JPH0546724B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a high frequency filter for electronic equipment, and particularly for radio wave generation in broadcasting stations, amateur radio stations, citizen radio stations, personal radio systems, military radar, etc. The present invention relates to a high frequency filter for protecting electronic equipment from radio wave interference caused by various radio waves emitted from a source.

[Prior art]

Conventionally, this type of high-frequency filter has adopted chip-type capacitors, as disclosed in Japanese Patent Application Laid-Open No. 58-61583, which has been used to transmit various radio waves to the input and output lines of electronic devices. Some devices are designed to prevent the propagation of high-frequency noise components based on

[Problem to be solved by the invention]

However, such high-frequency filters cannot provide uniform filtering characteristics over a wide radio frequency band, and cannot adequately protect electronic devices from the above-mentioned propagation of high-frequency noise components, that is, from radio interference. There is a problem that there is no.

SUMMARY OF THE INVENTION In order to solve these problems, the present invention provides a high frequency filter for electronic equipment that has uniform filtering characteristics over a radio frequency band.

[Means to solve the problem]

Therefore, the present invention provides an electronic device including a conductive casing and an electronic element provided with a connection terminal disposed inside the conductive casing and connected to a connection line extending from an external circuit. an insulating layer interposed between the connecting terminal and the connecting line; and an insulating layer provided on one surface of the insulating layer and connected between the connecting terminal of the electronic element and the connecting line, which has a predetermined resistance value. a conductive layer provided on the other surface of the insulating layer and connected to the conductive casing, the insulating layer having a dielectric constant that is very high compared to that of air, and The dielectric material is formed of a dielectric material having a dielectric constant that decreases as the radio frequency increases, and together with the impedance layer and the conductive layer, the dielectric constant is high in relation to the radio frequency characteristics over a wide radio frequency range. The present invention employs a high frequency filter for electronic equipment that is characterized by exhibiting filtering characteristics.

[Function and effect]

With the above configuration, the high frequency filter of the present invention has an impedance layer having a predetermined resistance value, which is provided on one surface of the insulating layer and is connected between the connection terminal of the electronic element and the connection line. Therefore, by consuming the high-frequency induced current as thermal energy based on the predetermined resistance value of this impedance layer, it is possible to obtain, for example, the blocking effect shown by the solid line in FIG. 9 of the present application,
It has the excellent effect of being able to obtain a stable high blocking effect over a wide radio frequency range.

〔Example〕

Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIGS. 1 and 2 show an electronic control system to which the present invention is applied, which is installed in a vehicle. Various electrical components U1, U2, U3, U4, U5 such as sensors and actuators are placed in various parts of the vehicle, and each input/output signal line W1, W2, W3 is connected to each electrical component U1, U2, U3, U4, U5. , W4, and W5 (arranged inside the vehicle body, such as in the passenger compartment, engine room, trunk, etc.). In such a case, each of the input/output signal lines W1 to W5 is made longer based on the relative arrangement relationship with the electronic device D (the second
(see figure).

As shown in FIG. 1, the electronic device D has a casing 10 (corresponding to a conductive casing) made of a metal good conductor.Elongated holes 11a formed in the front wall 11 of the casing 10 are provided with input and output ports. A connector 20 connected to the connector 20a connected to the signal lines W1 to W5 is fitted. Connector 2
0 indicates inverted L-shaped connector pins P1, P2, P3, P4, P extending in a row inside the casing 10.
5, and each of these connector pins P1, P
2, P3, P4, P5 are connected to each input/output signal line W1, W2, W3, through a connector 20a at each inner end thereof.
They are connected to W4 and W5, respectively. However, the casing 10 is assembled in a non-grounded state (that is, in an insulated state) at a suitable location inside the vehicle body, such as the passenger compartment, engine room, or trunk of the vehicle.

The printed circuit board 30 is supported above the bottom wall 12 within the casing 10 by a plurality of supporting members (not shown) made of metal good conductors.
a, 31b are as shown in FIGS. 1 and 3,
They are fixed to each other at intervals in the left-right direction of the casing 10. In such a case, each copper foil film 31
a, 31b are connected to the casing 10 by the supporting member.
It is short-circuited to the bottom wall 12 of the. On the other hand, on the upper surface of the printed circuit board 30, each wiring pattern 32a, 33
a, 34a, 35a, 36a are arranged in the front-rear direction of the casing 10 corresponding to each connector pin P1, P2, P3, P4, P5 of the connector 20, and these wiring patterns 32a, 33
The lower ends of the connector pins P1, P2, P3, P4, and P5 are connected to the upper surfaces of the connector pins a, 34a, 35a, and 36a, respectively. In addition, the printed circuit board 30
Each wiring pattern 32b, 33b, 3
4b, 35b, 36b are each wiring pattern 32a,
The wiring patterns 32b, 33b, 34 are arranged in the front and back direction of the casing 10 corresponding to the wiring patterns 33a, 34a, 35a, and 36a, respectively.
b, 35b, 36b and each wiring pattern 32a, 3
3a, 34a, 35a, and 36a, a predetermined interval is provided between each opposing end.

Further, on the upper surface of the pre-printed board 30, each electronic element 40, 50, 60 and a high frequency filter 70 constituting the main part of the present invention are assembled, and the electronic element 40 is connected to the printed board 30 with its lead terminal 41. Each lead terminal 4 is fixed to the top surface of the
2 and 43 are soldered onto the respective wiring patterns 32b and 33b, respectively. The electronic element 50 connects each wiring pattern 3 with its respective lead terminals 51 and 52.
They are soldered on 4b and 35b respectively,
The electronic element 60 is soldered onto the wiring pattern 36b with its lead terminal 61.
2, it is fixed to the upper surface of the printed circuit board 30.

The high frequency filter 70 is as shown in FIG.
Printed circuit board 3 between connector 20 and each electronic element 40, 50, 60 in casing 10
It is arranged on the top surface of 0. This high frequency filter 70 has a common electrode plate 71 (corresponding to conductivity), and this common electrode plate 71 is similar to that shown in FIGS.
As shown in the figure, from the left and right ends,
Each lead piece (made of conductive material) extends in shape
71a and 71b, a land hole 37a common to the printed circuit board 30 and the copper foil film 31a, and a land hole 37 common to the printed circuit board 30 and the copper foil film 31b.
Each wiring pattern 32a is inserted into each wiring pattern 32a and soldered to each copper foil film 31a, 31b.
36a and each of the wiring patterns 32b to 36b, and is supported above and parallel to the upper surface of the printed circuit board 30 between the opposing ends thereof. In such a case, the common electrode plate 71 is connected to each lead piece 71 at its left and right ends.
A, 71b are short-circuited to each copper foil film 31a, 31b, respectively.

The high frequency filter 70 also includes an insulating layer 7 formed on the upper surface of a common electrode plate 71, as shown in FIG.
2, and each strip-shaped electrode piece 73, 74, 75, 76, 77 (corresponding to an impedance layer) arranged parallel to each other in the front-rear direction of the casing 10 on the upper surface of the insulating layer 72, The insulating layer 72 is made of a dielectric material (for example, a dielectric material mainly composed of a two-component composition of lead iron niobate and lead iron tungstate) having a dielectric constant that changes as shown in FIG. 5 in relation to the radio frequency. material).
In such a case, the dielectric constant of the insulating layer 72 is sufficiently high compared to the dielectric constant of air, even if it decreases due to increase in radio frequency. Further, the thickness, length in the left-right direction, and length in the front-back direction of the insulating layer 72 are, for example, 0.5 mm, 20 mm, and 10 mm, respectively.
The resistance layer 73 is made of a resistance material having a predetermined resistance value (for example, a printed conductive paint mainly composed of carbon).
is printed on the upper surface of the insulating layer 72 between the two wiring patterns 32a and 32b, as shown in FIGS.
Each lead piece 73c, 73d extending in an L shape from each electrode piece 73a, 73b printed on the upper surface of both the front and rear ends of the wiring pattern 32a and the land hole 38a common to the printed circuit board 30, and the wiring pattern 32b And each wiring pattern 3 is inserted into the common land hole 39a of the printed circuit board 30.
2a and 32b, respectively. In such a case, the resistance layer 73 connects each lead piece 73 via each electrode piece 73a, 73b at both front and rear ends thereof.
c, 73d, each wiring pattern 32a, 32b
are shorted to each other.

In addition, each of the remaining resistance layers 74, 75, 76, 77
As shown in FIG. 1, each pair of wiring patterns 33a, 33b; 34a, 34b;
5a, 35b; 36a, 36b are formed by printing on each upper surface portion of the insulating layer 72, and each of these resistance layers 74, 75, 76, 77 is printed on each upper surface at both front and rear end portions. Each pair of electrode pieces 74a, 74b; 75a, 75b;
76a, 76b; L from 77a, 77b respectively
Each pair of lead pieces (made of conductive material) 74c, 74d; 75c, 75d; 76
c, 76d; 77c, 77d are each pair of land holes 38b, 39b; 38c, 39c; 38d, 3
9d; 38e, 39e and each pair of wiring patterns 33a, 33b; 34a, 34b; 35
a, 35b; soldered to 36a, 36b, respectively.

In such a case, each resistance layer 74, 75, 76, 77
is a pair of electrode pieces 74 at both front and rear ends thereof.
a, 74b; 75a, 75b; 76a, 76b;
Each pair of lead pieces 74 are connected via 77a and 77b.
c, 74d; 75c, 75d; 76c, 76d;
Each pair of wiring patterns 33 is formed by 77c and 77d.
a, 33b; 34a, 34b; 35a, 35b;
36a and 36b, respectively. In addition, each land hole 38b, 38c, 38 mentioned above
Substantially similar to the land hole 38a, the wiring patterns 33a, 34a, 35a, and 36a are formed in common with the printed circuit board 30, and are similar to the land holes 39b and 38e described above.
9c, 39d, 39e (not shown) are connected to each wiring pattern 33b, 34b, 35 under the printed circuit board 30, substantially similar to the land hole 39a.
b, 36b, respectively.

In the high frequency filter 70 configured in this way, each resistance layer 73, 74, 75, 76, 77
form two parallel lines together with the common electrode plate 71 via the insulating layer 72, and each electrode piece 73a, 73b, 74a, 74b, 75a, 75
b, 76a, 76b, 77a, 77b are the insulating layer 7
Together with the common electrode plate 71 via 2, two parallel lines are formed. Therefore, in the low radio frequency region, each resistance layer 73, 74, 75, 7
6, 77 and each electrode piece 73a, 73b, 74a,
74b, 75a, 75b, 76a, 76b, 77
a and 77b are the common electrode plate 7 with the insulating layer 72 interposed therebetween.
In cooperation with 1, it functions as a parallel plate type capacitor filter.

Further, in a region higher than the low region in radio frequency, each resistance layer 73, 74, 75, 7
6, 77 and each electrode piece 73a, 73b, 74a,
74b, 75a, 75b, 76a, 76b, 77
a and 77b are the common electrode plate 7 with the insulating layer 72 interposed therebetween.
1, each function as a filter which is a Retzchel type distributed constant circuit shown in FIG. In such a case, the Retzchel type distributed constant circuit in FIG.
Af, the resistance layers 73, 74, 75, 76 form a Retzchel type distributed constant circuit B in cooperation with the common electrode piece plate 71 via the insulating layer 72, and the electrode piece 7
3b, 74b, 75b, 76b, or 77b consists of a cascade connection of Retzchel-type distributed constant circuits Ar formed by cooperation with the common electrode plate 71 via the insulating layer 72. However, in FIG. 6, each symbol L1...Ln, L1'...Ln' indicates a distributed inductance, and each symbol G1,...Gn, G
1'...Cn' each indicates a distributed conductance, each code C1,...Cn, C1',...Cn' each indicates a distributed capacitance, and each code R
1, ......Rn respectively indicate distributed resistance.

In addition, each Retzchel type distributed constant circuit Af, B, Ar
Total distributed inductance La, Lb, total distributed conductance Ga, Gb, total distributed capacitance Ca,
Expressed by Cb and/or total distributed resistance R,
Each distributed constant circuit Af, B, Ar is a circuit similar to a lumped constant circuit, as shown in Figure 7.
Af,′,B′,Ar′. In such a case, each total distributed capacitance Ca, Cb is determined by the radio frequency characteristic of the dielectric constant 〓 of the dielectric material forming the insulating layer 72;
Each resistance layer 73-77 and each electrode piece 73a-77
a, 73a to 77b, and obtained as a curve C(f) as shown in FIG. 8, and each total distributed conductance Ga, Gb
is determined in the same way as for each total distributed capacitance Ca, Cb, and the curve G(f) is determined as shown in Figure 8.
obtained as. This means that the high frequency filter 7
0 means that in a wide region higher than the resistance region in the radio frequency, the filtering characteristic is substantially flat without any resonance phenomenon, as shown by the solid line ≦ in FIG. In this case, each resistance layer 73~
Due to the consumption of high-frequency induced radio waves as thermal energy (that is, transmission loss) based on each resistance value in 77, the cutoff characteristics of high-frequency filter 70 are as follows.
In the low radio frequency range, each resistance layer 73~
Breaking characteristics when 77 is used as a normal electrode piece (8th
It is significantly improved and becomes higher than that shown by the broken line 〓 in the figure. In addition, in FIGS. 6 and 7, the symbol e1 indicates the wiring patterns 32a, 33a, 34a,
35a or 36a, each symbol e2 or e4 indicates a copper foil film 31a or 31b, and symbol e3 indicates a wiring pattern 32b, 33b, 34b, 35b or 36b.

In this embodiment configured as described above, various radio waves E (having radio frequencies) from radio wave generation sources such as broadcasting stations, amateur radio stations, citizen radio stations, personal radio systems, military radar, etc. are shown in FIG. When the radio wave E is incident on the vehicle, a high frequency induced current I based on the radio wave E is transmitted to each input/output signal line W1, W.
2. Both connectors 20 guided by W3, W4, and W5
a, 20 and flows into the high frequency filter 70.
However, this high frequency filter 70
Based on the radio frequency characteristics of the dielectric constant 〓 in Fig. 5 and the high frequency component consumption characteristics based on the respective resistance values of each resistance layer 73 to 77, as described above, over a wide range of radio frequencies, the solid line 〓 in Fig. 9 As shown, since it has a substantially flat filtering characteristic, the high frequency induced current I flows through the common electrode plate 71 and each lead piece 71.
a, 71b and each of the copper foil films 31a, 31b, and the bottom wall 12 of the casing 10 via each of the supporting members.
There will definitely be an influx.

In other words, the high frequency filter 70 reliably blocks and filters the high frequency induced current I caused by the radio wave E, that is, the radio frequency component, from each electronic element 40, 50, 60 based on high filtering characteristics. Therefore, in spite of the presence of the radio wave E, only the input/output signal current between each of the electrical components U1 to U5 and each of the electronic elements 40 to 60 is transmitted and received by each of the input/output signal lines W1 to W5 and each connector 20a. , 20, each wiring pattern 32a to 36
a, each lead piece 73c to 77c, each electrode piece 73a
~77a, each resistance layer 73-77, each electrode piece 73b
77b, each lead piece 73d to 77d, and each wiring pattern 32b to 36b. In addition, when assembling the high frequency filter 70, each lead piece 71a, 71b, 73c,
74c, 75c, 76c, 77c, 73d, 74
d, 75d, 76d, 77d in each land hole 37
a, 37b, 38a, 38b, 38c, 38d,
38e, 39a, 39b, 39c, 39d, 39
All you need to do is insert and solder each to e.
This kind of high frequency filter can be easily mounted.

In the first embodiment, the high frequency filter 70 was assembled on the upper surface of the printed circuit board 30 between each of the wiring patterns 32a to 36a and each of the wiring patterns 32b to 36b. , as shown in FIG. 10, each wiring pattern 32a to 36aa, each part of the printed circuit board 30 and each copper foil film 31a, 31b located on the front side of each land hole 38a to 38e, and each lead piece of the high frequency filter 70. 73c, 74c, 75c, 76
c, 77c and each electrode piece 73a, 74a, 75
a, 76a, 77a are omitted, and each connector pin P1, P2, P3, P of the connector 20 is omitted.
4, connect the lower end of P5 to each resistance layer 73, 74, 75, 7
6, 77 may be soldered directly to the front end of the upper surface of each of them. In such a case, by omitting each wiring pattern 32a to 36a, disturbances such as high frequency noise directly riding on each of these wiring patterns 32a to 36a can be carried out. As a result, the filtering characteristics of the high frequency filter 70 can be further improved. Further, by omitting the printed circuit board 30 and the wiring patterns 32a to 36a as described above, the size and shape of this type of electronic device can be made even more compact.

Next, a second embodiment of the present invention will be described with reference to FIG. 11. In this second embodiment, the high frequency filter 80 is replaced with the high frequency filter 70 in the first embodiment, and the upper surface of the printed circuit board 30 is Its structural feature lies in the fact that it is vertically installed. The high frequency filter 80 has a common electrode plate 81 (corresponding to a conductive layer), and this common electrode plate 81
As shown in FIGS. 11 and 12, the lower edge 81a is connected to the printed circuit board 30 and each copper foil film 31.
Each wiring pattern 32a to 36a and each wiring pattern are inserted into a longitudinal land hole 38f (in place of each land hole 37a, 37b) common to wiring patterns 32a to 31b and soldered to each copper foil film 31a, 31b. It is vertically installed on the printed circuit board 30 between the opposing ends of 32b to 36b.

Further, as shown in FIGS. 11 and 12, the high frequency filter 80 includes the insulating layer 72 described in the first embodiment, each resistance layer 73 to 77, and each pair of electrode pieces 73a, 73b; 77a, 77b and
Alumina substrate 82 and each lead piece 73c, 74c, 75c, 76c, 7 in the first embodiment
Each electrode piece 73a, 74a, 75a,
Each lead piece (made of a conductive material) 83a, 84a, 85a, extending from 76a, 77a, respectively.
86a, 87a, and each lead piece 73d, 74d, 75d, 76d, 77d in the first embodiment
Each electrode piece 73b, 74b, 75b, 76
Respective lead pieces (made of conductive material) 83b, 84b, 85b, 86 extending from b, 77b, respectively
b, 87b, and the insulating layer 72 is fixed to the front surface of the common electrode plate 81 above the printed circuit board 30.

Each resistance layer 73 to 77 and each pair of electrode pieces 73
a, 73b; . . .; 77a, 77b are disposed on the front surface of the insulating layer 72 in substantially the same manner as in the first embodiment. The alumina substrate 82 has an insulating layer 7
2, it is fixed to the rear surface of the common electrode plate 81 and serves to reinforce the common electrode plate 81. As shown in FIG. 12, the lead piece 83a is inserted into the land hole 38a in the first embodiment and soldered to the wiring pattern 32a. on the other hand,
The lead piece 83b includes the insulating layer 72 and the common electrode plate 81.
and extends from each upper edge of the alumina substrate 82 to the rear surface of the alumina substrate 82, and its lower end is inserted into the land hole 39a in the first embodiment and soldered to the wiring pattern 32b. In such a case, the lead piece 83b is located at an appropriate distance from the upper edge of the insulating layer 72, the common electrode plate 81, the alumina substrate 82, and the rear surface of the alumina substrate 82, and the resistance layer 73 is located apart from each electrode piece. 73a,
It is short-circuited to each wiring pattern 32a, 32b via 73b and each lead piece 83a, 83b, respectively.

In addition, the remaining lead pieces 84a, 85a, 86
a, 87a are respectively inserted into the land holes 38b, 38c, 38d, 38e in the first embodiment, and are connected to the wiring patterns 33a, 34a, 35.
It is soldered to a and 36a. On the other hand, the remaining lead pieces 84a, 85b, 86b, and 87b extend to the rear surface side of the alumina substrate 82 in the same manner as the lead piece 84a, and are respectively inserted into the land holes 39b, 39c, 39d, and 39e in the first embodiment. It is inserted into each wiring pattern 33b, 34b, 35
b, 36b. In such case,
Each resistance layer 74, 75, 76, 77 has a pair of electrode pieces 74a, 74b; 75a, 75b; 76a,
76b; Each pair of lead pieces 8 at 77a and 77b
4a, 84b; 85a, 85b; 86a, 86
b; 87a, 87b for each pair of wiring patterns 33a, 33b; 34a, 34b; 35a, 35
b; Short-circuited to 36a and 36b, respectively.

In this embodiment configured as described above, similarly to the first embodiment, when various radio waves E are incident on the vehicle, a high frequency induced current I based on the radio waves E is generated.
is induced into each of the input/output signal lines W1 to W5 and flows into the high frequency filter 80 through both connectors 20a and 20, the high frequency induced current I
Under the filtering function of the high-frequency filter 80 similar to the high-frequency filter 70 in the embodiment, the water reliably flows through the common electrode plate 81 and the copper foil films 31a and 31b and into the bottom wall of the casing 10 via the respective supporting members. In other words, the high frequency filter 80
The high frequency induced current I, that is, the radio frequency component caused by this, is reliably blocked and filtered from each electronic element 40, 50, 60. Therefore, in spite of the presence of the radio wave E, only the input/output signal current between each of the electrical components U1 to U5 and each of the electronic elements 40 to 60 is transmitted and received by each of the input/output signal lines W1 to W5 and each connector 20a. ,20,
Each wiring pattern 32a to 36a, each lead piece 8
3a to 87a, each electrode piece 73a to 77a, each resistance layer 73 to 77, each electrode piece 73b to 77b, each lead piece 83b to 87b, and each wiring pattern 32b to
36b respectively.

In such a case, the high frequency filter 80
Unlike the high frequency filter 70 in the embodiment, since it is installed vertically on the printed circuit board 30, the common electrode plate 81 isolates each of the electronic devices 40 to 60 from the connector 20 and connects each of the electronic devices 40 to 60 from the inner opening of the connector 20. It is also possible to block various radio waves that are directly incident on 60. Further, the common electrode plate 81 is connected to each copper pipe film 31.
a, 31b, the connection area between this common electrode plate 81 and each of the copper foil films 31a, 31b can be made sufficiently large, and short-circuiting to the casing 10 at high frequencies can be further ensured. In addition, when assembling the high frequency filter 80, each lead piece 83a to 87a, 83b to 87b, the common electrode plate 8
1 to each land hole 38a to 38e, 39a.
Since it is only necessary to insert and solder the filters 39e and 38f, this kind of high frequency filter can be easily mounted.

Note that in the second embodiment, the high frequency filter 80 was installed vertically on the printed circuit board 30 between each of the wiring patterns 32a to 6a and each of the wiring patterns 32b to 36b. As shown in FIG. 13, each wiring pattern 32a to 3
6a, the printed circuit board 30 located on the front side of each land hole 38a to 38e and each copper foil film 31a, 31
b, each lead piece 83a to 87a and each electrode piece 73a to 77a of the high frequency filter 80
may be omitted, and the hanging portions of the connector pins P1, P2, P3, P4, and P5 of the connector 20 may be directly soldered to the front surfaces of the respective resistance layers 73, 74, 75, 76, and 77. In such a case, as in the case of the modification shown in FIG. The effect can be further improved. In addition, the above-mentioned printed circuit board 30 may be partially omitted and the wiring pattern 3 may be omitted.
By omitting 2a to 36a, this type of electronic device can be made even more compact. Note that each of the hanging portions of each of the connector pins P1 to P5 of the connector 20 is made long to ensure contact with each of the resistance layers 73 to 77.

Further, in the second embodiment, each lead piece 83b to 87b of the high frequency filter 80 is
As shown in the figure, the alumina substrate 82 is extended to the rear surface side, but the U-shaped resistance layers 91, 92, 93, 94, 95 (each resistance layer in the first embodiment (formed of the same material as layers 73 to 77), each resistance layer 73,
Instead of 74, 75, 76, and 77, they may be modified so as to be fixed to the front surface of the insulating layer 72, as shown in FIG.

In such a case, the wiring pattern 32b is extended between both wiring patterns 32a, 33a, the wiring pattern 33b is extended between both wiring patterns 33a, 34a, and the wiring pattern 34b is extended between both wiring patterns 34a.
a, 35b, the wiring pattern 35b extends between both wiring patterns 35a, 35a, and the wiring pattern 36b extends to the left side of the wiring pattern 36a. 9
Each electrode piece 91 from each lower end of the left arm portion of Nos. 4 and 95
Each lead piece 91c, 92c, 93 extends through a, 92a, 93a, 94a, 95a, respectively.
c, 94c, 95c for each land hole 38g, 38
h, 38i, 38j, 38k respectively, and each wiring pattern 32b, 33b, 34b, 35
b, 36b, and each resistance layer 9
Each electrode piece 91b, 92b, 93b, 94b,
Each lead piece 91 extends through 95b.
d, 92d, 93d, 94d, 95d into each land hole 38a, 38b, 38c, 38d, 38e, respectively, and each wiring pattern 32a, 33a,
They are soldered to 34a, 35a, and 36a, respectively.

According to this modification, the high frequency filter can be made compact without requiring the alumina substrate 82 shown in FIG.
Since it only needs to be fixed to the front surface of 2, productivity can be improved. In addition, in FIG. 11, each electrode piece 91a, 92a, 93a, 94a, 95a, 91
b, 92b, 93b, 94b, 95b and each lead piece 91c, 92c, 93c, 94c, 95c,
Of the electrode pieces 91a, 95a, 91b, 95b and the lead pieces 91c, 91d, 95c, 95d among the electrode pieces 91d, 92d, 93d, 94d, and 95d, only the symbols are shown.

Further, in the second embodiment, the alumina substrate 82 is used as the reinforcing means for the common electrode plate 81, but the present invention is not limited to this. For example, a normal insulating substrate may be used as the reinforcing means instead of the alumina substrate 82. It's okay.

Further, the high frequency filter in the modification shown in FIG. 14 is vertically installed on the printed circuit board 30 between each wiring pattern 32a to 36a and each wiring pattern 32b to 36b, but instead of this,
As shown in FIG. 15, substantially the same as in FIG. 13, each wiring pattern 32a to 36a,
Printed circuit board 3 corresponding to each of these wiring patterns
0 and each part of each copper foil film 31a, 31b, and each electrode piece 91 of the high frequency filter in FIG.
b, 92b, 93b, 94b, 95b and each lead piece 91d, 92d, 93d, 94d, 95d are omitted, and each hanging part of each connector pin P1, P2, P3, P4, P5 of connector 20 is replaced with each resistance layer. 91, 92, 93, 94, and 95 may be soldered directly to each right arm portion, and in such a case, the effect is substantially the same as that described for the high frequency filter in FIG. 13. can achieve the following effects.

Further, in carrying out the present invention, as shown in FIG. 16, a plurality of hybrid electronic devices 111
The high frequency filters 120 and 130 according to the present invention may be applied to a hybrid electronic device equipped with a hybrid substrate (110 made of an alumina substrate, a hollow substrate, etc.) (arranged with 111). In such a case, the high frequency filter 120 are each connection terminal 112a, 112b, 112c, 1 with external circuit
12d and each hybrid electronic device 111 to 111
The high frequency filter 130 is assembled on one side of the upper surface of the hybrid board 110 between the two, and the high frequency filter 130 is attached to each connection terminal 113a, 113b, 11
3c, 113d and each hybrid electronic element 111
111 on the other side of the upper surface of the hybrid board 110.

The high frequency filter 120 is shown in FIGS.
As shown in the figure, a conductor foil film 121 printed on one side of the upper surface of a hybrid substrate 110, a common electrode plate 122 (corresponding to the other of the pair of conductors) superposed on this conductor foil film 121, and this common electrode plate Each connection terminal 112a, 112b, 112 on the top surface of 122
Insulating layers 123a, 124a, 125a, 126a, arranged corresponding to
(Similar to the insulating layer 72 in the first embodiment)
and each of these insulating layers 123a, 124a, 125
The resistor layers 123b, 124b, 125b, 126b (same as the resistor layer 73 in the first embodiment) are printed on the upper surfaces of the resistor layers 123b, 126a, respectively.
24b, 125b, 126b have respective connection terminals 112a, 112b, 112c, 112 at one end thereof.
d, and each end thereof is connected to each hybrid electronic element 111-111 via each connection terminal 127a, 127b, 127c, 127d. Note that the conductor foil film 121 is short-circuited to a metal casing (not shown) via the hybrid substrate 110, and is also connected to the high-frequency filter 1.
30 is also configured substantially the same as the high frequency filter 120.

Therefore, in each of the high frequency filters 120 and 130 configured in this way, each connection terminal 112
Even if the high-frequency induced current I based on the radio wave E flows in from each external circuit through a to 112d and 113a to 113d, each high-frequency filter 120, 130 has a dielectric current of its respective insulating layer, as in the first embodiment. The high frequency induced current I is reliably cut off and filtered from each of the hybrid electronic elements 111 to 111 based on the radio frequency characteristics of the ratio 〓 and the high frequency loss characteristics of the resistance layer.

In addition, in each of the above embodiments and modifications,
Although an example in which the present invention is applied to an electronic control system for a vehicle has been described, the present invention is not limited to this, and when an electronic control system for a ship or various other moving bodies has relatively long input/output signal lines, the present invention may be installed at a fixed position. The present invention may also be applied and implemented in cases where the electronic control system has relatively long input/output signal lines.

In addition, in each of the above embodiments and modifications,
Although the casing 10 made of a good metal conductor is maintained in an ungrounded state, the casing 10 is not limited to this, and may be maintained in a grounded state on a part of the vehicle body. When the electronic circuit section has resistance to radio waves E, only a part of the casing 10 may be formed of a metal good conductor.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of essential parts showing a first embodiment of the present invention, FIG. 2 is a diagram showing a state in which a vehicle is equipped with an electronic control system to which the first embodiment is applied, and FIG. The figure is a sectional view taken along line 3-3 in Figure 1,
Figure 4 is a cross-sectional view taken along line 4-4, and Figure 5 is a cross-sectional view taken along line 4-4.
Figure 6 is a graph showing the relationship between the permittivity of the insulating layer and the radio frequency, Figure 6 is a diagram showing the distributed constant circuit of the high frequency filter in Figure 1, and Figure 7 is the same.
LCG constant filter circuit diagram, FIG. 8 is a graph showing the relationship between the total distributed conductance G and the total distributed capacitance C in FIG. 7 with the radio frequency,
FIG. 9 is a graph showing the filtering characteristics of the high-frequency filter in FIG. 1, FIG. 10 is a perspective view of a main part showing a modification of the first embodiment, and FIG.
12 is a sectional view taken along the line 12-12 in FIG. 11, and FIGS. 13 to 15 are perspective views of essential parts showing the embodiment.
The figure shows each modification of the second embodiment, the 16th
The figure is a perspective view showing a modification of each of the above embodiments, and FIG. 17 is an exploded perspective view of the high frequency filter in FIG. 16. Explanation of symbols, 10...Casing, 20, 20
a... Connector, 32a to 36a, 32b to 36
b... Wiring pattern, 40, 50, 60... Electronic element, 42, 43, 52, 61... Lead terminal,
70, 80, 120, 130...High frequency filter, 72, 123a to 126a...Insulating layer, 73
~77, 91~95, 123b~126b......
Resistance layer, 71, 81, 122... Common electrode plate, 1
01a-105a...electrode layer, 111...hybrid electronic device, D...electronic device, W1-W5...
...I/O signal line.

Claims (1)

[Claims] 1. A conductive casing 10, and connection terminals disposed inside the conductive casing and connected to connection lines W ₁ to _{W 5} and P ₁ to _{P 5} extending from an external circuit. Electronic elements 40, 50, 6
0,111, insulating layers 72, 123a to 126a interposed between the connection terminals of the electronic elements and the connection lines;
and impedance layers 73 to 77, 91 to 95, 123b to 126 having a predetermined resistance value, provided on one surface of this insulating layer and connected between the connection terminals of the electronic element and the connection line.
b, and conductive layers 71 and 8 provided on the other surface of the insulating layer and connected to the conductive casing.
1, 122, and the insulating layer is formed of a dielectric material having a dielectric constant that is very high compared to the dielectric constant of air and decreases as the radio frequency increases; A high frequency filter for electronic equipment, characterized in that the impedance layer and the conductive layer exhibit high filtering characteristics over a wide radio frequency range in relation to the radio frequency characteristics of the dielectric constant.