JPH0536856Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an electronic component storage pallet for storing semiconductors and the like.

[Conventional technology]

In conventional storage pallets, Figures 9 and 10
As shown in the figure, a hanging piece d formed on the outer peripheral edge of the back surface c is connected to the outer peripheral edge b of the front surface a of another storage pallet e.
The storage pallets e were stacked by positioning them by shallowly fitting them into the storage pallets e.

[The problem that the idea aims to solve]

In the case of conventional storage pallets, as mentioned above,
Since the fitting positioning mechanism consisting of the outer peripheral edge b and the hanging piece d was long, the dimensional accuracy was low due to variations in shrinkage after resin molding, and errors were likely to occur.
Therefore, a gap is created between the outer peripheral edge b and the hanging piece d, causing the stacked storage pallets e to wobble, which may cause damage to the semiconductors etc. stored inside. There were also cases in which the outer peripheral edge b did not fit within the hanging piece d.

Therefore, an object of the present invention is to provide an electronic component storage pallet having a positioning (attachment/detachment) mechanism with high dimensional accuracy.

[Means to solve the problem]

The electronic component storage pallet of the present invention is a rectangular plate-shaped storage pallet that has a plurality of storage areas formed on its surface and can be stacked in multiple stages. An elongated engagement groove was recessed in the direction perpendicular to the side, and a small protrusion that engaged with the engagement groove was protruded from the back surface.

Further, a circular hole is formed approximately at the center of the surface, and elongated engagement grooves having long axes on a radial line centered on the circular hole are formed at opposing positions near the outer periphery. At the same time, a cylindrical element that fits into the circular hole and a small protrusion that engages with the engagement groove were protruded from the back surface.

[Effect]

A small protrusion of another storage pallet is engaged with the engagement groove of the storage pallet configured as described above.
Alternatively, the cylindrical elements and small protrusions of another storage pallet are fitted or engaged with the circular holes and engagement grooves of the storage pallet, respectively. At this time, since the positioning (attachment/detachment) mechanism consisting of the engagement groove and small protrusion or the circular hole and cylindrical element is short, almost no error occurs, and therefore the stacked storage pallets are There is almost no misalignment.

〔Example〕

Examples will be described below with reference to the drawings. FIG. 1 is an embodiment showing the surface of an electronic component storage pallet according to the present invention. In the figure, 1 is a plastic storage pallet, and the storage pallet 1 is formed into a rectangular plate shape. A plurality of storage portions 3 are formed on the surface 2, and the surface 2
Near the outer periphery of and approximately at the center of each side, elongated engagement grooves 4, 4, 4, 4 are recessed in a direction perpendicular to the sides. Further, on the back surface 5 of the storage pallet 1, as shown in FIG.
Small protrusions 6, 6, 6, 6 that engage with 4 are provided in a protruding manner. The storage pallet 1 is attached and detached by the above-mentioned engagement groove 4 and small protrusion 6.
Can be stacked in multiple tiers. At this time, the third
As shown in FIG. 4, the engagement groove 4 is recessed in the axial direction of the small protrusion 6, so that the storage pallet 1
can be stacked with their outer edges aligned.
Further, as shown in FIG. 5, the engagement groove 4 has parallel straight parts 7, 7, and the size L is such that the small protrusion 6 can be inserted between the straight parts 7, 7 with a minute gap.
can be determined. Therefore, displacement of each side of the storage pallet 1 in the side direction T can be prevented. Further, the small protrusion 6 secures a predetermined gap with respect to the curved part 8 sandwiched between the straight parts 7, 7. In other words,
The minimum gap required is the maximum dimensional difference due to the difference in molding shrinkage between the upper and lower pallets.

FIG. 6 is a cross-sectional view showing the structure of the storage section 3, and a convex mounting table 9 on which a semiconductor or the like is placed is attached to the bottom surface of the storage section 3. Further, a hole 10 may be provided in the center of the bottom surface of the storage section 3 so that it can be seen whether semiconductors or the like are stored in the stacked storage pallets 1. In this embodiment, in FIG. 1, the holes 10 are not provided through the storage portions 3 marked with *, and the holes 10 are provided in the other storage portions 3.
was installed. Further, 13 is a rib, which is provided as appropriate to increase the strength.

FIG. 7 is a simplified diagram showing another embodiment. The storage portion 3 is the same as that shown in FIG. 1, and has a circular hole 11 recessed approximately in the center of the surface 2, and has holes 11 centered on the circular hole 11 at opposing positions near the outer periphery. An elongated engagement groove 4 having a long axis on a radial line is recessed. Although the engaging grooves 4, 4 are recessed in two places in the figure, they may be provided in the four corners, or any other position as mentioned above may be used.

Further, the engagement groove 4 is provided with parallel straight portions 7, 7, similar to the one shown in FIG. 5, and may be freely formed with an opening. Also, on the back side 5,
As shown in FIG. 8, a cylindrical element 12 that fits into the circular hole 11 is protruded, and a small protrusion 6 that engages with the engagement groove 4 is also protruded. The storage pallets 1 can be stacked in multiple stages without being displaced by the attachment/detachment mechanism constituted by the circular holes 11 and the cylindrical elements 12, or the engagement grooves 4 and the small protrusions 6. In this case, the central portion of the storage pallet 1 is positioned by the circular hole 11 and the cylindrical element 12, and the rotation of the storage pallet 1 is prevented by the engagement groove 4 and the small protrusion 6.

Note that the present invention is not limited to the above-described embodiments, and design changes may be made without departing from the gist of the present invention. For example, the small protrusion 6 may not be provided with the rib 13 and may be made into a cylindrical shape.

[Effect of idea]

Since the present invention is configured as described above, it has the following significant practical effects.

Compared to conventional fitting methods, dimensional differences due to variations in molding shrinkage can be distributed at the center of the pallet, so the maximum misalignment of the storage section is about half that of the conventional method. Therefore, the positioning play caused by the ribs on the back side of the storage section (FIG. 2, 14) can be reduced, and the effect can be increased.

Since the positioning (attachment/detachment) mechanism composed of the engagement groove 4 and the small protrusion 6 or the circular hole 11 and the cylindrical element 12 is short, the dimensional tolerance due to variation in shrinkage after resin molding is extremely small, making it possible to Therefore, the stacked storage pallets 1 hardly shift in position.
Therefore, the semiconductors and the like stored in the storage pallets 1, 1 are not damaged during handling or transportation, and can be said to be extremely safe. In addition, when electronic components are automatically stored in or removed from this pallet using a robot, etc.,
Since the position of the electronic component is accurate, it can be reliably gripped by a robot or the like.

[Brief explanation of the drawing]

Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a bottom view, FIG. 3 is a sectional view of FIG. 1, FIG. 4 is a sectional view of FIG. 1, FIG. 5 is a sectional view of the locked state, and FIG. - A sectional view, FIG. 7 is a simplified plan view showing another embodiment, and FIG. 8 is a bottom view thereof. FIG. 9 is a partially omitted plan view showing a conventional example, and FIG. 10 is a bottom view thereof. 1... Storage pallet, 2... Surface, 3... Storage portion, 4... Engagement groove, 5... Back surface, 6... Small protrusion, 11... Circular hole, 12... Cylindrical element.

Claims (1)

[Claims for Utility Model Registration] 1. In a rectangular plate-shaped storage pallet 1 in which a plurality of storage portions 3 are formed on the surface 2 and can be stacked in multiple stages, near the outer periphery of the surface 2 and on each side. An elongated engagement groove 4 is provided in a direction perpendicular to the side at approximately the center of the
An electronic component storage pallet characterized in that a small protrusion 6 that engages with the engagement groove 4 is protruded from the back surface 5. 2. In a rectangular plate-shaped storage pallet 1 in which a plurality of storage areas 3 are formed on the surface 2 and can be stacked in multiple stages, a circular hole 11 is recessed approximately in the center of the surface 2,
In addition, an elongated engagement groove 4 having a long axis on a radial line centered on the circular hole 11 is provided at opposite positions near the outer peripheral edge, and the circular hole 11
An electronic component storage pallet characterized in that a cylindrical element 12 that fits into the cylindrical element 12 and a small protrusion element 6 that engages with the engagement groove 4 are provided protruding from the back surface 5.