JPH053374B2 - - Google Patents

Info

Publication number
JPH053374B2
JPH053374B2 JP13757484A JP13757484A JPH053374B2 JP H053374 B2 JPH053374 B2 JP H053374B2 JP 13757484 A JP13757484 A JP 13757484A JP 13757484 A JP13757484 A JP 13757484A JP H053374 B2 JPH053374 B2 JP H053374B2
Authority
JP
Japan
Prior art keywords
molding
supply passage
mold
cooling medium
lower mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP13757484A
Other languages
Japanese (ja)
Other versions
JPS6116821A (en
Inventor
Keisuke Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Priority to JP13757484A priority Critical patent/JPS6116821A/en
Publication of JPS6116821A publication Critical patent/JPS6116821A/en
Publication of JPH053374B2 publication Critical patent/JPH053374B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/02Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/04Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90Measuring, controlling or regulating

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、合成樹脂材料の成形方法とその成形
装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for molding a synthetic resin material and an apparatus for molding the same.

〔従来技術〕[Prior art]

従来、ガラス繊維等の補強材によつて補強され
た熱硬化性合成樹脂材料からなる成形品を得る成
形方法のうち、成形圧力が低い成形方法の一つと
して、上型と下型とを開いて成形空間部を開放
し、その成形空間部にガラス繊維等の補強材をセ
ツトした後、上型と下型を閉じ合わせて閉成され
る成形空間部に熱硬化性合成樹脂材料を充填させ
て硬化させるレジンインジエクト成形方法が利用
されている。
Conventionally, among the molding methods for obtaining molded products made of thermosetting synthetic resin materials reinforced with reinforcing materials such as glass fibers, one of the molding methods with low molding pressure is to open the upper and lower molds. After opening the molding space and setting a reinforcing material such as glass fiber in the molding space, the upper and lower molds are closed and the closed molding space is filled with a thermosetting synthetic resin material. A resin inject molding method is used in which the resin is cured.

このレジンインジエクト成形方法は、設備費が
安価である利点を有するものの成形時間が長く、
生産性が低いという欠点を有する。その理由は、 (1) 成形圧力が低いことから、成形型の材料が
木、樹脂、石こう等が使用されており、これら
の材料は熱伝導性が悪い。
This resin inject molding method has the advantage of low equipment costs, but the molding time is long.
It has the disadvantage of low productivity. The reasons for this are: (1) Since the molding pressure is low, wood, resin, gypsum, etc. are used as mold materials, and these materials have poor thermal conductivity.

(2) 熱硬化性合成樹脂材料が加熱により硬化反応
が促進されることは公知であるが、成形型内に
加熱装置を内装しても成形型の熱伝導性が悪い
ために硬化促進の効果は十分でない。
(2) It is well known that the curing reaction of thermosetting synthetic resin materials is accelerated by heating, but even if a heating device is installed inside the mold, the effect of curing acceleration is limited due to the poor thermal conductivity of the mold. is not enough.

(3) 上述の(1)、(2)の結果、成形時間が長くなる。(3) As a result of (1) and (2) above, the molding time becomes longer.

そこで、レジンインジエクト成形方法の利点を
生かしつつも、成形時間を短縮する方法を考える
と次の条件が必要となる。
Therefore, when considering a method to shorten the molding time while taking advantage of the advantages of the resin injection molding method, the following conditions are required.

(1) 作業者がガラス繊維等の補強材を成形型の成
形空間部にセツトする時および成形品を成形型
から取り出す時は、作業者が成形型に触れる可
能性が高いので、安全上、この時の成形型の温
度は低いほうが望ましい。
(1) When workers set reinforcing materials such as glass fibers in the molding space of the mold or take out the molded product from the mold, there is a high possibility that the worker will touch the mold, so for safety reasons, It is desirable that the temperature of the mold at this time be low.

(2) ガラス繊維等の補強材のセツト作業終了から
合成樹脂材料の硬化までの間の成形型の温度は
高くしなければならない。
(2) The temperature of the mold must be high from the time the reinforcing material such as glass fiber is set until the synthetic resin material hardens.

(3) 成形の1サイクルをさらに短かくするために
は、上述の(1)、(2)の低温から高温への切換えお
よび高温から低温への切換えを短かくしなけれ
ばなならい。
(3) In order to further shorten one molding cycle, it is necessary to shorten the switching from low temperature to high temperature and from high temperature to low temperature in (1) and (2) above.

そして、上述の条件のうち(3)に相当する従来技
術が特開昭51−5362号として公知であり、それを
第3図の概略図によつて説明する。
A conventional technique corresponding to condition (3) above is known as Japanese Patent Laid-Open No. 51-5362, and will be explained with reference to the schematic diagram of FIG.

第3図において、51は下型であつて、この下
型51の上面には上方に開放する成形面51aが
形成されている。また、この下型51の上部には
上型52が配設されており、その下面には下方に
開放する成形面52aが形成されている。そし
て、下型51と上型52とが閉じ合わされた際
に、両型51,52との間に成形空間部が形成さ
れる。
In FIG. 3, 51 is a lower mold, and the upper surface of this lower mold 51 is formed with a molding surface 51a that opens upward. Further, an upper mold 52 is disposed above the lower mold 51, and a molding surface 52a that opens downward is formed on the lower surface of the upper mold 52. When the lower mold 51 and the upper mold 52 are closed together, a molding space is formed between the molds 51 and 52.

また、下型51と上型52の成形面51a,5
2aに近接して、加熱媒体と冷却媒体を交互に供
給する通路51b,52bが形成されており、そ
の一端はパイプ54によつて第1切換弁55に接
続され、他端はパイプ56によつて第2切換弁5
7に接続されている。
Moreover, the molding surfaces 51a, 5 of the lower mold 51 and the upper mold 52
Passages 51b and 52b for alternately supplying a heating medium and a cooling medium are formed adjacent to 2a. 2nd switching valve 5
7 is connected.

また、第1切換弁55の近傍には加熱装置58
と冷却装置59が配設されており、加熱装置58
はパイプ60aによつて第1切換弁55に接続さ
れ、パイプ60bによつて第2切換弁57に接続
されている。また、冷却装置59はパイプ61a
によつて第1切換弁55に接続され、パイプ61
bによつて第2切換弁57に接続されている。
Further, a heating device 58 is provided near the first switching valve 55.
A cooling device 59 is provided, and a heating device 58 is provided.
is connected to the first switching valve 55 by a pipe 60a, and connected to the second switching valve 57 by a pipe 60b. In addition, the cooling device 59 has a pipe 61a.
is connected to the first switching valve 55 by a pipe 61.
b to the second switching valve 57.

そして、熱硬化型合成樹脂材料を用いて成形品
を成形する際には、下型51の通路51bと上型
52の通路52bに冷却装置59から冷却媒体を
通過させて成形空間部53の成形面51a,52
bを適温に下げた後、開放された成形面にガラス
繊維等の補強材をセツトする。つぎに、第1切換
弁55および第2切換弁57を切り換え、加熱装
置58から加熱媒体を下型51の通路51bと上
型52の通路52bに通過させて成形空間部53
の成形面51a,52bを適温に加熱するととも
に、下型51と上型52を閉じ合わせる。その
後、成形空間部53に成形用の合成樹脂材料を充
填して加熱硬化させる。
When molding a molded product using a thermosetting synthetic resin material, a cooling medium is passed from the cooling device 59 through the passage 51b of the lower mold 51 and the passage 52b of the upper mold 52 to form the molding space 53. Surfaces 51a, 52
After lowering b to an appropriate temperature, a reinforcing material such as glass fiber is set on the open molding surface. Next, the first switching valve 55 and the second switching valve 57 are switched to allow the heating medium from the heating device 58 to pass through the passage 51b of the lower mold 51 and the passage 52b of the upper mold 52, thereby forming the molding space 53.
While heating the molding surfaces 51a and 52b to an appropriate temperature, the lower mold 51 and the upper mold 52 are closed together. Thereafter, a synthetic resin material for molding is filled into the molding space 53 and cured by heating.

しかしながら、このようなレジンインジエクト
成形方法においては、成形空間部53の成形面5
1a,52bを高温から低温または低温から高温
に切り換えるのは容易であるが、次のような不具
合がある。
However, in such a resin injection molding method, the molding surface 5 of the molding space 53
Although it is easy to switch 1a and 52b from high temperature to low temperature or from low temperature to high temperature, there are the following problems.

すなわち、加熱装置58と冷却装置59の加熱
媒体および冷却媒体の流体を同じものを利用し、
成形型51,52の通路51b,52bに加熱媒
体と冷却媒体を交互に流通させているため、通路
51b,52b内への加熱媒体と冷却媒体の入り
換え時間が長くなり、成形空間部53の成形面5
1a,52aの温度が所望とする温度に達するま
での時間が長くなる。
That is, by using the same heating medium and cooling medium fluid in the heating device 58 and the cooling device 59,
Since the heating medium and the cooling medium are alternately passed through the passages 51b and 52b of the molding molds 51 and 52, it takes a long time to replace the heating medium and the cooling medium into the passages 51b and 52b, and the molding space 53 is Molding surface 5
It takes a long time for the temperatures of 1a and 52a to reach the desired temperature.

また、第3図に示すように、冷却装置59によ
つて冷却された冷却媒体が通路51b,52bに
循環するようにされた状態から、加熱装置によつ
て加熱された加熱媒体が通路51b,52bに循
環するよう第1切換弁55および第2切換弁57
を切り換えると、第1切換弁55から通路51
b,52bを経て第2切換弁57までの配管通路
内に残存する冷却媒体が加熱装置58内に流入す
るため、加熱された加熱媒体の温度が一時的に降
下する。また、逆に加熱状態から冷却状態に切り
換えると、冷却装置59内に配管通路内に残存す
る加熱媒体が流入し、冷却された冷却媒体の温度
が一時的に上昇する。この結果、成形空間部53
の成形面51a,52aにおける温度切り換えが
遅くなり、成形サイクルが長くなる。
Further, as shown in FIG. 3, from a state in which the cooling medium cooled by the cooling device 59 is circulated through the passages 51b and 52b, the heating medium heated by the heating device is circulated through the passages 51b and 52b. 52b, the first switching valve 55 and the second switching valve 57
When switching the first switching valve 55 to the passage 51
Since the cooling medium remaining in the piping passageway up to the second switching valve 57 via b and 52b flows into the heating device 58, the temperature of the heated heating medium temporarily drops. Conversely, when switching from the heating state to the cooling state, the heating medium remaining in the piping passage flows into the cooling device 59, and the temperature of the cooled cooling medium temporarily increases. As a result, the molding space 53
Temperature switching on the molding surfaces 51a and 52a becomes slow, and the molding cycle becomes longer.

〔発明の目的〕[Purpose of the invention]

本発明は、上記の不具合を解消するためになさ
れたもので、その目的は上型と下型とによつて形
成される成形空間部と近接して加熱媒体の供給通
路と冷却媒体の供給通路を該成形空間部に沿つて
独立して形成することにより、上型と下型によつ
て形成される成形空間部の成形面の温度を所望と
する温度に達するまでの時間を短縮するととも
に、成形サイクルを短くすることができる合成樹
脂材料の成形方法とその成形装置を提供すること
にある。
The present invention has been made to solve the above-mentioned problems, and its purpose is to provide a heating medium supply passage and a cooling medium supply passage close to the molding space formed by the upper mold and the lower mold. is formed independently along the molding space, thereby shortening the time required for the temperature of the molding surface of the molding space formed by the upper mold and the lower mold to reach the desired temperature, It is an object of the present invention to provide a method for molding a synthetic resin material and a molding apparatus therefor, which can shorten the molding cycle.

〔発明の構成〕 上記の目的を達成するために、本発明に係る合
成樹脂材料の成形方法の構成は、上型と下型とに
よつて形成される成形空間部と近接して加熱媒体
の供給通路と冷却媒体の供給通路を該成形空間部
に独立して形成された成形型を用い、冷却媒体の
供給通路に冷却媒体を通過させて成形空間部の成
形面を適温に下げた後、開放された成形面に繊維
補強材をセツトし、前記冷却媒体の供給通路に圧
縮気体を流通させて該冷却媒体の供給通路から冷
却媒体を排出するとともに、前記加熱媒体の供給
通路に加熱媒体を通過させて成形空間部の成形面
を適温に加熱し、その後、上型と下型を閉じ合わ
せて閉成される成形空間部内に成形用の合成樹脂
材料を充填して加熱硬化せしめたものである。
[Structure of the Invention] In order to achieve the above object, the structure of the method for molding a synthetic resin material according to the present invention is such that a heating medium is placed in the vicinity of the molding space formed by the upper mold and the lower mold. Using a mold in which a supply passage and a cooling medium supply passage are formed independently in the molding space, the cooling medium is passed through the cooling medium supply passage to lower the molding surface of the molding space to an appropriate temperature, and then A fiber reinforcing material is set on the open molding surface, compressed gas is passed through the cooling medium supply passage to discharge the cooling medium from the cooling medium supply passage, and a heating medium is supplied to the heating medium supply passage. The molding surface of the molding space is heated to an appropriate temperature, and then the upper and lower molds are closed together, and the molding space is filled with a synthetic resin material for molding and cured by heating. be.

また、本発明に係る合成樹脂材料の成形装置の
構成は、上型と下型のそれぞれに、該上型と下型
とによつて形成される成形空間部に近接して加熱
媒体の供給通路と冷却媒体の供給通路を独立して
形成し、前記加熱媒体の供給通路に熱媒流体を加
熱して供給する手段と気体を圧送する手段とを互
いに切換え可能に設けるとともに、前記冷却媒体
の供給通路に冷媒流体を冷却して供給する手段と
気体を圧送する手段とを互いに切換え可能に設け
たものである。
Furthermore, the configuration of the apparatus for molding a synthetic resin material according to the present invention is such that each of the upper mold and the lower mold has a heating medium supply passageway adjacent to the molding space formed by the upper mold and the lower mold. and a cooling medium supply passage are formed independently, and a means for heating and supplying a heating medium fluid and a means for pumping gas are provided in the heating medium supply passage so as to be switchable with each other, and Means for cooling and supplying refrigerant fluid to the passage and means for pumping gas are provided so as to be switchable with each other.

〔実施例〕〔Example〕

以下、本発明の一実施例を図面に基づいて詳細
に説明する。
Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.

第1図は本発明に係る合成樹脂材料の成形装置
の概略平面図、第2図は第1図の−線に沿つ
て断面図を示すものである。
FIG. 1 is a schematic plan view of a synthetic resin material molding apparatus according to the present invention, and FIG. 2 is a sectional view taken along the line - in FIG. 1.

第1図および第2図において、1は石こうから
形成されている下型であつて、この下型1の上面
および両側面は金属材料によつて被覆されてお
り、その上面には上方に開放する凹状の成形面1
aが形成されているとともに、その周囲は平坦な
当接面1bとなつている。また、下型1の上部に
は上型2が配設されており、その下面および両側
面は下型1と同様に金属材料によつて被覆されて
いる。この上型2には下型1の成形面1aと対向
する部位に凹状の成形面2aが形成されており、
その周囲には下型の当接面1bと当接する平坦な
当接面2bが形成されている。そして、下型1と
上型2が閉じ合わされた際に、両型1,2の間に
成形空間部3が形成されるようになつている。
In FIGS. 1 and 2, 1 is a lower mold made of gypsum, the upper surface and both side surfaces of this lower mold 1 are covered with a metal material, and the upper surface is open upward. Concave molding surface 1
a is formed, and its periphery forms a flat contact surface 1b. Further, an upper mold 2 is disposed above the lower mold 1, and its lower surface and both side surfaces are covered with a metal material similarly to the lower mold 1. This upper mold 2 has a concave molding surface 2a formed at a portion facing the molding surface 1a of the lower mold 1,
A flat abutment surface 2b is formed around it, which abuts against the abutment surface 1b of the lower die. When the lower mold 1 and the upper mold 2 are closed together, a molding space 3 is formed between the molds 1 and 2.

また、下型1と上型2のそれぞれの金属部に
は、下型1と上型2とによつて形成される成形空
間部3に近接して加熱媒体を通過させる供給通路
4と冷却媒体を通過させる供給通路5がそれぞれ
独立して形成されている。
In addition, each of the metal parts of the lower mold 1 and the upper mold 2 has a supply passage 4 through which a heating medium passes in proximity to a molding space 3 formed by the lower mold 1 and the upper mold 2, and a cooling medium. Supply passages 5 are formed independently for each passage.

また、成形型1,2の近傍には第1切換弁6、
第2切換弁7、第3切換弁8および第4切換弁9
が配設されている。そのうち、第1切換弁6はパ
イプ10aによつて供給通路4の入口側にそれぞ
れ通じており、第2切換弁7はパイプ10bよつ
て供給通路4の出口側にそれぞれ通じている。ま
た、第3切換弁8はパイプ10cによつて供給通
路5の入口側にそれぞれ通じており、第4切換弁
9はパイプ10dによつて供給通路5の出口側に
それぞれ接続されている。
Further, a first switching valve 6 is provided near the molds 1 and 2.
Second switching valve 7, third switching valve 8 and fourth switching valve 9
is installed. Of these, the first switching valves 6 each communicate with the inlet side of the supply passage 4 through a pipe 10a, and the second switching valves 7 each communicate with the outlet side of the supply passage 4 through a pipe 10b. Further, the third switching valves 8 are connected to the inlet side of the supply passage 5 through pipes 10c, and the fourth switching valves 9 are connected to the outlet side of the supply passage 5 through pipes 10d.

また、第1切換弁6の近傍には熱媒流体を加熱
する加熱装置11と圧縮空気等の高圧気体を供給
する供給装置12とが配設されており、加熱装置
11出口側はパイプ13aによつて第1切換弁6
に接続され、入口側はパイプ13bによつて第2
切換弁7に接続されている。また、供給装置12
の出口側はパイプ13cによつて第1切換弁6お
よび第3切換弁8に接続されている。
Further, a heating device 11 for heating the heat medium fluid and a supply device 12 for supplying high pressure gas such as compressed air are arranged near the first switching valve 6, and the outlet side of the heating device 11 is connected to a pipe 13a. Therefore, the first switching valve 6
The inlet side is connected to the second
It is connected to the switching valve 7. In addition, the supply device 12
The outlet side of is connected to the first switching valve 6 and the third switching valve 8 by a pipe 13c.

また、第3切換弁8の近傍には冷媒流体を冷却
する冷却装置14が配設されており、その出口側
はパイプ15aによつて第3切換弁8に接続され
ているとともに、入口側はパイプ15bによつて
第4切換弁9に接続されている。
Further, a cooling device 14 for cooling the refrigerant fluid is arranged near the third switching valve 8, and its outlet side is connected to the third switching valve 8 by a pipe 15a, and its inlet side is connected to the third switching valve 8 through a pipe 15a. It is connected to the fourth switching valve 9 by a pipe 15b.

上記のように構成された合成樹脂材料の成形装
置において、熱硬化性合成樹脂材料を用いて成形
品を成形する際には、上型2を下型1から引き離
して成形空間部3を開放させ、下型1の成形面1
aにガラス繊維等の補強材をセツトする。その
間、第3切換弁8を切り換えて冷却装置14から
の冷却媒体を供給通路5に流通させて上型2の成
形面2aおよび下型1の成形面1aをそれぞれ冷
却する。
In the synthetic resin material molding apparatus configured as described above, when molding a molded product using a thermosetting synthetic resin material, the upper mold 2 is separated from the lower mold 1 to open the molding space 3. , molding surface 1 of lower mold 1
Set reinforcing material such as glass fiber on a. During this time, the third switching valve 8 is switched to allow the cooling medium from the cooling device 14 to flow through the supply passage 5 to cool the molding surface 2a of the upper mold 2 and the molding surface 1a of the lower mold 1, respectively.

そして、下型1の成形面1aへの補強材のセツ
ト作業終了後、第3切換弁8および第4切換弁9
を切り換えて供給装置12から高圧気体を供給通
路5に流通させ、供給通路5に残存する冷却媒体
を排出させる。その後、再び第3切換弁8および
第4切換弁9を切り換えて中立状態に維持すると
ともに、第1切換弁6を切り換えて加熱装置11
からの加熱媒体を供給通路4に流通させて上型2
の成形面2aおよび下型1の成形面1aをそれぞ
れ適温に加熱する。
After the reinforcing material is set on the molding surface 1a of the lower mold 1, the third switching valve 8 and the fourth switching valve 9
is switched to flow high-pressure gas from the supply device 12 to the supply passage 5, and the cooling medium remaining in the supply passage 5 is discharged. Thereafter, the third switching valve 8 and the fourth switching valve 9 are switched again to maintain the neutral state, and the first switching valve 6 is switched to maintain the heating device 11.
The heating medium from the upper mold 2 is passed through the supply passage 4 and
The molding surface 2a of the lower mold 1 and the molding surface 1a of the lower mold 1 are respectively heated to appropriate temperatures.

つぎに、上型2を下型1に閉じ合わせ、両型
1,2によつて閉成される補強材の内装された成
形空間部3に不飽和ポリエステル樹脂等の熱硬化
性合成樹脂材料を充填させる。そして、適温に加
熱された成形空間部3に充填された熱硬化性合成
樹脂材料は加熱により硬化が促進され、短時間の
うちに硬化して成形型1,2から取り出し可能と
なる。
Next, the upper mold 2 is closed to the lower mold 1, and a thermosetting synthetic resin material such as unsaturated polyester resin is applied to the molding space 3 filled with reinforcing material, which is closed by both molds 1 and 2. Let it fill. The thermosetting synthetic resin material filled in the molding space 3 heated to an appropriate temperature is accelerated to harden by heating, hardens within a short time, and can be removed from the molds 1 and 2.

つづいて、第1切換弁6および第2切換弁7を
切り換えて供給装置12から高圧気体を供給通路
4に流通させ、供給通路4に残存する加熱媒体を
排出させる。その後、再び第1切換弁6および第
2切換弁7を切り換えて中立状態に維持するとと
もに、第3切換弁8を切り換えて冷却装置14か
らの冷却媒体を供給通路5に流通させて下型1の
成形面1aおよび上型2の成形面2aをそれぞれ
冷却する。
Subsequently, the first switching valve 6 and the second switching valve 7 are switched to allow high-pressure gas to flow from the supply device 12 to the supply passage 4, and the heating medium remaining in the supply passage 4 is discharged. Thereafter, the first switching valve 6 and the second switching valve 7 are switched again to maintain the neutral state, and the third switching valve 8 is switched to allow the cooling medium from the cooling device 14 to flow through the supply passage 5, so that the lower mold 1 The molding surface 1a of the upper mold 2 and the molding surface 2a of the upper mold 2 are respectively cooled.

その後、上型2を下型1から引き離して成形品
部を開放させるとともに、成形品を下型1から取
り出し1サイクルが完了する。そして、上述と同
様にして2サイクル目の成形が行われる。
Thereafter, the upper mold 2 is separated from the lower mold 1 to open the molded part, and the molded product is taken out from the lower mold 1 to complete one cycle. Then, the second cycle of molding is performed in the same manner as described above.

なお、本発明における成形型1,2の冷却また
は加熱のタイミングは本実施例に限定されるもの
でなく、作業者が成形型1,2に触れる可能性の
高い時に成形型1,2を冷却し、そうでない時に
は加熱することもできる。また、本発明の成形装
置においては、熱可塑性合成樹脂材料にも適用す
ることができ、その際には熱可塑性合成樹脂材料
の成形型1,2への注入中は成形面1a,2aを
加熱して合成樹脂材料の温度降下による粘性の増
大を防ぎ、注入完了後に成形面1a,2aを冷却
して合成樹脂材料を固化させる。
Note that the timing of cooling or heating the molds 1 and 2 in the present invention is not limited to this embodiment, and the molds 1 and 2 are cooled when there is a high possibility that an operator will touch the molds 1 and 2. However, if this is not the case, you can also heat it. Furthermore, the molding apparatus of the present invention can also be applied to thermoplastic synthetic resin materials, in which case the molding surfaces 1a and 2a are heated while the thermoplastic synthetic resin material is being poured into the molds 1 and 2. This prevents an increase in viscosity due to a temperature drop in the synthetic resin material, and after injection is completed, the molding surfaces 1a and 2a are cooled to solidify the synthetic resin material.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明に係る合成樹脂材
料の成形方法とその成形装置においては、上型と
下型とによつて形成される成形空間部に近接して
加熱媒体の供給通路と冷却媒体の供給通路を該成
形空間部に沿つて独立して形成したから、上型と
下型によつて形成される成形空間部の成形面の温
度を所望とする温度に達するまでの時間を短縮す
ることができる効果がある。
As explained above, in the synthetic resin material molding method and the molding apparatus according to the present invention, a heating medium supply passage and a cooling medium are provided adjacent to the molding space formed by the upper mold and the lower mold. Since the supply passage is formed independently along the molding space, the time required for the temperature of the molding surface of the molding space formed by the upper mold and the lower mold to reach the desired temperature is shortened. There is an effect that can be done.

また、本発明においては、所望とする温度に達
するまでの時間を短縮することができることによ
つて、単位時間当りの生産量が大きく増加する効
果がある。
Further, in the present invention, since the time required to reach a desired temperature can be shortened, the production amount per unit time can be greatly increased.

また、本発明においては、加熱回路と冷却回路
を独立して設けるため、加熱、冷却のエネルギ容
量が小さくなり、稼働費が安価となる効果を有す
る。
Further, in the present invention, since the heating circuit and the cooling circuit are provided independently, the energy capacity for heating and cooling is reduced, and the operating cost is reduced.

また、本発明においては、作業者が成形型に触
れる可能性の高い時には成形型を冷却するように
したから、従来と同様な適温な作業環境温度を確
保することができる効果がある。
Further, in the present invention, since the mold is cooled when there is a high possibility that the worker will touch the mold, it is possible to maintain an appropriate working environment temperature similar to the conventional method.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る合成樹脂材料の成形装置
の概略平面図である。第2図は第1図の−線
に沿つて断面図である。第3図は従来の合成樹脂
材料の成形装置の概略断面図である。 1……下型、1a……成形面、1b……当接
面、2……上型、2a……成形面、2b……当接
面、3……成形空間部、4……供給通路、5……
供給通路、6……第1切換弁、7……第2切換
弁、8……第3切換弁、9……第4切換弁、10
a,10b,10c,10d……パイプ、11…
…加熱装置、12……供給装置、13a,13
b,13c……パイプ、14……冷却装置、15
a,15b……パイプ。
FIG. 1 is a schematic plan view of a synthetic resin material molding apparatus according to the present invention. FIG. 2 is a sectional view taken along the - line in FIG. 1. FIG. 3 is a schematic cross-sectional view of a conventional synthetic resin material molding apparatus. DESCRIPTION OF SYMBOLS 1... Lower mold, 1a... Molding surface, 1b... Contact surface, 2... Upper mold, 2a... Molding surface, 2b... Contact surface, 3... Molding space, 4... Supply passage , 5...
Supply passage, 6...First switching valve, 7...Second switching valve, 8...Third switching valve, 9...Fourth switching valve, 10
a, 10b, 10c, 10d...pipe, 11...
... Heating device, 12 ... Supply device, 13a, 13
b, 13c...Pipe, 14...Cooling device, 15
a, 15b...Pipe.

Claims (1)

【特許請求の範囲】 1 上型と下型とによつて形成される成形空間部
と近接して加熱媒体の供給通路と冷却媒体の供給
通路を該成形空間部に独立して形成された成形型
を用い、冷却媒体の供給通路に冷却媒体を通過さ
せて成形空間部の成形面を適温に下げた後、開放
された成形面に繊維補強材をセツトし、前記冷却
媒体の供給通路に圧縮気体を流通させて該冷却媒
体の供給通路から冷却媒体を排出するとともに、
前記加熱媒体の供給通路に加熱媒体を通過させて
成形空間部の成形面を適温に加熱し、その後、上
型と下型を閉じ合わせて閉成される成形空間部内
に成形用の合成樹脂材料を充填して加熱硬化せし
めることを特徴とする合成樹脂材料の成形方法。 2 上型と下型のそれぞれに、該上型と下型とに
よつて形成される成形空間部に近接して加熱媒体
の供給通路と冷却媒体の供給通路を独立して形成
し、前記加熱媒体の供給通路に熱媒流体を加熱し
て供給する手段と気体を圧送する手段とを互いに
切換え可能に設けるとともに、前記冷却媒体の供
給通路に冷媒流体を冷却して供給する手段と気体
を圧送する手段とを互いに切換え可能に設けたこ
とを特徴とする合成樹脂材料の成形装置。
[Claims] 1. A molding method in which a heating medium supply passage and a cooling medium supply passage are independently formed in the molding space formed by an upper mold and a lower mold in the vicinity of the molding space. After cooling the molding surface of the molding space to an appropriate temperature by passing the cooling medium through the cooling medium supply passage using a mold, a fiber reinforcement material is set on the open molding surface and compressed into the cooling medium supply passage. Discharging the cooling medium from the cooling medium supply passage by circulating gas,
A heating medium is passed through the heating medium supply passage to heat the molding surface of the molding space to an appropriate temperature, and then the synthetic resin material for molding is placed in the molding space that is closed by closing the upper mold and the lower mold. A method for molding a synthetic resin material, characterized by filling the material with heat and curing it. 2. A heating medium supply passage and a cooling medium supply passage are independently formed in each of the upper mold and the lower mold in proximity to the molding space formed by the upper mold and the lower mold, and A means for heating and supplying the heating medium fluid and a means for pumping the gas are provided in the medium supply passage so as to be switchable with each other, and a means for cooling and supplying the refrigerant fluid and a means for supplying the gas under pressure are provided in the cooling medium supply passage. 1. An apparatus for molding a synthetic resin material, characterized in that means for molding a synthetic resin material are provided so as to be switchable with each other.
JP13757484A 1984-07-03 1984-07-03 Method and apparatus for molding synthetic resin material Granted JPS6116821A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13757484A JPS6116821A (en) 1984-07-03 1984-07-03 Method and apparatus for molding synthetic resin material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13757484A JPS6116821A (en) 1984-07-03 1984-07-03 Method and apparatus for molding synthetic resin material

Publications (2)

Publication Number Publication Date
JPS6116821A JPS6116821A (en) 1986-01-24
JPH053374B2 true JPH053374B2 (en) 1993-01-14

Family

ID=15201898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13757484A Granted JPS6116821A (en) 1984-07-03 1984-07-03 Method and apparatus for molding synthetic resin material

Country Status (1)

Country Link
JP (1) JPS6116821A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0491385B1 (en) * 1990-12-19 1996-02-28 Ykk Corporation Coupling device
DE4104152A1 (en) * 1991-02-12 1992-08-27 Delcroix Jean L DEVICE FOR APPLYING SEVERAL DEVICES WITH ONE OR MORE FLUIDS AND TEMPERATURE THE DEVICES

Also Published As

Publication number Publication date
JPS6116821A (en) 1986-01-24

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