JPH05333101A - Ic board handling device - Google Patents

Abstract

PURPOSE:To enable the feed and recovery of an IC board to be coped with, even if feed and recovery trays respectively have a different configuration and matrix, by providing a tray guide breadth adjusting mechanism at both feed and recovery sides. CONSTITUTION:When a tray configuration set with a tray feed section 2 and a tray recovery section 3 is different, one side of the feed section 2 is brought into contact with a feed tray fixing guide 12, and a feed tray shift guide 11 is adjusted with a feed side tray guide breadth adjusting dial 9. The guide 11 is interlocked with a feed side empty tray shift guide 13, and adjusts the tray positioning of a feed side empty tray buffer section 7. In the recovery section 3, a recovery side empty tray buffer section 8 is similarly adjusted via the operation of a recovery side tray guide breadth adjusting dial 10. After trays are set in place, operation is reset and IC boards are carried to the feed section 2, a feed robot 5, a feed shuttle 16 and a test socket 4 in order, similar to the case where feed and recovery trays have the same configuration. Thereafter, acceptable IC boards are collected into the recovery section 3 and unacceptable IC boards into an unacceptable product tray recovery section 18 via discrimination with a tester.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC supply / collection tray in an IC handler.

[0002]

2. Description of the Related Art A conventional device, as disclosed in Japanese Patent Application Laid-Open No. 1-237471, enables tray-to-tray and magazine-to-magazine supply / collection. The collection side must have the same shape, and if it had a different shape, it was necessary to transfer it.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of using a feed tray and a collection tray having the same shape and the same matrix, and also, by setting parameters, trays having different shapes and different matrices. using,
It is to provide an IC handler capable of supplying and collecting ICs.

[0004]

In order to achieve the above object, the present invention adds software so that a parameter for setting tray data for each IC can be set as supply side tray data / collection side tray data. A guide width adjustment mechanism is provided on each of the supply side and the recovery side.

[0005]

[Function] By adding software and making the tray guide width adjustment mechanism independent on the supply side and the recovery side, the tray used has the same shape and the same matrix for both supply and recovery, and the supply tray and recovery tray are different It is possible to select whether the shape or the matrix is different, which eliminates the need for the trays for storing ICs to have the same shape at the time of supply and at the time of collection.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a layout diagram showing an example of a handler, which is compatible with trays and has different tray shapes on the supply side and the collection side. FIG. 2 is an explanatory diagram of the flow of ICs in the handler when the tray shapes are the same and the tray shapes of the supply side and the collection side are the same. FIG. 3 is a tray diagram in the case of having a matrix of 10 columns and 5 columns used for the handler. FIG. 4 shows a tray diagram in the case of having a matrix of 5 columns and 7 columns used for the handler.

Regarding an IC supply / recovery tray of a handler, an example of a handler in which the supply side and the recovery side use trays having different shapes and different matrices is as follows.
There is a layout diagram shown in FIG.

The handler main body 1 is provided with a tray supply section 2 and a tray recovery section 3 as main components, and is composed of a supply robot 5, a recovery robot 6 and the like as a transfer means to the test socket 4. In the handler having such a layout, the tray supply unit 2 is set with 5 vertical and 7 horizontal trays as shown in FIG. 4, and the tray collecting unit 3 is provided with 10 vertical columns as shown in FIG. Set the horizontal 5 rows of trays. At the time of setting, one side of the supply tray is applied to the supply tray fixing guide 12, and the supply side tray guide width adjusting knob 9 is used to adjust the supply tray moving guide 11 to a position where it is tray-guided.
By this adjustment, since the supply tray moving guide 11 and the supply side empty tray moving guide 13 are mechanically linked,
The tray positioning of the supply side empty tray buffer unit 7 is also adjusted. Similarly, one side of the recovery tray is also applied to the recovery tray fixing guide 15, and the recovery side tray guide width adjusting knob 10 adjusts the recovery tray moving guide 14 to a position where the tray is guided. As a result, the tray positioning adjustment of the empty tray buffer section 8 on the recovery side is performed, and the setting of the trays for supply and recovery is completed. After the trays are set, the setting is switched so that the same flow as the IC when the conventional supply / recovery trays in FIG. 2 have the same shape can be tested by the supply robot 5 from the tray supply unit 2 via the supply shuttle 16. The non-defective ICs are transported to the socket 4, and the defective ICs are recovered to the tray recovery unit 18, and the defective ICs are recovered to the defective tray recovery unit 18, as determined by the tester.

Although the present invention has been described above with reference to an example of the layout, the layout is not limited to this. Further, the tray is not limited to the tray shown in FIGS. 3 and 4.

[0010]

According to the present invention, it is possible to cope with the case where the tray shape and the matrix at the time of supply are different from those at the time of collection. For example, 35 ICs are stored in one tray in the step before the handler. Although the tray was used, the shipping tray can be applied to the case of using a tray for storing 50 pieces, and the IC transfer work of the tray is eliminated.

[Brief description of drawings]

FIG. 1 is an explanatory view of a tray guide width mechanism using trays having different shapes on a supply side and a recovery side.

FIG. 2 is an explanatory diagram of an IC flow of a tray compatible handler.

FIG. 3 is an example of a tray used for a handler, which is 5 × 10.
Top view of a tray with a matrix of rows.

FIG. 4 is a plan view of a tray having a matrix of 7 × 5 rows, which is an example of a tray different from that in FIG. 3;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Handler main body, 2 ... Tray supply part, 3 ... Tray collection part, 11 ... Supply tray movement guide, 12 ... Supply tray fixed guide, 13 ... Supply side empty tray movement guide.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hideyuki Shiba, 390 Muramatsu, Shimizu City, Shizuoka Prefecture, Hitachi Shimizu Engineering Co., Ltd. (72) Takeo Ogawa, 390, Muramatsu, Shimizu City, Shizuoka, Hitachi, Ltd.

Claims (1)

[Claims] 1. In the IC handler, in addition to the trays to be supplied and the trays to be collected having the same shape and the same matrix, the trays on the supplying side and the collecting side have different shapes and different matrices depending on selection. An IC handler characterized by being compatible with any product.