JPH0536895U - Forced air cooling structure for electronic devices - Google Patents

Abstract

(57) [Abstract] [Purpose] To reduce the variation in the air volume due to the location in the same substrate flow path and to improve the cooling efficiency without enlarging the shapes of the fan motor and the housing. A suction fan motor 4 is attached to one surface side of a housing 2 of an electronic device 1, and a discharge fan motor 5 is attached to the other surface side so as to face each other, and a honeycomb plate 7 is provided in the vicinity of the back surface of the suction fan motor 4. To arrange. When the length of each core 7a constituting the honeycomb plate 7 is made larger than the distance between the two surfaces of the core which face each other, the rectifying action of changing the turbulent flow of the honeycomb plate into a straight and uniform flow becomes more remarkable.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to a forced air cooling structure of an electronic device, such as a test head of an IC tester, on which a large number of printed circuit boards having electronic circuits are mounted and which generates a large amount of heat.

[0002]

[Prior Art]

 As shown in FIG. 2, the test head 1 of the IC tester includes a box-shaped housing 2 having a length L = 70 to 80 cm, a height H = 25 to 30 cm, and a width W = 40 to 70 cm in the front-rear direction. 30 to 40 printed circuit boards (50 × (20 to 25) cm) 3 called pin electronic cards are arranged in parallel in the width W direction and arranged in the front-rear direction. Suction fan motors 4a, 4b, 4c (4 is a generic name for these) are attached near the front plate 2a of the casing 2, respectively. Further, fan motors 5a, 5b, 5c for discharging (5 is a general term for these) are attached to the rear plate 2b side of the housing.

The thickness of the fan motors 4 and 5 in the front-rear direction is about 6 cm, and a distance of 5 to 6 cm is provided between the fan motors 4 and 5 and the printed circuit board 3. Ventilation holes 8 (8a, 8b, 8c) having substantially the same size as the outer diameter of the fan motor are formed in the front plate 2a and the rear plate 2b so as to face the fan motor. The forced air cooling method in which the suction fan and the discharge fan are installed in front of and behind the casing as shown in FIG. 2 is called a push-pull method.

[0004]

[Problems to be solved by the device]

 The spiral wind sucked by the fan motor 4 flows between the printed circuit boards 3 and is discharged to the outside by the fan motor 5. The spiral wind blown out by the fan motor 4 hits the plate surface of the printed circuit board 3 and is divided and flows in the inter-substrate flow path, but there is a part where the wind does not flow well due to the inter-substrate flow path. If there is a component that generates a large amount of heat by accident in a part where it is difficult to flow, the temperature of that component may exceed the allowable value, which may deteriorate the electrical characteristics of the component and therefore the circuit that contains it, or shorten the life of that component. there were.

In addition, if there is no portion where the wind does not flow easily, a large fan motor having a large air flow and thus a large electric power is used, and the space between the fan motors 4 and 5 and the print substrate 3 is increased. However, the test head 1 has a large outer shape, which is a problem. The purpose of the present invention is to solve such a conventional problem and to greatly reduce the variation in the air volume in the flow path between the substrates as compared with the conventional one without enlarging the shapes of the fan motor and the housing. It aims to provide a forced air cooling structure with good cooling efficiency.

[0006]

[Means for Solving the Problems]

 In the forced air cooling structure of the electronic device in which the suction fan motor is mounted on one side of the housing of the electronic device and the discharge fan motor is mounted on the multiple sides, in the present invention, a honeycomb plate is provided near the back surface of the suction fan motor. It is arranged. It is desirable that the length of each honeycomb core forming the honeycomb plate be set to be larger than the gap between the two opposing surfaces of the core.

[0007]

【Example】

 An embodiment of this invention is shown in FIG. 1 by giving the same reference numerals to the portions corresponding to those in FIG. 2, and the duplicated description will be omitted. In this invention, a honeycomb plate 7 made of metal or synthetic resin and having a thickness of about 10 mm is provided at a position about 6 mm from the back surface of the suction fan motor 4, as shown in FIG. 1C. Further, the space between the fan motors 4, 5 and the printed circuit board 3 is compressed to about 20 to 30 mm. On the honeycomb plate 7, a large number of hexagonal cores 7a similar to a honeycomb are formed without gaps in the front-back direction (thickness direction of the plate surface). Regarding the dimensions of each core, for example, the gap between the two surfaces facing each other is about 5 mm, and the length of the core is about 10 mm.

The spiral wind blown by the fan motor 4 is blown between the printed circuit boards through the honeycomb plate 7, and the wind flowing in each core is rectified by the honeycomb core in the longitudinal direction of the core. Are relatively uniformed. In this way, the honeycomb plate 7 has a rectifying action that changes the turbulent flow into a straight and uniform flow. This effect becomes more remarkable as the length of each core is made larger than the gap between the two surfaces facing each other.

[0009]

[Effect of the device]

 As described above, according to this invention, the honeycomb plate is provided on the back side of the suction fan motor 4, and the turbulent flow is converted into uniform straight air and blown out between the print substrates. For this reason, the wind easily flows through the flow path between the substrates, the variation in the air volume due to the difference in the location within the same flow path between the substrates is suppressed, and the cooling efficiency is improved as a whole.

Therefore, there is no possibility that the temperature of the component in the place where the wind is hard to flow exceeds the allowable value and the performance and the life of the component and the circuit are adversely affected, and therefore, the large-sized fan as in the past does not exist. Since the motor is used and there is no need to widen the gap between the fan motor and the printed circuit board, the size of the test head (generally an electronic device) can be made smaller and lighter than before.

Further, since the air flow is facilitated by interposing the honeycomb plate, the gap between the fan motors 4 and 5 and the printed circuit board 3 can be made smaller than before, which is more advantageous for downsizing.

[Brief description of drawings]

FIG. 1A is a side view of a housing showing an embodiment of the present invention, B
Is a front view thereof, and C is an enlarged perspective view showing a core of a part of the honeycomb plate 7 of A.

FIG. 2A is a side view of a test head of a conventional IC tester, and B is a front view thereof.

Claims (2)

[Scope of utility model registration request] 1. A forced air cooling structure for an electronic device, wherein a suction fan motor is mounted on one surface side of an electronic device casing and a discharge fan motor is mounted on the other surface side thereof. A forced air cooling structure for an electronic device, characterized in that a plate is provided. 2. The forced air cooling structure for an electronic device according to claim 1, wherein a length of each honeycomb core forming the honeycomb plate is set to be larger than a gap between two facing surfaces of the core.