JPH05310322A - Carrying device in temperature tank - Google Patents

Abstract

PURPOSE:To provide a carrying device in a temperature tank where a stable action can be obtained by a simple constitution. CONSTITUTION:A carriage holding part 3 to hold a semi-conductor device 10 in a temperature tank 2, and a driving part 4 to drive this carriage holding part 3 are provided, and at the same time, this driving part 4 is surrounded by a blocking cover 6. A driving motor 5, a first and a second pulleys 41, 42 and a belt 44 are provided as the driving part 4, and a flow-in port 6a to feed the air in the blocking cover 6 and a flow-out port 6b to discharge the air circulated in the blocking cover 6 are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer device in a temperature tank for transferring an object to be transferred in a temperature tank in which an atmosphere having a predetermined temperature is set.

[0002]

2. Description of the Related Art In an IC handler that measures the characteristics of a semiconductor device sealed in a package and judges whether it is good or bad,
The semiconductor device is placed in a temperature tank in which an atmosphere of a predetermined temperature is set, and the electrical characteristics at that time are measured. A transfer device is provided in the temperature tank of the IC handler to move the semiconductor device from the transfer tray to the inspection socket.

A conventional transfer device in a temperature tank will be described with reference to FIG. 3 by taking such an IC handler as an example. The IC handler 1 includes a temperature tank 2 in which a desired temperature atmosphere from a low temperature to a high temperature is set, and a transfer holder 3 for transferring the semiconductor device 10, which is an object to be transferred, placed in the temperature tank 2. A drive unit 4 for driving the transport holding unit 3 is provided outside the temperature tank 2.

A support shaft 43 is vertically provided at a substantially central portion of the carrying and holding unit 3, and is projected to the outside of the temperature tank 2 and connected to the driving unit 4. The drive unit 4 connects the first pulley 41 attached to the rotation shaft of the motor 5, the second pulley 42 screwed to the support shaft 43, and the first pulley 41 and the second pulley 42. It is composed of a belt 44.

Next, the operation of the IC handler 1 will be described. First, the transfer tray 31 accommodating the plurality of semiconductor devices 10 is arranged in the temperature tank 2 to set the atmosphere in the temperature tank 2 to a predetermined temperature. Then, the carrier holding unit 3 descends to hold the semiconductor device 10 on the carrier tray 31 by vacuum suction or the like. In this state, the carrying / holding unit 3 is raised to 1
Rotate 80 degrees. As a result, the semiconductor device 10 is moved above the measuring tray 32 while being held by the carrying and holding unit 3, and the carrying and holding unit 3 is lowered to place the semiconductor device 10 on the measuring tray 32. A socket (not shown) is arranged on the measuring tray 32 to obtain an electrical connection with the semiconductor device 10. Then, a predetermined characteristic is measured on the measuring tray 32 on which the semiconductor device 10 is arranged.

To raise and lower the carrying / holding unit 3, the rotational force of the drive motor 5 is used. That is, the rotation of the drive motor 5 is transmitted to the second pulley 42 via the first pulley 41 and the belt 44. Since the second pulley 42 is screwed into the support shaft 43, the rotation of the second pulley 42 causes the support shaft 43 to move in the vertical direction.

The support shaft 43 is attached to the temperature tank 2 via a bearing 45, and the support shaft 43 and the transport holding unit 3 are provided.
The operation is smooth. Furthermore, this bearing 45
The atmosphere inside the temperature tank 2 also serves as a shield from the outside atmosphere to stabilize the temperature inside the temperature tank 2. Particularly, in order to prevent dew condensation and malfunction due to low temperature, heated air is ejected from the nozzle 7 and blown onto the bearing 45.

[0008]

As described above, since the bearing 45 provided in the IC handler 1 is forced to be used under severe temperature conditions, it is necessary to use a bearing excellent in heat resistance. There is. In addition, equipment for use in preventing dew condensation on the bearing 45, such as the nozzle 7 that ejects heated air, is required. Therefore, if the drive unit 4 is arranged in the temperature tank 2, it is not necessary to use the bearing 45, but as a transmission mechanism for the drive motor 5, the first and second pulleys 41 and 42, the belt 44, etc., heat resistance is achieved. Since excellent ones and special parts must be used, the cost will be greatly increased and the degree of freedom in design will be lowered. Therefore, it is an object of the present invention to provide a carrier device in a temperature tank which can obtain stable operation with a simple structure.

[0009]

SUMMARY OF THE INVENTION The present invention is a carrier device in a temperature tank, which is made to solve such problems. That is, in the temperature bath set to the desired temperature,
A transfer device in a temperature tank for transferring an object to be transferred, and a transfer holder for holding the object to be transferred in the temperature tank, and a drive unit for driving the transfer holder, and The drive unit is surrounded by a shielding cover.

As a drive unit, a drive motor is provided with a transmission mechanism for transmitting this rotation.
Furthermore, an inflow port and an outflow port are provided in the shielding cover, and air is sent from the inflow port into the shielding cover,
The air circulated in the shielding cover is discharged from the outflow port.

[0011]

Since the cover for shielding is surrounded by the drive unit, the operation of the motor and the transmission mechanism of the drive unit can be protected from the temperature change of the temperature bath. Further, since the air inside the shielding cover can be circulated by the inflow port and the outflow port provided in the shielding cover, the temperature inside the shielding cover can be set to the usable temperature of the drive unit. ..

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A transfer device in a temperature tank of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view illustrating a carrier device in a temperature tank according to the present invention, showing an IC handler as an example. That is, this IC handler 1
Is a temperature tank 2 that is set to an atmosphere of a desired temperature, and a transfer holder 3 for transferring the semiconductor device 10 in the temperature tank 2.
And a drive unit 4 for driving the transport holding unit 3.

The temperature tank 2 forms an atmosphere necessary for measuring the electrical characteristics of the semiconductor device 10 with respect to temperature changes, so that the temperature can be set in the range of about -30 ° C to about + 175 ° C. .. In addition, the transport holding unit 3 sucks the plurality of semiconductor devices 10 housed in the transport tray 31 by a vacuum chuck (not shown) or the like and transfers the semiconductor devices 10 to the measurement tray 32.

The drive unit 4 for driving the transport holding unit 3 uses the rotation of the drive motor 5 as a power source, and the first pulley 4 attached to the rotary shaft of the drive motor 5.
1 and a belt 44 and a second pulley 42. The second pulley 42 is attached to a support shaft 43 vertically provided at a substantially central portion of the transport holding unit 3, and supports the support shaft 4
3 is screwed into the spiral groove formed on the support shaft 43 and the second shaft.
A so-called ball screw is configured with the pulley 42. As a result, the support shaft 43 is accurately moved up and down by the rotation of the drive motor 5.

The drive unit 4 including the drive motor 5, the first and second pulleys 41 and 42, and the belt 44 is surrounded by the shielding cover 6, and the drive unit 4 is protected from the temperature change in the temperature tank 2. 4 are protected. Further, an inflow port 6a and an outflow port 6b are provided on, for example, a side surface of the shielding cover 6, and predetermined air that has entered from the inflow port 6a circulates through the shielding cover 6 and is discharged from the outflow port 6b. It

The operation of the IC handler 1 is as follows. First, the plurality of semiconductor devices 10 are stored in the transfer tray 31 and the temperature tank 2 is operated.
Place inside. Next, the drive unit 4 is operated to lower the support shaft 43 and lower the transport holding unit 3. Then, the semiconductor device 10 accommodated in the transfer tray 31 is suction-held by a vacuum chuck or the like (not shown) attached to the back surface side of the transfer holding unit 3. After that, while raising the transport holding unit 3,
The semiconductor device 10 rotated by 180 degrees and held by suction is transferred onto the measurement tray 32.

Then, the transport holding unit 3 is lowered, and at the same time,
The vacuum force of the vacuum chuck is released, and the semiconductor device 10 is placed on the measurement tray 32. A socket (not shown) is arranged in each of the measuring trays 32, and the semiconductor device 10 is mounted on this socket. Then, the predetermined electrical characteristics are measured by the measuring tray 32. Such a series of operations are performed in an atmosphere of a predetermined temperature, and the semiconductor device 1 is operated at several temperatures.
The characteristic of 0 is inspected to determine whether it is good or bad.

Next, a driving unit 4 for driving the transport holding unit 3
Will be described. FIG. 2 is a schematic cross-sectional view illustrating the driving portion of the present invention. In order to move the transport holding unit 3 up and down, the drive motor 5 is operated to rotate the first pulley 41. Then, this power is transmitted to the second pulley 42 via the belt 44. The second pulley 42 and the support shaft 43 are in a relation of a female screw and a male screw of a ball screw,
The rotation of the second pulley 42 allows the support shaft 43 to accurately move up and down.

The shielding cover 6 surrounding the driving unit 4 is provided with an inflow port 6a and an outflow port 6b, and the air blown from the inflow port 6a is covered by the shielding cover 6
It circulates inside and is discharged from the outlet 6b. This allows
The inside of the shielding cover 6 is always at the operable temperature of the drive unit 4. Therefore, as the drive motor 5 and the first and second pulleys 41, 42, etc., which compose the drive unit 4, those equivalent to those used at normal room temperature can be used.

The inflowing air has, for example, two kinds of temperatures, and normal dry air (about 25 ° C.) and heated dry air (about 80 ° C.) are prepared. The temperature inside the shielding cover 6 is controlled by adjusting the flow rates of air of these two temperatures.

For example, when the semiconductor device 10 is measured at a high temperature (about 170 ° C.) in the temperature chamber 2 of the IC handler 1, normal dry air (about 25 ° C.) is circulated in the shielding cover 6. Then, only the temperature inside the shielding cover 6 is lowered. On the other hand, when the atmosphere in the temperature tank 2 is set to a low temperature (about -30 ° C), heated dry air (about 80 ° C) is circulated in the shielding cover 6 so that only the temperature in the shielding cover 6 rises. Let

The operating temperature of the drive unit 4 may be within a temperature range in which the normal drive motor 5 or the like can be used,
For example, it is about 0 ° C to 100 ° C. Therefore, it is not necessary that the inside of the shielding cover 6 is kept in a completely sealed state, as long as the temperature can be controlled within the temperature range in which the driving unit 4 can operate.

Since the driving unit 4 is arranged in the temperature tank 2 as described above, the bearing 45 is provided between the inside and the outside of the temperature tank 2.
(See FIG. 3) It is possible to configure the IC handler 1 that does not need to be provided. In the present embodiment, the IC handler 1 is used for description, but the present invention is not limited to this, and the carrying and holding unit 3 for carrying the object to be carried into the temperature tank.
Any device may be used.

[0024]

As described above, the carrying device in the temperature tank of the present invention has the following effects. That is, since the drive unit is arranged in the temperature tank and the drive unit is surrounded by the shielding cover, the drive unit such as the drive motor can be operated even if the temperature in the temperature tank changes. Furthermore, since the temperature is controlled by circulating the air in the shielding cover with the inlet and outlet provided in the shielding cover, even in a temperature tank where severe temperature changes occur,
It is not necessary to use a driving motor or the like having excellent heat resistance.
Further, since it is not necessary to provide a complicated device for preventing dew condensation such as a bearing, the cost of the device can be reduced. Moreover, since a drive unit equivalent to room temperature can be configured, the degree of freedom in designing the device is improved.

[Brief description of drawings]

FIG. 1 is a perspective view illustrating a transfer device in a temperature tank according to the present invention.

FIG. 2 is a schematic cross-sectional view illustrating a driving portion of the present invention.

FIG. 3 is a perspective view illustrating a conventional conveying device in a temperature tank.

[Explanation of symbols]

 1 IC Handler 2 Temperature Tank 3 Transport Holding Unit 4 Drive Unit 5 Drive Motor 6 Shield Cover 6a Inlet Port 6b Outlet Port 10 Semiconductor Device 31 Transport Tray 32 Measuring Tray 41 First Pulley 42 Second Pulley 43 Spindle 44 belt

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takayuki Kikuchi 6-735 Kitashinagawa, Shinagawa-ku, Tokyo Sony Corporation

Claims (3)

[Claims] 1. In a temperature bath set to a desired temperature,
In a transport device for transporting an object to be transported, a transport holding unit for holding the transport object and a drive unit for driving the transport holding unit are provided in the temperature bath. The transport device in the temperature tank is characterized in that the drive unit is surrounded by a shielding cover. 2. The transfer device in the temperature tank according to claim 1, wherein the drive unit includes a drive motor and a transmission mechanism for transmitting the rotation of the drive motor. .. 3. The shielding cover is provided with an inlet for taking in air into the shielding cover and an outlet for discharging the air circulated in the shielding cover. The carrier device in the temperature tank according to claim 1, characterized in that.