JPH056682Y2 - - Google Patents
Info
- Publication number
- JPH056682Y2 JPH056682Y2 JP3347588U JP3347588U JPH056682Y2 JP H056682 Y2 JPH056682 Y2 JP H056682Y2 JP 3347588 U JP3347588 U JP 3347588U JP 3347588 U JP3347588 U JP 3347588U JP H056682 Y2 JPH056682 Y2 JP H056682Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- plate
- shaped circuit
- circuit body
- expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 12
- 239000004810 polytetrafluoroethylene Substances 0.000 description 12
- 230000008602 contraction Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、線膨張の小さい板状回路体に関す
る。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a plate-shaped circuit body with small linear expansion.
本願出願人は、回路素子の性能を十分に生かす
周辺部品の開発に鋭意取り組んで、既に実願昭62
−172878で、V.S.W.R.が１に近くパルスの乱れ
が少ない板状回路体用コネクタを提唱している。
前記出願において出願人は、延伸多孔質四弗化エ
チレン樹脂（以下Ｅ−PTFEと称す）シートより
成る配線板にエポキシ板を密着一体化して構成さ
れる板状回路体を開示しているが、この場合、板
状回路体としての線膨張はエポキシ板に支配され
るため、配線密度が高くなるに従つて加工精度等
に支障をきたすようになつてきていた。
The applicant has been working diligently to develop peripheral components that fully utilize the performance of circuit elements, and has already completed the application process in 1982.
-172878, proposes a connector for plate-shaped circuit bodies with a VSWR close to 1 and less pulse disturbance.
In the above-mentioned application, the applicant discloses a plate-shaped circuit body constructed by closely integrating an epoxy board with a wiring board made of an expanded porous polytetrafluoroethylene resin (hereinafter referred to as E-PTFE) sheet. In this case, the linear expansion of the plate-shaped circuit body is controlled by the epoxy plate, and as the wiring density increases, processing accuracy and the like are increasingly affected.
本考案はこの問題点を解決するためになされた
もので、線膨張が小さく高密度配線が可能である
板状回路体を提供しようとするものである。
The present invention was devised to solve this problem, and aims to provide a plate-shaped circuit body that has small linear expansion and allows high-density wiring.
本考案は上記課題を達成するためになされたも
ので、Ｅ−PTFEシートの少なくとも一方の面に
配線を施してなる配線板にセラミツク板を密着一
体化して成る板状回路体を構成する。
The present invention has been devised to achieve the above-mentioned object, and constitutes a plate-shaped circuit body made by closely integrating a ceramic board with a wiring board formed by wiring on at least one side of an E-PTFE sheet.
本考案によれば、上記のごとくＥ−PTFEシー
トの少なくとも一方の面に配線を施してなる配線
板はセラミツク板を密着一体化して板状回路体を
構成しているので、柔軟な構造を有するＥ−
PTFEシートより成る配線板は、線膨張率のち小
さいセラミツク板の膨張／収縮に呼応して極めて
小さい膨張／収縮となつて、重ね合わせ接合して
も配線接合ずれを生じず、高密度配線が可能とな
る。
According to the present invention, the wiring board formed by wiring on at least one side of the E-PTFE sheet as described above has a flexible structure because the ceramic board is closely integrated to form a plate-shaped circuit body. E-
Wiring boards made of PTFE sheets have extremely small expansion/contraction in response to the expansion/contraction of the ceramic board, which has a small coefficient of linear expansion, so even when stacked and bonded, wiring connections do not shift and high-density wiring is possible. becomes.
第１図と第２図は、それぞれ本考案による板状
回路体の断面図である。
1 and 2 are sectional views of a plate-shaped circuit body according to the present invention, respectively.
第１図に基づいて本考案を説明すると、Ｅ−
PTFEシート２の両方の面に銅箔を帖着し、一方
の面をエツチングして形成した配線３および銅箔
６より成る配線板５にセラミツク板４を密着一体
化して板状回路体１を構成しているので、柔軟な
構造を有するＥ−PTFEシート２より成る配線板
５は線膨張率の小さいセラミツク板４の膨張／収
縮に拘束されて極めて小さい膨張／収縮となつ
て、高密度配線が可能となる。 To explain the present invention based on Fig. 1, E-
A ceramic plate 4 is closely integrated with a wiring board 5 consisting of a wiring 3 and a copper foil 6, which are formed by applying copper foil to both sides of a PTFE sheet 2 and etching one side to form a plate-shaped circuit body 1. Therefore, the wiring board 5 made of the E-PTFE sheet 2 having a flexible structure is restrained by the expansion/contraction of the ceramic board 4 with a small coefficient of linear expansion, resulting in extremely small expansion/contraction, resulting in high-density wiring. becomes possible.
第２図は本考案による板状回路体の異なる実施
例で、Ｅ−PTFEシート８の両方の面に銅箔を帖
着し、エツチングにより形成した配線９と接地線
１０より成る配線板１２にセラミツク板１１およ
び銅箔１３を密着一体化して板状回路体７を構成
しているので、柔軟な構造を有するＥ−PTFEシ
ート８より成る配線板１２は線膨張率の小さいセ
ラミツク板１１の膨張／収縮に拘束されて極めて
小さい膨張／収縮となつて、高密度配線が可能と
なる。また、この実施例においては、配線９と接
地線１０の幅および間隔を制御して特性インピー
ダンスを特定することが出来る他、このような構
造を採ることにより配線９間の漏話（クロストー
ク）も防ぐことが出来る。また、銅箔１３は外部
からの電磁波障害を防ぐ役割をもつている。 Fig. 2 shows a different embodiment of the plate-shaped circuit body according to the present invention, in which copper foil is pasted on both sides of an E-PTFE sheet 8, and a wiring board 12 consisting of wiring 9 and grounding wire 10 formed by etching is shown. Since the plate-shaped circuit body 7 is constructed by closely integrating the ceramic board 11 and the copper foil 13, the wiring board 12 made of the E-PTFE sheet 8 having a flexible structure can absorb the expansion of the ceramic board 11, which has a small coefficient of linear expansion. /Constricted by contraction, the expansion/contraction is extremely small, making high-density wiring possible. Furthermore, in this embodiment, in addition to being able to specify the characteristic impedance by controlling the width and spacing between the wiring 9 and the grounding wire 10, crosstalk between the wiring 9 can also be prevented by adopting such a structure. It can be prevented. Further, the copper foil 13 has the role of preventing electromagnetic wave interference from the outside.
以上説明したように本考案によれば、Ｅ−
PTFEシートの少なくとも一方の面に配線を施し
てなる配線板はセラミツク板を密着一体化して板
状回路体を構成しているので、柔軟な構造を有す
るＥ−PTFEシートより成る配線板は、線膨張率
の小さいセラミツク板の膨張／収縮に拘束されて
極めて小さい膨張／収縮となつて、高密度配線が
可能となる。
As explained above, according to the present invention, E-
A wiring board made of a PTFE sheet with wiring on at least one side has a ceramic board closely integrated with it to form a plate-like circuit body, so a wiring board made of an E-PTFE sheet with a flexible structure has The expansion/contraction of the ceramic plate, which has a small coefficient of expansion, is constrained to extremely small expansion/contraction, making high-density wiring possible.
なお本考案は上記実施例に限定されるものでは
なく、本考案の技術思想内での種々の変更はもち
ろん可能である。 Note that the present invention is not limited to the above-mentioned embodiments, and various modifications can be made within the technical idea of the present invention.
第１図と第２図は、それぞれ本考案による異な
る実施例を示す板状回路体の断面図である。
２，８……Ｅ−PTFEシート、３，９……配
線、４，１１……セラミツク板、６，１３……銅
箔、１０……接地線。
1 and 2 are cross-sectional views of plate-shaped circuit bodies showing different embodiments of the present invention, respectively. 2, 8... E-PTFE sheet, 3, 9... Wiring, 4, 11... Ceramic board, 6, 13... Copper foil, 10... Grounding wire.
Claims (1)
とも一方の面に配線を施してなる配線板にセラミ
ツク板を密着一体化して成る板状回路体。 A plate-shaped circuit body comprising a ceramic board closely integrated with a wiring board formed by wiring on at least one side of a stretched porous ethylene tetrafluoride resin sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3347588U JPH056682Y2 (en) | 1988-03-14 | 1988-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3347588U JPH056682Y2 (en) | 1988-03-14 | 1988-03-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01137564U JPH01137564U (en) | 1989-09-20 |
| JPH056682Y2 true JPH056682Y2 (en) | 1993-02-19 |
Family
ID=31260156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3347588U Expired - Lifetime JPH056682Y2 (en) | 1988-03-14 | 1988-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056682Y2 (en) |
-
1988
- 1988-03-14 JP JP3347588U patent/JPH056682Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01137564U (en) | 1989-09-20 |
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