JPH0538916U - Solid-state imaging device - Google Patents

Abstract

(57) [Abstract] [Purpose] To improve the flare characteristics of a solid-state imaging device and to improve the workability of attaching the flare prevention plate. [Structure] A flare prevention plate 12 is provided above a CCD element 11 disposed in a package, and the flare prevention plate 1 is provided at a position corresponding to an effective pixel area 11A of the CCD element.
The second opening is formed so as to expand downward. The opening surface of this opening portion faces downward in the effective pixel region 11A.
Even when the light incident from the upper side of the solid-state imaging device hits the aperture surface, the reflected light is set to be incident at a position outside the effective pixel region. Therefore, the CCD element can capture an image without being disturbed by the reflected light.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a solid-state image pickup device, and more particularly to a solid-state image pickup device provided with a flare prevention plate having a high flare prevention function.

[0002]

[Prior Art]

 Conventionally, as this type of solid-state imaging device, one shown in FIG. 3 is known. In the figure, A is a solid-state image pickup device, in which a CCD chip 2 is fixedly mounted in a package 1 formed of an insulating material and wired by a predetermined wire 3. A flare prevention plate 4 made of stainless steel is provided above the CCD chip 2, and a sealing glass 5 is provided above the flare prevention plate 4. As shown in FIG. 4, the flare prevention plate 4 has an opening formed at a position corresponding to the effective pixel area of the CCD chip 2.

[0003]

[Problems to be solved by the device]

 However, in such a conventional solid-state imaging device, since etching (wet etching) is performed from both upper and lower surfaces at the same time as a method of forming an opening in the flare prevention plate 4, etching masks on both upper and lower surfaces are used. The shape of the opening surface 4A as shown in FIG. 5 changes due to the deviation and slight difference in the etching conditions. With such a change in the cross-sectional shape of the opening surface 4A of the flare prevention plate 4, there is a problem that the flare characteristics are influenced by the mounting position of the flare prevention plate 4 on the package 1, the orientation of the flare prevention plate 4, and the like. there were. Further, there is a big problem in workability because work effort such as deciding the mounting direction is required in consideration of the cross-sectional shape of the opening surface 4A. In particular, the light incident on the opening surface 4A of the flare prevention plate 4 causes improper reflection due to its cross-sectional shape and is incident on the effective pixel area of the CCD chip 2 to disturb the image on the CCD, thereby causing flare characteristics. It has a problem that makes it worse.

The present invention has been made in view of such conventional problems, and intends to obtain a solid-state imaging device that improves flare characteristics and enhances workability of attaching the flare prevention plate. It is something.

[0005]

[Means for Solving the Problems]

 Therefore, the present invention provides a solid-state imaging device comprising a flare prevention plate having an opening for allowing light incidence above the effective pixel of the solid-state imaging device, wherein the opening of the flare prevention plate is the solid state. The solution to this problem is to incline the inner wall surface so that it expands toward the image sensor side.

[0006]

[Action]

 Since the opening of the flare prevention plate is widened toward the solid-state image sensor side, the light incident on the inner wall surface of the opening is prevented from entering the effective pixel area of the solid-state image sensor. Therefore, the flare characteristics of the solid-state imaging device are improved.

[0007]

【Example】

 Hereinafter, details of the solid-state imaging device according to the present invention will be described based on embodiments shown in the drawings.

1 and 2 show an embodiment of the present invention. In the solid-state imaging device according to the present embodiment, the configuration in which the flare prevention plate 12, sealing glass (not shown) and the like are provided above the CCD element 11 provided in the package (not shown) is the same as the above-described conventional example. The same is true. In the present embodiment, the opening of the flare prevention plate 12 opened corresponding to the effective pixel area 11A of the CCD element 11 is formed by expanding downward, and the opening surface which is the inner wall surface of the opening is formed. Are formed in a tapered shape.

In this embodiment, a resist mask is patterned only on the surface of the flare prevention plate 12 having a thickness of 0.2 mm, and etching is performed by using the resist mask as a mask, thereby expanding downward. The opening could be obtained. The spread angle (θ) shown in FIG. 2 is in the range of 20 ° to 45 °, and it is possible to prevent light incident from above from entering the effective pixel region 11A of the CCD element. As described above, in the present embodiment, it is possible to prevent the light incident from the oblique direction from the upper part of the package from being reflected on the opening surface of the flare prevention plate 12 and entering the effective pixel region 11A of the CCD element. It is possible to prevent a harmful effect that a spot-like image is generated on the image.

In addition, when the flare prevention plate 12 is attached to the package, it suffices that the surface with a large opening diameter faces downward and the effective pixel region 11A be assembled with attention to the plane shape (vertical and horizontal). Therefore, it becomes unnecessary to perform complicated work with small certainty as in the past. Therefore, the yield of products can be improved.

The other configurations of this embodiment are similar to those of the conventional example.

Although the embodiments have been described above, the present invention is not limited to this, and the gist of the configuration, that is, an opening for allowing light incidence is formed above the effective pixel of the solid-state imaging device. In the solid-state imaging device including the flare prevention plate, if the inner wall surface is inclined so that the opening of the flare prevention plate expands toward the solid-state imaging device side, the opening The processing method, dimensions, etc. of can be changed as appropriate.

[0013]

[Effect of the device]

 As is clear from the above description, according to the present invention, it is possible to prevent the improper light incident on the CCD element and improve the flare characteristics.

Further, in the present invention, there is an effect that the workability of attaching the flare prevention plate can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention.

FIG. 2 is a partially enlarged sectional view of the embodiment of the present invention.

FIG. 3 is a sectional view of a conventional solid-state imaging device.

FIG. 4 is a perspective view of a conventional flare prevention plate.

FIG. 5 is a partial cross-sectional view of a conventional flare prevention plate.

[Explanation of symbols]

11 ... CCD element, 11A ... Effective pixel area, 12 ... Flare prevention plate, 12A ... Opening surface.

Claims (1)

[Scope of utility model registration request] 1. A solid-state imaging device comprising a flare prevention plate having an opening for allowing light incidence above the effective pixel of the solid-state imaging device, wherein the opening of the flare prevention plate is the solid-state imaging device. A solid-state imaging device, wherein an inner wall surface is inclined so as to expand toward the side.