JPH0562079U - Panel mounting structure - Google Patents

Panel mounting structure

Info

Publication number
JPH0562079U
JPH0562079U JP252692U JP252692U JPH0562079U JP H0562079 U JPH0562079 U JP H0562079U JP 252692 U JP252692 U JP 252692U JP 252692 U JP252692 U JP 252692U JP H0562079 U JPH0562079 U JP H0562079U
Authority
JP
Japan
Prior art keywords
panel
electronic component
substrate
hole
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP252692U
Other languages
Japanese (ja)
Other versions
JP2586237Y2 (en
Inventor
敬三 猪崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1992002526U priority Critical patent/JP2586237Y2/en
Publication of JPH0562079U publication Critical patent/JPH0562079U/en
Application granted granted Critical
Publication of JP2586237Y2 publication Critical patent/JP2586237Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

(57)【要約】 【目的】 基板の端部に設けられた電子部品とこの電子
部品が挿入されるパネルの穴部との間に生じる隙間を一
定に保つことができるパネルの取付構造の提供。 【構成】 パネル14の穴部14aに基板5の電子部品
7を挿入すると、パネル14に立設された突起17の押
圧力により基板5はパネル14に立設された突起16に
押し付けられ、また、穴部14aからの電子部品7の抜
けは突起17の先端に設けられた爪部17aが電子部品7
に係合することにより阻止される。
(57) [Abstract] [Purpose] To provide a panel mounting structure capable of keeping a constant gap between an electronic component provided at an end of a substrate and a hole of a panel into which the electronic component is inserted. .. [Structure] When the electronic component 7 of the substrate 5 is inserted into the hole 14a of the panel 14, the substrate 5 is pressed against the protrusion 16 provided on the panel 14 by the pressing force of the protrusion 17 provided on the panel 14, and When the electronic component 7 is pulled out from the hole 14a, the claw portion 17a provided at the tip of the protrusion 17 is attached to the electronic component 7.
Is blocked by engaging with.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、基板の端面に取り付けられるパネルの取付構造に関する。 The present invention relates to a panel mounting structure mounted on an end surface of a substrate.

【0002】[0002]

【従来の技術】[Prior Art]

図7乃至図9に従来の電子機器を示す。 7 to 9 show conventional electronic devices.

【0003】 この電子機器の筐体は、上ケース1、下ケース2、前面パネル3及び背面パネ ル4にて構成されており、前面パネル3にはプリント配線板(基板)5の一端側 が固定され、背面パネル4には基板5の他端側に設けられたコネクタ等の電子部 品7が挿入される穴部4aが形成されている。また、図9に示す如く、上ケース 1の内壁には、背面パネル4の上端が挿入される溝9及び基板5を押さえるボス 10が設けられ、下ケース2の内壁には、背面パネル4の下端が挿入される溝12 及び基板5を押さえるボス13が設けられている。The housing of this electronic device is composed of an upper case 1, a lower case 2, a front panel 3 and a rear panel 4, and the front panel 3 has one end side of a printed wiring board (board) 5. The rear panel 4 is fixed and has a hole 4a formed in the other end of the substrate 5 into which an electronic component 7 such as a connector is inserted. Further, as shown in FIG. 9, the inner wall of the upper case 1 is provided with a groove 9 into which the upper end of the rear panel 4 is inserted and a boss 10 for pressing the substrate 5, and the inner wall of the lower case 2 is provided with the rear panel 4. A groove 12 into which the lower end is inserted and a boss 13 for pressing the substrate 5 are provided.

【0004】 また、電子機器の組立は、図8に示す如く、電子部品7を穴部4aに挿入して 基板5の端面5aに背面パネル4を当接させ、この状態を保持しながら下ケース 2に基板5を載置するとともに背面パネル4の下端を溝12に挿入し、さらに上 ケース1で基板5を覆うとともに背面パネル4の上端を溝9に挿入し、上下ケー ス1,2のボス10,13を螺着することによりなされる。Further, as shown in FIG. 8, when assembling an electronic device, the electronic component 7 is inserted into the hole 4a to bring the rear panel 4 into contact with the end surface 5a of the substrate 5, and the lower case is held while maintaining this state. 2, the lower end of the rear panel 4 is inserted into the groove 12, the upper case 1 covers the substrate 5, and the upper end of the rear panel 4 is inserted into the groove 9. This is done by screwing the bosses 10 and 13.

【0005】 しかしながら、この従来の電子機器によると、背面パネル4は上,下のケース 1,2の溝9,12に両端が挿入されることにより保持されているだけなので、 組立誤差、部品誤差のため背面パネル4は上下方向(図9に示す矢印方向)及び 左右方向(紙面に直交する方向)にがたつきが生じていた。そのため、穴部4a と電子部品7との間に生じる隙間が電子部品7の上下及び左右方向共に一定に保 たれないので外観が良好でないという不具合があった。However, according to this conventional electronic device, the rear panel 4 is held only by inserting the both ends into the grooves 9 and 12 of the upper and lower cases 1 and 2, so that an assembly error and a component error may occur. Therefore, the back panel 4 was wobbled in the up-down direction (the direction of the arrow shown in FIG. 9) and in the left-right direction (the direction orthogonal to the paper surface). As a result, the gap between the hole 4a and the electronic component 7 cannot be kept constant in the vertical and horizontal directions of the electronic component 7, resulting in a poor appearance.

【0006】 また、基板5及び背面パネル4を上,下のケース1,2に取り付けるときに、 電子部品7が穴部4aに挿入された状態を維持しながらパネル4の両端を上,下 のケース1,2の溝9,12に挿入する必要があるので、基板5及びパネル4の 取付作業は煩雑なものとなっていた。Further, when the substrate 5 and the rear panel 4 are attached to the upper and lower cases 1 and 2, both ends of the panel 4 are moved up and down while maintaining a state in which the electronic component 7 is inserted into the hole 4a. Since it is necessary to insert the grooves into the grooves 9 and 12 of the cases 1 and 2, the mounting work of the substrate 5 and the panel 4 is complicated.

【0007】[0007]

【考案が解決しようとする課題】[Problems to be solved by the device]

上述の如く、従来のパネルの取付構造では、パネルの穴部とこの穴部に挿入さ れた電子部品の位置関係がパネルのがたつきにより変化するので、パネルの穴部 と電子部品との間に生じる隙間を一定に保てないという問題があった。 As described above, in the conventional panel mounting structure, the positional relationship between the panel hole and the electronic components inserted in the hole changes due to the rattling of the panel. There was a problem that the gap between them could not be kept constant.

【0008】 本考案はこのような従来の欠点を解決するべくなされたものであり、パネルの 穴部とこの穴部に挿入される電子部品との間に生じる隙間を一定に保つことがで きるパネルの取付構造を提供することを目的とする。The present invention has been made in order to solve such a conventional drawback, and it is possible to keep a constant gap between a hole of a panel and an electronic component inserted in the hole. It is intended to provide a panel mounting structure.

【0009】[0009]

【課題を解決するための手段】[Means for Solving the Problems]

本考案のパネルの取付構造は、電子部品が端面から突出させられた状態で一方 の面に設けられた基板と、前記電子部品が挿入される穴部を有するパネルとを具 備し、このパネルには、前記基板の他方の面と対向させられて位置付けられる第 1の突起と、弾性を有し前記電子部品を押圧して前記基板を前記第1の突起に向 けて押圧する第2の突起とが設けられ、この第2の突起の先端側には、前記電子 部品と係合し前記電子部品が前記穴部から抜け出ることを阻止する爪部が設けら れた構成となっている。 The panel mounting structure of the present invention comprises a substrate provided on one surface with electronic components protruding from the end face, and a panel having a hole into which the electronic components are inserted. Includes a first protrusion that is positioned so as to face the other surface of the substrate, and a second protrusion that has elasticity and presses the electronic component to press the substrate toward the first protrusion. A protrusion is provided, and a claw portion that engages with the electronic component and prevents the electronic component from coming out of the hole is provided on the tip end side of the second protrusion.

【0010】[0010]

【作用】[Action]

本考案では、パネルの穴部に電子部品を挿入すると、電子部品を押圧する第2 の突起の作用により基板は第1の突起に押し付けられるので、電子部品は穴部内 の所定位置に位置付けられ、また、第2の突起の爪部により穴部からの電子部品 の抜けは阻止されるので、電子部品が穴部の所定位置に位置付けられた状態で、 パネルは基板に取り付けられる。 In the present invention, when the electronic component is inserted into the hole of the panel, the substrate is pressed against the first protrusion by the action of the second protrusion that presses the electronic component, so that the electronic component is positioned at a predetermined position in the hole. Further, since the claw portion of the second protrusion prevents the electronic component from coming out of the hole, the panel is attached to the substrate with the electronic component positioned at the predetermined position of the hole.

【0011】[0011]

【実施例】【Example】

以下、本考案の実施例を図1乃至図6を参照して詳述する。 Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS.

【0012】 図1乃至図3は第1の実施例を説明する図であり、図1はパネルの取付構造を 説明する断面図、図2はパネルを基板に取り付ける状態を示した斜視図、図3は パネルの穴部と電子部品の位置関係を示したパネルの背面図である。1 to 3 are views for explaining a first embodiment, FIG. 1 is a sectional view for explaining a panel mounting structure, and FIG. 2 is a perspective view showing a state in which the panel is mounted on a substrate. 3 is a rear view of the panel showing the positional relationship between the holes of the panel and the electronic components.

【0013】 本考案に係る電子機器の筐体は、背面パネル14の構造を除いて図7に示す筐 体と同様の構成とされている。すなわち、上ケース1、下ケース2、前面パネル 3及び背面パネル14にて筐体が構成されており、前面パネル3にはプリント配 線板(基板)5の一端側が固定され、上ケース1の内壁には背面パネル4の上端 が挿入される溝9及び基板5を押さえるボス10が設けられ、下ケース2の内壁 には背面パネル14の下端が挿入される溝12及び基板5を押さえるボス13が 設けられている。The housing of the electronic device according to the present invention has the same structure as the housing shown in FIG. 7 except for the structure of the rear panel 14. That is, a housing is composed of the upper case 1, the lower case 2, the front panel 3 and the rear panel 14, and one end side of the printed wiring board (board) 5 is fixed to the front panel 3, The inner wall is provided with a groove 9 into which the upper end of the rear panel 4 is inserted and a boss 10 for pressing the substrate 5, and the inner wall of the lower case 2 is provided with a groove 12 into which the lower end of the rear panel 14 is inserted and a boss 13 for pressing the substrate 5. Is provided.

【0014】 背面パネル14はプラスチックにて形成されており、図1及び図2に示すごと く、下端側には支え板(第1の突起)16が立設され、中央部位に突起(第2の 突起)17が立設され、この突起17の先端には基板5の他端側に設けられた電 子部品7と係合する爪17aが設けられている。また、パネル14は、支え板16 と突起17との間に、電子部品7が挿入される穴部14aが形成されている。The rear panel 14 is made of plastic, and as shown in FIGS. 1 and 2, a support plate (first protrusion) 16 is erected on the lower end side, and a protrusion (second protrusion) is formed at the central portion. 17) is provided upright, and a claw 17a that engages with the electronic component 7 provided on the other end side of the substrate 5 is provided at the tip of this protrusion 17. In addition, the panel 14 has a hole 14 a formed between the support plate 16 and the protrusion 17 into which the electronic component 7 is inserted.

【0015】 この電子機器の組立ては、まず、図2に示す如く、電子部品7を背面パネル14 の穴部14aに挿入して基板5の端面5aに背面パネル14を当接させる。この とき、図1に示す如く、突起17の爪部17aは電子部品7に係合する状態とな るので穴部14aからの電子部品7の抜けはこの爪部17aで阻止され、かつ基 板5及び電子部品7を支え板16及び突起17で挾持する状態となるので、背面 パネル14は、電子部品7が穴部14aに挿入された状態で基板5の端部に取り 付けられる。In assembling this electronic device, first, as shown in FIG. 2, the electronic component 7 is inserted into the hole 14a of the rear panel 14 and the rear panel 14 is brought into contact with the end surface 5a of the substrate 5. At this time, as shown in FIG. 1, the claw portion 17a of the projection 17 is in a state of engaging with the electronic component 7, so that the electronic component 7 is prevented from coming off the hole 14a by the claw portion 17a, and the base plate is prevented. 5 and the electronic component 7 are held by the support plate 16 and the protrusion 17, the rear panel 14 is attached to the end of the substrate 5 with the electronic component 7 inserted in the hole 14a.

【0016】 次に、背面パネル14が取り付けられた基板5を下ケースに載置するとともに 背面パネル14の下端を溝12に挿入し、さらに上ケース1で基板5を覆うとと もに背面パネル14の上端を溝9に挿入し、上,下のケース1,2のボス10, 13を螺着する。Next, the substrate 5 to which the rear panel 14 is attached is placed in the lower case, the lower end of the rear panel 14 is inserted into the groove 12, and the upper case 1 covers the substrate 5 and the rear panel is attached. The upper end of 14 is inserted into the groove 9, and the bosses 10 and 13 of the upper and lower cases 1 and 2 are screwed.

【0017】 これで電子機器の組立は完了する。この場合に、基板5は、電子部品7を押圧 する突起17の押圧力により支え板16に押し付けられた状態となっており、穴 部14aに対する電子部品7の上下方向の位置決めは、支え板16により行われ ている。従って、穴部14aと電子部品7との間に生ずる隙間のうち、電子部品 7の上部側に生ずる隙間S1と下部側に生ずる隙間S2とを一定(本例ではS1 =S2)に保つことができる。但し、本例では、背面パネル14の左右方向の位 置決めは上,下のケース1,2の内側の側壁により行われているため、背面パネ ル14は左右方向については若干のがたつきが生じる。従って、電子部品7の左 側に生じる隙間S3及び右側に生ずる隙間S4は背面パネル14のがたつきによ り変化する。This completes the assembly of the electronic device. In this case, the substrate 5 is in a state of being pressed against the support plate 16 by the pressing force of the projection 17 that presses the electronic component 7, and the vertical positioning of the electronic component 7 with respect to the hole 14a is performed by the support plate 16. It is done by. Therefore, of the gaps formed between the hole 14a and the electronic component 7, the gap S1 formed on the upper side of the electronic component 7 and the gap S2 formed on the lower side can be kept constant (S1 = S2 in this example). it can. However, in this example, the rear panel 14 is positioned in the left-right direction by the inner side walls of the upper and lower cases 1 and 2, so that the rear panel 14 slightly rattles in the left-right direction. Occurs. Therefore, the clearance S3 generated on the left side of the electronic component 7 and the clearance S4 generated on the right side of the electronic component 7 change due to the rattling of the rear panel 14.

【0018】 図4乃至図6は本考案の第2の実施例を説明する図であり、図4はパネルを基 板に取り付ける状態を示した斜視図、図5はパネルの取付構造を説明する断面図 、図6はパネルの穴部と電子部品の位置関係を示したパネルの背面図である。4 to 6 are views for explaining a second embodiment of the present invention. FIG. 4 is a perspective view showing a state in which a panel is attached to a base plate, and FIG. 5 is a panel attachment structure. FIG. 6 is a rear view of the panel showing the positional relationship between the holes of the panel and the electronic components.

【0019】 本例は、背面パネル19の構造を除いて第1の実施例と同様な構成となってい る。すなわち、本例の背面パネル19では、第1の実施例の背面パネル14に設 けられた支え板16のかわりに、一対のガイドレール(第1の突起)20,20 が設けられている。これら一対のガイドレール20,20には、夫々、基板5の 左右の端部を案内するための溝20aが形成されている。従って、図4に示す如 く、基板5の左右の端部をガイドレール20,20の溝20aに挿入し、矢印方 向へスライドさせることにより、電子部品7を背面パネル19の穴部19aに滑 らかに挿入できる。この場合に、基板5は、図5に示す如く、電子部品7を押圧 する突起17の押圧力によりガイドレール20の下側部20bに押し付けられて おり、基板5の左右両端はガイドレール20の側板部20cで位置決めされてい る。従って、背面パネル19は、上下方向及び左右方向のいずれの方向について も基板5に対してがたつくことはない。従って、図6に示す如く、穴部19aと 電子部品7との間に生ずる隙間は、電子部品7の上下方向に生ずる隙間S1, S2(本例ではS1=S2)とともに左右方向に生ずる隙間S3,S4(本例で はS3=S4)も一定に保つことができる。This example has the same configuration as the first example except for the structure of the back panel 19. That is, in the rear panel 19 of this example, a pair of guide rails (first protrusions) 20, 20 are provided in place of the support plate 16 provided on the rear panel 14 of the first embodiment. Grooves 20a for guiding the left and right ends of the substrate 5 are formed in the pair of guide rails 20, 20, respectively. Therefore, as shown in FIG. 4, the left and right ends of the board 5 are inserted into the grooves 20a of the guide rails 20 and 20 and slid in the direction of the arrow so that the electronic component 7 is inserted into the hole 19a of the rear panel 19. Can be inserted smoothly. In this case, as shown in FIG. 5, the board 5 is pressed against the lower side portion 20b of the guide rail 20 by the pressing force of the projection 17 that presses the electronic component 7, and the left and right ends of the board 5 are the guide rail 20. It is positioned by the side plate portion 20c. Therefore, the back panel 19 does not rattle with respect to the substrate 5 in either the vertical direction or the horizontal direction. Therefore, as shown in FIG. 6, the gap formed between the hole 19a and the electronic component 7 is the gap S3 generated in the left-right direction together with the gaps S1 and S2 generated in the vertical direction of the electronic component 7 (S1 = S2 in this example). , S4 (S3 = S4 in this example) can also be kept constant.

【0020】[0020]

【考案の効果】[Effect of the device]

以上説明したように本考案では、パネルの穴部に電子部品を挿入すると、電子 部品を押圧する第2の突起により基板は第1の突起に押し付けられ、また、穴部 からの電子部品の抜けは電子部品と係合する爪部で阻止される。従って、電子部 品と穴部との間に生ずる隙間を一定に保った状態でパネルを基板の端面に取り付 けることができる。 As described above, in the present invention, when the electronic component is inserted into the hole of the panel, the substrate is pressed against the first protrusion by the second protrusion that presses the electronic component, and the electronic component is removed from the hole. Are blocked by the claws that engage the electronic components. Therefore, the panel can be attached to the end surface of the substrate while maintaining a constant gap between the electronic component and the hole.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の第1の実施例に係るパネルの取付構造
を説明する断面図。
FIG. 1 is a sectional view illustrating a panel mounting structure according to a first embodiment of the present invention.

【図2】上記パネルを基板に取り付ける状態を示した斜
視図。
FIG. 2 is a perspective view showing a state in which the panel is attached to a substrate.

【図3】上記パネルの穴部と電子部品の位置関係を示し
たパネルの背面図。
FIG. 3 is a rear view of the panel showing the positional relationship between the holes of the panel and electronic components.

【図4】本考案の第2の実施例に係るパネルを基板に取
り付ける状態を示した斜視図。
FIG. 4 is a perspective view showing a state in which a panel according to a second embodiment of the present invention is attached to a substrate.

【図5】上記パネルの取付構造を説明する断面図。FIG. 5 is a cross-sectional view illustrating a mounting structure of the panel.

【図6】上記パネルの穴部と電子部品の位置関係を示し
たパネルの説明図。
FIG. 6 is an explanatory view of the panel showing the positional relationship between the hole of the panel and the electronic component.

【図7】従来の電子機器の分解斜視図。FIG. 7 is an exploded perspective view of a conventional electronic device.

【図8】従来のパネルを基板に取り付ける状態を示した
斜視図。
FIG. 8 is a perspective view showing a state in which a conventional panel is attached to a substrate.

【図9】従来のパネルの取付構造を示す断面図。FIG. 9 is a cross-sectional view showing a conventional panel mounting structure.

【符号の説明】[Explanation of symbols]

5……基板 7……電子部品 14…パネル 14a…穴部 16…第1の突起 17…第2の突起 17a…爪部 5 ... Board 7 ... Electronic component 14 ... Panel 14a ... Hole 16 ... First protrusion 17 ... Second protrusion 17a ... Claw

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 電子部品が端面から突出させられた状態
で一方の面に設けられた基板と、前記電子部品が挿入さ
れる穴部を有するパネルとを具備し、このパネルには、
前記基板の他方の面と対向させられて位置付けられる第
1の突起と、弾性を有し前記電子部品を押圧して前記基
板を前記第1の突起に向けて押圧する第2の突起とが設
けられ、この第2の突起の先端側には、前記電子部品と
係合し前記電子部品が前記穴部から抜け出ることを阻止
する爪部が設けられていることを特徴とするパネルの取
付構造。
1. An electronic component is provided with a substrate provided on one surface in a state of being projected from an end face, and a panel having a hole into which the electronic component is inserted.
A first protrusion that is positioned so as to face the other surface of the substrate and a second protrusion that has elasticity and that presses the electronic component to press the substrate toward the first protrusion are provided. The panel mounting structure is characterized in that a claw portion that engages with the electronic component and prevents the electronic component from coming out of the hole is provided on a tip side of the second protrusion.
JP1992002526U 1992-01-28 1992-01-28 Panel mounting structure Expired - Fee Related JP2586237Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1992002526U JP2586237Y2 (en) 1992-01-28 1992-01-28 Panel mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1992002526U JP2586237Y2 (en) 1992-01-28 1992-01-28 Panel mounting structure

Publications (2)

Publication Number Publication Date
JPH0562079U true JPH0562079U (en) 1993-08-13
JP2586237Y2 JP2586237Y2 (en) 1998-12-02

Family

ID=11531828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1992002526U Expired - Fee Related JP2586237Y2 (en) 1992-01-28 1992-01-28 Panel mounting structure

Country Status (1)

Country Link
JP (1) JP2586237Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273780A (en) * 2006-03-31 2007-10-18 Saxa Inc Fixing structure of printed board
JP2012151212A (en) * 2011-01-18 2012-08-09 Denso Corp Electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6420786U (en) * 1987-07-28 1989-02-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6420786U (en) * 1987-07-28 1989-02-01

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273780A (en) * 2006-03-31 2007-10-18 Saxa Inc Fixing structure of printed board
JP4701118B2 (en) * 2006-03-31 2011-06-15 サクサ株式会社 PCB mounting structure
JP2012151212A (en) * 2011-01-18 2012-08-09 Denso Corp Electronic device

Also Published As

Publication number Publication date
JP2586237Y2 (en) 1998-12-02

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