JPH0539899U - Board edge splitting jig - Google Patents
Board edge splitting jigInfo
- Publication number
- JPH0539899U JPH0539899U JP9781291U JP9781291U JPH0539899U JP H0539899 U JPH0539899 U JP H0539899U JP 9781291 U JP9781291 U JP 9781291U JP 9781291 U JP9781291 U JP 9781291U JP H0539899 U JPH0539899 U JP H0539899U
- Authority
- JP
- Japan
- Prior art keywords
- base
- gap
- plate
- width
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
(57)【要約】 (修正有)
【目的】 集合回路基板から分割溝に沿って切除される
耳部の厚さと幅が違っても、耳部挿入溝の幅と深さを自
在に調整可能とする。
【構成】 基台51上に立設された門形の可動枠部材5
2と平行に板状の固定部材53を設け、その間に間隙を
形成し、板状可動部材52の移動により、前記間隙の幅
を調整可能とする。さらに、基台51上に底面形成部材
55を設け、その上面で前記間隙の底面を形成する。底
面形成部材55の下に楔状の高さ調整部材57挿入し、
その挿入深さを変えることで底面形成部材55の上面の
高さを調節し、前記の間隙の深さを調整可能とする。
(57) [Summary] (Modified) [Purpose] The width and depth of the ear insertion groove can be adjusted freely even if the thickness and width of the ear cut from the collective circuit board along the dividing groove are different. And [Configuration] A gate-shaped movable frame member 5 erected on a base 51
A plate-shaped fixing member 53 is provided in parallel with the plate 2, and a gap is formed between them, and the width of the gap can be adjusted by moving the plate-shaped movable member 52. Further, a bottom surface forming member 55 is provided on the base 51, and the bottom surface of the gap is formed on the upper surface thereof. Insert a wedge-shaped height adjusting member 57 under the bottom surface forming member 55,
By changing the insertion depth, the height of the upper surface of the bottom surface forming member 55 is adjusted, and the depth of the gap can be adjusted.
Description
【0001】[0001]
本考案は混成集積回路を製造する際に用いられる治具に関し、特に混成集積回 路用集合基板の耳部を折って分割するための基板耳部分割用治具の改良に関する 。 The present invention relates to a jig used for manufacturing a hybrid integrated circuit, and more particularly to an improvement of a board edge splitting jig for folding and splitting an edge of a hybrid integrated circuit collective board.
【0002】[0002]
一般に、回路用基板上に配線パターンを形成すると共に回路部品を登載して混 成集積回路基板を製造する場合、図4に示す様に、板状のセラミックやガラス− エポキシ樹脂等の絶縁基板からなる集合回路基板30が作られ、この集合回路基 板30には、その厚みの約半分程度の深さの分割用溝(スリット)31、31… が縦横に形成される。この集合回路基板30は、前記分割溝31によって混成集 積回路用基板35と耳部36、36…とに区切られている。この混成集積回路用 基板35は、その周囲の分割用溝31に沿って耳部36、36…を折除し、さら には、図示されない分割用溝に沿って分割されることにより、個々の混成集積回 路用基板に分割される。 Generally, when a wiring pattern is formed on a circuit board and circuit components are mounted to manufacture a hybrid integrated circuit board, as shown in FIG. 4, a plate-shaped ceramic or glass-epoxy resin insulating board is used. .. is formed, and dividing grooves (slits) 31 having a depth of about half the thickness thereof are formed in the vertical and horizontal directions on the collective circuit substrate 30. The integrated circuit board 30 is divided by the dividing groove 31 into a hybrid integrated circuit board 35 and ears 36, 36, .... This hybrid integrated circuit substrate 35 is formed by dividing the ears 36, 36 ... along the dividing groove 31 around the substrate 35, and further by dividing along the dividing groove (not shown). Divided into hybrid integrated circuit boards.
【0003】 従来、この様な混成集積回路用集合基板30から耳部36、36…を折除する ために、図5に示すような正面形が略「凸」形を呈する基板耳部分割用治具40 が用いられていた。この基板耳部分割用治具40は、その頂面部43に前記耳部 36、36…を挿入する溝44が設けられている。Conventionally, in order to break off the ears 36, 36, ... From the hybrid integrated circuit collective substrate 30 as described above, the ears are divided as shown in FIG. The jig 40 was used. This substrate edge splitting jig 40 is provided with a groove 44 on the top surface 43 thereof for inserting the above-mentioned ears 36, 36 ...
【0004】 この基板耳部分割用治具40を使って、前記集合基板30から分割用溝31に 沿って耳部36を折り、分割するには、例えば、次のような方法で行われる。ま ず、前記基板耳部分割用治具40に形成された耳挿入溝44に集合基板30の折 除しようとする耳部36を挿入する。次に、前記集合基板30の本体を一方の手 で押え、他方の手は前記基板耳部分割用治具40を持ち、前記集合回路基板30 と前記基板耳部分割用治具の一方または双方を曲げることにより、前記分割用溝 31が開く方向に集合基板30を撓ませ、同分割用溝31に沿って前記耳部36 を折り、分割する。Using the substrate edge dividing jig 40 to fold and divide the edge portion 36 from the collective substrate 30 along the dividing groove 31 is performed, for example, by the following method. First, the ears 36 to be broken of the collective substrate 30 are inserted into the ears insertion groove 44 formed in the substrate ears dividing jig 40. Next, the main body of the aggregate board 30 is held by one hand, and the other hand holds the board edge dividing jig 40, and one or both of the aggregate circuit board 30 and the board ear dividing jig. Is bent to bend the collective substrate 30 in the direction in which the dividing groove 31 is opened, and the ear portion 36 is folded along the dividing groove 31 to divide it.
【0005】[0005]
しかしながら、上述した従来の耳部分割用治具を使って混成集積回路用集合基 板から耳部を分割しようとする場合、製造される混成集積回路用集合基板の耳部 の寸法、特に、その厚さや幅が異なっていると、それに対応した溝幅と溝深さを 有する基板耳部分割用治具が個別に必要となる。このため、混成集積回路用集合 基板を製造する場合は、個別に基板耳部分割用治具を作って予め用意しておかな ければならず、その製作のための期間や費用等により、製品の製造期間が長くな ったり、費用が製品のコストに転嫁される等の課題があった。。 However, when the ear is to be separated from the composite integrated circuit aggregate substrate using the conventional ear segment dividing jig described above, the size of the ear of the composite integrated circuit aggregate substrate to be manufactured, in particular, If the thickness and the width are different, it is necessary to individually provide a jig for dividing the edge portion of the substrate, which has a groove width and a groove depth corresponding thereto. For this reason, when manufacturing a collective substrate for a hybrid integrated circuit, it is necessary to separately prepare jigs for dividing the tabs of the substrate and prepare them in advance. There were problems such as the longer manufacturing period and the cost being passed on to the cost of the product. .
【0006】 そこで本考案は、このような従来技術の課題に鑑み、混成集積回路用集合基板 の耳部の幅や厚さの違いに応じて耳部挿入溝の幅や深さを適宜調整することの可 能な基板耳部分割用治具を提供することを目的とする。In view of the above problems of the prior art, the present invention appropriately adjusts the width and depth of the ear insertion groove according to the difference in the width and thickness of the ear of the composite integrated circuit aggregate substrate. It is an object of the present invention to provide a jig for dividing the edge portion of a substrate that can be used.
【0007】[0007]
ずなわち、前記の目的を達成するため、本考案では、基台と、前記基台上に設 置された板状の固定部材と、前記板状固定部材と間隔をおいて平行に立設される と共に、基台の上面に沿って移動可能に取り付けられた門形の可動枠部材と、該 可動枠部材と前記板状固定部材との間隙の底面を形成するよう基台上に設置され 、底面が基台に対して勾配を有する底面形成部材と、前記底面形成部材の底面と 基台の上面との間に挿入され、前記底面形成部材の底面と等しい勾配を有する楔 形の深さ調整部材とを備えたことを特徴とする基板耳部分割用治具を提供する。 In other words, in order to achieve the above-mentioned object, in the present invention, a base, a plate-shaped fixing member installed on the base, and a plate-like fixing member that is installed upright in parallel with each other at a distance. And a gate-shaped movable frame member that is movably attached along the upper surface of the base, and is installed on the base so as to form a bottom surface of a gap between the movable frame member and the plate-shaped fixed member. A bottom surface forming member whose bottom surface has a slope with respect to the base, and a wedge-shaped depth inserted between the bottom surface of the bottom surface forming member and the top surface of the base and having a slope equal to that of the bottom surface forming member. Provided is a jig for dividing a substrate edge portion, which is provided with an adjusting member.
【0008】[0008]
前記の本考案による基板耳分割用治具によれば、分割折除すべき混成集積回路 用集合基板の耳部の厚さの違いに対しては、板状固定部材に対向して平行に取り 付けられた可動枠部材を移動し、板状固定部材と可動枠部材との間の間隙の幅を 調節することで対応することができる。また、前記混成集積回路用集合基板の耳 部の幅に対しては、前記深さ調整部材の底面形成部材の下への挿入深さを調整し 、底面形成部材を昇降させることにより、前記板状固定部材と可動枠部材との間 の間隙の深さを調節することで対応が可能である。 According to the above-described substrate edge dividing jig of the present invention, the difference in the thickness of the edge portion of the composite integrated circuit collective substrate to be divided and folded is taken parallel to the plate fixing member. This can be dealt with by moving the attached movable frame member and adjusting the width of the gap between the plate-shaped fixed member and the movable frame member. Further, with respect to the width of the ear portion of the composite integrated circuit aggregate substrate, the depth of the depth adjusting member inserted below the bottom face forming member is adjusted, and the bottom face forming member is moved up and down to move the plate. This can be dealt with by adjusting the depth of the gap between the fixed member and the movable frame member.
【0009】[0009]
以下、本考案の実施例について、図面を参照しながら、詳細に説明する。 図1に示すように、板状の基台51の上には、その幅方向に亙って固定枠部材 53が一体に立設されている。この固定部材53の基部両側には、基台51の上 面との間にコ字形の凹部54が形成されている。 さらに、前記固定枠部材53の後方、つまり図1の右側には、前記固定枠部材 53に対向して平行に門形の可動部材52が乗せられており、固定部材53と可 動部材52との間に上下に一定の幅の図2で示すような間隙Gが形成される。可 動部材52の基部58、58は、基台1の前後方向、すなわち図1において左右 方向に一定の高さで伸びており、この基部58、58が固定部材53の下部両側 に形成された前記凹部54にスライド自在に嵌め込まれている。従って、可動部 材52は、基部58、58の長手方向にスライド移動し、前記間隙Gの幅が可変 できるようになっている。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. As shown in FIG. 1, on a plate-shaped base 51, a fixed frame member 53 is integrally provided upright over the width direction thereof. U-shaped recesses 54 are formed between the upper surface of the base 51 and both sides of the base of the fixing member 53. Further, on the rear side of the fixed frame member 53, that is, on the right side of FIG. 1, a gate-shaped movable member 52 is placed in parallel to face the fixed frame member 53, and the fixed member 53 and the movable member 52 are provided. Between them, a gap G having a constant width is formed vertically as shown in FIG. The base parts 58, 58 of the movable member 52 extend at a constant height in the front-back direction of the base 1, that is, in the left-right direction in FIG. 1, and the base parts 58, 58 are formed on both lower sides of the fixing member 53. It is slidably fitted in the recess 54. Therefore, the movable member 52 is slidable in the longitudinal direction of the bases 58, 58 so that the width of the gap G can be changed.
【0010】 また、前記門形の可動枠部材52の内側には、底面形成部材55が挿入され、 これが前記板状の固定部材53に当たっており、この底面形成部材55の上面に よって前記間隙Gの底面が形成される。この立方形状の底面形成部材55は、前 記門形の可動枠部材52の内側幅寸法より僅かに狭い幅を有している。前記間隙 Gの底面を形成する底面形成部材55の上面は平面であるが、その底面は、基台 51の上面に対して20°前後の勾配を有している。A bottom surface forming member 55 is inserted inside the gate-shaped movable frame member 52, which abuts against the plate-shaped fixing member 53. The top surface of the bottom surface forming member 55 allows the gap G to be formed. The bottom surface is formed. The cubic bottom surface forming member 55 has a width slightly smaller than the inner width dimension of the gate-shaped movable frame member 52. The top surface of the bottom surface forming member 55 forming the bottom surface of the gap G is a flat surface, and the bottom surface has a slope of about 20 ° with respect to the top surface of the base 51.
【0011】 2本の角棒からなる挟持部材56、56が前記基部58、58の内側であって 、前記門形の可動枠部材52に対して板状の固定部材53の反対側に取り付けら れる。 前記基部58、58はこの挟持部材56、56の切り欠き部に係合され、この 挟持部材56、56と前記板状の固定部材53とで前記底面形成部材55を挟ん でいる。これにより、底面形成部材55は上下には移動可能であるが、前後方向 へは前記板状の固定部材53と挟持部材56、56とによって挟まれ、動きが規 制されている。A sandwiching member 56, 56 composed of two square bars is attached to the inside of the base 58, 58 on the opposite side of the plate-shaped fixing member 53 with respect to the gate-shaped movable frame member 52. Be done. The bases 58, 58 are engaged with the notches of the holding members 56, 56, and the bottom forming member 55 is held between the holding members 56, 56 and the plate-shaped fixing member 53. As a result, the bottom surface forming member 55 is vertically movable, but is regulated in the front-rear direction by being sandwiched by the plate-like fixing member 53 and the sandwiching members 56, 56.
【0012】 さらに、前記底面形成部材55の下には、前記挟持部材56、56の間から楔 形の深さ調整部材57が挿入されている。この深さ調整部材57の幅は、前記2 本の角棒からなる挟持部材56、56の間隔より僅かに狭くなっており、そのた 図1に矢印で示す方向に移動可能となっている。この深さ調整部材57の底面は 、基台51の上面に密着しており、その上面は、前記底面形成部材55の底面と 等しい勾配を有し、同底面と密着している。Further, below the bottom face forming member 55, a wedge-shaped depth adjusting member 57 is inserted between the sandwiching members 56, 56. The width of the depth adjusting member 57 is slightly narrower than the distance between the sandwiching members 56, 56 composed of the two square rods, and is movable in the direction indicated by the arrow in FIG. The bottom surface of the depth adjusting member 57 is in close contact with the upper surface of the base 51, and the upper surface thereof has the same gradient as the bottom surface of the bottom surface forming member 55 and is in close contact with the same bottom surface.
【0013】 基板耳部分割用治具50において、図2に示す間隙Gの深さDを小さくする場 合、同図(a)に示すように、前記深さ調整部材57を図において左方向(矢印 )に移動させる。これにより、図2の(b)に示すように、前記深さ調整部材5 7の勾配によって前記底面形成部材55が上方に移動し、間隙Gの底面を形成す る深さ調整部材57の上面の高さが高くなるため、間隙Gの深さDが浅くなる。 これに対し、前記深さ調整部材57を右方向に移動させれば、間隙Gの深さDが 深くなる。When the depth D of the gap G shown in FIG. 2 is reduced in the board edge dividing jig 50, the depth adjusting member 57 is moved leftward in the drawing as shown in FIG. Move to (arrow). As a result, as shown in FIG. 2B, the bottom surface forming member 55 moves upward due to the gradient of the depth adjusting member 57, and the upper surface of the depth adjusting member 57 forming the bottom surface of the gap G. Since the height of the gap G becomes high, the depth D of the gap G becomes shallow. On the other hand, when the depth adjusting member 57 is moved rightward, the depth D of the gap G becomes deeper.
【0014】 さらに、間隙Gの幅dを狭くする場合は、図3の(a)に示すように、前記門 形の可動枠部材52を図において右側に移動する。これに伴い、前記板状の固定 部材53と前記門形の可動枠部材52との間隔、つまり間隙の幅dが狭くなる。 これに対して、溝Gの幅dを広げる場合には、前記門形の可動枠部材52を左側 に移動すればよい。Further, when the width d of the gap G is narrowed, as shown in FIG. 3A, the gate-shaped movable frame member 52 is moved to the right side in the drawing. Along with this, the distance between the plate-shaped fixed member 53 and the gate-shaped movable frame member 52, that is, the width d of the gap is narrowed. On the other hand, in order to increase the width d of the groove G, the gate-shaped movable frame member 52 may be moved to the left.
【0015】[0015]
以上の説明からも明かな様に、本考案による基板耳部分割用治具によれば、基 板耳部を挿入して分割するための間隙の幅や深さを自在に調節することが出来る ため、幅や厚さの違う集合回路基板の耳部について、各々専用の治具を用意する 必要が無くなるという効果が得られる。 As is clear from the above description, according to the substrate edge dividing jig according to the present invention, the width and depth of the gap for inserting and dividing the substrate edge can be freely adjusted. Therefore, it is possible to obtain an effect that it is not necessary to prepare a dedicated jig for each ear portion of the collective circuit board having different widths and thicknesses.
【図1】本考案による基板耳部分割用治具の構造を示す
分解斜視図である。FIG. 1 is an exploded perspective view showing the structure of a substrate edge dividing jig according to the present invention.
【図2】前記の基板耳部分割用治具の溝の深さの調節操
作を説明する側面図である。FIG. 2 is a side view for explaining an adjusting operation of the depth of the groove of the jig for dividing the substrate edge portion.
【図3】前記の基板耳部分割用治具の溝の幅の調節操作
を説明する側面図である。FIG. 3 is a side view for explaining an operation of adjusting the width of the groove of the jig for dividing the substrate edge portion.
【図4】基板耳部分割治具によってその耳部が分割折除
される集合回路基板の一例を示す図である。FIG. 4 is a diagram showing an example of a collective circuit board in which the ears are divided and folded by a board ears division jig.
【図5】従来技術による基板耳部分割用治具を示す斜視
図である。FIG. 5 is a perspective view showing a jig for dividing a substrate edge portion according to a conventional technique.
50 基板耳部分割用治具 51 基台 52 可動枠部材 53 固定部材 55 底面形成部材 56 挟持部材 57 深さ調整部材 50 Board Edge Separation Jig 51 Base 52 Movable Frame Member 53 Fixing Member 55 Bottom Forming Member 56 Clamping Member 57 Depth Adjusting Member
Claims (1)
固定部材と、前記板状固定部材と間隔をおいて平行に立
設されると共に、基台の上面に沿って移動可能に取り付
けられた門形の可動枠部材と、該可動枠部材と前記板状
固定部材との間隙の底面を形成するよう基台上に設置さ
れ、底面が基台に対して勾配を有する底面形成部材と、
前記底面形成部材の底面と基台の上面との間に挿入さ
れ、前記底面形成部材の底面と等しい勾配を有する楔形
の深さ調整部材とを備えたことを特徴とする基板耳部分
割用治具。1. A base, a plate-shaped fixing member provided on the base, and a plate-shaped fixing member that are erected parallel to each other at a distance and move along an upper surface of the base. A movable frame member that is mounted so that it is possible, and a bottom surface that is installed on the base so as to form a bottom surface of a gap between the movable frame member and the plate-shaped fixing member, and the bottom surface has a slope with respect to the base. A forming member,
A substrate edge separating jig, which is inserted between a bottom surface of the bottom surface forming member and an upper surface of a base and has a wedge-shaped depth adjusting member having a slope equal to that of the bottom surface of the bottom surface forming member. Ingredient
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9781291U JP2505705Y2 (en) | 1991-10-31 | 1991-10-31 | Board edge separation jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9781291U JP2505705Y2 (en) | 1991-10-31 | 1991-10-31 | Board edge separation jig |
Publications (2)
Publication Number | Publication Date |
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JPH0539899U true JPH0539899U (en) | 1993-05-28 |
JP2505705Y2 JP2505705Y2 (en) | 1996-07-31 |
Family
ID=14202174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9781291U Expired - Lifetime JP2505705Y2 (en) | 1991-10-31 | 1991-10-31 | Board edge separation jig |
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JP (1) | JP2505705Y2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015009331A (en) * | 2013-06-28 | 2015-01-19 | 三星ダイヤモンド工業株式会社 | Break tool of brittle material substrate |
JP2015009496A (en) * | 2013-06-28 | 2015-01-19 | 三星ダイヤモンド工業株式会社 | Break tool of brittle material substrate |
JP2015009332A (en) * | 2013-06-28 | 2015-01-19 | 三星ダイヤモンド工業株式会社 | Break tool of brittle material substrate |
TWI620632B (en) * | 2013-06-28 | 2018-04-11 | Mitsuboshi Diamond Ind Co Ltd | Cutting tool for substrate of brittle material |
-
1991
- 1991-10-31 JP JP9781291U patent/JP2505705Y2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015009331A (en) * | 2013-06-28 | 2015-01-19 | 三星ダイヤモンド工業株式会社 | Break tool of brittle material substrate |
JP2015009496A (en) * | 2013-06-28 | 2015-01-19 | 三星ダイヤモンド工業株式会社 | Break tool of brittle material substrate |
JP2015009332A (en) * | 2013-06-28 | 2015-01-19 | 三星ダイヤモンド工業株式会社 | Break tool of brittle material substrate |
TWI620632B (en) * | 2013-06-28 | 2018-04-11 | Mitsuboshi Diamond Ind Co Ltd | Cutting tool for substrate of brittle material |
Also Published As
Publication number | Publication date |
---|---|
JP2505705Y2 (en) | 1996-07-31 |
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