JPH0541030Y2 - - Google Patents

Info

Publication number
JPH0541030Y2
JPH0541030Y2 JP1985170603U JP17060385U JPH0541030Y2 JP H0541030 Y2 JPH0541030 Y2 JP H0541030Y2 JP 1985170603 U JP1985170603 U JP 1985170603U JP 17060385 U JP17060385 U JP 17060385U JP H0541030 Y2 JPH0541030 Y2 JP H0541030Y2
Authority
JP
Japan
Prior art keywords
card
electrode plates
circuit board
integrated circuit
battery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985170603U
Other languages
Japanese (ja)
Other versions
JPS6278472U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985170603U priority Critical patent/JPH0541030Y2/ja
Publication of JPS6278472U publication Critical patent/JPS6278472U/ja
Application granted granted Critical
Publication of JPH0541030Y2 publication Critical patent/JPH0541030Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】 <技術分野> 本考案は、メモリ内容を保護するための十分な
容量のバツクアツプ用電源を備えたICカードに
関するものである。
[Detailed Description of the Invention] <Technical Field> The present invention relates to an IC card equipped with a backup power source of sufficient capacity to protect memory contents.

<従来技術> ICカードには、内蔵メモリに揮発性のランダ
ム・アクセス・メモリRAMを採用したものがあ
るが、この場合、該RAMの記憶データを揮発さ
せないため、前記RAMに電力を供給するバツク
アツプ用電池が不可欠となる。
<Prior art> Some IC cards employ volatile random access memory RAM as their built-in memory, but in this case, in order to prevent the data stored in the RAM from volatilizing, the batteries are essential.

しかし、ICカードのセツト厚は0.76m/mと規
定されているから、バツクアツプ用として充分な
容量の電池を確保することは困難である。
However, since the set thickness of an IC card is specified as 0.76 m/m, it is difficult to secure a battery with sufficient capacity for backup.

<考案の目的> 本考案は、上記の事情に鑑み、電池構造を形成
するカードにICカードに必要な回路基板とLSIチ
ツプを実装させ、電池の容量を上昇させて、該
ICチツプのメモリを長時間バツクアツプできる
ようにすることを目的とする。
<Purpose of the invention> In view of the above circumstances, the present invention increases the capacity of the battery by mounting the circuit board and LSI chip necessary for an IC card on the card forming the battery structure.
The purpose is to enable long-term backup of IC chip memory.

<実施例> 以下、本考案を図面を参照しつつ説明する。<Example> The present invention will now be described with reference to the drawings.

第1図は本考案の実施例に係るICカードの平
面図であり、図示する如く、カード本体1は書き
込み用、又は読み出し用端子2を有している。
FIG. 1 is a plan view of an IC card according to an embodiment of the present invention, and as shown, a card body 1 has a writing or reading terminal 2. As shown in FIG.

第2図が本実施例のICカードの断面構造図で
あつて、相対向する正(+)電極板(Sus)3と
負(−)電極板(Sus)4で固定電解(セパレー
ターを兼ねる)5が挟持されている。これによつ
て、電池が形成されている。
Figure 2 is a cross-sectional structural diagram of the IC card of this example, in which a positive (+) electrode plate (Sus) 3 and a negative (-) electrode plate (Sus) 4 are used for fixed electrolysis (also serving as a separator). 5 is being held. This forms a battery.

又、両電極板3,4の間隔はシール剤6a,6
bで規制されており、前記固体電解5は、該両電
極板3,4及び前記シール剤6a,6bで封止さ
れている。
Moreover, the distance between both electrode plates 3 and 4 is determined by sealants 6a and 6.
The solid electrolyte 5 is sealed with the electrode plates 3 and 4 and the sealants 6a and 6b.

前記シール材6bは、両電極板3,4の端に設
けられた前記シール材6aと異なり、ICカード
本体1の内部(内側)に設けられているが、これ
は、該シール材6bが前記固体電解5と接触して
いない方の両電極板3,4で形成された間〓部分
7に、ICカードとして必要な回路基板PWB8及
びLSIチツプ(CPU及びRAMを有する)9を実
装するためである。
The sealing material 6b is provided inside (inside) the IC card body 1, unlike the sealing material 6a provided at the ends of both electrode plates 3 and 4. This is to mount a circuit board PWB 8 and an LSI chip (having a CPU and RAM) 9 necessary for an IC card in the space 7 formed by the two electrode plates 3 and 4 that are not in contact with the solid electrolyte 5. be.

なお、10は絶縁層であつて、前記正電極板
3、前記負電極板4並びに前記回路基板8及び
LSIチツプ9間のシヨートを防いでいる。
In addition, 10 is an insulating layer, and the said positive electrode plate 3, the said negative electrode plate 4, the said circuit board 8, and
This prevents shots between LSI chips 9.

前記電池の電力は、図示しない配線により、前
記LSIチツプのRAMに供給される。
Power from the battery is supplied to the RAM of the LSI chip through wiring (not shown).

なお、前記正電極板3の外側には上装飾用デイ
スプレイフイルム11が貼付され、又、前記負電
極板4の外側には下装飾用デイスプレイフイルム
12が貼付される。
An upper decorative display film 11 is attached to the outer side of the positive electrode plate 3, and a lower decorative display film 12 is attached to the outer side of the negative electrode plate 4.

第3図は本実施例のICカードの電池領域(斜
線部分)Pを示すもので、回路部品が実装された
部分を除いて全てが電池となつている。なお、一
点鎖線X−X′に沿うて切断されると第2図の通
りになる。
FIG. 3 shows the battery area (shaded area) P of the IC card of this embodiment, and the entire area except the area where circuit components are mounted is a battery. Note that when cut along the dashed line X-X', the result is as shown in FIG.

<効果> 以上の様に本考案のICカードによれば、略IC
カード全体を覆う相対向する正及び負の電極板
と、前記両電極板で挟持された電解部と、前記電
解部から更に前記両電極板を延長した延長部分
と、前記両電極に挟まれた部分に設けた、前記電
解部を封止する封止部材と、前記封止部材により
前記電解部と分離された前記延長部分の間隔に実
装した回路基板及び集積回路チツプと、前記両電
極板のいずれかに、前記回路基板への接続端子を
挿入させるための開口部分とを設け、前記開口部
分の下部に前記回路基板及び前記集積回路チツプ
を位置させているので、集積回路チツプのメモリ
のバツクアツプ用として充分な容量の電池が得ら
れ、バツクアツプ時間の大幅な延長が計れ、電池
構造がICカードと一体になつている効果がある
以外に、電池電極部が回路基板及び集積回路チツ
プをシールドすることとなり、外部からの静電気
から回路基板及び集積回路チツプの保護を行い、
開口部分を介して表面に表れている回路基板及び
集積回路チツプも、開口部分が金属性の電極板に
設けられているために、静電気に対するシールド
対策が行われているという効果があるものであ
り、構造が簡単で、安価に製造できる。
<Effects> As described above, according to the IC card of the present invention, approximately IC
Opposing positive and negative electrode plates that cover the entire card, an electrolytic part sandwiched between the two electrode plates, an extension part that extends both the electrode plates further from the electrolytic part, and an extended part sandwiched between the two electrodes. a sealing member provided in the section for sealing the electrolytic section; a circuit board and an integrated circuit chip mounted in a space between the extended section separated from the electrolytic section by the sealing member; An opening for inserting a connection terminal to the circuit board is provided in one of the openings, and the circuit board and the integrated circuit chip are located below the opening, so that the memory of the integrated circuit chip can be backed up. In addition to being able to obtain a battery with sufficient capacity for use, significantly extending backup time, and integrating the battery structure with the IC card, the battery electrode part shields the circuit board and integrated circuit chip. Therefore, we protect circuit boards and integrated circuit chips from external static electricity.
The circuit board and integrated circuit chip exposed to the surface through the opening have the effect of being shielded against static electricity because the opening is provided on a metal electrode plate. , has a simple structure and can be manufactured at low cost.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の適用されるICカードの平面
図、第2図は本考案の実施例に係るICカードの
断面構造図、第3図は同ICカードの構成の説明
に供する図である。 1……ICカード本体、3……正電極板、4…
…負電極板、5……固体電解、8……回路基板、
9……LSIチツプ。
Fig. 1 is a plan view of an IC card to which the present invention is applied, Fig. 2 is a cross-sectional structural diagram of an IC card according to an embodiment of the present invention, and Fig. 3 is a diagram for explaining the structure of the IC card. . 1... IC card body, 3... Positive electrode plate, 4...
...Negative electrode plate, 5...Solid electrolyte, 8...Circuit board,
9...LSI chip.

Claims (1)

【実用新案登録請求の範囲】 略ICカード全体を覆う相対向する正及び負の
電極板と、 前記両電極板で挟持された電解部と、 前記電解部から更に前記両電極板を延長した延
長部分と、 前記両電極に挟まれた部分に設けた、前記電解
部を封止する封止部材と、 前記封止部材により前記電解部と分離された前
記延長部分の間隔に実装した回路基板及び集積回
路チツプと、 前記両電極板のいずれかに、前記回路基板への
接続端子を挿入させるための開口部分とを設け、 前記開口部分の下部に前記回路基板及び前記集
積回路チツプを位置させたことを特徴とするIC
カード。
[Claims for Utility Model Registration] Positive and negative electrode plates facing each other that cover substantially the entire IC card, an electrolytic part sandwiched between the two electrode plates, and an extension of the two electrode plates further extending from the electrolytic part. a sealing member provided in a portion sandwiched between the electrodes and sealing the electrolytic part; a circuit board mounted in a space between the extended part separated from the electrolytic part by the sealing member; an integrated circuit chip, and an opening for inserting a connection terminal to the circuit board in either of the electrode plates, and the circuit board and the integrated circuit chip are positioned below the opening. An IC characterized by
card.
JP1985170603U 1985-11-05 1985-11-05 Expired - Lifetime JPH0541030Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985170603U JPH0541030Y2 (en) 1985-11-05 1985-11-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985170603U JPH0541030Y2 (en) 1985-11-05 1985-11-05

Publications (2)

Publication Number Publication Date
JPS6278472U JPS6278472U (en) 1987-05-19
JPH0541030Y2 true JPH0541030Y2 (en) 1993-10-18

Family

ID=31105476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985170603U Expired - Lifetime JPH0541030Y2 (en) 1985-11-05 1985-11-05

Country Status (1)

Country Link
JP (1) JPH0541030Y2 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58187855U (en) * 1982-06-07 1983-12-13 セイコーインスツルメンツ株式会社 ID system
JPS60100863U (en) * 1983-12-14 1985-07-09 三菱電機株式会社 IC built-in card

Also Published As

Publication number Publication date
JPS6278472U (en) 1987-05-19

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