JPH05327159A - Connection structure of substrate and flexible flat cable - Google Patents

Abstract

PURPOSE:To provide connection structure capable of eliminating a connector by a method wherein the ends of a flexible flat cable may be directly and quick dis-connectably fitted to the terminal parts of a substrate. CONSTITUTION:The ends of a flexible flat cable are overlapped with the parts wherein the terminals 13 of a substrate 11 are provided; the alignment pins 33 of a cover plate 31 are inserted into alignment holes 25, 14; furthermore, split pins 34 are also inserted into anchor pins 15 of the substrate 11 so as to fix the cover plate 31 to the substrate 11. Through these procedures, the conductors 23 of the flexible flat plate 21 are pressure-welded onto the corresponding terminals 13 of the substrate 11 to be connected to one another by the spring tension due to the warpage of the cover plate 31 and the recessions 32 thereof.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure in which a terminal of a flexible flat cable (hereinafter abbreviated as "FFC") is detachably connected to a terminal portion of a substrate.

[0002]

2. Description of the Related Art FFC is a thin tape-like insulating sheet made of polyester or the like, which is formed by attaching a metal foil such as copper to one side of the sheet to form a pattern by etching and further attaching a resin film or the like on the upper surface of the metal foil for insulation. It is a cable. This cable allows conductors to be arranged in a narrow pitch of, for example, about 2.54 mm, and has come to be widely used as a cable for connecting substrates of various electronic devices to each other.

The FFC is connected to the board by a method of directly soldering the terminal of the FFC to the terminal portion of the board or a method of attaching a connector to the terminal of the FFC and connecting to the board through the connector. .. In this case, if both terminals of the FFC are soldered to the terminal portions of the board, the board and the board cannot be separated from each other, which causes inconvenience when replacing or repairing the board. Therefore, at least one of the terminals of the FFC needs to be connected to the board through the connector.

[0004]

Since the FFC is a thin sheet-like cable, it is expected that the electronic devices can be miniaturized by connecting the substrates using the FFC, but in reality, Since the connector used for the connection is much thicker than the FFC, it has been a bottleneck in downsizing of electronic devices.

Further, since the connector is used to connect the FFC and the board, the number of parts increases and the assembly becomes complicated,
Parts management becomes complicated, and since the connector itself has a complicated structure in which a large number of contacts are arranged at a predetermined pitch, it has been a cause of increasing the manufacturing cost of electronic devices.

Therefore, an object of the present invention is to directly and removably attach the terminal of the FFC to the terminal portion of the substrate and omit the connector, thereby making it possible to miniaturize the electronic equipment and to improve the manufacturing workability. An object of the present invention is to provide a connection structure between a substrate and an FFC that can reduce the manufacturing cost.

[0007]

In order to achieve the above object, in the connection structure of the substrate and the FFC of the present invention, the terminal of the FFC is superposed on the terminal portion of the substrate, and the terminal of the FFC is provided between the terminal and the substrate. The lid plate is fitted to the substrate so as to sandwich the pin, and the locking means for detachably fitting the lid plate to the substrate is aligned with each terminal of the substrate and each conductor of the FFC. And a means for elastically bringing the end of the FFC into pressure contact with the substrate by the cover plate.

In the above-mentioned structure, when a preferable mode of the present invention is mentioned, the locking means includes a cotter pin projecting from the inner surface of the cover plate and having an enlarged head, and a hole provided in the substrate. It is preferable that

Further, it is preferable that the positioning means comprises a positioning pin projecting from an inner surface of the cover plate and a positioning hole provided in the FFC and the substrate.

Further, it is preferable that the press-contact means has a structure in which the cover plate is bent outward, or a convex portion provided on the inner surface of the cover plate.

Furthermore, it is preferable that the lid plate has a structure that is openably and closably connected to the substrate.

[0012]

According to the connection structure of the present invention, the terminal portion of the substrate is F
Stack the FC terminals and cover with a lid. At this time, the positioning means positions the terminals of the board and the conductors of the FFC so that they are aligned with each other, and the locking means detachably fits the lid plate to the board. As a result, the conductor of the FFC and the terminal of the substrate can be surely brought into contact with each other by the pressure contact means, and the conduction can be secured. Further, when the board is repaired or replaced, the terminal of the FFC can be separated from the board by removing the locking means and opening the lid plate.

As described above, since the terminal of the FFC can be directly fixed to the board and can be removed by opening the cover plate if necessary, it is not necessary to connect to the board through the connector, and the number of parts can be reduced. By reducing the amount, it is possible to improve the manufacturing workability and contribute to the reduction of the manufacturing cost.
Further, since the FFC terminal is installed on the substrate and sandwiched between the lid plates, the structure can be made thinner and the electronic device can be downsized as compared with the case of connecting to the substrate via the connector.

In a preferred embodiment of the present invention, when the locking means is formed of a split pin which is provided on the inner surface of the cover plate so that the head has an enlarged diameter, and a hole provided in the substrate, the cover plate. When the cotter pin is inserted into the hole of the board, the head of the cotter pin engages with the peripheral edge of the hole on the back surface of the board, so that the lid plate can be locked, and the cotter pin can be reduced in diameter to make the hole. The lid plate can be released by pulling out from the lid plate.

Further, when the positioning means is composed of a positioning pin protruding from the inner surface of the cover plate and a positioning hole provided in the FFC and the board, F is provided on the terminal portion of the board.
The FFC can be accurately positioned on the substrate by inserting the positioning pins of the lid plate into the positioning holes of both with the terminals of the FC stacked.

Further, when the pressure contact means has a structure in which the cover plate is curved outward, when the cover plate is covered and locked, a spring force is applied due to the outward curved shape, and the FFC is pressed against the substrate. can do. Further, when the lid plate is provided with a convex portion on the inner surface thereof, the conductor portion of the FFC can be strongly pressed against the terminal portion of the substrate by the convex portion.

Furthermore, when the cover plate is structured to be openably and closably connected to the substrate, it is sufficient to rotate the cover plate to close it, resulting in further improved workability. Since there is no possibility that the component will be separated from the substrate and disappears, component management becomes easy.

[0018]

1 to 3 show an embodiment of a connecting structure according to the present invention, FIG. 1 is an overall perspective view of the connecting structure, FIG. 2 is a sectional view of the connecting structure, and FIG. 3 is used for the connecting structure. It is a sectional view of a cover plate.

In FIG. 1, the FFC 21 has a conductor 23 in which a copper foil is patterned on one surface of a synthetic resin sheet 22 and is covered with a synthetic resin film 24 so as to sandwich the conductor 23 between the synthetic resin sheet 22 and the synthetic resin sheet 22. The synthetic resin film 24 is peeled off at the end of the conductor 23
Is exposed for a predetermined length. Positioning holes 25 are formed on both sides of the terminal of the FFC 21.

The substrate 11 is for mounting an element of an electronic component, has a wiring pattern 12 such as a copper wire formed thereon, and has terminals 13 soldered to its terminals. Positioning holes 14 and locking holes 15 are formed on both sides of the portion where the terminals 13 are provided. F
The conductors 23 at the terminals of the FC 21 are formed at the same pitch as the terminals 13 of the substrate 11, and the conductors 23 and the terminals 13 are aligned by aligning them.

The cover plate 31 has a length equal to or larger than the width of the FFC 21, and has a shape curved outward as shown in the drawing.
When assembled to 1, the spring force is applied. A convex portion 32 is formed in the central portion of the lower surface of the lid plate 31 along the longitudinal direction.
The protrusion 23 is formed, and is located in a portion where the conductor 23 of the FFC 21 and the terminal 13 of the substrate 11 overlap each other. Furthermore,
Positioning pins 33 and split pins 34 are provided on both sides of the lower surface of the cover plate 31, respectively.
3 is positioning holes 25 and 14 of the FFC 21 and the substrate 11.
, And the split pin 34 is in a position corresponding to the locking hole 15 of the substrate 11.

Next, the procedure for connecting the FFC 21 to the substrate 11 in this connection structure will be described.
The terminal portion of C21 is overlaid on the portion of the substrate 11 where the terminal 13 is provided, and the positioning pin 33 of the cover plate 31 is attached to the FFC21.
Of the board 11 with the FFC 21 interposed therebetween while inserting the positioning pin 25 of the board 11 into the positioning hole 14 of the board 11 and inserting the split pin 34 of the cover board 31 into the locking hole 15 of the board 11. Put on top. Then, when the split pin 34 is firmly pushed into the locking hole 15 of the substrate 11, the split pin 3
The head of 4 engages with the periphery of the locking hole 15 on the back surface of the substrate 11,
The lid plate 31 is fixed to the substrate 11.

As a result, as shown in FIG. 2, the positioning pin 33 is inserted into the positioning hole 25 of the FFC 21 and the positioning hole 14 of the substrate 11, so that the conductor 23 of the FFC 21 is aligned with the terminal 13 of the substrate 11, Due to the spring force caused by the warp of the cover plate 31 and the pressing force of the convex portion 32 formed on the inner surface of the cover plate 31, the conductor 23 portion of the FFC 21 is moved to the substrate 11.
The terminal 13 is pressed into contact with the terminal 13 for reliable conduction. In addition,
The FFC 21 can also be removed from the substrate 11 by reducing the diameter of the split pin 34, pulling it out from the locking hole 15, and opening the lid plate 31.

FIG. 4 shows another example of the convex portion formed on the cover plate used in the connection structure of the present invention. That is, the convex portion 35 formed on the lid plate 31 has one side edge portion connected to the inner surface of the lid plate 31 and the other side edge portion between the inner surface of the lid plate 31 and the other side edge portion when viewed from the side section. Has a predetermined gap, extends in the surface direction, and is separated from the inner surface of the cover plate 31. With this structure, the convex portion 35 has a spring property, and the conductor 23 of the FFC 21 can be effectively pressed against the terminal 13 of the substrate 11.

FIG. 5 shows still another example of the convex portion formed on the cover plate used in the connection structure of the present invention. That is, the convex portion 36 formed on the lid plate 31 has one end connected to the side edge portion of the lid plate 31 and is bent with a predetermined gap between the convex portion 36 and the inner surface of the lid plate 31, In addition, the conductors 23 of the FFC 21 and the terminals 13 of the substrate 11 are independently formed at a pitch corresponding to the pitch. According to this structure, the individual conductors 23 of the FFC 21 are surely brought into contact with the corresponding terminals 13 of the board 11 even if the heights of the terminals 13 are not uniform due to variations in the soldering of the terminals 13 of the board 11. be able to.

FIG. 6 shows another embodiment of the connection structure of the present invention. That is, in this embodiment, the lid plate 41
However, it is different in that it is openably and closably connected to the substrate 11 as shown by an arrow A in the figure, and other points are the same as in the embodiment shown in FIGS. In this way, by connecting the lid plate 41 to the substrate 11 so as to be openable and closable,
The connection operation of the FFC 21 is further facilitated, the cover plate 41 is not lost, and the parts management is facilitated.

[0027]

As described above, according to the present invention,
The FFC terminal can be fixed directly to the board, and if necessary, it can be removed by opening the lid plate, eliminating the need to connect to the board via a connector, reducing the number of parts, and facilitating manufacturing workability. Can be improved and the manufacturing cost can be reduced. Further, since the FFC terminal is installed on the substrate and sandwiched between the lid plates, the structure can be made thinner and the electronic device can be downsized as compared with the case of connecting to the substrate via the connector.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a connection structure of the present invention.

FIG. 2 is a sectional view of the connection structure.

FIG. 3 is a cross-sectional view of a cover plate used in the connection structure.

FIG. 4 is a cross-sectional view showing another example of the protrusion formed on the lid plate used in the connection structure of the present invention.

FIG. 5 is a cross-sectional view showing still another example of the convex portion formed on the lid plate used in the connection structure of the present invention.

FIG. 6 is a perspective view showing another embodiment of the connection structure of the present invention.

[Explanation of symbols]

 11 board 12 wiring pattern 13 terminal 14 positioning hole 15 locking hole 21 FFC 23 conductor 25 positioning hole 31 cover plate 32, 35, 36 convex portion 33 positioning pin 34 split pin

Claims (6)

[Claims] 1. A structure in which a terminal of a flexible flat cable is superposed on a terminal portion of a substrate, and a lid plate is fitted to the substrate so as to sandwich the terminal of the flexible flat cable between the substrate and the terminal, Locking means for removably fitting the plate to the board, means for aligning each terminal of the board and each conductor of the flexible flat cable, and a terminal of the flexible flat cable by the cover plate. And a means for elastically pressure-contacting the substrate with the substrate, and a connecting structure between the substrate and the flexible flat cable. 2. The board according to claim 1, wherein the locking means includes a split pin that is provided on the inner surface of the lid plate and has a head with an enlarged diameter, and a hole provided in the board. Connection structure with a flexible flat cable. 3. The board according to claim 1, wherein the positioning means includes a positioning pin protruding from an inner surface of the cover plate, and a positioning hole formed in the flexible flat cable and the board. Connection structure with a flexible flat cable. 4. The connection structure between a substrate and a flexible flat cable according to claim 1, wherein the press-contact means has a structure in which the cover plate is bent outward. 5. The connection structure between a substrate and a flexible flat cable according to claim 1, wherein the press-contact means is a convex portion provided on the inner surface of the lid plate. 6. The connection structure between a substrate and a flexible flat cable according to claim 1, wherein the lid plate is openably and closably connected to the substrate.