JPH0546089U - Boiling cooling circuit - Google Patents
Boiling cooling circuitInfo
- Publication number
- JPH0546089U JPH0546089U JP9556391U JP9556391U JPH0546089U JP H0546089 U JPH0546089 U JP H0546089U JP 9556391 U JP9556391 U JP 9556391U JP 9556391 U JP9556391 U JP 9556391U JP H0546089 U JPH0546089 U JP H0546089U
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- cooling
- electronic device
- pressure
- reservoir tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】
【目的】 艦船の艦橋上部等高所設置の電子機器を冷却
する為の冷却回路に於て、軽量でシンプルな制御系を有
し、配管系を低圧に保持したままで所定の冷却能力を有
する沸騰冷却回路を提供するものである。
【構成】 リザーバタンクを電子機器の下方の所定位置
に大気解放して設置することにより、大がかりな循環装
置及び冷凍機なしに電子機器内の沸騰冷却を実現でき
る。また配管系の圧力を全体的に低く保持でき、リザー
バタンクや配管の耐圧設計及び冷媒のリークに対するリ
スクを大幅に軽減できる。また、凝縮器内の液面センサ
で冷媒の気化状況を検出してファンの回転数をインバー
タ制御することにより、飽和蒸気温度をコントロールで
きる。
(57) [Abstract] [Purpose] A lightweight and simple control system is provided for a cooling circuit for cooling electronic equipment installed at an upper altitude of the bridge of a ship, while keeping the piping system at a low pressure. The present invention provides a boiling cooling circuit having a predetermined cooling capacity. By arranging a reservoir tank at a predetermined position below an electronic device with the atmosphere open to the atmosphere, boiling cooling in the electronic device can be realized without a large-scale circulation device and a refrigerator. In addition, the pressure of the piping system can be kept low as a whole, and the risk of leak pressure of the refrigerant and the design of the pressure resistance of the reservoir tank and piping can be greatly reduced. Further, the saturated vapor temperature can be controlled by detecting the vaporization state of the refrigerant by the liquid level sensor in the condenser and controlling the rotation speed of the fan by the inverter.
Description
【０００１】[0001]
本考案は、例えば艦船の艦橋上部等高所に設置される電子機器を冷却する為の 冷却回路に於て、軽量でシンプルな制御系を有し、配管系を低圧に保持したまま で所定の冷却能力を有する沸騰冷却回路を提供するものである。 The present invention has a lightweight and simple control system for a cooling circuit for cooling an electronic device installed at a high place such as an upper part of a ship's bridge, for example. A boiling cooling circuit having a cooling capacity is provided.
【０００２】[0002]
図２は従来の冷却回路の構成例を示す図である。図に於て、１は電子機器、２ は配管系、３はリザーバタンク、４は冷媒補充口弁、５は加圧装置、６は循環装 置、７は冷凍機である。 FIG. 2 is a diagram showing a configuration example of a conventional cooling circuit. In the figure, 1 is an electronic device, 2 is a piping system, 3 is a reservoir tank, 4 is a refrigerant replenishing port valve, 5 is a pressurizing device, 6 is a circulating device, and 7 is a refrigerator.
【０００３】 従来の冷却回路に於ては前記のように構成され、冷却すべき電子機器１からは 遥かに下方に設置された循環装置６及び冷凍機７により、所定の温度・流量の冷 媒が電子機器１に循環され、冷却を行った後循環装置６に回収される。また冷媒 圧力基準となるリザーバタンク３には、循環装置６の吸入側圧力を所定に保持す る為加圧装置５が設置されていた。In the conventional cooling circuit, the circulation device 6 and the refrigerator 7 configured as described above and arranged far below the electronic device 1 to be cooled are used to cool the coolant at a predetermined temperature and flow rate. Is circulated in the electronic device 1, cooled, and then collected in the circulation device 6. In addition, a pressurizing device 5 was installed in the reservoir tank 3 which serves as a refrigerant pressure reference in order to maintain a predetermined suction side pressure of the circulation device 6.
【０００４】[0004]
従来の冷却回路に於ては、電子機器の性能向上・小型軽量化により発熱量及び 発熱密度が増加傾向にある為、その冷却系にも能力向上が要求され、強制液冷却 を採用する限りは冷媒循環量及び循環抵抗が増加して循環装置の大型化につなが り、また冷却能力アップの為循環冷媒冷却用冷凍機も益々大型化の傾向にあった 。また、艦船の艦橋や支筒の上部といった高所装備の電子機器については、その 設置場所に大型の冷媒循環器や冷凍機を同様に設置することは船体の重量バラン スやスペースの問題から許されず、電子機器の設置場所より遥か下方に設置され る為配管布設長さも長くなって更に循環装置に負荷がかかるという問題があった 。また、リザーバタンク内の液面と電子機器の設置位置高低差から電子機器内に 極度の負圧が生じて冷媒が常温で沸騰してしまうのを防止する為、リザーバタン ク内を加圧装置により所定圧力に加圧しておく必要があり、その分リザーバタン クを含む配管系が高圧となり、強度及び冷媒リークに対する信頼性にリスクが生 じていた。 本考案による冷却回路は、かかる問題を解決し、軽量でシンプルな制御系を有 し、冷媒系を低圧に保持したままで所定の冷却能力を有する沸騰冷却回路を提供 するものである。 In conventional cooling circuits, the amount of heat generated and the density of heat generated tend to increase due to the improved performance of electronic devices and the reduction in size and weight.Therefore, the cooling system is also required to have improved capacity, so long as forced liquid cooling is adopted. Refrigerant circulation volume and circulation resistance increased, which led to the enlargement of the circulation system, and due to the increased cooling capacity, refrigerators for circulating refrigerant cooling tended to increase in size. In addition, for electronic equipment equipped with high places such as bridges of ships and upper parts of branch pipes, it is not allowed to install a large-sized refrigerant circulator or refrigerator in the same place because of problems of weight balance and space of the hull. However, since it was installed far below the installation location of the electronic equipment, there was the problem that the length of pipe laying would be long and the load on the circulation device would be further increased. Also, in order to prevent the refrigerant from boiling at room temperature due to extreme negative pressure inside the electronic device due to the difference in height between the liquid level in the reservoir tank and the installation position of the electronic device, a pressure device is used inside the reservoir tank. Since it was necessary to pressurize to a predetermined pressure, the piping system including the reservoir tank became high in pressure, and there was a risk in strength and reliability against refrigerant leakage. The cooling circuit according to the present invention solves such a problem, provides a lightweight and simple control system, and provides a boiling cooling circuit having a predetermined cooling capacity while keeping the refrigerant system at a low pressure.
【０００５】[0005]
本考案による冷却回路に於ては、電子機器での冷却効果を向上する為沸騰冷却 方式を採用するものであり、従来電子機器内でリザーバタンクとの設置位置高低 差により懸念されていた負圧の発生を逆に利用して、電子機器内の冷媒圧力を常 温での冷媒飽和蒸気圧レベルに保持して飽和状態とすることにより、電子機器が 発熱した場合に冷媒を沸騰させるというものである。従って、リザーバタンク内 は加圧する必要がなく、電子機器の下方の所定位置に大気解放して設置する。ま た、一度沸騰して気化した冷媒は、凝縮器に於てファンによって空調された雰囲 気エアーの流れにより再び液化される。また、電子機器の発熱量変動や配管から の入出熱等熱負荷変動に対しては、凝縮器内の液面センサにより液面の変動を検 知して情報をファンに送信し、その信号によってファンの回転数をインバータ制 御することで凝縮量を制御して液面を所定範囲内に維持できる。 The cooling circuit according to the present invention employs a boiling cooling method in order to improve the cooling effect in the electronic device, and the negative pressure which has been a concern due to the difference in the installation position height with the reservoir tank in the conventional electronic device. In the opposite way, the refrigerant pressure in the electronic device is kept at the saturated refrigerant vapor pressure level at normal temperature to bring it into a saturated state, so that the refrigerant boils when the electronic device generates heat. is there. Therefore, it is not necessary to pressurize the inside of the reservoir tank, and it should be opened to the atmosphere at a predetermined position below the electronic equipment. Further, the refrigerant that has once boiled and vaporized is liquefied again by the flow of the air in the condenser, which is conditioned by the fan. In addition, for fluctuations in the heat generation amount of electronic devices and fluctuations in heat load such as heat input and output from piping, the fluctuation of the liquid level is detected by the liquid level sensor in the condenser, and information is sent to the fan. By controlling the fan speed with an inverter, the amount of condensation can be controlled and the liquid level can be maintained within a predetermined range.
【０００６】[0006]
本考案による冷却回路に於ては、前記の通りリザーバタンクを電子機器の下方 の所定位置に大気解放して設置することにより、電子機器内の冷媒圧力を常温で の冷媒飽和蒸気圧レベルに保持して飽和状態とすることにより沸騰冷却を可能と し、電子機器の高発熱密度に見合った冷却を、大がかりな循環装置及び冷凍機な しに実現できる。この際リザーバタンクを加圧していない為、配管系の圧力を全 体的に低く保持できる為、リザーバタンクや配管の設計にあたっては耐圧性及び 冷媒のリークに対するリスクを大幅に軽減できる。また、冷却系の熱負荷変動に 対しても、凝縮器内の液面センサで冷媒の気化状況を検出することにより熱負荷 状況を把握し、これをファンに信号で送信して、ファンの回転数を熱負荷状況に あわせてインバータ制御することにより、冷媒液面高さつまり冷媒圧力を所定範 囲内に制御でき、結局飽和蒸気温度をコントロールできることになる。また、冷 媒の補充についても、加圧装置がない為冷媒補充口弁と大気解放弁の開閉操作に より容易に可能となる。 In the cooling circuit according to the present invention, as described above, by installing the reservoir tank at a predetermined position below the electronic device by releasing it to the atmosphere, the refrigerant pressure inside the electronic device is maintained at the refrigerant saturated vapor pressure level at room temperature. Then, by making it saturated, boiling cooling is possible, and cooling that matches the high heat generation density of electronic equipment can be realized without a large-scale circulation device or refrigerator. At this time, since the pressure in the reservoir tank is not pressurized, the pressure in the piping system can be kept low as a whole, and therefore the pressure resistance and the risk of refrigerant leakage can be greatly reduced when designing the reservoir tank and piping. In addition, even if the heat load of the cooling system fluctuates, the liquid level sensor in the condenser detects the vaporization status of the refrigerant to understand the heat load status, and sends this to the fan as a signal to rotate the fan. By controlling the number of inverters according to the heat load condition, the refrigerant liquid level, that is, the refrigerant pressure can be controlled within a predetermined range, and the saturated vapor temperature can be finally controlled. Also, since there is no pressurizing device, the replenishment of the cooling medium can be easily performed by opening and closing the refrigerant replenishment port valve and the atmosphere release valve.
【０００７】[0007]
実施例１． 図１は本考案による冷却回路の一実施例を示す図である。図に於て、１は電子 機器、２は配管系、３はリザーバタンク、４は冷媒補充口弁、８は凝縮器、９は ファン、１０は液面センサ、１１は大気解放弁である。 Example 1. FIG. 1 is a diagram showing an embodiment of a cooling circuit according to the present invention. In the figure, 1 is an electronic device, 2 is a piping system, 3 is a reservoir tank, 4 is a refrigerant replenishing port valve, 8 is a condenser, 9 is a fan, 10 is a liquid level sensor, and 11 is an atmosphere release valve.
【０００８】 前記の様に構成された冷却回路に於ては、リザーバタンクとの設置位置高低差 により発生する負圧を利用して、電子機器内の冷媒圧力を常温での冷媒飽和蒸気 圧に保持し、電子機器が発熱した場合に冷媒を沸騰させることで沸騰冷却を行う ことができる。従って、リザーバタンク内は加圧する必要がなく、電子機器の下 方の所定位置に大気解放して設置する。また、一度沸騰して気化した冷媒は、凝 縮器に於てファンによって空調された雰囲気エアーの流れにより再び液化される 。また、電子機器の発熱量変動や配管からの入出熱等熱負荷変動に対しては、凝 縮器内の液面センサにより冷媒の気化状況を検知してファンの回転数をインバー タ制御することで凝縮量を制御し、液面を所定範囲内に維持することで冷媒飽和 温度をコントロールできる。尚、冷媒補充時については、加圧装置がない為、冷 媒補充口弁と大気解放弁の開閉操作により容易に可能である。In the cooling circuit configured as described above, the negative pressure generated due to the height difference of the installation position from the reservoir tank is used to change the refrigerant pressure in the electronic device to the saturated vapor pressure of the refrigerant at room temperature. It is possible to carry out boil cooling by holding it and boiling the refrigerant when the electronic device generates heat. Therefore, it is not necessary to pressurize the inside of the reservoir tank, and it should be installed in the atmosphere at a predetermined position below the electronic equipment with the atmosphere open. In addition, the refrigerant that has once boiled and vaporized is liquefied again by the flow of atmospheric air conditioned by the fan in the condenser. For fluctuations in the heat value of electronic devices and fluctuations in heat load such as heat input and output from pipes, the liquid level sensor in the condenser must detect the vaporization status of the refrigerant to control the fan speed by inverter. The refrigerant saturation temperature can be controlled by controlling the amount of condensation with and maintaining the liquid level within a predetermined range. Since there is no pressurizing device, the refrigerant can be easily replenished by opening and closing the coolant replenishing port valve and the atmosphere release valve.
【０００９】[0009]
以上述べた通り、本考案による冷却回路に於ては、前記の通りリザーバタンク を電子機器の下方の所定位置に大気解放して設置することにより、電子機器内の 沸騰冷却を可能とし、電子機器の高発熱密度に見合った冷却を、大がかりな循環 装置及び冷凍機なしに実現できる。この際リザーバタンクを加圧していない為配 管系の圧力を全体的に低く保持でき、リザーバタンクや配管の耐圧設計及び冷媒 のリークに対するリスクを大幅に軽減できる。また、凝縮器内の液面センサで冷 媒の気化状況を検出してファンの回転数をインバータ制御することにより、飽和 蒸気温度をコントロールできる。 As described above, in the cooling circuit according to the present invention, as described above, by installing the reservoir tank at a predetermined position below the electronic device with the atmosphere open to the atmosphere, the electronic device can be cooled by boiling. Cooling commensurate with the high heat generation density of can be realized without a large-scale circulation device and refrigerator. At this time, since the pressure in the reservoir tank is not increased, the pressure in the pipe system can be kept low, and the risk of leak pressure of the reservoir tank and piping and leakage of refrigerant can be greatly reduced. In addition, the saturated vapor temperature can be controlled by detecting the vaporization status of the cooling medium by the liquid level sensor in the condenser and controlling the fan speed by the inverter.
【図１】この考案の一実施例を示す部分図である。FIG. 1 is a partial view showing an embodiment of the present invention.
【図２】従来の構成例を示す図である。FIG. 2 is a diagram showing a conventional configuration example.
１ 電子機器 ２ 配管系 ３ リザーバタンク ４ 冷媒補充口弁 ５ 加圧装置 ６ 循環装置 ７ 冷凍機 ８ 凝縮器 ９ ファン １０ 液面センサ １１ 大気解放弁 1 Electronic Equipment 2 Piping System 3 Reservoir Tank 4 Refrigerant Replenishing Port Valve 5 Pressurizer 6 Circulator 7 Refrigerator 8 Condenser 9 Fan 10 Liquid Level Sensor 11 Atmosphere Release Valve
Claims (1)
要する電子機器を冷却する為の沸騰冷却回路に於て、冷
媒の基準出力を設定する為のリザーバタンクと、気化し
た冷媒をインバータ制御によって冷却し凝縮させる為の
ファンと、前記ファンが取付けられた熱交換器と、冷媒
の液面高さを検知し、液面情報を信号として前記ファン
に送信する機能を有した液面センサとから構成され、前
記リザーバタンクの水面と電子機器の設置位置高低差に
よる冷媒静圧損失を利用して、電子機器内で冷媒沸騰さ
せて沸騰冷却を行うことを特徴とした沸騰冷却回路。1. A reservoir tank for setting a reference output of a refrigerant in an evaporative cooling circuit for cooling an electronic device, which is installed at an upper altitude of a bridge of a ship and requires cooling, and an inverter for vaporizing the refrigerant. A fan for cooling and condensing under control, a heat exchanger to which the fan is attached, and a liquid level sensor having a function of detecting the liquid level height of the refrigerant and transmitting the liquid level information as a signal to the fan A boiling cooling circuit, which is characterized by comprising: (1) and utilizing the static pressure loss of the refrigerant due to the difference in height between the water surface of the reservoir tank and the installation position of the electronic device to boil and cool the refrigerant in the electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9556391U JPH0546089U (en) | 1991-11-21 | 1991-11-21 | Boiling cooling circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9556391U JPH0546089U (en) | 1991-11-21 | 1991-11-21 | Boiling cooling circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0546089U true JPH0546089U (en) | 1993-06-18 |
Family
ID=14141060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9556391U Pending JPH0546089U (en) | 1991-11-21 | 1991-11-21 | Boiling cooling circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0546089U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010230276A (en) * | 2009-03-27 | 2010-10-14 | Fuji Heavy Ind Ltd | Ebullient cooling device |
| WO2024090236A1 (en) * | 2022-10-28 | 2024-05-02 | 株式会社デンソー | Heat transfer member and heat transfer member manufacturing method |
-
1991
- 1991-11-21 JP JP9556391U patent/JPH0546089U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010230276A (en) * | 2009-03-27 | 2010-10-14 | Fuji Heavy Ind Ltd | Ebullient cooling device |
| WO2024090236A1 (en) * | 2022-10-28 | 2024-05-02 | 株式会社デンソー | Heat transfer member and heat transfer member manufacturing method |
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