JPH0562570U - Vertical electrolytic plating equipment - Google Patents

Abstract

(57) [Summary] (Corrected) [Constitution] Applying an electrical insulator on the upper part of the electrode plate 6 suspended from the plating solution surface, facing the steel strip running in the vertical electroplating tank. The plating liquid flow cutout groove 9 is provided. [Effect] It is possible to stably supply the plating solution from the notch groove to the area between the anode and the strip, and to avoid the phenomenon that the strip is biased toward the anode during high-speed striping. It is improved up to 2 times. In terms of quality as well, by applying an insulator to the area with a large current density deviation that exists near the notch groove in the upper part of the anode, it is possible to suppress variations in the coating weight in the strip width direction and to secure a quality equal to or better than the conventional method. did it. What kind of anode shape can be obtained by applying this insulator in a region from a position above the plating liquid surface level to a position where the distance is about 1.5 times the width of the opening downward from the lower end of the opening? In addition, it is possible to perform electroplating in which the amount of variation in unit weight is suppressed with respect to the current value level.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electrolytic plating apparatus for running metal strips, for example steel strips.

[0002]

[Prior Art]

 Electrolytic tin plating and galvanizing of running metal strips are conducted by a conductor roll and a strip cathode that passes through an aqueous solution containing metal ions in a plating tank and an electrode plate suspended in the aqueous solution. In the meantime, many kinds of electroplating apparatuses have been used in which a voltage is applied to electrolytically deposit metal plating such as tin and zinc on the surface of the strip.

Electrolytic plating apparatuses are roughly classified into horizontal electrolytic plating apparatuses and vertical electrolytic plating apparatuses, as shown in FIGS. 1 and 2 of Japanese Patent Publication No. 61-21320. Vertical electroplating equipment is generally used because of its advantages such as shorter equipment length than horizontal electroplating equipment and good degassing of the plating solution between the strip and the electrode plate. It operates by the proximity electrolysis method that narrows the gap between the required power saving.

However, the electrode plate of such a vertical electrolytic plating apparatus has an engaging shape as shown in FIG. 3 of Japanese Utility Model Publication No. 60-23231 and FIG. 1 of Japanese Utility Model Publication No. 61-364. Since the shaped electrode plate is suspended in an electric conductor installed above the plating solution tank and is provided in the plating solution, the plating that flows in the plating solution tank is used in the high-speed plating method of 300 m / min or more. The flow of the solution is blocked by the electrode plate, and the pressure of the plating solution applied to the inner and outer surfaces of the running strip becomes non-uniform, causing the uneven strip to come into contact with the electrode plate, causing linear spark flaws on the strip. there were.

As a technique for solving such a problem, Japanese Unexamined Patent Publication No. 61-190093 discloses, “Equal pressure is applied from a pair of static pressure pads provided at the upper and lower central portions of an electrode plate, and further, an electric field is applied between the electrode plates. An electrolytic plating device that provides a pair of edge masks made of insulating material that can be moved in and out freely to allow the strip to run stably. "A pair of supports provided in the upper and lower central portions of the electrode plate, published in Japanese Utility Model No. 61-106969. Further, there is an "electrolytic plating apparatus provided with a roll", and further, in Japanese Patent Laid-Open No. 1-219191, there is "an electrolytic plating apparatus which adjusts a gap between electrodes by following a changing strip shape".

[0006]

[Problems to be solved by the device]

 However, these techniques do not eliminate the offset phenomenon because it is difficult to quickly and evenly control the static pressure on both sides through the strip. Furthermore, there was a problem that it would not be put to practical use due to the occurrence of flaws due to strips of support rolls and the difficulty in maintenance and operation.

[0007]

[Means for Solving the Problems]

 The purpose of the present invention is to provide an electroplating apparatus that solves these problems. The gist of the present invention is to be suspended from the plating surface facing the strip running in the vertical electroplating tank. In the vertical electrolytic plating apparatus, a notch groove directed to the inner bottom of the plating tank is provided with a notch groove for flowing a plating solution in which an electrical insulator is applied, on the upper part of the electrode plate.

[0008]

[Action]

 Hereinafter, the present invention will be described with reference to the drawings. The figure shows an embodiment of the present invention. In FIG. 1, 1 is a plating tank. The plating tank 1 is one in which a running metal strip 2 is passed through a plating solution 3 and a plating metal such as tin or zinc is electrodeposited on the metal strip 2, and an energizing roll 4 is provided above the plating tank 1. A sink roll 5 is provided below the plating tank 1. That is, the running metal strip 2 is provided so as to pass around the sink roll 5 of the plating tank 1 while being energized.

Reference numeral 6 denotes an electrode plate, which is suspended from above the plating liquid surface so as to face one side or both sides of the metal strip 2 running in the plating tank 1. Further, as shown in FIG. 2, the electrical insulator 8 is applied (painted) on the upper portion (near the plating solution surface) of the electrode plate 6 to the one or multiple cutout grooves 7 directed to the bottom of the plating tank 1. The plating solution flow cutout groove 9 is provided.

The shaded area in the figure shows the application area of the electrical insulator 8, and the area is not particularly limited, but the area from the plating solution surface level of the electrode plate to the bottom surface of the notch or the notch as shown in FIG. It is advisable to apply in a region up to 1.5a times the groove width a. The plating solution flow cutout groove 9 has an effect of promoting the reflux of the plating solution surface near the electrode plate 6 to prevent the metal strip 2 from being offset, and to reduce the variation in the coating weight of the metal strip 2 in the width direction. Further, the effect is stabilized when an edge mask is provided near the electrode plate 6 and used as in the conventional case.

The vertical electrolytic plating apparatus of the present invention as described above is used in accordance with a normal plating method. However, compared with the conventional electrolytic plating apparatus, there is no deviation of the metal strip and variation in the coating weight of the metal strip. It has the feature of being significantly reduced.

[0012]

【Example】

The line speed varies from 0 to 600 m / min in the conventional vertical plating tank in which the conductor roll and sink roll span is 3 m, the anode-strip distance is 30 mm, and the upper part of the anode is 50 mm above the plating surface. Then, a strip running test was conducted. The results are shown in Table 1. At this time, the line speed at which the strip came into contact with the anode was 300 m / min, while seven notch grooves with a width of 100 mm and a height of 165 mm were set at 63 mm intervals, and the insulator was further extended to a position 210 mm above the anode. In the plating tank of the present invention using the coated anode, the offset phenomenon did not occur even at a line speed of 600 m / min. Further, the variation in the coating weight in the width direction at this time was 2.8 ± 0.2 g / m ² with the thin coating material, which was equal to or higher than that of the conventional anode shape.

[0013]

[Table 1]

[0014]

[Effect of the device]

 As is clear from the table, the present invention can suppress the occurrence of the strip deviation phenomenon, and can double the line speed more than the conventional one and the quality of the coating weight distribution in the width direction is equal to or better than the conventional one. The product can be obtained, and the productivity is approximately doubled than the conventional one.

[Brief description of drawings]

FIG. 1 is a sectional view of a vertical electrolytic plating apparatus of the present invention,

FIG. 2 is an electrode plate in the width direction of a metal strip to be plated of the present invention,

FIG. 3 shows a coating area of an electric insulator in a notched portion of an electrode plate.

[Explanation of symbols]

 1 Plating Tank 2 Metal Strip 3 Plating Solution 4 Current Roll 5 Sink Roll 6 Electrode Plate 7 Notch Groove 8 Electrical Insulator 9 Plating Solution Flow Notch Groove

Claims (1)

[Scope of utility model registration request] 1. An electrical insulator is provided in a notch groove directed to the bottom of the plating tank at the upper part of an electrode plate which is suspended from above the plating liquid surface facing a steel strip running in a vertical electrolytic plating tank. A vertical electrolytic plating apparatus, which is provided with a coating liquid flow cut groove.