JPH0563118B2 - - Google Patents
Info
- Publication number
- JPH0563118B2 JPH0563118B2 JP23381787A JP23381787A JPH0563118B2 JP H0563118 B2 JPH0563118 B2 JP H0563118B2 JP 23381787 A JP23381787 A JP 23381787A JP 23381787 A JP23381787 A JP 23381787A JP H0563118 B2 JPH0563118 B2 JP H0563118B2
- Authority
- JP
- Japan
- Prior art keywords
- cold plate
- cam member
- semiconductor elements
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 13
- 239000003507 refrigerant Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000002826 coolant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23381787A JPS6477199A (en) | 1987-09-18 | 1987-09-18 | Semiconductor electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23381787A JPS6477199A (en) | 1987-09-18 | 1987-09-18 | Semiconductor electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6477199A JPS6477199A (en) | 1989-03-23 |
| JPH0563118B2 true JPH0563118B2 (US20080293856A1-20081127-C00150.png) | 1993-09-09 |
Family
ID=16961037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23381787A Granted JPS6477199A (en) | 1987-09-18 | 1987-09-18 | Semiconductor electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6477199A (US20080293856A1-20081127-C00150.png) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8027162B2 (en) * | 2009-09-24 | 2011-09-27 | International Business Machines Corporation | Liquid-cooled electronics apparatus and methods of fabrication |
| US9307674B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
| US8493738B2 (en) | 2011-05-06 | 2013-07-23 | International Business Machines Corporation | Cooled electronic system with thermal spreaders coupling electronics cards to cold rails |
| US8687364B2 (en) | 2011-10-28 | 2014-04-01 | International Business Machines Corporation | Directly connected heat exchanger tube section and coolant-cooled structure |
| US9879926B2 (en) | 2012-06-20 | 2018-01-30 | International Business Machines Corporation | Controlled cooling of an electronic system for reduced energy consumption |
-
1987
- 1987-09-18 JP JP23381787A patent/JPS6477199A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6477199A (en) | 1989-03-23 |
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