JPH0561675U - Cooling device for electronic equipment - Google Patents
Cooling device for electronic equipmentInfo
- Publication number
- JPH0561675U JPH0561675U JP257992U JP257992U JPH0561675U JP H0561675 U JPH0561675 U JP H0561675U JP 257992 U JP257992 U JP 257992U JP 257992 U JP257992 U JP 257992U JP H0561675 U JPH0561675 U JP H0561675U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- side half
- heat
- casing
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】
【目的】 電子機器筐体用冷却装置の冷却効率を向上す
る改良に関する。
【構成】 第１の電子機器筐体用冷却装置は、使用済み
の冷却用外気の送出路が、熱交換用ヒートパイプの熱吸
収側半部に対接する部分の筐体側壁にそって設けられて
いる筐体用冷却装置である。また、第２の電子機器筐体
用冷却装置は、使用済みの冷却用外気の送出路が、熱吸
収側半部に対接する筐体側壁を囲むように設けられ、さ
らには、伝熱フィンが設けられているダクトの中を通る
ことゝされている筐体用冷却装置である。
(57) [Abstract] [Objective] To improve the cooling efficiency of a cooling device for an electronic device casing. According to a first aspect of the present invention, there is provided a cooling device for an electronic device casing, in which a used cooling outside air delivery path is provided along a casing side wall of a portion in contact with a heat absorbing side half portion of a heat exchange heat pipe. It is a cooling device for a housing. Further, in the second electronic device casing cooling device, the used cooling air delivery passage is provided so as to surround the casing side wall that is in contact with the heat absorption side half, and further the heat transfer fins are provided. It is a cooling device for a casing that is passed through an installed duct.
Description
【０００１】[0001]
本考案は、電子機器筐体用冷却装置の改良に関する。特に、冷却効率を向上す る改良に関する。 The present invention relates to an improvement of a cooling device for an electronic device casing. In particular, it relates to improvements that improve cooling efficiency.
【０００２】[0002]
数値制御工作機械用制御函等密閉型の電子機器筐体用冷却装置の１例に、図４ に示すような構造を有するものが知られている。 As one example of a cooling device for a sealed electronic device casing such as a control box for a numerical control machine tool, one having a structure as shown in FIG. 4 is known.
【０００３】 図において、１は筐体であり、２は熱交換用ヒートパイプであり熱吸収側半部 21と熱放散側半部22とよりなり、熱吸収側半部21のみは、電子機器筐体１中に収 容されて第１の送風ファン31によって送風される被冷却風Ａを吹き付けられる。 熱放散側半部22は、筐体１を貫通して、筐体１の外部に設けられる冷却室12中に 収容されて、第２の送風ファン32によって冷却用外気Ｂを吹き付けられる。被冷 却風Ａによって加熱された熱吸収側半部21の熱は熱放散側半部22に伝熱して冷却 用外気Ｂによって冷却される。In the figure, 1 is a housing, 2 is a heat exchange heat pipe, and is composed of a heat absorption side half 21 and a heat dissipation side half 22. Only the heat absorption side half 21 is an electronic device. The cooled air A that is contained in the housing 1 and is blown by the first blowing fan 31 is blown. The heat-dissipation side half portion 22 penetrates the housing 1 and is housed in the cooling chamber 12 provided outside the housing 1, and the outside air B for cooling is blown by the second blower fan 32. The heat of the heat absorbing side half portion 21 heated by the cooled air A is transferred to the heat radiating side half portion 22 and is cooled by the cooling outside air B.
【０００４】[0004]
上記した従来技術に係る電子機器筐体用冷却装置においては、熱放散側半部22 を冷却した冷却用外気Ｂは、筐体の冷却に全く利用されておらず、十分に昇温す る前に冷却室12の外に放出されることになっていたゝめ、冷却用外気Ｂをさらに 十分に利用しうる電子機器筐体用冷却装置の開発が望まれていた。 In the cooling device for an electronic device casing according to the above-described conventional technique, the outside air B for cooling that has cooled the heat dissipation side half portion 22 is not used for cooling the casing at all, and before the temperature rises sufficiently. Since it is supposed to be discharged to the outside of the cooling chamber 12, it has been desired to develop a cooling device for an electronic equipment casing that can utilize the outside air B for cooling more sufficiently.
【０００５】 本考案の目的は、この要請に応えるものであり、冷却用外気Ｂをさらに十分に 利用しうる電子機器筐体用冷却装置を提供することにある。An object of the present invention is to meet this demand, and to provide a cooling device for an electronic device housing that can more fully utilize the outside air B for cooling.
【０００６】[0006]
上記の目的は、下記いづれの手段によっても達成される。 The above object can be achieved by any of the following means.
【０００７】 第１の手段は、熱吸収側半部（21）と熱放散側半部（22）とよりなる熱交換用 ヒートパイプ（２）を主要部材とし、前記の熱吸収側半部（21）は密閉された電 子機器筐体（１）中に収容され、前記の熱放散側半部（22）は前記の電子機器筐 体（１）外部に設けられる冷却室（12）内に設置されており、前記の熱吸収側半 部（21）は前記の電子機器筐体（１）内において第１の送風ファン（31）によっ て筐体内被冷却風（Ａ）を吹き付けられ、前記の熱放散側半部（22）は前記の冷 却室（12）中において第２の送風ファン（32）によって冷却用外気（Ｂ）を吹き 付けられ、この冷却用外気（Ｂ）の送出路（13）は前記の熱吸収側半部（21）に 対接する部分の筐体側壁（11）にそって設けられている電子機器筐体用冷却装置 である。The first means is that the heat exchange heat pipe (2) consisting of the heat absorption side half (21) and the heat dissipation side half (22) is the main member, and the heat absorption side half ( 21) is housed in a sealed electronic device housing (1), and the heat dissipation side half (22) is inside a cooling chamber (12) provided outside the electronic device housing (1). The heat absorption side half (21) is installed in the electronic device casing (1) by the first blower fan (31) to blow cooled air (A) inside the casing, The heat-dissipation-side half (22) is blown with cooling outside air (B) by the second blower fan (32) in the cooling chamber (12), and the cooling outside air (B) is sent out. The passage (13) is a cooling device for an electronic device casing, which is provided along the casing side wall (11) in a portion facing the heat absorption side half (21).
【０００８】 第２の手段は、熱吸収側半部（21）と熱放散側半部（22）とよりなる熱交換用 ヒートパイプ（２）を主要部材とし、前記の熱吸収側半部（21）は密閉された電 子機器筐体（１）中に収容され、前記の熱交換用ヒートパイプ（２）は前記の電 子機器筐体（１）を貫通しており、前記の熱放散側半部（22）は前記の電子機器 筐体（１）外に設けられる冷却室（12）内に設置され、それぞれ、送風ファン（ 31）（32）をもって、それぞれ、筐体内被冷却風（Ａ）と冷却用外気（Ｂ）とを 吹き付けられる電子機器筐体用冷却装置において、前記の冷却用外気（Ｂ）の送 出路（13）が前記の熱吸収側半部（21）に対接する前記の筐体側壁（11）を囲む ように設けられたダクト（４）内を通過するようにされている電子機器筐体用冷 却装置である。The second means has a heat exchange heat pipe (2) composed of a heat absorption side half (21) and a heat dissipation side half (22) as a main member, and the heat absorption side half ( 21) is housed in a sealed electronic device housing (1), and the heat exchange heat pipe (2) penetrates the electronic device housing (1) to dissipate the heat. The side half part (22) is installed in the cooling chamber (12) provided outside the electronic device casing (1), and each has a blower fan (31) (32) to cool the cooled air inside the casing ( In a cooling device for an electronic device casing in which A) and the outside air for cooling (B) are blown, the delivery path (13) for the outside air for cooling (B) is in contact with the heat absorption side half (21). A cooling device for an electronic device casing, which is configured to pass through a duct (4) provided so as to surround the side wall (11) of the casing. That.
【０００９】 上記第２の手段において、前記のダクト（４）に囲まれるように設けられてい る前記の筐体側壁（11）に伝熱フィン（41）が設けられていると、冷却効率の向 上にさらに有効である。In the second means, when the heat transfer fin (41) is provided on the side wall (11) of the housing which is provided so as to be surrounded by the duct (4), cooling efficiency is improved. It is even more effective.
【００１０】[0010]
本考案に係る第１の電子機器筐体用冷却装置においては、使用済みの冷却用外 気Ｂの送出路13が、熱交換用ヒートパイプ２の熱吸収側半部21に対接する部分の 筐体側壁11にそって設けられているので、冷却用外気Ｂの未利用の冷気を有効に 利用することができるので、冷却効率が向上する。 In the first cooling device for electronic equipment according to the present invention, the delivery passage 13 for the used cooling ambient air B is in contact with the heat absorption side half portion 21 of the heat exchange heat pipe 2. Since it is provided along the body side wall 11, the unused cold air of the cooling outside air B can be effectively used, and the cooling efficiency is improved.
【００１１】 また、本考案に係る第２の電子機器筐体用冷却装置においては、使用済みの冷 却用外気Ｂの送出路13が、熱吸収側半部21に対接する筐体側壁11を囲むように設 けられるダクト４の中を通ることゝされているので、冷却用外気Ｂの未利用の冷 気を有効に利用して熱吸収側半部21を直接冷却することができるので、冷却効率 が向上する。さらに、この第２の手段の変形例においては、ダクト４に囲まれる ように設けられている筐体側壁11の一部（熱交換用ヒートパイプ２の熱吸収側半 部21に対接する一部）に伝熱フィン41が設けられているので、この変形例の冷却 効率はさらに向上している。Further, in the second electronic device casing cooling device according to the present invention, the delivery path 13 for the used cooling outside air B has the casing side wall 11 that contacts the heat absorption side half portion 21. Since it is arranged to pass through the duct 4 provided so as to surround it, the unused air of the cooling outside air B can be effectively used to directly cool the heat absorption side half portion 21, Cooling efficiency is improved. Furthermore, in the modified example of the second means, a part of the housing side wall 11 provided so as to be surrounded by the duct 4 (a part that contacts the heat absorption side half 21 of the heat exchange heat pipe 2) ), The heat transfer fins 41 are provided, so that the cooling efficiency of this modification is further improved.
【００１２】[0012]
以下、図面を参照して、本考案の三つの実施例に係る電子機器筐体用冷却装置 について説明する。 Hereinafter, a cooling device for an electronic device casing according to three embodiments of the present invention will be described with reference to the drawings.
【００１３】 第１実施例 図１参照 図において、１は筐体であり、２は熱交換用ヒートパイプであり熱吸収側半部 21と熱放散側半部22とよりなり、被冷却風Ａは送風ファン31によって熱吸収側半 部21に吹き付けられて熱交換用ヒートパイプ２を加熱する。加熱された熱交換用 ヒートパイプ２の熱は熱放散側半部22に伝熱し、この伝熱により加熱された熱放 散側半部22は冷却用外気Ｂを送風ファン32によって吹き付けられて冷却される。 熱放散側半部22を冷却して温まった冷却用外気Ｂの送出路13は、図示するように 、熱吸収側半部21に対接する領域にそって流出されることゝされているので、筐 体１の冷却に寄与する。 First Embodiment Refer to FIG. 1. In the figure, reference numeral 1 is a housing, 2 is a heat exchange heat pipe, which is composed of a heat absorption side half portion 21 and a heat dissipation side half portion 22. Is blown onto the heat absorption side half 21 by the blower fan 31 to heat the heat exchange heat pipe 2. The heat of the heated heat exchange heat pipe 2 is transferred to the heat radiating side half 22, and the heat radiating side half 22 heated by this heat is cooled by blowing the cooling outside air B by the blower fan 32. To be done. As shown in the figure, the delivery path 13 for the outside air B for cooling, which has cooled the heat-dissipation-side half 22 and has been warmed, flows out along the region that is in contact with the heat-absorption-side half 21, so that It contributes to the cooling of the casing 1.
【００１４】 第２実施例 図２参照 図において、１は筐体であり、２は熱交換用ヒートパイプであり熱吸収側半部 21と熱放散側半部22とよりなり、被冷却風Ａは送風ファン31によって熱吸収側半 部21に吹き付けられて熱交換用ヒートパイプ２を加熱し、加熱された熱交換用ヒ ートパイプ２の熱は熱放散側半部22に伝熱し、この伝熱により加熱された熱放散 側半部22は冷却用外気Ｂを送風ファン32によって吹き付けられて冷却される。 Second Embodiment Referring to FIG. 2, reference numeral 1 denotes a housing, 2 denotes a heat exchange heat pipe, which is composed of a heat absorption side half portion 21 and a heat dissipation side half portion 22. Is blown onto the heat absorption side half 21 by the blower fan 31 to heat the heat exchange heat pipe 2, and the heat of the heated heat exchange heat pipe 2 is transferred to the heat dissipation side half 22. The heat-dissipation side half portion 22 heated by is blown with the cooling outside air B by the blower fan 32 to be cooled.
【００１５】 ４は本考案の要旨に係るダクトであり、熱交換用ヒートパイプ２の熱吸収側半 部21に対接する部分の筐体側壁11を囲むように設けられており、冷却用外気Ｂの 送出路13はこのダクト４の中を通過するようにされている。Reference numeral 4 denotes a duct according to the gist of the present invention, which is provided so as to surround the side wall 11 of the housing which is in contact with the heat absorption side half 21 of the heat exchange heat pipe 2, and which is used for cooling outside air B. The delivery path 13 of the is passed through the duct 4.
【００１６】 このように構成される電子機器筐体用冷却装置は、使用済みの冷却用外気Ｂの 未利用の冷気を有効に利用して熱吸収側半部21を直接冷却することができるので 、冷却効率が向上する。In the cooling device for electronic device casing configured as described above, the unused cooling air of the used cooling outside air B can be effectively used to directly cool the heat absorption side half portion 21. , The cooling efficiency is improved.
【００１７】 第３実施例 図３参照 第２実施例との相違は、ダクト４に囲まれた領域の筐体側壁11の部分に伝熱フ ィン41が付加されており、冷却効果をさらに向上していることである。 Third Embodiment See FIG. 3 The difference from the second embodiment is that a heat transfer fin 41 is added to the portion of the housing side wall 11 in the region surrounded by the duct 4 to further improve the cooling effect. That is improving.
【００１８】[0018]
以上説明したように、本考案に係る第１の電子機器筐体用冷却装置においては 、使用済みの冷却用外気の送出路が、熱交換用ヒートパイプの熱吸収側半部に対 接する部分の筐体側壁にそって設けられているので、冷却用外気の未利用の冷気 を有効に利用することができるので、冷却効率が向上する。また、本考案に係る 第２の電子機器筐体用冷却装置においては、使用済みの冷却用外気の送出路が、 熱吸収側半部に対接する筐体側壁を囲むように設けられ、さらには、伝熱フィン 41が設けられているダクトの中を通ることゝされているので、冷却用外気の未利 用の冷気を有効に利用して熱吸収側半部を直接冷却することができるので、冷却 効率が向上する。 As described above, in the first electronic device housing cooling device according to the present invention, the used cooling outside air delivery path is connected to the heat absorbing side half of the heat exchange heat pipe. Since it is provided along the side wall of the housing, the unused cold air of the outside air for cooling can be effectively used, and the cooling efficiency is improved. Further, in the second electronic device housing cooling device according to the present invention, the used cooling outside air delivery path is provided so as to surround the housing side wall that is in contact with the heat absorption side half portion, and Since it is arranged to pass through the duct in which the heat transfer fins 41 are provided, it is possible to directly utilize the unused cool air of the cooling outside air to directly cool the heat absorbing side half. The cooling efficiency is improved.
【図１】本考案の第１実施例に係る電子機器筐体用冷却
装置の構成図である。FIG. 1 is a configuration diagram of a cooling device for an electronic device housing according to a first embodiment of the present invention.
【図２】本考案の第２実施例に係る電子機器筐体用冷却
装置の構成図である。FIG. 2 is a configuration diagram of a cooling device for an electronic device housing according to a second embodiment of the present invention.
【図３】本考案の第３実施例に係る電子機器筐体用冷却
装置の構成図である。FIG. 3 is a configuration diagram of a cooling device for an electronic device housing according to a third embodiment of the present invention.
【図４】従来技術に係る電子機器筐体用冷却装置の１例
の構成図である。FIG. 4 is a configuration diagram of an example of a cooling device for an electronic device casing according to a conventional technique.
１ 電子機器筐体 11 熱交換用ヒートパイプの熱吸収側半部に対接する
部分の筐体側壁 12 冷却室 13 冷却用外気の送出路 ２ 熱交換用ヒートパイプ 21 熱交換用ヒートパイプの熱吸収側半部 22 熱交換用ヒートパイプの熱放散側半部 31・32 送風ファン ４ ダクト 41 伝熱フィン Ａ 筐体内被冷却風 Ｂ 冷却用外気1 electronic equipment housing 11 housing side wall of the portion facing the heat absorption side half of the heat exchange heat pipe 12 cooling chamber 13 cooling air delivery path 2 heat exchange heat pipe 21 heat exchange heat pipe heat absorption Side half 22 Heat dissipation of heat exchange heat pipe Side half 31/32 Blower fan 4 Duct 41 Heat transfer fin A Cooled air inside the enclosure B Outside air for cooling
Claims (3)
2）とよりなる熱交換用ヒートパイプ（２）を主要部材
とし、前記熱吸収側半部（21）は密閉された電子機器筐
体（１）中に収容され、前記熱放散側半部（22）は前記
電子機器筐体（１）外部に設けられる冷却室（12）内に
設置されてなり、前記熱吸収側半部（21）は前記電子機
器筐体（１）内において第１の送風ファン（31）によっ
て筐体内被冷却風（Ａ）を吹き付けられ、前記熱放散側
半部（22）は前記冷却室（12）中において第２の送風フ
ァン（32）によって冷却用外気（Ｂ）を吹き付けられ、
該冷却用外気（Ｂ）の送出路（13）は前記熱吸収側半部
（21）に対接する部分の筐体側壁（11）にそって設けら
れてなることを特徴とする電子機器筐体用冷却装置。1. A heat absorption side half (21) and a heat dissipation side half (2)
2) is a heat exchange heat pipe (2) as a main member, and the heat absorption side half (21) is housed in a sealed electronic equipment casing (1), and the heat dissipation side half (21) 22) is installed in a cooling chamber (12) provided outside the electronic device casing (1), and the heat absorption side half part (21) is located inside the electronic device casing (1). The air to be cooled (A) in the housing is blown by the blower fan (31), and the heat dissipation side half (22) is cooled by the second blower fan (32) in the cooling chamber (12). ),
The electronic device housing is characterized in that the delivery path (13) for the outside air (B) for cooling is provided along the housing side wall (11) in a portion facing the heat absorption side half (21). Cooling device.
2）とよりなる熱交換用ヒートパイプ（２）を主要部材
とし、前記熱吸収側半部（21）は密閉された電子機器筐
体（１）中に収容され、前記熱放散側半部（22）は前記
電子機器筐体（１）外に設けられる冷却室（12）内に設
置され、それぞれ、送風ファン（31）（32）をもって、
それぞれ、筐体内被冷却風（Ａ）と冷却用外気（Ｂ）と
を吹き付けられる電子機器筐体用冷却装置において、 前記冷却用外気（Ｂ）の送出路（13）は前記熱吸収側半
部（21）に対接する前記筐体側壁（11）の一部を囲むよ
うに設けられたダクト（４）内を通過することゝされて
なることを特徴とする電子機器筐体用冷却装置。2. The heat absorption side half (21) and the heat dissipation side half (2)
2) is a heat exchange heat pipe (2) as a main member, and the heat absorption side half (21) is housed in a sealed electronic equipment casing (1), and the heat dissipation side half (21) 22) is installed in a cooling chamber (12) provided outside the electronic device casing (1), and has a blower fan (31) (32),
In a cooling device for an electronic device casing, which is respectively blown with the cooled air (A) in the casing and the outside air (B) for cooling, the delivery path (13) of the outside air (B) for cooling is the heat absorption side half part. A cooling device for an electronic equipment casing, characterized in that the cooling device passes through a duct (4) provided so as to surround a part of the casing side wall (11) facing the (21).
られてなる前記筐体側壁（11）には伝熱フィン（41）が
設けられてなることを特徴とする請求項２記載の電子機
器筐体用冷却装置。3. The electron transfer fin according to claim 2, wherein a heat transfer fin (41) is provided on the side wall (11) of the housing which is provided so as to be surrounded by the duct (4). Equipment enclosure cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP257992U JP2535449Y2 (en) | 1992-01-28 | 1992-01-28 | Cooling device for electronic equipment housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP257992U JP2535449Y2 (en) | 1992-01-28 | 1992-01-28 | Cooling device for electronic equipment housing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0561675U true JPH0561675U (en) | 1993-08-13 |
| JP2535449Y2 JP2535449Y2 (en) | 1997-05-14 |
Family
ID=11533285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP257992U Expired - Lifetime JP2535449Y2 (en) | 1992-01-28 | 1992-01-28 | Cooling device for electronic equipment housing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2535449Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10261888A (en) * | 1997-03-19 | 1998-09-29 | Denso Corp | Cooler and housing cooling unit with cooler |
| JP5584333B1 (en) * | 2013-07-16 | 2014-09-03 | 新日鉄住金エンジニアリング株式会社 | Server rack indoor system |
-
1992
- 1992-01-28 JP JP257992U patent/JP2535449Y2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10261888A (en) * | 1997-03-19 | 1998-09-29 | Denso Corp | Cooler and housing cooling unit with cooler |
| JP5584333B1 (en) * | 2013-07-16 | 2014-09-03 | 新日鉄住金エンジニアリング株式会社 | Server rack indoor system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2535449Y2 (en) | 1997-05-14 |
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