

As explained above, in the present invention, a pattern is created by simply repeating the operation of specifying two diagonal points, so it is rich in layout properties, and the gaps can be filled in according to the situation of the surrounding patterns. It is easy to create a resistance pattern along the lines. Furthermore, since the target shape ratio (NS) value is displayed sequentially during the layout, the designer is freed from all calculations related to the resistance pattern.

Furthermore, since all the detailed parts of the pattern are automatically created by the program, it is much easier to use than conventional methods.
It is possible to process at least 10 times faster.

[Brief explanation of the drawing]

FIG. 1 is a flowchart explaining an embodiment of the present invention, FIG. 2 is a plan view of an example of a pattern created according to FIG. 1, and FIG. 3 is a flowchart showing an example of a conventional work process. . ce1~5...Coordinates, _A1 , ₂ ...Horizontal zigzag pattern, _B1 ~ ₃ ...Vertical zigzag pattern, _C1 ~ ₃ ...
Ladder pattern, D ₁ to ₄ ... Solid pattern, 6
...Thin film resistance pattern, 11-15, 21-24
...Step.

Claims (1)

[Claims] 1 Using the coordinate input device of the CAD system, set a virtual rectangular area given by specifying two diagonal points on a predetermined plane of the display,
A waveform, zigzag, ladder, rectangle, or other resistance pattern shape is generated to fill this virtual rectangular area, and the resistance pattern with the lowest resistance value closest to a predetermined value among these resistance patterns is specified. , Furthermore, for the residual resistance value, a similar resistance pattern is specified at two diagonal points following the two diagonal points, and this is repeated sequentially until the resistance value of the sum of these resistance patterns reaches the desired resistance value. A method for creating a thin film resistor pattern shape, characterized by creating the entire shape.