JPH0546940A - Floating head - Google Patents

Abstract

PURPOSE:To reduce the area of a lead extraction part in a levitation type head which is provided with a thin film head on a slider and to make the levita tion type head small-sized and lightweight. CONSTITUTION:In a floating head 50 which is provided with a thin film head 10 on a slider 20, the head is constituted in such a way that guide grooves 23, for positioning use of lead wires 30, which are connected to a lead extraction part 7 in the thin film head 10 and into which the lead wires 30 connected to the lead extraction part 7 are inserted are formed in the slider 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flying head for recording / reproducing information on a magnetic recording medium or magneto-optical recording medium, and more particularly for recording / reproducing by a hard disk type drive device.

[0002]

2. Description of the Related Art A hard disk drive (HDD) used as an external storage device such as an electronic computer
In magnetic recording / reproducing such as, a flying type head is used which faces the surface of the recording medium at a constant interval. This head is constructed by cutting out a large number of sliders 20 from a wafer-shaped substrate 1 made of ceramic or the like and depositing and forming a thin film head on the sliders 20, as shown in a manufacturing process of FIG. ..

FIG. 8 is an enlarged schematic perspective view of the slider 20. The slider 20 faces one side of a recording medium such as a magnetic recording medium or a magneto-optical recording medium while maintaining a required space, that is, a flying height. Surface (ABS surface: Air Bearing Surface) 21
However, for example, both sides thereof are sandwiched by a groove 22 provided so as to extend along the relative traveling direction with respect to the recording medium. Then, for example, on one end surface 2 of the slider 20, the operating magnetic gap faces the air bearing surface 21,
A thin film head 10 such as a magnetic head or a magneto-optical head is adhered and formed. Reference numeral 9 denotes a protective film which is deposited on the thin film head 10 to be flattened, and lead lead portions 7a and 7b of the thin film head 10 are provided so as to penetrate the protective film 9 and expose its surface to the outside. Be done.

An example of such a thin film head 10 will be described with reference to the schematic enlarged sectional view of FIG. Thin film head 10
The magnetic layer 3 is deposited on the base 1 made of a non-magnetic layer such as ceramic in front of the air bearing surface 21, and the non-magnetic gap forming layer 4 is deposited on the front end. Then, a non-magnetic insulating layer 5 is applied to the rear portion and flattened, and the coil winding portion 6 made of the conductive layer 9 is patterned thereon as a required spiral pattern, for example. Then, after the non-magnetic insulating layer 5 is again deposited on this, an opening is formed on the gap forming layer 4 and on the rear end of the lower magnetic layer 3 to fill the inside of the opening. The magnetic layer 8 is deposited and patterned so that the gap forming layer 4 is formed in the magnetic layers 3 and 8 at the front end facing the air bearing surface 21.
Are sandwiched between them to form a magnetic gap g. Then, a protective film 9 made of an insulating layer is deposited thereon, and lead lead-out portions 7a and 7b for leading out terminals from the coil winding portion are formed by, for example, forming an opening in a required portion and then performing plating or the like. Thus, the thin film head 10 is configured.

The thin film head 10 described above is attached to the same slider 2
In the case of forming two elements with almost the same structure on 0, as shown in FIG.
As shown in a schematic enlarged plan view of 0, a magnetic gap g is formed so as to face the air bearing surface 21, for example, on the end surface 2 of the base body 1 that constitutes the slider. The lead lead-out portion 7 (7a and 7b) from the coil winding portion 6 is formed on the same end face 2 as in the illustrated example.

Terminals are led out from the lead lead-out portion 7 and, as shown in a schematic enlarged perspective view of FIG.
The rear surface of the slider 20, that is, the surface opposite to the air bearing surface 21, is fixed to the tip portion of the load beam 41 of the gimbal 40. Although not shown, a drive unit for moving the flying head 50 in parallel with the surface of the recording medium is connected to the supporting portion 42 of the gimbal 40 so that the flying head 50 scans a recording medium such as a magnetic recording medium. Although not shown, the flying head 50 floats above the surface of the magnetic disk by the air flow generated by the rotation of the recording medium, for example, the magnetic disk, and recording / reproduction is performed so as not to damage the recording surface. Reference numeral 43 is a tube portion that holds the lead wire 30.

The wire bonding of the floating head 50 is conventionally performed as shown in a schematic enlarged sectional view of FIG.
For example, a lead lead-out portion 7 made of a conductive layer, that is, a so-called bonding pad portion is patterned at a predetermined position on the end surface 2 of the slider 20, and a tip portion of the lead wire 30 is bonded thereon by a thermocompression bonding method or an ultrasonic method. ing.

In the case of such a bonding method,
The width W _P of the lead lead-out portions 7a and 7b is selected in consideration of the alignment error of the lead wire 30. For example, when the diameter of the lead wire 30 is φ, the width W _P is about 3φ.
_P was needed. For example, when connecting two lead wires 30 as in the illustrated example, the diameter φ is set to 3
If the width is 0 μm, the lead lead portions 7a and 7b have a width of 12
When the distance L between the lead lead-out portions 7a and 7b is 50 μm, the width W of the entire region required for lead-out of the terminals is 290 μm, which occupies a large area on the slider 20. In particular, when the number of lead lead-out portions 7 is increased by providing a plurality of thin film heads 10 as described above, the ratio of this area is further increased.

However, in recent years, in order to reduce the influence of such external vibration of the flying head, the flying head has been made smaller and lighter. That is, by reducing the length of the air bearing surface of the flying head as described above, it is possible to improve the followability to irregularities and undulations on the surface of the recording medium to stabilize the flying height, and to reduce the weight. It is desired to reduce the influence of external vibration,
It has been desired to reduce the area of the lead lead-out portion 7 and downsize the slider 20.

[0010]

SUMMARY OF THE INVENTION The present invention aims to reduce the area of the lead-out portion as described above and to reduce the size and weight of the flying head.

[0011]

FIG. 1 is a schematic enlarged perspective view showing an example of a flying type head according to the present invention. According to the present invention, as shown in FIG. 1, in a flying head 50 having a thin film head 10 on a slider 20, the slider 20 communicates with a lead lead-out portion 7 of the thin film head 10 and is connected to the lead lead-out portion 7. A guide groove 23 for positioning the lead wire 30 into which the lead wire 30 is inserted is provided.

[0012]

As described above, in the flying head of the present invention, the slider 20 is connected to the lead lead-out portion 7 of the thin film head 10.
Since the guide groove 23 for positioning the lead wire 30 into which the lead wire 30 connected to the lead lead-out portion 7 is inserted is provided, it is possible to consider the positioning error when bonding the lead wire 30. Since it is not necessary to provide the lead wire 30 and the lead wire 30 is fitted in the guide groove 23, the bonding can be performed without causing the positional deviation, and the area of the lead lead-out portion 7 can be significantly reduced.

As an example, when two lead wires 30 having a diameter φ of 30 μm are bonded on the lead lead-out portion 7, two guide grooves 23 having a groove width of about 30 μm are provided, as in the above-mentioned conventional example. The lead wires 30 can be surely positioned by the above-mentioned method, and the distance between the lead wires 30 should be such that a required short circuit does not occur, for example, 50 μm.
The width of the entire lead lead-out portion 7 is 110 μ
m. That is, the width of the entire conventional lead lead-out portion 7 is 290 μm.
It can be significantly smaller than m.

Therefore, according to the present invention, the flying head 50
The size and weight of can be reduced.

[0015]

【Example】

Example 1 An example of a flying head 50 according to the present invention will be described with reference to FIG. In this case, an example is shown in which one thin film head 10 is adhered and formed on the front end surface 2 of the base 1. In FIG. 1, reference numeral 1 denotes a base body made of ceramic or the like which constitutes a slider 20, and an air bearing surface 21 facing a recording medium such as a magnetic recording medium is provided on one surface of the substrate 20 so as to extend in a traveling direction relative to the recording medium. Both sides of the slider 20 are sandwiched by grooves 22 provided so as to communicate with the front end surface 2 and the rear end surface (not shown) of the slider 20. And on this end face 2,
The thin film head 10 is adhered to the air bearing surface 21 so that the magnetic gap g is exposed. The thin film head 10 has the same configuration as that of the example described with reference to FIGS. 9 and 10, for example.

A guide groove 23 for positioning the lead wire 30 connected to the lead lead-out portion 7 is communicated with the end face 2 across the lead lead-out portion 7 (7a and 7b) of the thin film head 10, for example. Is provided. The guide groove 23 is formed, for example, from the inside of the groove 22 on the air bearing surface 21 side to the air bearing surface 2
The lead lead portions 7a and 7b are formed by mechanical cutting or the like so as to communicate with the back surface 24 to which a gimbal (not shown) on the side opposite to 1 is bonded.

The shape and size of the guide groove 23 is, for example, as shown in FIG.
As shown in the schematic enlarged sectional view, the depth d is selected by the following formula 1 with respect to the diameter φ of the lead wire 30.

[0018]

[Equation 1] 1 / 3φ ≦ d <φ

In the illustrated example, the guide groove 23 is formed in a semicircular shape. At this time, as shown in FIG.
At least one of the guide grooves 23 is configured to communicate with the lead lead-out portion 7b other than the bonding portion, and the depth of the guide groove 23 is appropriately controlled as described above, and the lead lead-out portion 7b is provided. Is controlled appropriately, that is, the thickness of the protective film 9 is appropriately controlled so as not to electrically cut the lead lead-out portion 7b.

Then, the tip portion of the lead wire 30 is inserted into the guide groove 23, and the lead wire 30 is adhered by, for example, an ultrasonic bonding method so as to be embedded in the guide groove 23 as shown in FIG. Is connected to the lead lead portion.

In this case, since the lead wire 30 is fitted in the guide groove 23 without causing a positional deviation, the guide groove 23 can be arranged without considering a positioning error. That is, the width of the guide groove 23 is about 30 μm,
The space between the adjacent guide grooves 23 can be set to about 50 μm. For this reason, the width of the wire bonding region can be set to about 110 μm, which is narrower than the conventional width, and the area of this portion can be reduced. Therefore, miniaturization of the slider 20, that is, the flying head 50,
The weight can be reduced.

Embodiment 2 Description will be given with reference to an enlarged schematic perspective view of FIG. 4, parts corresponding to those in FIG. 1 are designated by the same reference numerals, and duplicate description will be omitted. In this case, when a pair of thin film heads 10 are adhered and formed on the end surface 2 of the slider 20, so as to correspond to the lead lead-out portions 7 of the respective thin film heads 10,
Similar to the first embodiment described above, this is an example in which the guide groove 23 for positioning the lead wire 30 is communicated from the air bearing surface 21 side to the back surface 24 side opposite thereto, and is provided by mechanical cutting or the like. Also in this case, as in the first embodiment, the area of the bonding region can be reduced, and the flying head can be reduced in size and weight.

Embodiment 3 Description will be given with reference to the schematic enlarged perspective view of FIG. 5, parts corresponding to those in FIG. 1 are designated by the same reference numerals, and duplicate description will be omitted. In this example, a guide groove 23 for positioning the lead wire 30 corresponding to the lead lead-out portion 7 of the thin film head 10 is extended from the lead lead-out portion 7 on the end face 2 along the lead lead-out portion 7 to form an air bearing surface. 21 and the side surface 25 orthogonal to the end surface 2 are provided so as to communicate with each other. In this example, as in the first embodiment, the area of the bonding region can be reduced, and the flying head can be made smaller and lighter.

Embodiment 4 Description will be given with reference to the schematic enlarged perspective view of FIG. 6, parts corresponding to those in FIG. 1 are designated by the same reference numerals, and duplicate description will be omitted. In this example, the thin film head is attached to the end face 2
Although formed on the end surface 2, the guide groove 23 for positioning the lead wire 30 is not provided on the end surface 2, and the guide groove 23 is formed on the one side surface 25 orthogonal to the air bearing surface 21 and the back surface 24. Therefore, it is provided by communicating with an end surface (not shown) on the opposite side to this by mechanical cutting or the like.
Each of these guide grooves 23 is provided at a position corresponding to each lead lead-out portion 7 on the end face 2 so as to communicate with the lead lead-out portion 7. In this example, as in the first embodiment, the area of the bonding region can be reduced, and the flying head can be made smaller and lighter.

In each of the above-described embodiments, the area of the lead lead-out portion 7 of the flying type head can be reduced, and the length of, for example, the flying surface of the flying type head can be made small.
It was possible to reduce the fluctuation of the flying height by improving the followability to unevenness and waviness on the surface of the recording medium. Further, the weight reduction can reduce the influence of external vibration, and for example, the tension of the gimbal described in FIG. 11 can be reduced.

The floating head of the present invention is not limited to the above-mentioned examples, but can be applied to various other floating heads.

[0027]

As described above, according to the flying type head of the present invention, the slider 20 communicates with the lead lead-out portion 7,
By inserting the lead wire 30 connected to the lead lead-out portion 7 and providing the guide groove 23 for positioning the lead wire 30, it is possible to reduce the margin in consideration of the alignment error of the lead wire 30. Therefore, the area of the lead lead-out portion 7 can be reduced. As a result, the slider 20 can be downsized, the followability to undulations on the surface of the recording medium can be improved, and fluctuations in the flying height can be reduced.

Further, by reducing the size and weight, the influence of external vibration can be suppressed and the tension of the gimbal can be reduced.

[Brief description of drawings]

FIG. 1 is an enlarged schematic perspective view of an example of a flying head of the present invention.

FIG. 2 is an enlarged schematic cross-sectional view of a main part of an example of a floating head of the present invention.

FIG. 3 is an enlarged schematic cross-sectional view of a main part of an example of a floating head of the present invention.

FIG. 4 is an enlarged schematic perspective view of another example of the flying head of the present invention.

FIG. 5 is an enlarged schematic perspective view of another example of the flying head of the present invention.

FIG. 6 is an enlarged schematic perspective view of another example of the flying head of the present invention.

FIG. 7 is a manufacturing process diagram of an example of a flying head.

FIG. 8 is a schematic linear enlarged perspective view of a main part of an example of a conventional floating head.

FIG. 9 is an enlarged schematic cross-sectional view of a main part of an example of a conventional floating head.

FIG. 10 is an enlarged schematic plan view of a main part of an example of a conventional floating head.

FIG. 11 is an enlarged schematic perspective view of an example of a conventional floating head.

FIG. 12 is an enlarged schematic cross-sectional view of a main part of an example of a conventional flying head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base 2 End surface 3 Magnetic layer 4 Gap material layer 5 Insulating layer 6 Coil winding part 7 Lead derivation part 7a Lead derivation part 7b Lead derivation part 8 Magnetic layer 9 Protective film 10 Thin film head 20 Slider 21 Air bearing surface 22 Groove 23 Guide groove 24 Back 25 Side 30 Lead Wire 40 Gimbal 50 Floating Head

Claims (1)

[Claims] 1. A flying type head having a thin film head on a slider, wherein positioning of a lead wire communicating with the lead lead portion of the thin film head and inserting a lead wire connected to the lead lead portion to the slider. A flying type head, characterized in that it is provided with a guide groove for use.