JPH05338187A - Method for forming resist pattern - Google Patents

Abstract

PURPOSE:To easily form a resist pattern in an economical manner from an aspect of equipment or production cost using an inexpensive material without causing an environmental problem. CONSTITUTION:In a resist pattern forming method for forming a resist film having a desired pattern on a base material 7 to be processed and adapted to post-processing generating a change in a part having no resist film on the basis of the difference between the properties of the surface due to the presence and absence of the resist film, an ink jet printer 6 drawing and printing an image on the basis of an image signal by the injection of ink is used and, as the ink of the ink jet printer 6, resist ink 5 is used. The image signal of a pattern to be formed is applied to the ink jet printer to print and form the pattern of the resist film due to the resist ink on the surface of the base material to be processed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention produces a processing change in a non-patterned portion based on the step of forming a pattern by a resist coating on the surface of a substrate to be processed and the presence or absence of the pattern on the surface. The present invention relates to a method and apparatus for forming a resist pattern applied to a processing method using a resist pattern, which includes a step of advancing the processing while protecting the pattern portion from the processing action.

[0002]

2. Description of the Related Art A pattern is formed on a surface of a substrate to be processed by a resist coating, and a pattern change is caused in a patternless portion based on the presence or absence of the pattern on the surface to protect the pattern portion from a processing action. However, there is a processing method that advances processing.

As a field of application of such a processing method, pattern etching, pattern plating, pattern vapor deposition, pattern electrolytic oxidation, etc. are known and widely used.

FIG. 5 is a diagram showing steps of a known etching method.

Explaining the etching method with reference to the drawings, a base material that can be dissolved by an etching solution such as various metals or polyimide is prepared, and this base material is first subjected to a cleaning treatment for degreasing or the like. .. Then, baking is performed to remove the adsorbed moisture.

Next, resist application is carried out. In this resist application step, a liquid resist solution is applied or a resist film processed in advance into a film is pressure-bonded. And
In the pre-baking step, the solvent of the resist is evaporated and removed.

On the other hand, the pattern for etching is C
The pattern is designed by using AD (Computer Aided Design) or the like, and the designed pattern is plotted and checked by a cutting plotter or a photo plotter.

At this stage, the pattern is plotted at a magnifying power larger than that of the pattern that is normally processed. The plotted pattern is then filmed with a camera and the film thus photographed is developed into a film.

The film thus obtained is an original plate for exposure.

Next, resist is applied to the surface of the base material and prebaking is performed. Next, the above-mentioned exposure master is superposed on the surface of this prebaked substrate, and ultraviolet exposure is carried out from the top of the master. The pattern of the above-mentioned exposure original plate is such that the portion to be left by etching is transparent and the portion to be removed is black.

When ultraviolet light exposure is performed through the exposure original plate,
In the resist on the base material, the portion located in the transparent portion of the pattern is polymerized and cured by ultraviolet rays. Therefore, the exposure is completed when the resist is polymerized and cured by ultraviolet rays. After the exposure, a developing process is performed to remove the uncured resist material, and the developing solution and the rinse solution are evaporated by post-baking, and the adhesive force of the cured portion is increased by heat to complete the resist pattern forming step. ..

When the patterning of the resist is completed in this way, the etching process starts.

In the step of etching the substrate, the second chloride is used.
A liquid that chemically dissolves a metal such as iron or cupric chloride is caused to act on the patterned surface to remove the metal in the portion of the base material where there is no resist pattern. Then, the resist film which has become unnecessary in the final step is peeled or oxidized to be removed, and the whole step is completed.

Even if a processing method other than etching is used and a resist pattern is used, the steps up to the formation of the resist pattern are the same.

The apparatus used in the resist pattern forming step is a cleaning tank, a baking oven, a resist coating machine or a pressure bonding machine, an ultraviolet exposure apparatus, a resist developing machine, C
AD, a cutting plotter or a photo plotter, a large camera, a film developing machine set, a waste water treatment device, and the like. Further, as a material, after washing, a resist material, a cutting film, a photographic film, a set of a photographic developing solution, a wastewater treatment agent, etc. are used.

[0016]

By the way, such a conventional resist pattern forming method has complicated steps, and it takes a long time to form the pattern.

Further, the work requires human resources having specialized knowledge and skills, and expensive materials are consumed for pattern formation. Furthermore, not only will waste liquid and waste that may pollute the environment be generated in the process of processing, and various expensive equipment will be required for processing, and the area occupied by that equipment will increase. Since it is large, the equipment investment becomes enormous, and further, the maintenance and management of the equipment requires a great deal of money. In addition, there are many problems that must be solved, such as consuming a large amount of energy and water for processing.

Therefore, an object of the present invention is to provide a resist pattern forming method which is easy to form a resist pattern, is inexpensive in materials, is free from environmental problems, and is economical in terms of equipment and production cost. To do.

[0019]

In order to achieve the above object, the present invention is as follows. That is, to form a resist film of a desired pattern on the surface of the substrate to be processed, and apply it to the post-processing step that causes a change in the part without the resist film based on the difference in the surface properties depending on the presence or absence of the resist film. In the above method for forming a pattern of a resist film, an inkjet printer that draws and prints an image by ink ejection based on an image signal is used, the resist ink is used as the ink of the inkjet printer, and the image signal of the pattern to be formed is This pattern was applied to this inkjet printer to print a pattern of a resist film with a resist ink on the surface of the substrate to be processed.

Further, the ink for ultraviolet curing resist is ejected from the ink jet print head to form a pattern, and the formed pattern is irradiated with ultraviolet rays to be cured.

[0021]

As described above, in the present invention, the ink jet printer which draws and prints the resist image by jetting the resist ink based on the image signal is used, and the image signal of the pattern to be formed is given to this ink jet printer to be processed substrate. A resist pattern is formed by printing a pattern of a resist coating with a resist ink on the surface of the material.

According to this method, the resist ink ejected from the ink jet print head controlled by the drive signal generated based on the information received in the form of the image signal and deposited on the substrate to be processed is used. ,
Since the resist pattern is directly formed on the substrate,
The original plate for exposing the pattern is not required, and the exposure and development processes of the photograph are completely unnecessary, so the materials can be cheaper, there is no concern about environmental problems, and it is economical in terms of equipment and production costs. In addition to the above, the resist pattern forming method is characterized in that the resist pattern is extremely easily formed because the image information is directly printed.

Further, an ink for ultraviolet curable resist is used,
By irradiating the pattern after printing with ultraviolet light to cure it, the ink printed on the substrate to be processed is polymerized and cured by the ultraviolet light to form a strong coating and firmly onto the substrate. It becomes attached.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

(Embodiment 1 of Method) FIG. 1 is a diagram showing steps of a resist pattern forming method according to the present invention. As shown in the figure, in the step of forming a resist pattern according to the present invention, first, a pattern design step 2 for designing a pattern is carried out to design a required resist pattern. Next, a signal conversion step 3 is carried out to convert the designed pattern into a signal for printing. Then, a print head drive signal forming step 4 for converting the signal for printing into a drive signal for the printer is executed, and an ink jet printing step 6 for driving the printer in accordance with the print head drive signal formed in this step is executed. To do.

In the ink jet printing step 6, the resist ink 5 is used, and the resist ink 5 is applied to the substrate 7 to be processed.
Print the resist pattern. After that, the etching step 8 is entered to etch the substrate 7 to be processed,
When the process is completed, the resist removing step 9 is performed to remove the used resist pattern on the processed substrate 7.

As described above, in forming the resist pattern on the substrate 7 to be processed, in the present invention, the resist pattern is formed by printing with an ink jet printer, which eliminates the steps of preparing an original plate, exposing and developing. The point is that it was done. As a result, the use of chemicals and water, which were necessary in the steps of making the original plate, exposing and developing, is eliminated, and energy and labor are saved.

Since the pattern design in the pattern design step 2 is intended to obtain image information of the resist pattern as a signal (data), it is preferable to use a CAD system in view of labor saving and efficiency. An original drawing created by handwork may be read by an image scanner, converted into an image signal, and obtained as image information.

The process of the present invention is started when the image information of the pattern is converted into an electric signal and supplied. The received signals are rearranged in signal conversion step 3 in the proper combination and order to control the inkjet printhead. When the original signal is a vector signal, vector-raster conversion is first performed to obtain a raster image signal.

The raster image signal is then converted into a signal train determined in relation to the nozzle arrangement of the ink jet print head and the main / sub scanning mechanism. For example, in the case where the inkjet nozzle has a multi-nozzle configuration and each nozzle operates at the same time to eject ink, a plurality of image signals are sequentially taken out one after another in correspondence with the nozzle array position, and the next head drive is performed. Send to the signal forming process. This step is a step of forming a voltage and pulse width signal for directly driving the print head.

The next ink jet printing step 6 is the final step of patterning. In this step, a resist ink is applied as an inkjet print ink.

The properties required of the resist ink differ depending on the type of processing step to be performed next. For example, if the subsequent step is a step using a water-soluble treatment liquid such as etching, electroforming, electrolytic oxidation, first of all, the resist ink needs to be water resistant. In some cases, alkali resistance is required.

Therefore, the most suitable ink in this case is an oil-based ink jet ink, a jet ink which jets a solid wax in a state of being melted by heat, an ultraviolet curing type ink which will be described later, and the like.

Further, in the ink jet printing step 6, the substrate 7 to be processed is applied as an image receiving surface. When the post-process is etching, various metals such as copper, nickel and stainless steel, or etchable plastics such as polyimide are applied as the substrate to be processed.

When the subsequent process is electroforming, a conductive base material such as a metal plate is applied. In this case, a coating film of oxide, chromate, sulfide or the like may be formed on the metal surface so that the processed product can be easily peeled off.

When the ink adhering to the substrate to be processed cures, all steps of resist pattern formation are completed.

FIG. 1 illustrates the steps of etching and resist removal as an example of the subsequent steps. However, in the case of other processing methods, the process is different from this.

When a metal plate is used as the base material 7 to be processed and etching is performed, the base material on which the resist pattern is formed is dipped or corroded in a corrosive liquid such as ferric chloride or cupric chloride. The solution is poured like a shower to proceed with etching. As a result, the metal in the portion without the resist pattern is removed by corrosion, but the metal under the resist pattern remains as it is. As a result, it is possible to perform processing according to the shape of the resist pattern.

Since the resist pattern remains without being etched, the resist removing step 10 is finally performed to remove it. Since there are some applications where the resist pattern may remain after etching, the resist removing step is omitted in that case, but the resist pattern is normally removed because it interferes.

The resist pattern is removed by softening the resist film with an alkaline liquid or the like and applying an external force such as a jet water stream or brushing to the resist film.
If the resist pattern is an extremely thin film, it can be removed by plasma etching.

By the way, the feature of the present invention is to
The resist pattern is formed by directly printing the resist pattern on the base material by the print head, and the ultraviolet curing resist ink is used as the resist ink to be adhered on the base material by the inkjet print head. Is very convenient.

For example, in the case of ultraviolet curable ink, the ink does not solidify unless it is irradiated with ultraviolet light, so that the effect of preventing clogging of the ink jet nozzle due to solidification of the ink can be obtained.

Further, the formed resist pattern becomes a firm film upon irradiation with ultraviolet rays, and the adhesive force with the base material is also increased, so that the durability against a processing liquid such as an etching liquid or an electrolytic liquid used in a later step is increased, The function as a pattern is enhanced.

(Embodiment 2 of Method) FIG. 2 is a process chart in the case where an ultraviolet curable ink is used as a resist ink. The difference from the example of FIG. 1 is that the UV-curable resist ink 5'is used as an ink for resist.
It is applied to the printing process, and the ultraviolet irradiation process 8 is added after the inkjet printing process.

A prescription example of the ultraviolet curing ink jet resist ink is shown below. Pigment or dye: Appropriate amount (may be omitted) Sensitizer (amino compound, ketones, etc.): 2-15 (weight ratio) Oligomeric prepolymer (EA, acrylic urethane, etc.): 20-50 (weight ratio) Reactive monomer (PETA, TMPTA, etc.): 10-20 (weight ratio) Additives (stabilizer, lubricant, etc.): 0.1-5 (weight ratio) Regarding the colorant, the resist pattern is originally for visual observation. It is not necessary because it is not so, but it is useful in the case of visually judging whether or not patterning is normally performed, so it is better to add an appropriate amount.

In the decorative etching process, the resist pattern may be left as it is, but in this case, a colorant is intentionally added to the resist pattern,
In some cases, the visual effect is enhanced. The resist ink in this case is not limited to the ultraviolet curable type, but the ultraviolet curable type is preferable because it excels in film strength and adhesiveness.

Next is the ultraviolet curing step 8. In this step, an ultraviolet light source such as a high pressure mercury lamp is used and a wavelength of 250 nm to
Polymerize the prepolymer under the action of 350 nm UV light,
Let it harden.

(Embodiment 1 of Apparatus) Next, a resist pattern forming apparatus to which the above-described resist pattern forming method of the present invention is applied will be described with reference to FIG.

FIG. 3 (a) is a block diagram of a resist pattern forming apparatus according to the present invention, and FIG. 3 (b) is a front view of an orifice plate of an ink jet print head used in this apparatus.

In FIG. 3A, 11 is a base plate, 12 is a guide post, 13 is a guide post beam, and 14 is a guide post beam.
Is an elevator, 15 is an elevator arm, 16 and 17 are slide rails, 18 and 19 are slide bearings, 20 is a bearing receiver, 21 is a wire hook, 22 is a wire, and 23.
Is a wire pulley, 24 is a motor receiving plate, 25 is a main scanning motor, 27 is a cam follower, 26 is a cam follower shaft, 2
9 is a cam, 28 is a cam shaft, 30 is a sub-scanning motor, 31 is a moving scanning base, 32 is an inkjet print head, 3
3 is an orifice plate, 34 is a suction support, 35 is a suction port,
36 is an exhaust port, 37 is an exhaust fan, 38 is a substrate to be processed,
39 is a pillar, 40 is a pattern CAD, 41 is a receiving circuit,
42 is a signal conversion circuit, 43 is a head driver circuit, 4
Reference numerals 4 and 45 are motor driver circuits, and 46 is a control circuit.

Two guide posts 12 are vertically arranged in the vicinity of one end side of the upper surface of the base plate 11 with a space therebetween. The guide posts 12 are rod-shaped members, and the upper ends of the pair of guide posts 12 are guide post beams 13.
Are fixed by being spanned, and an arch-shaped frame is formed.

The pair of guide posts 12 is fitted with an elevating table 14 which is guided by the guide posts 12 to ascend and descend. A slide bearing is fitted on the surface of the elevating table 14 in contact with the guide posts 12 so that the elevating table 14 can be smoothly moved up and down.

An elevating table arm 15 is provided on the elevating table 14 with its arms extending horizontally, and two slide rails 16 and 17 are provided near the tip end side of the arm.

The movable scanning table 31 is attached to the slide rails 16 and 17, for which the slide bearings 18 and 19 are fitted into the bearing receiver 20, and the slide rails 16 and 17 penetrate the slide bearings 18 and 19. ..

The movable scanning table 31 has a wire hook 21 for fixing the wire 22. The wire 22 is stretched between a wire pulley 23 attached to the shaft of the main scanning motor 25 and a wire pulley rotatably attached to the other lift arm (not shown). When the main scanning motor 25 rotates, the moving scanning table 31 moves. Is configured to move on the slide rail.

A cam follower 27 is attached to the lifting table 14 and the shaft 2
The cam 29 supports the lift table. A coil-shaped spring S is provided on the upper end side of the lift table 14 to urge the lift table 14 downward.

A shaft 28 is fixedly attached to the cam 29, and although not shown, the shaft 28 is supported by a bearing attached to the base plate 11 and is connected to the shaft of the sub-scanning motor 30. ing. Therefore, the rotation of the sub-scanning motor 30 is transmitted to the cam 29 via the shaft 28, and with the rotation of the cam 29,
The cam follower 27, which is in contact with the side portion of the cam 29, is moved up and down so that the lift table 14 can be driven up and down.

An ink jet print head 32 is mounted on the movable scanning table 31. A resist ink is used in the inkjet print head 32.

The orifice plate 33 of the ink jet print head 32 is provided with a plurality of ink jet nozzles N as shown in FIG. The inkjet nozzles N are arranged two-dimensionally,
The height positions are slightly changed and each nozzle N has a multi-nozzle structure capable of ejecting ink simultaneously.

When the rotation of the main scanning motor 25 is transmitted to the wire 22 by the pulley, the wire 22 moves the movable scanning base 31 along the slide rails 16 and 17, and the ink jet print head 32 is operated during that time, the width W
Printing with the resist ink is performed on the band-shaped scanning area of.

Further, by rotating the sub-scanning motor 30, the elevating table 14 can be moved up and down, but the amount is set to W per one time.

A substrate 38 to be processed on which a resist pattern is printed is supported by a suction support 34 mounted on the base plate 11 so as to face the ink jet print head 32. The suction support base 34 has a box shape, an exhaust port 36 is provided on the back side, and an exhaust fan 37 is attached to the exhaust port portion. A plurality of suction ports 35 are provided on the front side of the box-shaped suction support 34, and when the exhaust fan 37 is rotated, air is sucked into the box of the support 34 through the suction ports 35. Therefore, when the substrate 38 to be processed is placed on the front surface thereof, it is held by negative pressure.

Therefore, after the work substrate 38 to be printed with the resist pattern is adsorbed and held on the suction support 34, the main scanning motor 25 is rotated, and the rotation is transmitted to the wire 22 by the pulley to move and scan. When the inkjet print head 32 is printed by an image signal while moving the table 31 along the slide rails 16 and 17, printing with resist ink is performed in a belt-shaped scanning area having a width W, and this main scanning is completed. Each time, the sub-scanning motor 30 is rotated, the elevating table 14 is shifted by W, and the moving scanning table 31 is again moved in the main scanning direction. By repeating this operation, the band-shaped scanning area is expanded one after another. Then, the scanning region can be spread over the entire surface of the substrate 38 to be processed. Then, according to the image signal, a resist pattern can be printed on the entire surface of the substrate 38 to be processed.

Information on the pattern to be formed on the substrate 38 to be processed by this apparatus is supplied in the form of an electric signal. The pattern CAD system 40 creates pattern information and outputs it in the form of an electric signal. The pattern CAD system 40 described here is an example of a host-side device.

The pattern signal, which is the pattern information output from the pattern CAD system 40, is received by the receiving circuit 41, and the receiving circuit 41 includes an interface circuit and a buffer memory. The signal received by the receiving circuit 41 is sent to the signal converting circuit 42. If the pattern signal is a vector signal, the signal conversion circuit 42 converts it into a raster signal.

Further, in the signal conversion circuit 42, as shown in FIG.
Based on the orifice configuration of the inkjet print head 32 as shown in FIG. 9B, signal conversion for ejecting ink simultaneously from each orifice to form a pattern is performed.

The converted signal is sent to the driver circuit 43 and converted into a drive signal having a voltage and pulse width suitable for operating each ink jet orifice element. For example, inkjet print head 3
In the case of a print head using a piezo element as 2, a voltage of about 100 V and a pulse width of several hundred microseconds (μs)
Is a typical drive pulse waveform.

Motor for main and sub scanning (pulse motor,
Alternatively, the drive circuits for driving and controlling the servo motor etc.) are 44 and 45. The above-described main / sub-scanning movement and the driving of the inkjet print head 32 for pattern formation need to be controlled in conjunction with each other, and the control circuit 46 is provided so that the control can be performed. This control circuit 46 simultaneously controls the device 4 on the host side.
0 and the resist pattern forming apparatus of the present invention are used for mutual signal flow and operation control.

By designing the pattern with such a configuration, the inkjet print head 32 is designed to be designed on the surface of the substrate 38 to be processed on the suction support 34, while the ink jet print head 32 is caused to perform main and sub scanning in accordance with the design content. A patterned resist film can be printed.

As described above, in the embodiment shown in FIG. 3, the ink jet print head is moved in both vertical and horizontal directions (main and sub-scanning), and the substrate to be processed is fixed to form the resist pattern.

In the case of this configuration, since all the moving elements for pattern formation are performed by the print head example, the pattern formation is possible even if the shape, dimensions, etc. of the substrate to be processed change. It has a wide range of characteristics.

The structure and operation principle of these scanning mechanism and ink jet print head are not limited to this example. In addition, flexible printed circuit boards,
When forming a pattern on a flexible thin sheet-shaped substrate such as a thin metal plate, the substrate is supported by sandwiching two points between paired conveying rollers or winding both ends. By moving it, sub-scan feed can be performed. It is also possible to support the substrate on the drum and use the rotation of the drum for scanning as shown in the following examples.

The ink jet print head is not limited to the one having an on-demand type multi-nozzle structure, and a continuous type head is also applicable.

(Embodiment 2 of Apparatus) The advantage of using the ultraviolet curable ink as the resist ink used for forming the resist pattern is as described above.

By the way, when the ultraviolet curable ink is applied, the substrate to be processed may be sent to the ultraviolet irradiation device to cure the ink after the pattern formation by the ink jet print head, but in the resist pattern forming device of the present invention. By disposing the ultraviolet light source at a position facing the passage of the substrate to be processed, the entire process of forming the resist pattern can be completed by this apparatus.

FIG. 4 shows an embodiment of an apparatus for realizing such a thing.

In the figure, the elements with the reference numerals 16 to 46 'are the same as the elements with the same reference numerals in FIG.
And 50 is a base material support drum, 51 is a grip, 52
Is a substrate to be processed, 53 is a high pressure mercury lamp, 54 is a lamp cover, and 55 is a mercury lamp lighting circuit.

In this embodiment, an ultraviolet-curable resist ink is applied to the ink jet print head 32, and an ultraviolet light source is arranged facing the conveyance path of the substrate to be processed. The drum 50 is provided with a grip 51 for supporting the base material to be processed on its peripheral surface. The base material to be processed is wound around the peripheral surface of the drum 50, and the end portion of the base material to be processed is gripped by this grip. By fixing at 51, the base material to be processed is held on the peripheral surface of the drum 50.

A motor 30 'for rotating the drum 50 is provided. By rotating the drum 50 by this motor 30', the substrate to be processed is scanned in the sub-scanning direction.

With this structure, when the substrate to be processed is a flexible sheet-shaped substrate such as a metal thin plate or a flexible printed circuit board material, the front end and the rear end thereof are held by the grips 51, and are placed on the drum 50. Can be held in close contact.

In the case of this apparatus, the ink jet print head 32 is arranged so as to face the drum 50, and a high pressure mercury lamp 53 for irradiating ultraviolet rays is arranged on the peripheral surface of the drum 50.

The ink jet print head 32 is mounted on the movable scanning table 31, moves on the slide rails 16 and 17 in the main scanning direction, and ejects the resist ink onto the belt-shaped area. In addition, the inkjet print head 32
The motor 30 'for rotating the drum is driven and controlled by the driver circuit 45' for each reciprocating movement, and the drum 50 is moved in the direction of the arrow by the width W of the belt-like area, and the ejection area of the resist ink is expanded one after another. ..

When the area where the pattern formed by the resist ink is formed approaches the ultraviolet light irradiation area of the high pressure mercury lamp 53, the resist ink jetted in a pattern is polymerized and hardened to change into a strong film required as a resist film. To do.

In this way, if the movement of the member to be processed and the movement of the print head are combined to perform the main / sub scanning, the space of the moving mechanism for scanning can be reduced,
Further, the mechanism for moving can be simplified.

In the structure shown in FIG. 4, the main scanning may be performed by rotating the drum, and the sub-scanning may be performed by moving the print head. in this way,
The configuration in which the member to be processed is moved and scanned is easy to apply when the member to be processed is a sheet-like member and is light.

As described above, according to the present invention, a resist film having a desired pattern is formed on the surface of a substrate to be processed, and a change is made to a portion without a resist film on the basis of a difference in surface properties depending on the presence or absence of the resist film. As the above-mentioned resist pattern forming method for applying to the post-processing step to generate, an inkjet printer that draws and prints an image by ink ejection based on an image signal is used, and a resist ink is used as the ink of this inkjet printer,
The image signal of the pattern to be formed is applied to this inkjet printer to print and form the resist film pattern with the resist ink on the surface of the substrate to be processed, so the pattern formation process can be completed easily and in a short time. Then
Moreover, it became possible to form a resist pattern without special specialized knowledge or manpower.

Also, the material consumed for pattern formation is small, and there is no waste liquid or waste that pollutes the environment. Further, the pattern forming apparatus is simple and small in size, occupies a small area, and consumes little energy or resources such as water.

Further, as an apparatus for realizing the resist pattern forming method by such steps, a means for supporting the substrate to be processed, an ink jet print head to which the resist ink is applied, a substrate to be processed and an ink jet print head are provided. The resist pattern forming apparatus is composed of means for relatively moving and scanning, and a signal conversion circuit for receiving a resist pattern image signal and generating a signal for operating the print head driver circuit. This allows the above method to be embodied.

Further, in addition to the above method, a step of forming a pattern on the surface of the substrate to be processed by jetting an ultraviolet curable resist ink from an ink jet print head controlled by a pattern image signal, and an ultraviolet ray on the pattern. And a step of irradiating and curing the resin.

According to this, it is possible to prevent clogging of the ink-jet nozzle, improve reliability, and reliably cure the resist ink in a short time, and the resist coating film formed has a strong film quality and is used as a base material. Produces the effect of increasing the adhesiveness of.

Further, as an apparatus for realizing the resist pattern forming method by such steps, a means for supporting a substrate to be processed, an ink jet print head to which an ink for ultraviolet curing resist is applied, a substrate to be processed and an ink jet print. The means for scanning the head by moving the head relatively, the ultraviolet light source arranged on the passage surface of the substrate to be processed, and the signal conversion circuit that receives the resist pattern image signal and generates a signal for operating the print head driver circuit A pattern forming device was constructed. This allows the above method to be embodied.

Next, the application of the present invention to the fabrication of a three-dimensional object was examined, and this will be described below. (Background) Nikkei Mechanical 1991.7.8
As shown on pages 56 to 59 of the publication, it is known to manufacture a three-dimensional object based on a CAD design sectional view or a sectional view sliced in the height direction such as a contour map of a map.

As a method therefor, there is, for example, a pure mechanical manufacturing method such as laminating patterned materials corresponding to the unit thickness of each cross section.

As a manufacturing method which does not use mechanical means, an ultraviolet curable resin is scanned by an ultraviolet laser modulated by a pattern signal to be cured in a pattern, and the cured layers are successively laminated to form a three-dimensional object. The method is known.

FIG. 6 is a diagram for explaining the above-mentioned three-dimensional object manufacturing method. First, the ultraviolet curable resin 202 is put in the container 201. An elevating table 20 for supporting a workpiece is provided in the container 201.
3 is provided. The elevator is submerged in the resin liquid and the height of the elevator is adjusted so that a slightly thin liquid layer is formed on the surface of the elevator. Then, the liquid surface of the thin ultraviolet curable resin is two-dimensionally scanned while irradiating the ultraviolet laser beam 205 modulated based on the tomographic diagram.

The portion irradiated with the ultraviolet rays becomes a polymerized and cured film as indicated by reference numeral 204 '. Assuming that the three-dimensional object to be manufactured is 204 in FIG. 7A, the cross-sectional shape is input as a layer structure in which the three-dimensional object is subdivided in the height direction.
Sectional views of representative layers 204A, 204B, and 204C among them are shown in (b), (c), and (d), respectively.

The solid is formed from the lowermost layer, and when the curing of one layer is completed, the elevator is once submerged below the liquid surface of the resin and then returned to the predetermined height again. Then, an uncured liquid film for the next layer is formed on the already formed cured film, and scanning exposure is performed toward this layer while modulating the ultraviolet beam. By repeating such a process, the hardened layers are stacked one by one, and a three-dimensional object is manufactured.

(Problem) In the conventional method for manufacturing a three-dimensional object using the ultraviolet curable resin, a large amount of uncured ultraviolet curable resin must be prepared as compared with the manufactured object. A large and expensive laser light source for obtaining a strong ultraviolet light beam and a beam scanning device are required, therefore the device occupies a large area and the cost is high.
It becomes a large-scale device.

Further, since the method is to sequentially stack the hardened layers from the bottom surface, in the case of the three-dimensional object as shown in FIG.
A region such as 207 that can be stacked and supported from 06 can be manufactured, but a shaped part such as 208 in which there is no part to be supported in a lower layer or an adjacent part cannot be manufactured.

A method for manufacturing a three-dimensional object which has a simple and small structure and which has a small amount of ultraviolet-curing resin to be used and has few restrictions on the shape of the three-dimensional object which can be manufactured will be described below.

(Outline of Examples) In the present invention, in order to solve the drawbacks of the conventional three-dimensional object manufacturing method, [1]. A method of manufacturing a three-dimensional object based on a slice plan view signal showing a cross-sectional shape of each layer subdivided in a height direction, the process of creating a slice plan view of the three-dimensional object, and an inkjet slice signal A print signal converting step of converting the head into a signal for urging the head; a step of urging the inkjet head based on the signal to eject the ultraviolet curable resin droplets toward the droplet receiving surface; Using the above step of irradiating the ultraviolet rays onto the ultraviolet curable resin droplets in a pattern, the above steps were repeated for each slice plane, and the layers were sequentially laminated to solve the problem.

According to the manufacturing method of this three-dimensional object, the ultraviolet curable resin liquid jetted according to the signal sent in the form of a sectional view by the ink jet head and the scanning mechanism having a small size and a simple structure is irradiated with ultraviolet rays to be cured, Since the three-dimensional object is manufactured by repeating this process, the minimum amount of resin required is slightly larger than the volume of the three-dimensional object, the apparatus is inexpensive, and the occupied area is small.

[2]. In [1], a step of creating a support table pattern diagram showing the shape of the support table for supporting a part of the three-dimensional object during the manufacturing process based on the slice plan view showing the shape of the three-dimensional object; Based on the pattern diagram
A print signal conversion step of converting into a signal for energizing another ink jet orifice, and based on the above signal, the droplets for forming a removable support are formed in parallel with droplet ejection for forming a three-dimensional object. The step of spraying was added for each slice plane formation, and the step of spraying droplets on all slice planes and the step of removing the support from the three-dimensional object after the ultraviolet irradiation step were added.

According to this method, it is possible to manufacture the support base necessary for the manufacturing process at the same time as the three-dimensional object, and finally remove the supporting portion to leave only the three-dimensional object. The restrictions can be greatly relaxed.

[3]. In addition, in [1], based on a slice plan view showing the shape of the three-dimensional object, a step of creating a pattern diagram of the three-dimensional object and a support table for supporting a part of the three-dimensional object during manufacturing; A pattern drawing process showing the boundary surface of the support base, a step of ejecting ultraviolet curing droplets based on the three-dimensional object and the support base pattern chart, and a release agent droplet based on the boundary surface pattern chart in parallel with the above step. After the step of jetting, the step of jetting liquid droplets on all slice planes, and the step of irradiating ultraviolet rays, a step of removing the support from the three-dimensional object was added.

According to this method, it is possible to manufacture the support base necessary for the manufacturing process at the same time as the three-dimensional object, and finally remove the supporting portion to leave only the three-dimensional object. The restrictions can be greatly relaxed.

[4]. Furthermore, the step of scanning and moving the droplet receiving surface and the inkjet head in the first direction to eject droplets for each slice plane, and the step of moving the droplet receiving surface and the inkjet head in a direction different from the first direction. Periodically, a step of relatively rotating the scanning direction to eject a droplet on another slice plane, a step of designating the scanning direction, and a step of converting a print signal under a condition changed based on the designation. I tried to repeat it.

According to this method, even if there are irregularities in the ejection characteristics of multiple ink jet nozzles or the like, the steps are combined so that the irregularities can be offset, and a uniform machined plane can be manufactured.

(Embodiment 1 of the three-dimensional object manufacturing method) FIGS. 9 to 11 are explanatory views of the first embodiment of the three-dimensional object manufacturing method according to the present invention. 9 is a process diagram, FIG. 10 is a cross-sectional view of a three-dimensional object, and FIG. 11 is a diagram showing an example of inkjet nozzle arrangement.

By the way, the present invention utilizes the technique of ejecting the uncured ultraviolet curable resin liquid in the form of droplets according to a control signal, and an ink jet printing method is known as a method of forming droplets and controlling ejection. Therefore, for convenience of explanation, the droplet ejecting means in the present invention is called an ink jet head and the ejection port is expressed as a nozzle or an orifice, but the droplet ejected in the present invention is not ink.

Further, in the present invention, spraying the resin liquid or the like is not for printing, but for the sake of explanation, the above process may be called printing.

In the process diagram shown in FIG. 9, 110 is a tomographic diagram creating process, 111 is a print signal converting process, 112 is an ultraviolet curable resin liquid injection process, 113 is an ultraviolet irradiation process,
Reference numeral 114 indicates a manufactured three-dimensional object.

When a CAD system is used to design a three-dimensional object, the sectional view is output as a sectional view from the CAD system. When copying from the measured information of a three-dimensional object like a map, the cross-sectional shape is shown by a contour map.

Now, taking an example of producing a hemispherical solid as shown by attaching the reference numeral 115 to (a) in FIG. 10, this is made into a pattern sliced in layers in the height direction, and this pattern Will be sequentially stacked to produce a three-dimensional object.

The representative layers thereof are 115A and 115A.
Sectional views of B and 115C are shown in (b), (c), and (d). Then, the cross-section drawing step 10 is advanced so that each cross-section is transmitted in the form of a raster cross-section signal whose main scanning direction is the direction indicated by the dotted line and the solid line.

The ink jet head used is a multi-nozzle ink jet head as shown by reference numeral 116 in FIG. Reference numeral 117 denotes an orifice opening of the multi-nozzle inkjet head 116,
The ultraviolet curable resin liquid is jetted simultaneously from each orifice opening.

In accordance with the arrangement of such orifices,
A print signal conversion circuit 111 converts a signal picked up from the raster section signal so as to be sent to the inkjet head in parallel.

For example, in FIG. 11, X is the main scanning direction,
The Y and the sub-scanning direction, the orifice 17 is the pitch P _x in the main scanning direction, are arranged at a pitch P _y in the sub-scanning direction, the pitch P _y is equal to the sub-scanning direction pitch of the raster cross signal, the pitch P _x in the main scanning It is assumed that the pixel signal pitch in the direction is n times.

In order to distribute the orifice signals having such an arrangement, in the memory space accommodating the raster section signals,
An address corresponding to the orifice position is designated, a signal is picked up, taken out in parallel, and converted into a drive signal. Then, in the next step of injecting the ultraviolet curable resin, this drive signal is applied to the inkjet head 116 to eject the ultraviolet curable resin onto the droplet receiving surface.

The ultraviolet irradiation step 113 is carried out in parallel with the injection of the resin forming one cross section or after the injection is completed by operating the ultraviolet light source. A high pressure mercury lamp or the like can be used as the light source.

When the formation of one slice layer is completed in this way, the process returns to step 110 and the same step is repeated to form the next layer. Then, when the formation of all the cross-sectional layers is completed, the three-dimensional object 114 is obtained.

The following can be applied as a UV curable resin formulation. Pigment or dye: Appropriate amount (may be omitted) Sensitizer (amino compound, ketones, etc.): 2-50 (weight ratio) Oligomeric prepolymer (EA, acrylic urethane, etc.): 20-50 (weight ratio) Reactive monomers (PETA, TMPTA, etc.): 10-20 (weight ratio) Additives (stabilizers, lubricants, etc.): 0.1-5 (weight ratio) Colorants such as pigments or dyes can be produced into three-dimensional objects. It may be added according to the required color, and is not essentially necessary. Further, as described later, an organic solvent or the like may be added when obtaining a gel-like cured product.

By the way, the combination of applying the ultraviolet curable resin liquid to the ink jet head is extremely convenient from the viewpoint of preventing clogging of the orifice. That is, unlike ordinary printing inks, there is no drying and solidification due to natural standing, so clogging does not occur when not in use.

(Second Embodiment of Method for Producing Solid Object) Next, according to the present invention, a solid object having a shape as shown in FIG. 8 which cannot be produced by the conventional ultraviolet resin curing method using laser scanning light is used. The method of manufacturing will be described.

12A and 12B show an example of a three-dimensional object 109 to be manufactured, FIG. 12A is a side view, and FIG. 12B is a top view. Reference numeral 106 denotes a bottom surface that is supported by the resin droplet receiving surface during manufacturing, and 107 and 108 are bottom side surfaces that are higher than the bottom surface. Three-dimensional object manufacturing method In the three-dimensional object manufacturing method of the present invention described in the first embodiment, the manufacturing starts from the bottom surface 106, and the three-dimensional object can be stacked on the upper space that can be stacked on the bottom surface. it can.
However, since it is not possible to receive the resin droplets in a portion floating in the air, such as 107 or 108, which has no supporting object on the lower side, this portion cannot be manufactured.

Therefore, in the manufacturing method of the present invention, FIG.
As shown in FIG. 2 (c), in order to form a bottom surface floating in the air, a support base 321 that receives resin droplets during the manufacturing process and can be removed in the final manufacturing process is made simultaneously with the manufacturing of the three-dimensional object. While trying to proceed with the production.

FIG. 13 is a process diagram of the second embodiment of the method for manufacturing a three-dimensional object, and FIG. 14 is a diagram for specifically explaining the process. In FIG. 13, 110 is a slice plan view creating process, 111 is a print signal converting process, 112 is an ultraviolet curable resin liquid spraying process, 117 is a support base pattern drawing creating process, 118 is a print signal converting process, and 119 is support base liquid spraying. Step 113 is an ultraviolet irradiation step, 120 is a support stand removing step, and 114 is a manufactured three-dimensional object.

Steps 110, 111, 112 and 113 have the same contents as the steps described in FIG. Step 117 is a step of creating a pattern diagram for the support base 321 based on the slice plan view.

FIG. 14 is a view for explaining a slice plan view for the three-dimensional object 109 and the support base 321. Figure 1
When proceeding with the production of the three-dimensional object 109 as shown in 2 (c),
The pattern diagrams corresponding to the slice planes S ₁ -S ₁ ′ and S ₂ -S ₂ ′ are shown in (a) to (d). (A), (b)
Is a pattern diagram of a portion forming the three-dimensional object 109,
(C) and (d) are pattern diagrams for the support base 321.

The support base pattern may be provided corresponding to a portion that needs to be supported. In the illustrated example, the resin droplet receiving surface 32 is provided.
An example in which the support base 321 is made on the 0 is shown, but the support base 321 may be made on the three-dimensional object 109 being manufactured, and the three-dimensional object 109 may be further stacked on it.

Reference numeral 118 denotes a step of converting the pattern diagram of the support base 321 into a print signal, which is the same as step 111. Then, 119 is a step of ejecting the liquid that forms the support base 321. Step 112 of injecting the ultraviolet curable resin liquid
The droplet ejection step 119 for forming the support base 321 and the support table 321 are advanced substantially simultaneously so that both steps are completed in units of slice planes. When the step of ultraviolet irradiation 113 is completed, the process returns to the next slice layer pattern forming step.

The material forming the support base 321 needs to be removable. A method may also be used in which a liquid in which a pigment is dispersed in a soluble binder is jetted to form the support 321 and a solvent is allowed to act in the final step 120 to remove the support 321.

Using a UV curable resin to which a solvent was added, a gel-like cured product was obtained by irradiation with UV rays and used as a support 321.
In the final step 120, the support base 321 made of the gel-like cured material is peeled off, or a solvent that dissolves the gel-like cured material is acted on and removed. In order to prepare a gel-like cured product or a soft cured product, a resin liquid in which a low molecular weight polymer is generated by irradiation with ultraviolet rays may be applied. Alternatively, a method may be used in which the support base 321 and the three-dimensional object 109 can be separated by injecting a release material as described later.

Alternatively, the droplets forming the support base 321 may be solid such as wax which is solid at room temperature and becomes liquid at high temperature. In this case, the support 321 is removed by heating or a solvent.

In the process of forming the three-dimensional object 109 and the support 321 part, the layer thickness formed by one droplet ejection is different between the support 321 part and the three-dimensional object 109 because the composition of the applied liquid is different. If they are different, it is possible to proceed with the production without any abnormality by adding a correction for adjustment in the thickness direction in the support table pattern drawing process.

The removal of the support 321 in the final step 120 is as described above.

As described above, in the manufacturing method of FIGS. 13 and 14, since two different types of droplets are ejected simultaneously, each ink jet head is integrated to form two types of droplets. What you get is good.

In the method for producing a three-dimensional object described with reference to FIGS. 13 and 14, the method of injecting the release agent onto the boundary surface of the three-dimensional object 109 is slightly different from the other methods, so that the method shown in FIG. The process will be described with reference to FIG.

FIG. 15 is a process drawing, FIG. 16 is a three-dimensional object 109,
It is a figure explaining the relationship of the support stand 321 'and the mold release layer 326, and FIG.17 (a)-(b) has shown each pattern figure.

In FIG. 16 (a), the three-dimensional object 109 and the support 321 'may have the same composition or different compositions, but they are made of the same ultraviolet curable resin for simplification. It is more convenient to do it. And the release layer 3
26 is formed by applying a thin layer along the boundary surface between the two.

As described above with reference to FIG. 16, the three-dimensional object 109 is produced by removing the support table 321 'by applying a force for separating the support table 321' and the three-dimensional object 109. is there.

In the process diagram of FIG. 15, 122 is a cured product pattern diagram producing process, 123 is a release layer pattern diagram producing process, 111 ′ and 124 are print signal converting processes, and 125.
Is a release agent injection process, and 120 'is a support stand removal process.

Based on the slice plan view created in step 110, two pattern views for the manufacturing process are created.
One is a cured product pattern diagram created in step 122, and this pattern constitutes a three-dimensional object and a support. The other is a release layer pattern diagram, which is a three-dimensional object 109 and a support 32.
A release layer 326 between the 1'boundaries is formed.

In FIG. 17, (a) to (e) show examples of the above pattern diagrams, which correspond to the three-dimensional object 109 in FIG. _{S 1 -S 1 ', S 2} -S 2' at the same sectional position as the cross section of the shown in FIG. _{12 (c), S 3 -S} 3 '
The cross section of is at the position shown in FIG.

FIG. 17 (a) is a pattern diagram of the cured product in the S ₁ -S ₁ ′ cross section, which includes the three-dimensional object and the support base, and leaves the release layer between them. Similarly, FIG.
(B) is a cured product pattern diagram of S ₂ -S ₂ '.

Next, FIG. 17C is a pattern diagram of the release layer in the S ₁ -S ₁ ′ cross section, and FIG. 17D is S ₂ −.
S ₂ 'is a release layer pattern diagram of cross section. And in FIG.
(E) shows the release layer pattern diagram of S _3, S ₃ 'section.

The print signal conversion process of 111 'and 124 is the same as the example of FIGS. Then, in the resin liquid jetting step 112, the ultraviolet curable resin liquid is jetted.
Further, in the release agent injection step 25, the release agent is injected. Therefore, the inkjet head preferably has two orifice groups.

As the release agent, waxes dissolved in a solvent, silicone oil, silicone resin liquid, fluorinated resin liquid, etc. are applied.

Next, when the ultraviolet irradiation step 113 is completed, the process returns to the step for forming the next slice layer. When the final layer is cured, the support 321 'is then removed and the three-dimensional object 109 is completed.

In each of the methods described above, the applicable ink jet head may be a multi-nozzle on-demand type or a single-nozzle continuous type. In any case, it is considerably difficult to make the size and distribution density of the liquid droplets of the resin liquid to be sprayed uniform. For example, in the former multi-nozzle type, unevenness occurs due to inconsistency in the shape of each nozzle or the shape of the part to which the injection energy is applied,
Further, when the strip-shaped ejection regions are connected to each other one after another, unevenness occurs in the overlap of the joints.

Even in the continuous type ink jet head, mechanical scanning movement is performed in the main scanning and the sub scanning, but it is difficult to eliminate the feeding unevenness.

There is such unevenness, and the pattern of the unevenness acts as it is when forming each slice plane,
The inconvenience arises that unevenness is generated on the surface to be flatly laminated.

In order to eliminate such irregularity obstacles without increasing the accuracy of the ink jet head and the scanning mechanism, the droplet receiving surface and the ink jet head are moved in the first direction by scanning to move each of the slice planes. A step of ejecting a droplet, a step of relatively rotating the droplet receiving surface and a scanning direction of the inkjet head in a direction different from the first direction, and ejecting a droplet on another slice plane, It is effective to adopt a method in which the step of designating the scanning direction and the step of converting the print signal under the conditions changed based on the above designation are periodically repeated.

18 and 19 are views for explaining the above-mentioned manufacturing method. The former is a process drawing, and the latter is a drawing for explaining a combination example in the scanning direction and a uniformizing effect of the surface to be formed.

In FIG. 18, 110, 111, 11
The steps 2 and 113 are the same as the method described in FIG. The only difference is that the scanning direction in the step of injecting the resin liquid is changed while being sequentially rotated.

Therefore, there is a scanning direction designating step 127, which controls the print signal converting step and the resin liquid jetting step. The change of the printing direction is switched in units of formation of each layer, and is switched during the process from the step of irradiating ultraviolet rays to the step of forming the next layer.

FIG. 19 shows an example of such switching. The illustrated example is an example of manufacturing a three-dimensional object having an elliptic cylindrical shape.

A-1 and a-2 indicate the formation of the lowermost layer,
a-1 indicates the first direction of the ellipse with respect to the scanning direction. Further, a-2 indicates the distribution of the unevenness of the droplets at this time.

When the injection is repeated in this posture, the unevenness is piled up as it is, and the absolute value of the height difference when making a plane is enlarged.

Therefore, in the next layer forming step, as shown in b-1, the direction of the ellipse is rotated by 90 ° with respect to the scanning direction. The situation of the layers superposed in this direction is as shown in b-2, and the absolute value of the unevenness does not increase.

Further, in the next layer formation, when the ellipse is rotated as shown by c-1, the formed layer is in the direction of reducing the unevenness as shown by c-2. Then, the next layer formation is d-
1 and d-2, and thereafter, by repeating the rotations a to d, unevenness in height of the stacked layer thickness does not increase.

In order to perform such rotation, it is necessary to change the conversion condition for forming the print signal from the slice plan view for each rotation direction. That is, c-1
The conversion must be performed after changing the direction of the graphic pattern as shown in ~ d-1. At the same time, in the resin liquid ejecting step 112, the image receiving surface, that is, the surface of the liquid droplet receiving plate and the scanning direction of the inkjet head are relatively rotated. The easiest way is to rotate the receiving plate surface.

The division of the rotation angle can be arbitrarily set according to the situation of unevenness. However, the greater the number of divisions, the greater the effect of reducing unevenness, but the calculation at the time of converting the print signal becomes complicated. Therefore, it is preferable to optimize the division from the balance between the two.

Although the respective methods for producing a three-dimensional object have been described in detail above, according to the method for producing a three-dimensional object discussed in the present invention,
A three-dimensional object manufacturing method that can be executed by a simple device with a simple process can be obtained. Further, it is possible to provide a method for manufacturing a three-dimensional object which can be operated with a small amount of the ultraviolet curable resin liquid having a volume close to that of the three-dimensional object. Further, it is possible to obtain a method capable of producing a three-dimensional object having a shape that cannot be produced by the conventional method.

Further, it is possible to obtain a manufacturing method in which the unevenness of the thickness of each layer at the time of manufacturing the three-dimensional portion is mutually corrected to obtain a three-dimensional object having a flat finished surface.

[0166]

As described above, the present invention uses an ink jet printer that draws and prints a resist image by ejecting resist ink based on the image signal, and applies the image signal of the pattern to be formed to this ink jet printer. A resist pattern is formed by printing a pattern of a resist coating with a resist ink on the surface of a processed substrate. According to this method, it is created based on the information received in the form of an image signal. The resist pattern ejected from the inkjet print head controlled by the drive signal and deposited on the substrate to be processed forms a resist pattern directly on the substrate. Since it is not necessary and the photo exposure and development steps are completely unnecessary,
As a result, the materials are cheap, there is no concern about environmental problems, it is economical in terms of equipment and production costs, and because the image information is printed, it is extremely easy to form a resist pattern. A method of forming a resist pattern having

[Brief description of drawings]

FIG. 1 is a process drawing showing an embodiment of the present invention.

FIG. 2 is a process drawing showing another embodiment of the present invention.

3A is a configuration diagram of a resist pattern forming apparatus according to the present invention, and FIG. 3B is a front view of an orifice plate.

FIG. 4 is a configuration diagram showing another embodiment of the present invention.

FIG. 5 is a diagram for explaining a conventional example.

FIG. 6 is a diagram for explaining a conventional three-dimensional object manufacturing method.

FIG. 7 is a diagram illustrating a conventional three-dimensional object manufacturing method,
(A) is a device configuration diagram, (b), (c) and (d) are layer 4
Sectional drawing of A, 4B, and 4C.

FIG. 8 is a diagram for explaining a conventional three-dimensional object manufacturing method.

FIG. 9 is a process explanatory view of the first embodiment of the three-dimensional object manufacturing method.

FIG. 10 is a sectional view of a three-dimensional object.

FIG. 11 is a view showing an arrangement example of inkjet nozzles.

12A and 12B are explanatory views of a second embodiment of a three-dimensional object manufacturing method, FIGS. 12A and 12B show an example of a three-dimensional object to be manufactured, and FIG. 12C is a view for explaining a manufacturing situation. Fig.

FIG. 13 is a process diagram of a three-dimensional object manufacturing method according to a second embodiment.

FIG. 14 is a diagram for specifically explaining the step of FIG.

FIG. 15 is a process diagram of a method in which a release agent is sprayed onto the boundary surface of a three-dimensional object.

FIG. 16 is a diagram illustrating a relationship between a three-dimensional object, a support and a release layer.

FIG. 17 is a pattern diagram of the three-dimensional object, the support and the release layer in FIG. 16 in the method of injecting the release agent on the boundary surface of the three-dimensional object, and (a) to (e) of FIG. The figure which shows an example.

FIG. 18 is a process drawing for explaining another manufacturing method.

FIG. 19 is a diagram for explaining the manufacturing method of FIG. 18, including (a-1) to (d-1) and (a-2) to (d-
FIG. 2) is a view for explaining a combination example in the scanning direction and the effect of equalizing the formed surface.

[Explanation of symbols]

11 ... Base plate, 12 ... Guide post, 13 ... Guide post beam, 14 ... Lifting platform, 15 ... Lifting platform arm, 1
6, 17 ... Slide rail, 18, 19 ... Slide bearing, 20 ... Bearing receiver, 21 ... Wire hook,
22 ... Wire, 23 ... Wire pulley, 24 ... Motor receiving plate, 25 ... Main scanning motor, 27 ... Cam follower, 26 ...
Cam follower shaft, 29 ... Cam, 28 ... Cam shaft, 30 ... Sub scanning motor, 31 ... Moving scan table, 32 ... Inkjet print head, 33 ... Orifice plate, 34 ... Suction support stand, 35 ... Suction port, 36 ... Exhaust port , 37 ... Exhaust fan,
38 ... Work substrate, 39 ... Struts, 40 ... Pattern CAD
System, 41 ... Receiving circuit, 42 ... Signal converting circuit, 43
... head driver circuit, 44, 45 ... motor driver circuit, 46 ... control circuit.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H05K 3/18 D 7511-4E

Claims (1)

[Claims] 1. A post-processing step in which a resist film having a desired pattern is formed on the surface of a substrate to be processed, and a change is caused in a portion without the resist film based on the difference in surface properties depending on the presence or absence of the resist film. In the method for forming a pattern of a resist film to be applied, an inkjet printer that draws and prints an image by ejecting ink based on an image signal is used, the resist ink is used as the ink of the inkjet printer, and the pattern to be formed is A resist pattern forming method comprising applying an image signal to the inkjet printer to print a pattern of a resist film with a resist ink on the surface of a substrate to be processed.