JPH0543489U - Connection structure of card type board and connector - Google Patents

Connection structure of card type board and connector

Info

Publication number
JPH0543489U
JPH0543489U JP9082391U JP9082391U JPH0543489U JP H0543489 U JPH0543489 U JP H0543489U JP 9082391 U JP9082391 U JP 9082391U JP 9082391 U JP9082391 U JP 9082391U JP H0543489 U JPH0543489 U JP H0543489U
Authority
JP
Japan
Prior art keywords
connector
type substrate
card
card type
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9082391U
Other languages
Japanese (ja)
Inventor
竜也 小沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP9082391U priority Critical patent/JPH0543489U/en
Publication of JPH0543489U publication Critical patent/JPH0543489U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】 コネクタに挿入され接続されるカード型基板
端部の接続用電極と、この電極に接触するコネクタ内部
の接続用端子との配線本数を簡易な構造で容易に数倍に
増加させる。 【構成】 コネクタに挿入するカード型基板端部の接続
用電極を挿入方向に対し、複数段形成すると共に、これ
らの接続用電極に対応し、これらの電極と接続されるコ
ネクタ内の接続用端子も複数段並設する。
(57) [Abstract] [Purpose] The number of wires between the connection electrode at the end of the card-type substrate that is inserted and connected to the connector and the connection terminal inside the connector that contacts this electrode can be easily determined with a simple structure. Double. [Structure] A plurality of connecting electrodes at the end of a card-type substrate to be inserted into a connector are formed in the insertion direction and corresponding to these connecting electrodes, connecting terminals in the connector to be connected to these electrodes Will also be installed side by side.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

この考案は、電気部品等を搭載したカード型基板とコネクタの接続において、 コネクタ等の大きさや接続用電極等の間隔をほぼ同等に保ったまま、より多くの 接続用電極及び端子の配設を可能にするカード型基板とコネクタの接続構造に関 するものである。 In the present invention, when connecting a card-type substrate on which electrical parts and the like are mounted to a connector, more connecting electrodes and terminals are arranged while keeping the size of the connector and the spacing between the connecting electrodes and the like substantially the same. It relates to the connection structure between the card-type board and the connector that enables it.

【0002】[0002]

【従来の技術】[Prior Art]

図2に従来のカード型基板及びコネクタの接続構造の例を示す。同図の(A) ないし(D)はカード型基板の端部の片面に接続用電極が形成された例であり、 (E)ないし(G)は両面に電極が形成された例である。 FIG. 2 shows an example of a conventional card-type board and connector connection structure. (A) to (D) of the figure are examples in which connection electrodes are formed on one side of the end of the card type substrate, and (E) to (G) are examples in which electrodes are formed on both sides.

【0003】 同図(A)はカード型基板端部の断面図であり、カード型基板10の端部上面 には接続用電極20が印刷等の手法により形成されている。FIG. 1A is a cross-sectional view of the end of the card type substrate, and the connection electrodes 20 are formed on the upper surface of the end of the card type substrate 10 by a method such as printing.

【0004】 同図(B)はコネクタの断面図であり、コネクタ30内に接触用のバネ50を 有する導体で作られた接続用端子40が組込まれている。なお、コネクタ30の 本体部(ケース)は絶縁体により形成されている。また(A)(B)両図間の矢 印はカード型基板10の端部をコネクタ30に挿入する方向を示している。FIG. 1B is a cross-sectional view of the connector, in which the connecting terminal 40 made of a conductor having a contact spring 50 is incorporated in the connector 30. The main body (case) of the connector 30 is made of an insulator. The arrows between (A) and (B) show the direction in which the end of the card type substrate 10 is inserted into the connector 30.

【0005】 同図(C)はコネクタ30にカード型基板10の端部が挿入された状態(接続 状態)を示す断面図である。カード型基板10の一端上面に形成された接続用電 極20に、接続用端子40先端のバネ50が圧接され、両者を電気的に接続させ ている。FIG. 1C is a cross-sectional view showing a state where the end of the card type substrate 10 is inserted into the connector 30 (connection state). A spring 50 at the tip of the connecting terminal 40 is pressed against the connecting electrode 20 formed on the upper surface of one end of the card type substrate 10 to electrically connect them.

【0006】 また同図(E)ないし(G)に、カード型基板10端部の上下両面に接続用電 極20が形成された接続構造の例を、上記と同様に各断面図で示す。Further, FIGS. 6 (E) to 6 (G) each show an example of a connecting structure in which connecting electrodes 20 are formed on both upper and lower surfaces of the end portion of the card type substrate 10 in the same sectional views as the above.

【0007】 同図(E)に示すような両面に電極20を有するカード型基板10の端部が、 同図(F)に示すような上下に接続用端子40を設けたコネクタ30内に、矢印 方向に挿入され、同図(G)に示すような接続状態で互いに接触する。The end portion of the card type substrate 10 having the electrodes 20 on both sides as shown in FIG. 2E is inserted into the connector 30 provided with the connecting terminals 40 at the top and bottom as shown in FIG. Inserted in the direction of the arrow, they contact each other in the connected state as shown in FIG.

【0008】 なお同図(D)は、同図(A)に示すカード型基板10の接続用電極20が形 成された端部を上方から見た状態を示す平面図である。複数の電極20が平行に 挿入方向に向け形成されている。上述した両面式のカード型基板であれば、この ような接続用電極が上下両面に形成される。また、図には示さないが、カード型 基板の複数方向に、上記と同様のコネクタとの接続電極部が設けられる場合もあ り、一方のコネクタにカード型基板の一端を挿入した後、カード型基板の他方に 他のコネクタをカード型基板の他端部がコネクタ内に挿入されるよう差込む等の 方式がとられることもある。It should be noted that FIG. 3D is a plan view showing a state in which the end portion of the card type substrate 10 shown in FIG. A plurality of electrodes 20 are formed in parallel in the insertion direction. In the case of the above-mentioned double-sided card type substrate, such connecting electrodes are formed on both upper and lower surfaces. Although not shown in the figure, there are cases where the same connection electrode parts as the above are provided on the card type board in multiple directions, and after inserting one end of the card type board into one connector, the card In some cases, another connector may be inserted into the other side of the die substrate such that the other end of the card die substrate is inserted into the connector.

【0009】[0009]

【考案が解決しようとする課題】[Problems to be solved by the device]

例えば、このようなカード型基板を用いた機器等がより高性能になり、カード 型基板自体も高密度化等が推進されるにつれ、カード型基板に接続する配線数等 も増加する。 For example, as devices and the like using such a card type substrate become higher in performance and the card type substrate itself is made higher in density, the number of wirings connected to the card type substrate also increases.

【0010】 しかしながら、上述したような従来の接続構造では、例えばカード型基板の接 続用電極の幅や間隔を縮小し密度を上げて本数を増やすにしても、精度上の問題 などがあり、接続可能な配線数等に当然限界が生じる。このため、例えばカード 型基板の端部以外にも接続ピン等を突設し、高密度コネクタ等を接続するなどの 方法も併用せざるを得なくなる。However, in the conventional connection structure as described above, for example, even if the width and interval of the connection electrodes of the card type substrate are reduced to increase the density to increase the number, there is a problem in accuracy. Naturally, there is a limit to the number of wires that can be connected. For this reason, for example, it is inevitable to use a method in which a connection pin or the like is provided in a protrusion other than the end portion of the card type substrate and a high density connector or the like is connected.

【0011】 ところがこうした方法では、上述したような従来のカード型基板の端部に電極 を形成してコネクタに挿入する方法と比較し、カード型基板や機器自体の構成も 複雑になり、製造工数も増して高価になるなどの問題が生じる。However, in such a method, as compared with the above-described method of forming an electrode on the end portion of the card-type substrate and inserting the electrode into the connector, the configuration of the card-type substrate and the device itself becomes complicated, and the number of manufacturing steps is increased. There is a problem that it becomes more expensive and expensive.

【0012】 このため本考案では、接続可能な配線等の本数を大幅に増加させながら、製造 も比較的容易であり、カード型基板や機器も簡易に構成できるような、カード型 基板とコネクタの接続構造を提供することを目的とする。Therefore, according to the present invention, the number of connectable wires and the like is greatly increased, and the manufacturing is relatively easy, and the card-type board and the connector can be configured easily so that the card-type board and the connector can be easily configured. It is intended to provide a connection structure.

【0013】[0013]

【課題を解決するための手段】[Means for Solving the Problems]

このような目的を達成するため、本考案によるカード型基板とコネクタの接続 構造では、コネクタに挿入するカード型基板端部の接続用電極を挿入方向に対し 、複数段形成すると共に、これらの接続用電極に対応し、これらの電極と接続さ れるコネクタ内の接続用端子も複数段並設することを特徴とする。 In order to achieve such an object, in the connection structure of the card-type substrate and the connector according to the present invention, the connecting electrodes at the end of the card-type substrate to be inserted into the connector are formed in a plurality of stages in the insertion direction, and the connection electrodes are connected. It is characterized in that a plurality of connection terminals in the connector corresponding to the electrodes for use and connected to these electrodes are also arranged in parallel.

【0014】[0014]

【作用】[Action]

このようなカード型基板とコネクタの接続構造であれば、同等の接続用電極等 の幅や間隔であっても、挿入方向に対して形成される段数が2段であれば2倍、 3段であれば3倍・・の接続線数が得られるようになり、かつ製造方法や工数な どもさほど増大しなくて済む。 With such a connection structure of the card-type substrate and the connector, even if the widths and intervals of the connection electrodes and the like are the same, if the number of steps formed in the insertion direction is two, double or three steps. In that case, the number of connecting wires can be tripled, and the manufacturing method and man-hours do not have to be increased so much.

【0015】[0015]

【実施例】【Example】

図1は、この考案を適用した一実施例のカード型基板とコネクタの接続構造を 示す図である。同図の(A)ないし(D)はカード型基板端部の片面に接続用電 極が形成された例であり、(E)ないし(H)は両面に電極が形成された例であ る。 FIG. 1 is a diagram showing a connection structure of a card type substrate and a connector of an embodiment to which the present invention is applied. (A) to (D) of the figure are examples in which a connecting electrode is formed on one side of the end of the card type substrate, and (E) to (H) are examples in which electrodes are formed on both sides. ..

【0016】 同図(A)はカード型基板端部の断面図であり、カード型基板1の端部上面に は接続用電極2が複数段(例えば2段)に、例えば印刷等の手法により形成され ている。FIG. 1A is a cross-sectional view of the end of the card type substrate. The connection electrodes 2 are provided in a plurality of steps (for example, two steps) on the upper surface of the end of the card type substrate 1, for example, by a method such as printing. Has been formed.

【0017】 同図(B)はコネクタの断面図であり、コネクタ3内に、接触用のバネ5を有 する導体で作られた接続用端子4が、接続用電極2に対応して複数段並設されて いる。なおコネクタ3の本体部(ケース)は絶縁体により形成されている。また (A)(B)両図間の矢印はカード型基板1の端部をコネクタ3に挿入する方向 を示している。FIG. 1B is a sectional view of the connector, in which a connecting terminal 4 made of a conductor having a contact spring 5 is provided in a plurality of stages corresponding to the connecting electrode 2. They are installed side by side. The body (case) of the connector 3 is made of an insulator. The arrows between (A) and (B) indicate the direction in which the end of the card type substrate 1 is inserted into the connector 3.

【0018】 同図(C)はコネクタ3内にカード型基板1の端部が挿入された状態(接続状 態)を示す断面図である。カード型基板1の一端上面に複数段形成された接続用 電極2に、同じく複数段配設された接続用端子4先端のバネ5がそれぞれ対応し て圧接され、両者を電気的に接続させている。FIG. 1C is a sectional view showing a state (connection state) in which the end portion of the card type substrate 1 is inserted into the connector 3. The connecting electrodes 2 formed in a plurality of steps on the upper surface of one end of the card type substrate 1 are correspondingly pressed with the springs 5 at the tips of the connecting terminals 4 arranged in a plurality of steps to electrically connect the two. There is.

【0019】 同図(D)は、同図(A)に示すカード型基板1の接続用電極2が形成された 端部を上方から見た状態を示す平面図である。複数の電極2が平行に、かつ挿入 方向に向け複数段(例えば2段)に形成されている。なお、カード型基板1先端 側(同図右側)の段の電極からカード型基板内部へ引込む接続配線は、内側(同 図左側)の段の電極の間を通しても良いが、例えば同図に示すようなスルーホー ル6を用いて基板の裏面に導き配線するなども可能である。FIG. 3D is a plan view showing a state where the end portion of the card type substrate 1 shown in FIG. A plurality of electrodes 2 are formed in parallel and in a plurality of steps (for example, two steps) toward the insertion direction. The connection wiring drawn from the electrode on the tip side of the card type substrate 1 (the right side in the figure) to the inside of the card type substrate may pass between the electrodes on the inner side (the left side in the figure). It is also possible to use such a through hole 6 to lead the wiring to the back surface of the substrate and perform wiring.

【0020】 また、同図(E)ないし(H)にカード型基板1の上下両面に接続用電極2が 形成された接続構造の例を上記と同様に各断面図等で示す。In addition, FIGS. 6E to 6H show examples of a connecting structure in which the connecting electrodes 2 are formed on the upper and lower surfaces of the card type substrate 1, respectively, in the same manner as the above with the cross-sectional views.

【0021】 同図(E)に示す両面に複数段の電極2を有するカード型基板1の端部が、同 図(F)に示すような上下に同じく複数段の接続用端子4を対応して設けたコネ クタ3に、両図間に示す矢印方向に挿入され、同図(G)に示すような接続状態 で互いに接触する。The end portion of the card type substrate 1 having a plurality of electrodes 2 on both sides shown in FIG. 6E corresponds to the connection terminals 4 of the same upper and lower sides as shown in FIG. The connector 3 provided in the figure is inserted in the direction of the arrow shown between the figures, and contacts each other in the connected state as shown in FIG.

【0022】 同図(H)は、同図(E)に示す両面式のカード型基板1の接続用電極2が形 成された端部を上方から見た状態を示す平面図である。複数の電極2が平行に挿 入方向に向け複数段形成されている。このような接続用電極が下面にも同様に形 成されている。FIG. 2H is a plan view showing a state in which the end portion of the double-sided card type substrate 1 shown in FIG. A plurality of electrodes 2 are formed in parallel in parallel with each other in the insertion direction. Such a connecting electrode is similarly formed on the lower surface.

【0023】 このようにして、接続用電極や端子の配線本数を容易に数倍に増やすことが可 能になる。かつ、前述した従来の各種方法、例えば接続用電極等の幅や間隔を圧 縮したり、カード型基板内部にコネクタ接続用のピン等を突設したりする方法な どに比較し、製造工数の増加等もはるかに少なくて済み、またカード型基板や機 器自体等の外形寸法も小さく単純な構成にすることができる。In this way, it becomes possible to easily increase the number of wires of the connecting electrodes and terminals by several times. In addition, the man-hours required for manufacturing are compared with various conventional methods described above, such as the method of compressing the width and interval of the connecting electrodes and the like, and the method of protruding pins for connector connection inside the card type substrate. The increase in the number of devices is much smaller, and the external dimensions of the card-type board and the device itself are small, and a simple structure can be achieved.

【0024】 なお、図には示さないが、カード型基板の複数方向の端部に同様のコネクタと の接続電極部が設けられる場合においても、本考案が適用可能なことは言うまで もない。Although not shown in the drawing, it is needless to say that the present invention can be applied to a case where connection electrode portions with similar connectors are provided at ends of the card type substrate in a plurality of directions.

【0025】[0025]

【考案の効果】[Effect of the device]

カード型基板等の構成を大きく変更することなく、容易に接続用電極や端子の 配線本数を数倍に増やすことが可能になる。また従来の各種方法、例えば接続用 電極等の幅や間隔を圧縮したり、カード型基板内部にコネクタ接続用のピン等を 突設したりする方法などに比較し、製造工数の増加等もはるかに少なくて済む。 さらに、カード型基板の構造も単純にでき、厚みも増加させずに済むので、該基 板や機器自体等の外形寸法も小さく単純な構成にすることができる。 It is possible to easily increase the number of wirings of the connecting electrodes and terminals several times without significantly changing the configuration of the card type substrate or the like. In addition, compared to various conventional methods, such as compressing the width and spacing of the connecting electrodes, or projecting pins for connector connection inside the card-type board, the number of manufacturing steps will increase. Very few. Furthermore, since the structure of the card type substrate can be simplified and the thickness does not need to be increased, the external dimensions of the substrate, the device itself, etc. can be made small and a simple structure can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案を適用した一実施例のカード型基板とコ
ネクタとの接続構造を示す図である。
FIG. 1 is a diagram showing a connection structure between a card type substrate and a connector according to an embodiment of the present invention.

【図2】従来のカード型基板とコネクタの接続構造を示
す図である。
FIG. 2 is a diagram showing a connection structure of a conventional card type substrate and a connector.

【符号の説明】[Explanation of symbols]

1 カード型基板 2 接続用電極 3 コネクタ 4 接続用端子 5 バネ 6 スルーホール 1 card type substrate 2 connection electrode 3 connector 4 connection terminal 5 spring 6 through hole

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 カード型基板の、接続用電極を形成した
端部をコネクタに挿入することにより、このコネクタ内
に設けた接続用端子と前記接続用電極とが接触し、電気
的に接続される構造を有するカード型基板及びコネクタ
において、 前記接続用電極をカード型基板の挿入方向に対し、複数
段形成すると共に、これらの接続用電極に対応して前記
コネクタ内の接続用端子も複数段並設したことを特徴と
するカード型基板とコネクタの接続構造。
1. A card-type substrate is inserted into a connector at an end portion on which a connecting electrode is formed, so that the connecting terminal provided in the connector and the connecting electrode are brought into contact with each other to be electrically connected. In a card-type board and a connector having a structure, the connection electrodes are formed in a plurality of steps in the insertion direction of the card-type board, and the connection terminals in the connector are also provided in a plurality of steps corresponding to the connection electrodes. A connection structure of a card type substrate and a connector, which are arranged side by side.
JP9082391U 1991-11-06 1991-11-06 Connection structure of card type board and connector Pending JPH0543489U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9082391U JPH0543489U (en) 1991-11-06 1991-11-06 Connection structure of card type board and connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9082391U JPH0543489U (en) 1991-11-06 1991-11-06 Connection structure of card type board and connector

Publications (1)

Publication Number Publication Date
JPH0543489U true JPH0543489U (en) 1993-06-11

Family

ID=14009315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9082391U Pending JPH0543489U (en) 1991-11-06 1991-11-06 Connection structure of card type board and connector

Country Status (1)

Country Link
JP (1) JPH0543489U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8187038B2 (en) 2009-07-24 2012-05-29 Denso Corporation Card edge connector and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8187038B2 (en) 2009-07-24 2012-05-29 Denso Corporation Card edge connector and method of manufacturing the same

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