JPH05318799A - Thermal head - Google Patents

Thermal head

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Publication number
JPH05318799A
JPH05318799A JP13471392A JP13471392A JPH05318799A JP H05318799 A JPH05318799 A JP H05318799A JP 13471392 A JP13471392 A JP 13471392A JP 13471392 A JP13471392 A JP 13471392A JP H05318799 A JPH05318799 A JP H05318799A
Authority
JP
Japan
Prior art keywords
heating resistor
conductive layer
thermal head
thermal
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13471392A
Other languages
Japanese (ja)
Inventor
Ryoichi Shiraishi
良一 白石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP13471392A priority Critical patent/JPH05318799A/en
Publication of JPH05318799A publication Critical patent/JPH05318799A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To provide a thermal head sliding without damaging thermal paper or a thermal transfer ribbon and performing printing of high quality on recording paper. CONSTITUTION:A thermal head is constituted by forming a plurality of heating resistors on a square insulating substrate 2 along one side among two sides meeting each other at a right angle on the upper surface of the substrate 2 by membrane forming technique and providing a plurality of the connection terminals 6 connected to an external electric circuit on the substrate 2 along the other side and electrically connecting the heating resistors 3 and the connection terminals 6 by a conductive layer 4 formed by membrane forming technique. The connection terminals 6 are formed at a position lower than the surface provided with the heating resistors 3 by thick membrane forming technique.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はワードプロセッサ等のプ
リンタ機構に組み込まれるサーマルヘッドの改良に関
し、より詳細には記録紙に所定速度で摺接させつつ印
字、印画を行うシリアル型のサーマルヘッドの改良に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a thermal head incorporated in a printer mechanism such as a word processor, and more particularly, an improvement of a serial type thermal head for printing and printing while slidingly contacting a recording paper at a predetermined speed. It is about.

【0002】[0002]

【従来の技術】従来、ワードプロセッサ等のプリンタ機
構に組み込まれるシリアル型のサーマルヘッドは図4に
示す如く、アルミナセラミックス等の電気絶縁材料から
成り、四角形状を有する絶縁基体11の上面に、窒化タン
タル等から成る複数個の発熱抵抗体12と、該発熱抵抗体
12に接続され、各発熱抵抗体12にジュール発熱を起こさ
せるための電力を供給する複数個の導電層13とを被着さ
せた構造を有しており、各発熱抵抗体12に導電層13を介
して電力を印加し、発熱抵抗体12をジュール発熱させる
とともに感熱紙や熱転写リボンに摺接させ、発熱抵抗体
12の発する熱で感熱紙を変色させたり、熱転写リボンの
インクを記録紙に転写させることによって記録紙に所定
の印字、印画が行われる。
2. Description of the Related Art Conventionally, as shown in FIG. 4, a serial type thermal head incorporated in a printer mechanism such as a word processor is made of an electrically insulating material such as alumina ceramics. A plurality of heat generating resistors 12 and the like, and the heat generating resistors
The heating resistor 12 has a structure in which a plurality of conductive layers 13 for supplying electric power to cause Joule heat generation are attached to each heating resistor 12, and each heating resistor 12 has a conductive layer 13 Power is applied to the heating resistor 12 to generate Joule heat, and the heating resistor 12 is slidably contacted with the thermal paper or the thermal transfer ribbon.
Predetermined printing and printing are performed on the recording paper by discoloring the thermal paper with the heat generated by 12 or transferring the ink of the thermal transfer ribbon to the recording paper.

【0003】尚、前記サーマルヘッドにおいては発熱抵
抗体12が絶縁基体11の一辺( 感熱紙との摺接において摺
接方向の後部側の辺) に沿って直線状に配列されてお
り、発熱抵抗体12を感熱紙や熱転写リボンに摺接させる
ことによって記録紙に印字を行う際、サーマルヘッドの
感熱紙や熱転写リボンに対する滑りを良好とするととも
に印字、印画の滲みを有効に防止するようになってい
る。
In the thermal head, the heating resistors 12 are linearly arranged along one side of the insulating substrate 11 (the side on the rear side in the sliding contact direction with the thermal paper). When printing on recording paper by sliding the body 12 to thermal paper or thermal transfer ribbon, it makes the thermal head slide well on thermal paper or thermal transfer ribbon, and effectively prevents bleeding of printing or printing. ing.

【0004】また前記絶縁基体11上に被着される発熱抵
抗体12及び導電層13は微細パターンであるため通常、ス
パッタリング法やイオンプレーティング法等の薄膜形成
技術及びフォトリソグラフィー技術を採用することによ
って形成されている。
Further, since the heating resistor 12 and the conductive layer 13 deposited on the insulating substrate 11 are fine patterns, it is usual to adopt a thin film forming technique such as a sputtering method or an ion plating method and a photolithography technique. Is formed by.

【0005】更に前記発熱抵抗体12に接続される導電層
13はその終端が絶縁基体11の発熱抵抗体12の配列方向と
直交する方向の一辺に導出されており、該終端は外部電
気回路と接続される接続端子14を構成し、外部電気回路
基板15の配線16が半田等を介し取着、接続される。
Further, a conductive layer connected to the heating resistor 12
The end of 13 is led out to one side of the insulating substrate 11 in the direction orthogonal to the arrangement direction of the heating resistors 12, the end constitutes a connection terminal 14 connected to an external electric circuit, and the external electric circuit board 15 The wiring 16 is attached and connected via solder or the like.

【0006】しかしながら、この従来のサーマルヘッド
においては発熱抵抗体12と該発熱抵抗体12に電力を供給
する導電層13とが同一平面に形成されていること、各導
電層13の終端に形成されている接続端子14と外部電気回
路基板15の配線16との接続が半田等を介して行われてい
ること等から外部電気回路基板15の配線16と接続端子14
との接続部位の高さが発熱抵抗体12の高さより高くな
り、その結果、サーマルヘッドを感熱紙や熱転写リボン
等に摺接させ、記録紙に印字、印画を行う際、前記外部
電気回路基板15の配線16と接続端子14との接続部が感熱
紙や熱転写リボンに接触して感熱紙等に傷を付けてしま
ったり、感熱紙や熱転写リボンと発熱抵抗体との接触が
不完全となり、記録紙に高品質の印字、印画が形成でき
ないという欠点を有していた。
However, in this conventional thermal head, the heating resistor 12 and the conductive layer 13 for supplying electric power to the heating resistor 12 are formed on the same plane and are formed at the end of each conductive layer 13. Since the connection terminal 14 and the wiring 16 of the external electric circuit board 15 are connected via solder or the like, the wiring 16 of the external electric circuit board 15 and the connection terminal 14 are
The height of the connection portion with and becomes higher than the height of the heating resistor 12, as a result, when the thermal head is brought into sliding contact with thermal paper or thermal transfer ribbon, and when printing or printing on recording paper, the external electric circuit board is used. The connection portion between the wiring 16 of 15 and the connection terminal 14 contacts the thermal paper or the thermal transfer ribbon to scratch the thermal paper, or the contact between the thermal paper or the thermal transfer ribbon and the heating resistor becomes incomplete. It has a drawback that high quality printing and printing cannot be formed on the recording paper.

【0007】そこで上記欠点を解消するために絶縁基体
11に設けた接続端子14の位置を絶縁基体11に段差を設け
ることよって発熱抵抗体12が被着されている面より低く
し、これによって外部電気回路基板15の配線16と接続端
子14との接続部の高さを低く抑えることが考えられる。
Therefore, in order to solve the above-mentioned drawbacks, an insulating substrate
The position of the connection terminal 14 provided on 11 is made lower than the surface on which the heating resistor 12 is adhered by providing a step on the insulating substrate 11, and thereby the wiring 16 of the external electric circuit board 15 and the connection terminal 14 are separated. It is possible to keep the height of the connection portion low.

【0008】しかしながら絶縁基体11に段差を設けると
絶縁基体11の上面に、終端に接続端子14を有する導電層
13をスパッタリング法等の薄膜形成技術による成膜とフ
ォトリソグラフー技術によるパターン化によって被着さ
せる際、段差部において均一厚みの成膜が不可となると
ともに露光光の干渉によるパターンニングの乱れを発生
して所望する正確なパターンが得られず、その結果、導
電層13が断線したり、或いは隣接する導電層13が短絡し
たりしてサーマルヘッドとしての機能が喪失するという
欠点を誘発してしまう。
However, when a step is formed on the insulating base 11, a conductive layer having a connection terminal 14 at the end is formed on the upper surface of the insulating base 11.
When depositing 13 by thin film formation technology such as sputtering and patterning by photolithography technology, it becomes impossible to form a uniform thickness at the stepped portion and patterning disturbance due to interference of exposure light occurs. As a result, the desired accurate pattern cannot be obtained, and as a result, the conductive layer 13 is broken, or the adjacent conductive layer 13 is short-circuited, which causes a defect that the function as a thermal head is lost. ..

【0009】[0009]

【目的】本発明は上記欠点に鑑み案出されたもので、そ
の目的は感熱紙や熱転写リボン等に傷を付けることなく
摺動し、記録紙に品質の高い印字、印画を行うことがで
きるサーマルヘッドを提供することにある。
[Purpose] The present invention has been devised in view of the above-mentioned drawbacks, and an object thereof is to perform sliding and printing on a recording paper with high quality without damaging the thermal paper or thermal transfer ribbon. It is to provide a thermal head.

【0010】[0010]

【課題を解決するための手段】本発明は四角状絶縁基体
の上面で直交する二つの辺のうち、一方の辺に沿って薄
膜形成技術により形成される複数個の発熱抵抗体を、他
方の辺に沿って外部電気回路に接続される複数個の接続
端子を被着し、且つ前記発熱抵抗体と接続端子とを薄膜
形成技術により形成される導電層により電気的に接続し
てなるサーマルヘッドであって、前記接続端子は発熱抵
抗体が被着されている面より低い位置に厚膜形成技術に
よって形成されていることを特徴とするものである。
The present invention provides a plurality of heating resistors formed by a thin film forming technique along one of two sides orthogonal to each other on the upper surface of a rectangular insulating substrate, and A thermal head in which a plurality of connection terminals connected to an external electric circuit are attached along the sides, and the heating resistor and the connection terminals are electrically connected by a conductive layer formed by a thin film forming technique. The connection terminal is formed by a thick film forming technique at a position lower than the surface on which the heating resistor is adhered.

【0011】[0011]

【作用】本発明のサーマルヘッドによれば外部電気回路
に接続される接続端子を発熱抵抗体が形成されている面
より低い位置に形成したことから接続端子に外部電気回
路基板の配線を半田等を介して接続しても該接続部の高
さは発熱抵抗体より低くなり、その結果、外部電気回路
基板の配線と接続端子の接続部が感熱紙や熱転写リボン
に接触して感熱紙等に傷を付けることはなく、同時に感
熱紙や熱転写リボンと発熱抵抗体との接触を良好として
記録紙に高品質の印字、印画を形成することができる。
According to the thermal head of the present invention, since the connection terminal connected to the external electric circuit is formed at a position lower than the surface on which the heating resistor is formed, the wiring of the external electric circuit board is soldered to the connection terminal. The height of the connecting portion is lower than that of the heat-generating resistor even when connected via, and as a result, the connecting portion of the wiring of the external electric circuit board and the connecting terminal comes into contact with the thermal paper or the thermal transfer ribbon and becomes a thermal paper. It is possible to form high quality prints and prints on the recording paper without causing scratches and at the same time making good contact between the heat sensitive paper or the heat transfer ribbon and the heat generating resistor.

【0012】[0012]

【実施例】次に本発明を添付図面に基づき詳細に説明す
る。図1 は本発明にかかるサーマルヘッドの平面図、図
2 は図1 に示すサーマルヘッドのXーX線断面図、図3
は図1に示すサーマルヘッドの側面図を示し、サーマル
ヘッド1 は基本的に絶縁基体2 、発熱抵抗体3 及び導電
層4 より構成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings. Figure 1 is a plan view of the thermal head according to the present invention.
2 is a sectional view of the thermal head shown in FIG.
Shows a side view of the thermal head shown in FIG. 1, and the thermal head 1 is basically composed of an insulating substrate 2, a heating resistor 3 and a conductive layer 4.

【0013】前記絶縁基体2 はアルミナセラミックス等
の電気絶縁材料から成り、その上面に発熱抵抗体3 及び
導電層4 が被着され、発熱抵抗体3 及び導電層4 を支持
するら支持部材として作用する。
The insulating substrate 2 is made of an electrically insulating material such as alumina ceramics, and the heating resistor 3 and the conductive layer 4 are adhered on the upper surface of the insulating substrate 2. When the heating resistor 3 and the conductive layer 4 are supported, the insulating substrate 2 functions as a supporting member. To do.

【0014】前記アルミナセラミックス等の電気絶縁材
料から成る絶縁基体2 は、例えばアルミナ(Al 2 O 3 )
、シリカ(SiO2 ) 、マグネシア(MgO) 、カルシア(CaO)
等の原料粉末に適当な有機溶剤、溶媒を添加混合して
泥漿状となすとともにこれを従来周知のドクターブレー
ド法やカレンダーロール法等を採用しシート状に成形す
ることによってセラミックグリーンシート( セラミック
生シート) を得、しかる後、前記セラミックグリーンシ
ートを打ち抜き加工法により所定形状に打ち抜き、高温
( 約1600℃) で焼成することによって四角形状に製作さ
れる。
The insulating substrate 2 made of an electrically insulating material such as alumina ceramics is, for example, alumina (Al 2 O 3 )
, Silica (SiO 2 ), magnesia (MgO), calcia (CaO)
Ceramic green sheet (ceramic green sheet) is formed by adding a suitable organic solvent and solvent to raw material powder such as to form a slurry and forming it into a sheet by using the well-known doctor blade method or calender roll method. Sheet), and then the ceramic green sheet is punched into a predetermined shape by a punching process,
It is made into a square shape by firing at (about 1600 ° C).

【0015】また前記四角形状の絶縁基体2 上面にはそ
の一辺( 感熱紙や熱転写リボンとの摺接において摺接方
向の後部側の辺) に沿って帯状の蓄熱層5 が被着されて
おり、該蓄熱層5 は発熱抵抗体3 の発する熱を適度に蓄
積し、サーマルヘッドが速く印字に必要な高温となるよ
う作用する。
Further, a band-shaped heat storage layer 5 is deposited on the upper surface of the quadrangular insulating substrate 2 along one side thereof (the side on the rear side in the sliding contact direction in the sliding contact with the thermal paper or the thermal transfer ribbon). The heat storage layer 5 appropriately accumulates the heat generated by the heating resistor 3 and acts so that the thermal head quickly reaches the high temperature required for printing.

【0016】前記蓄熱層5 は例えば、SiO 2 ーBaO ーCa
O ーAl 2 O 3ーB 2 O 3 系ガラスやSiO 2 ー Al 2 O 3
ーBaO 系ガラス等のガラスから成り、所定成分のガラス
粉末に適当な有機溶剤、溶媒を添加混合して得たガラス
ペーストを絶縁基体2 の上面に従来周知のスクリーン印
刷法により帯状に印刷塗布し、これを約700 ℃の温度で
焼き付けることによって絶縁基体2 の上面に帯状に被着
される。
The heat storage layer 5 is made of, for example, SiO 2 --BaO--Ca.
O over Al 2 O 3 over B 2 O 3 type glass, SiO 2, over Al 2 O 3
-Made of glass such as BaO-based glass, a glass paste obtained by adding and mixing an appropriate organic solvent and solvent to glass powder of the specified components is applied by printing on the upper surface of the insulating substrate 2 in a strip shape by a conventionally known screen printing method. By baking this at a temperature of about 700 ° C., it is applied in a strip shape on the upper surface of the insulating substrate 2.

【0017】前記絶縁基体2 に被着させた帯状蓄熱層5
上にはまた複数個の発熱抵抗体3 が直線状に配列被着さ
れており、該発熱抵抗体3 の両端には各発熱抵抗体3 の
個々に接続される個別導電層4aと各発熱抵抗体3 に共通
に接続される共通導電層4bとより成る導電層4 が被着さ
れている。
A band-shaped heat storage layer 5 adhered to the insulating substrate 2
A plurality of heating resistors 3 are linearly arranged and deposited on the upper side of the heating resistor 3. At both ends of the heating resistor 3, the individual conductive layers 4a individually connected to the heating resistors 3 and the heating resistors are attached. A conductive layer 4 consisting of a common conductive layer 4b commonly connected to the body 3 is applied.

【0018】前記発熱抵抗体3 は窒化タンタル等から成
り、該発熱抵抗体3 は、それ自体が所定の電気抵抗率を
有しているため発熱抵抗体3 の両端に被着接続されてい
る個別導電層4aと共通導電層4bとを介して電力が供給印
加されるとジュール発熱を起こし、印字画像を形成する
に必要な温度、例えば300 〜450 ℃の温度に発熱する。
The heating resistor 3 is made of tantalum nitride or the like, and since the heating resistor 3 itself has a predetermined electric resistivity, it is individually attached to both ends of the heating resistor 3. When electric power is supplied and applied through the conductive layer 4a and the common conductive layer 4b, Joule heat is generated, and heat is generated at a temperature required to form a printed image, for example, a temperature of 300 to 450 ° C.

【0019】尚、前記発熱抵抗体3 は従来周知のスパッ
タリング法等の薄膜形成技術及びフォトリソグラフィー
技術を採用することによって絶縁基体2 の上面に被着さ
せた蓄熱層5 上に微細パターンに被着形成される。
The heating resistor 3 is applied in a fine pattern on the heat storage layer 5 applied to the upper surface of the insulating substrate 2 by using a thin film forming technique such as a sputtering method and a photolithography technique which are well known in the art. It is formed.

【0020】また前記発熱抵抗体3 にはその両端に個別
導電層4aと共通導電層4bとから成る導電層4 が被着接続
されており、該導電層4 は発熱抵抗体3 にジュール発熱
をおこさせるための所定の電力を供給する作用を為す。
A conductive layer 4 composed of an individual conductive layer 4a and a common conductive layer 4b is adhered and connected to both ends of the heating resistor 3, and the conductive layer 4 causes Joule heating to the heating resistor 3. It has a function of supplying a predetermined electric power for causing the operation.

【0021】前記導電層4 はアルミニウム(Al)、銅(Cu)
等の金属から成り、従来周知のスパッタリング法等の薄
膜形成技術及びフォトリソグラフィー技術を採用するこ
とによって発熱抵抗体3 の両端から絶縁基体2 の一辺(
発熱抵抗体3 の配列方向に対し直交する方向の一辺) に
かけて微細パターンに被着形成される。
The conductive layer 4 is made of aluminum (Al), copper (Cu)
Made of a metal such as
A fine pattern is adhered to and formed on one side of the heating resistor 3 in a direction orthogonal to the arrangement direction.

【0022】また前記導電層4 は絶縁基体2 の一辺に導
出させた部位が絶縁基体2 の一辺に設けた接続端子6 に
接続されており、該接続端子6 には外部電気回路基板7
の配線8 が半田等のロウ材を介し取着接続される。
Further, the conductive layer 4 is connected to a connecting terminal 6 provided on one side of the insulating substrate 2 at a portion led out to one side of the insulating substrate 2, and the connecting terminal 6 has an external electric circuit board 7 connected thereto.
The wiring 8 is attached and connected through a brazing material such as solder.

【0023】前記導電層4 が接続される接続端子6 は外
部電気回路基板7 の配線8 と導電層4 とを接続する作用
を為し、図3 に示すように絶縁基体1 に設けた段差の領
域Aに形成されている。
The connection terminal 6 to which the conductive layer 4 is connected functions to connect the wiring 8 of the external electric circuit board 7 and the conductive layer 4, and as shown in FIG. It is formed in the region A.

【0024】前記接続端子6 は絶縁基体2 の段差領域A
に形成され、発熱抵抗体3 よりも低い位置に形成されて
いることから接続端子6 に外部電気回路基板7 の配線8
を半田等のロウ材を介し取着接続したとしても該接続部
の高さは発熱抵抗体3 の位置より相当低くなり、その結
果、印字時、外部電気回路基板7 の配線8 と接続端子6
との接続部が感熱紙や熱転写リボンに接触することはな
く、感熱紙等に傷を付けるのを皆無とし、同時に感熱紙
や熱転写リボンと発熱抵抗体との接触を良好として記録
紙に高品質の印字、印画を形成することができる。
The connection terminal 6 is a stepped area A of the insulating substrate 2.
Since it is formed at a position lower than the heating resistor 3, the connection terminal 6 is connected to the wiring 8 of the external electric circuit board 7.
Even if they are attached and connected via a brazing material such as solder, the height of the connection portion is considerably lower than the position of the heating resistor 3, and as a result, at the time of printing, the wiring 8 of the external electric circuit board 7 and the connection terminal 6 are connected.
Since the connection part with does not contact the thermal paper or thermal transfer ribbon, it does not scratch the thermal paper, etc., and at the same time, the thermal paper and thermal transfer ribbon are in good contact with the heating resistor to ensure high quality recording paper. Can be printed and printed.

【0025】また前記接続端子6 は金、銀等の金属から
成り、該金属粉末に適当な有機溶剤、溶媒を添加混合し
て得た金属ペーストを絶縁基体2 の段差領域A に従来周
知のスクリーン印刷法等を採用することによって印刷塗
布するとともにこれを約600℃の温度で焼き付けること
によって絶縁基体2 の段差領域A に一部を導電層4 に接
触させた状態で所定パターンに被着形成される。この場
合、接続端子6 はスクリーン印刷等の厚膜形成技術によ
り形成されることから絶縁基体2 に段差を有していたと
しても所定厚み、所定パターンに正確に形成することが
でき、その結果、導電層4 を接続端子6 を介して外部電
気回路基板7 の配線8 に確実に接続することができ、外
部電気回路基板7 の配線8 から導電層4 に発熱抵抗体3
をジュール発熱させるに必要な所定の電力を確実に供給
することができる。
The connection terminal 6 is made of a metal such as gold or silver, and a metal paste obtained by adding and mixing an appropriate organic solvent or solvent to the metal powder is applied to the step area A of the insulating substrate 2 by a conventionally known screen. By applying a printing method or the like and printing it at a temperature of about 600 ° C., the stepped region A of the insulating substrate 2 is partially formed in contact with the conductive layer 4 to form a predetermined pattern. It In this case, since the connection terminal 6 is formed by a thick film forming technique such as screen printing, even if the insulating substrate 2 has a step, it can be accurately formed in a predetermined thickness and a predetermined pattern. The conductive layer 4 can be securely connected to the wiring 8 of the external electric circuit board 7 via the connection terminal 6, and the heating resistor 3 can be connected from the wiring 8 of the external electric circuit board 7 to the conductive layer 4.
It is possible to reliably supply the predetermined electric power required to generate Joule heat.

【0026】尚、前記接続端子6 が形成される絶縁基体
2 の段差領域A は絶縁基体2 の一辺を研削板を用いた機
械的加工、或いは絶縁基体2 となるセラミックグリーン
シートの一部をカッターナイフ等で削り取っておくこと
によって絶縁基体2 の一辺に形成される。
An insulating substrate on which the connection terminal 6 is formed
The stepped region A of 2 is formed on one side of the insulating base 2 by mechanically processing one side of the insulating base 2 using a grinding plate or by scraping off a part of the ceramic green sheet to be the insulating base 2 with a cutter knife or the like. To be done.

【0027】かくして、本発明のサーマルヘッドによれ
ば各発熱抵抗体3 に外部電気回路基板7 の配線8 及び導
電層4 を介して電力を印加し、発熱抵抗体3 をジュール
発熱させるとともに感熱紙や熱転写リボンに摺接させ、
発熱抵抗体3 の発する熱で感熱紙を変色させたり、熱転
写リボンのインクを記録紙に転写させることによって記
録紙に所定の印字、印画が行われる。
Thus, according to the thermal head of the present invention, electric power is applied to each heating resistor 3 via the wiring 8 of the external electric circuit board 7 and the conductive layer 4 to heat the heating resistor 3 by Joule heat and the thermal paper. And sliding contact with the thermal transfer ribbon,
Predetermined printing and printing are performed on the recording paper by discoloring the thermal paper with the heat generated by the heating resistor 3 or transferring the ink of the thermal transfer ribbon to the recording paper.

【0028】尚、本発明は上述の実施例に限定されるも
のではなく、本発明の要旨を逸脱しない範囲であれば種
々の変更は可能であり、例えば発熱抵抗体3 及び導電層
4 の表面を窒化珪素やサイアロン等から成る保護膜9 で
被覆しておけば該被覆層9 によって発熱抵抗体3 や導電
層4 が感熱紙や熱転写リボンとの摺接により磨耗を受け
るのを有効に防止することができるとともに発熱抵抗体
3 や導電層4 に大気中に含まれる水分や感熱紙に含まれ
るナトリウムイオン等が接触するのを阻止して発熱抵抗
体3 や導電層4 が酸化腐食するのを有効に防止すること
ができる。
The present invention is not limited to the above-mentioned embodiments, but various modifications can be made without departing from the scope of the present invention. For example, the heating resistor 3 and the conductive layer.
If the surface of 4 is covered with a protective film 9 made of silicon nitride, sialon, etc., it is effective for the heating layer 3 and conductive layer 4 to be worn by sliding contact with the thermal paper or thermal transfer ribbon by the coating layer 9. Can be prevented and heat generating resistor
It is possible to prevent the moisture contained in the atmosphere and the sodium ions contained in the thermal paper from coming into contact with 3 and the conductive layer 4 and effectively prevent the heating resistor 3 and the conductive layer 4 from being oxidized and corroded. ..

【0029】[0029]

【発明の効果】本発明のサーマルヘッドによれば外部電
気回路基板の配線が接続される接続端子を発熱抵抗体が
形成されている面より低い位置に形成したことから接続
端子に外部電気回路基板の配線を半田等を介して接続し
ても該接続部の高さは発熱抵抗体より低くなり、その結
果、外部電気回路基板の配線と接続端子の接続部が感熱
紙や熱転写リボンに接触して感熱紙等に傷を付けること
はなく、同時に感熱紙や熱転写リボンと発熱抵抗体との
接触を良好として記録紙に高品質の印字、印画を形成す
ることができる。
According to the thermal head of the present invention, since the connection terminal to which the wiring of the external electric circuit board is connected is formed at a position lower than the surface on which the heating resistor is formed, the external electric circuit board is connected to the connection terminal. Even if the wiring is connected via solder or the like, the height of the connecting portion is lower than that of the heating resistor, and as a result, the connecting portion between the wiring of the external electric circuit board and the connecting terminal contacts the thermal paper or thermal transfer ribbon. Thus, the thermal paper or the like is not damaged, and at the same time, the thermal paper or the thermal transfer ribbon can be brought into good contact with the heating resistor to form high-quality prints and prints on the recording paper.

【0030】また接続端子をスクリーン印刷等の厚膜形
成技術により形成したことから接続端子と導電層とを確
実に接続させることができるとともに隣接する接続端子
間に短絡が発生するのを皆無となすことができ、その結
果、各発熱抵抗体に外部電気回路基板の配線から供給さ
れる電力を導電層を介して確実に印加させ、各発熱抵抗
体に印字に必要な所定のジュール発熱を正確に行わせる
ことができる。
Further, since the connection terminals are formed by a thick film forming technique such as screen printing, the connection terminals and the conductive layer can be surely connected to each other and a short circuit between adjacent connection terminals is completely eliminated. As a result, the electric power supplied from the wiring of the external electric circuit board can be surely applied to each heating resistor through the conductive layer, and each heating resistor can accurately generate the predetermined Joule heat required for printing. Can be done.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のサーマルヘッドの一実施例を示す平面
図である。
FIG. 1 is a plan view showing an embodiment of a thermal head of the present invention.

【図2】図1に示すサーマルヘッドのXーX線断面図で
ある。
FIG. 2 is a sectional view taken along line XX of the thermal head shown in FIG.

【図3】図1に示すサーマルヘッドの側面図である。FIG. 3 is a side view of the thermal head shown in FIG.

【図4】従来のサーマルヘッドの平面図である。FIG. 4 is a plan view of a conventional thermal head.

【符号の説明】[Explanation of symbols]

1・・・・・サーマルヘッド 2・・・・・絶縁基体 3・・・・・発熱抵抗体 4・・・・・導電層 5・・・・・蓄熱層 6・・・・・接続端子 7・・・・・外部電気回路基板 8・・・・・配線 1-Thermal head 2--Insulating substrate 3--Heating resistor 4--Conductive layer 5--Heat storage layer 6-Connecting terminal 7・ ・ ・ ・ ・ External electric circuit board 8 ・ ・ ・ ・ ・ Wiring

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】四角状絶縁基体の上面で直交する二つの辺
のうち、一方の辺に沿って薄膜形成技術により形成され
る複数個の発熱抵抗体を、他方の辺に沿って外部電気回
路に接続される複数個の接続端子を被着し、且つ前記発
熱抵抗体と接続端子とを薄膜形成技術により形成される
導電層により電気的に接続してなるサーマルヘッドであ
って、前記接続端子は発熱抵抗体が被着されている面よ
り低い位置に厚膜形成技術によって形成されていること
を特徴とするサーマルヘッド。
1. A plurality of heating resistors formed by a thin film forming technique along one side of two sides orthogonal to each other on the upper surface of a rectangular insulating substrate, and an external electric circuit along the other side. A thermal head having a plurality of connection terminals attached to each other, and electrically connecting the heating resistor and the connection terminals by a conductive layer formed by a thin film forming technique. Is a thermal head characterized by being formed by a thick film forming technique at a position lower than the surface on which the heating resistor is applied.
JP13471392A 1992-05-27 1992-05-27 Thermal head Pending JPH05318799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13471392A JPH05318799A (en) 1992-05-27 1992-05-27 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13471392A JPH05318799A (en) 1992-05-27 1992-05-27 Thermal head

Publications (1)

Publication Number Publication Date
JPH05318799A true JPH05318799A (en) 1993-12-03

Family

ID=15134861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13471392A Pending JPH05318799A (en) 1992-05-27 1992-05-27 Thermal head

Country Status (1)

Country Link
JP (1) JPH05318799A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009530813A (en) * 2006-03-15 2009-08-27 イリノイ トゥール ワークス インコーポレイティド Thermal printing conductive ribbon and method
CN114728523A (en) * 2019-11-26 2022-07-08 罗姆股份有限公司 Thermal print head and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009530813A (en) * 2006-03-15 2009-08-27 イリノイ トゥール ワークス インコーポレイティド Thermal printing conductive ribbon and method
CN114728523A (en) * 2019-11-26 2022-07-08 罗姆股份有限公司 Thermal print head and method of manufacturing the same

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