JPH05298945A - Manufacture of electric circuit molding - Google Patents

Manufacture of electric circuit molding

Info

Publication number
JPH05298945A
JPH05298945A JP4100798A JP10079892A JPH05298945A JP H05298945 A JPH05298945 A JP H05298945A JP 4100798 A JP4100798 A JP 4100798A JP 10079892 A JP10079892 A JP 10079892A JP H05298945 A JPH05298945 A JP H05298945A
Authority
JP
Japan
Prior art keywords
conductive
melting point
resin
thermoplastic resin
electric circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4100798A
Other languages
Japanese (ja)
Inventor
Hiroaki Fukumoto
宏昭 福本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP4100798A priority Critical patent/JPH05298945A/en
Publication of JPH05298945A publication Critical patent/JPH05298945A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0014Shaping of the substrate, e.g. by moulding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Abstract

PURPOSE:To provide the manufacture for electric circuit moldings usable as physical solid wiring circuit excellent in conductivity, by directly joining plural conductive moldings. CONSTITUTION:Resin compositions, composed by blending concuctive metallic fibers and low-melting point metal with thermoplastic resin, are injection molded by using a mold having a given shape, and straight or curved rodlike conductive molding 2 and 3, having a jointing part 1, like e.g. the combination of conical recessed and protuded parts, in one side end part, are formed respectively. Next, the joining part 1 of these moldings 2 and 3 are locally heated with hot air devices respectively to expose conductive metallic fibers from surfaces. Then the joining parts 1 of both the sides are engaged and pressure-contacted, and also is heated at temperature higher than the melting point of the thermoplastic resin and the low-melting point metal to be welded with an ultrasonic welding device.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、導電性の良好な電気回
路用の成形品を製造する方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a molded article for an electric circuit having good conductivity.

【0002】[0002]

【従来の技術】従来から、樹脂成形体に電気的な回路を
形成するには、成形体表面に導電性ペーストの転写や導
体金属のめっき等により回路を形成する方法や、金属板
の加工品を取付ける方法、あるいは金属端子を取着しそ
の間を塩化ビニル樹脂のような樹脂被覆電線で接続する
方法などが行われている。そして、これらの中でも樹脂
被覆電線を用いた方法が、配線の形状を自由に変えるこ
とができ、かつ単純な作業で回路形成を行うことができ
るため一般に行われている。
2. Description of the Related Art Conventionally, in order to form an electric circuit on a resin molded body, a method of forming a circuit on the surface of the molded body by transferring a conductive paste or plating a conductive metal, or a processed product of a metal plate. For example, a method of attaching a metal terminal or a method of attaching a metal terminal and connecting between the terminals with a resin-coated electric wire such as vinyl chloride resin is used. Among them, the method using a resin-coated electric wire is generally used because the shape of the wiring can be freely changed and a circuit can be formed by a simple operation.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、このよ
うにして電気回路が形成された成形品においては、樹脂
被覆電線がフレキシブルではじめから配線形状になって
いるわけではないため、生産性が悪かった。すなわち、
樹脂被覆電線により電気回路を形成するには、これを手
作業で曲げたり捻ったりして所定の配線形状を形成し、
それを樹脂成形体の表面に端子を介して接続固定すると
ともに、配線の途中にバンド等を設けて位置決めを行っ
ているため、自動化が難しく生産性が上がらないという
問題があった。
However, in the molded product in which the electric circuit is formed in this way, the resin-coated electric wire is not flexible and does not have the wiring shape from the beginning, so that the productivity is poor. .. That is,
To form an electric circuit with resin-coated electric wires, bend and twist it manually to form a predetermined wiring shape,
Since it is connected and fixed to the surface of the resin molded body through terminals and a band or the like is provided in the middle of the wiring for positioning, there is a problem that automation is difficult and productivity is not improved.

【0004】一方、このような電気回路成形品に代わる
ものとして、導電性樹脂からなる成形品が考えられ検討
されている。ここで、導電性樹脂としては、熱可塑性樹
脂等に導電性金属繊維を配合したものと、カーボンなど
の導電性粉末を配合したものの2種類のものが考えられ
る。
On the other hand, as an alternative to such an electric circuit molded article, a molded article made of a conductive resin has been considered and studied. Here, as the conductive resin, two types can be considered: one in which a conductive metal fiber is mixed with a thermoplastic resin or the like, and one in which a conductive powder such as carbon is mixed.

【0005】しかし、前者の導電性金属繊維が配合され
た樹脂材料からなる成形体は、比較的導電性が良好であ
るものの、回路形成に必要な他の部品との接触面が樹脂
層に覆われており、表面にごく少量の導電性金属繊維が
露出しているにすぎない。そのため、金属端子をインサ
ート成形や成形後挿入するなどの方法で取り付け、それ
を介して接続を行わなければならなかった。また、成形
体同士を接合して回路を形成するには、導電性金属繊維
の配合量を増加させたり、あるいは接合部表面の樹脂層
をブラスト処理やカッター等で切削除去する必要がある
が、ブラスト処理を行う方法では、材料の特性を低下さ
せるばかりでなく、成形性やコスト面で問題があり、ま
たカッター等で切削除去する方法では、加工上の制約が
あり導電性金属繊維を十分に露出させることができない
という問題があった。さらに、後者の導電性粉末が配合
された樹脂材料からなる成形体においては、十分な機械
的特性が保持されるような配合量では、良好な導電性が
得られないという問題があった。
However, although the former molded article made of a resin material mixed with conductive metal fibers has relatively good conductivity, the contact surface with other parts required for circuit formation is covered with the resin layer. The exposed surface is exposed to a very small amount of conductive metal fibers. Therefore, it has been necessary to attach the metal terminal by a method such as insert molding or insert after molding, and to connect through it. In addition, in order to form a circuit by joining the molded bodies together, it is necessary to increase the amount of the conductive metal fiber compounded, or to remove the resin layer on the surface of the joined portion by cutting with a blast treatment or a cutter. The method of performing blasting not only deteriorates the characteristics of the material, but also has a problem in terms of formability and cost, and the method of cutting and removing with a cutter or the like has processing restrictions, and the conductive metal fibers must be sufficiently removed. There was a problem that it could not be exposed. Further, in the latter case of the molded body made of the resin material mixed with the conductive powder, there is a problem that good conductivity cannot be obtained with a blending amount that maintains sufficient mechanical properties.

【0006】本発明はこれらの問題を解決するためにな
されたもので、複数の導電性成形体を直接接合し、導電
性に優れ形のある立体的な配線回路として使用できる電
気回路成形品を製造する方法を提供することを目的とす
る。
The present invention has been made to solve these problems, and provides an electric circuit molded product which can be used as a three-dimensional wiring circuit having excellent conductivity by directly bonding a plurality of conductive molded products. It is intended to provide a method for manufacturing.

【0007】[0007]

【課題を解決するための手段】本発明の電気回路成形品
の製造方法は、熱可塑性樹脂を主体とし導電性金属繊維
と低融点金属とをそれぞれ含む導電性樹脂組成物を、接
合部を有する所定の形状に成形した後、得られた複数の
導電性成形体の少なくとも一方の接合部を局部的に加熱
し、前記導電性金属繊維を表面から露出させ、次いでこ
れらの接合部を互いに圧接しながら、圧接部を前記熱可
塑性樹脂および低融点金属の融点より高い温度に加熱し
て溶着することを特徴とする。
The method for producing an electric circuit molded article according to the present invention has a conductive resin composition containing a thermoplastic resin as a main component and a conductive metal fiber and a low melting point metal, respectively, and having a joint portion. After molding into a predetermined shape, at least one joint of the obtained plurality of conductive molded bodies is locally heated to expose the conductive metal fibers from the surface, and then these joints are pressed against each other. However, the pressure contact portion is heated to a temperature higher than the melting points of the thermoplastic resin and the low melting point metal to be welded.

【0008】本発明において、導電性樹脂組成物のベー
スとなる熱可塑性樹脂としては、ポリエチレン、ポリプ
ロピレン、ABS(アクリロニトリル−ブタジエン−ス
チレン共重合体)樹脂、ポリフェニレンスルファイド、
ポリフェニレンオキサイド等が使用される。また、この
ような熱可塑性樹脂に配合される導電性金属繊維として
は、銅またはステンレス等の繊維があり、低融点金属と
しては、錫、鉛、はんだ等がある。ここで、低融点金属
を配合するにはマスターバッチのかたちで添加混合する
ことが好ましい。さらに、前記した導電性金属繊維の配
合量は、体積抵抗率が10-3Ωcm以下と、電気回路用と
して十分な導電性を有する成形体が得られるような量と
することが望ましく、低融点金属の配合量は樹脂組成物
全体の5〜20重量%とすることが望ましい。
In the present invention, as the thermoplastic resin which is the base of the conductive resin composition, polyethylene, polypropylene, ABS (acrylonitrile-butadiene-styrene copolymer) resin, polyphenylene sulfide,
Polyphenylene oxide or the like is used. Further, as the conductive metal fiber blended in such a thermoplastic resin, there is a fiber such as copper or stainless steel, and as the low melting point metal, there are tin, lead, solder and the like. Here, in order to mix the low melting point metal, it is preferable to add and mix it in the form of a masterbatch. Further, it is desirable that the content of the above-mentioned conductive metal fiber is such that the volume resistivity is 10 −3 Ωcm or less, and a molded product having sufficient conductivity for an electric circuit can be obtained. The metal content is preferably 5 to 20% by weight of the total resin composition.

【0009】本発明において、このような導電性樹脂組
成物からなる導電性成形体の接合部の形状は、後述する
圧接および加熱溶着の作業性を考慮して位置決めが容易
なように、かつ接合部の電気抵抗値の低減のために接触
表面積が大きくなるように、凹凸を組み合わせた形状と
することが望ましい。
In the present invention, the shape of the joint portion of the conductive molded body made of such a conductive resin composition is such that the positioning is easy in consideration of the workability of pressure welding and heat welding described later, and the bonding is performed. In order to reduce the electric resistance value of the portion, it is desirable to have a shape in which irregularities are combined so that the contact surface area becomes large.

【0010】本発明において、このような導電性成形体
の接合部を局部的に加熱する方法としては、例えば熱風
装置を用いて熱可塑性樹脂の融点より高い温度の熱風を
直接吹き付ける等の方法がある。また、こうして加熱さ
れた導電性成形体の接合部を加熱溶着するには、例えば
超音波振動を加え振動摩擦により発熱させる方法等を採
ることができる。そして、このような加熱に際しては、
圧接された接合部の導電性樹脂中の熱可塑性樹脂および
低融点金属が、瞬間的にでも融点より高い温度に加熱さ
れるように条件が設定される。すなわち、溶着の際の加
熱温度が高すぎると、接合部周辺の導電性樹脂が広い範
囲で溶融し、成形体の変形が生じてしまうので、超音波
加熱のように、昇温効果が高くかつ精密な温度コントロ
ールが可能な手段を用いて加熱溶着される。
In the present invention, as a method of locally heating the joint portion of such a conductive molded body, for example, a method of directly blowing hot air having a temperature higher than the melting point of the thermoplastic resin using a hot air device is used. is there. Further, in order to heat-weld the joint portion of the conductive molded body thus heated, for example, a method of applying ultrasonic vibration to generate heat by vibration friction can be adopted. And in such heating,
Conditions are set so that the thermoplastic resin and the low melting point metal in the conductive resin of the pressure-bonded joint portion are instantaneously heated to a temperature higher than the melting point. That is, if the heating temperature at the time of welding is too high, the conductive resin around the joint is melted in a wide range and deformation of the molded body occurs. It is heated and welded using a means capable of precise temperature control.

【0011】[0011]

【作用】本発明の製造方法においては、まず熱可塑性樹
脂に導電性金属繊維と低融点金属とがそれぞれ配合され
た導電性樹脂組成物が、射出成形等の方法で成形され、
成形体同士を接合するための接合部を有する所定の形状
の導電性成形体が形成される。得られた導電性成形体に
おいては、熱可塑性樹脂中に分散された導電性金属繊維
同士が、低融点金属の介在により互いに接合されて網目
状となって存在しており、良好な導電性が示される。次
いで、得られた複数の導電性成形体の所望の接合部を、
熱風装置等により局部的に加熱し、表面の樹脂層を溶融
させる。このような樹脂層の加熱溶融の結果、成形時に
引き延ばされたことにより樹脂層内部に残留する応力が
緩和されるうえに、樹脂層の直ぐ下に導電性金属繊維が
存在する面では、比熱の差で樹脂の温度が高くなりやす
いため、接合部の導電性金属繊維を覆った樹脂層が引き
裂かれ、導電性金属繊維が接合部の表面から露出する。
そして、このような加熱処理を、接合すべき導電性成形
体の片側または両側の接合部について行った後、これら
の接合部を合わせて圧接しながら、超音波溶着装置等に
より、圧接部を熱可塑性樹脂および低融点金属の融点よ
り高い温度に加熱して溶着させる。こうして、導電性成
形体の圧接された接合部において、樹脂層を介在させる
ことなく導電性金属繊維同士が直接接した状態で、熱可
塑性樹脂および低融点金属の融点より高い温度に加熱さ
れることにより、各導電性金属繊維を覆っている低融点
金属が溶融するので、溶融した低融点金属を介して導電
性金属繊維が強固に接合されて良好な電気的接続が得ら
れる。また、このとき圧接接合部の樹脂層も相互に溶融
して接着するので、各成形体間の機械的接続強度も十分
に得られ、電気的機械的特性の優れた電気回路成形品が
形成される。
In the production method of the present invention, first, a conductive resin composition in which a conductive metal fiber and a low melting point metal are mixed with a thermoplastic resin is molded by a method such as injection molding,
A conductive molded body having a predetermined shape having a joint for bonding the molded bodies together is formed. In the obtained conductive molded article, the conductive metal fibers dispersed in the thermoplastic resin are bonded to each other through the interposition of the low melting point metal and are present in the form of a mesh, and have good conductivity. Shown. Then, the desired joint portion of the obtained plurality of conductive molded bodies,
The resin layer on the surface is melted by locally heating with a hot air device or the like. As a result of such heating and melting of the resin layer, the stress remaining inside the resin layer due to being stretched at the time of molding is relaxed, and in the surface where the conductive metal fiber is present immediately below the resin layer, Since the temperature of the resin tends to rise due to the difference in specific heat, the resin layer covering the conductive metal fibers in the joint is torn, and the conductive metal fibers are exposed from the surface of the joint.
Then, after such a heat treatment is performed on one side or both sides of the conductive molded body to be bonded, the ultrasonic welding device or the like is used to heat the pressure-bonded part while pressure-bonding these bonded parts together. It is heated to a temperature higher than the melting points of the plastic resin and the low melting point metal to be welded. Thus, in the pressure-bonded joint portion of the conductive molded body, the conductive metal fibers are directly contacted to each other without interposing the resin layer, and are heated to a temperature higher than the melting points of the thermoplastic resin and the low melting point metal. As a result, the low-melting-point metal covering each conductive metal fiber is melted, so that the conductive metal fiber is firmly bonded through the melted low-melting-point metal, and good electrical connection can be obtained. Further, at this time, since the resin layers of the pressure-bonded joints are also melted and adhered to each other, a sufficient mechanical connection strength between the molded products can be obtained, and an electric circuit molded product having excellent electromechanical properties can be formed. It

【0012】[0012]

【実施例】以下、本発明の実施例を図面に基づいて説明
する。実施例においては、まず熱可塑性樹脂に導電性金
属繊維を配合してなる導電性樹脂、例えばエミリヤ(東
芝ケミカル(株)社の商品名)に、錫、鉛、はんだのよ
うな低融点金属をマスターバッチのかたちで10重量%の
割合で添加してなる導電性樹脂組成物を、所定形状の金
型を用いて射出成形し、図1に示すように、片側端部に
以下に示す形状の接合部1を有する、直棒状および屈曲
棒状の導電性成形体2、3をそれぞれ成形した。すなわ
ち、一方の直棒状の導電性成形体2の端部接合部1に
は、図2(a)に示すような円錐状の凹部4、あるいは
図2(b)または図2(c)に示すような充実円柱状の
凸部5または中空円柱状のボス部6をそれぞれ形成し、
他方の屈曲棒状の導電性成形体3の接合部1には、対応
する形状の凸部7または貫通孔8をそれぞれ形成した。
次いで、このように成形された棒状および屈曲棒状の導
電性成形体2、3の接合部1を、それぞれ熱風装置によ
り局部的に加熱して表面の樹脂層を溶融させ、導電性金
属繊維を表面から露出させた。その後、図3(a)〜
(c)に示すように、両方の導電性成形体2、3の接合
部1を嵌合させ、加熱用治具9等を用いて圧接しなが
ら、超音波溶着装置により、熱可塑性樹脂および低融点
金属の融点より高い温度で加熱し、圧接された接合部1
を溶着させた。
Embodiments of the present invention will be described below with reference to the drawings. In the examples, first, a conductive resin prepared by blending a conductive metal fiber with a thermoplastic resin, for example, Emilia (trade name of Toshiba Chemical Co., Ltd.), a low melting point metal such as tin, lead, or solder is added. A conductive resin composition added in a proportion of 10% by weight in the form of a masterbatch is injection-molded using a mold having a predetermined shape, and as shown in FIG. Straight rod-shaped and bent rod-shaped conductive molded bodies 2 and 3 each having a joint portion 1 were molded. That is, the conical recess 4 as shown in FIG. 2A, or the conical recess 4 shown in FIG. 2B or FIG. 2C in the end joint portion 1 of the one straight rod-shaped conductive molded body 2. Such a solid cylindrical convex portion 5 or a hollow cylindrical boss portion 6 is formed,
In the joint portion 1 of the other bent rod-shaped conductive molded body 3, the convex portion 7 or the through hole 8 having a corresponding shape was formed.
Next, the joint portions 1 of the rod-shaped and bent rod-shaped conductive molded bodies 2 and 3 thus molded are locally heated by a hot air device to melt the resin layer on the surface, and the conductive metal fibers are surfaced. Exposed from. After that, FIG.
As shown in (c), the joining portions 1 of both the conductive molded bodies 2 and 3 are fitted, and the thermoplastic resin and low resin are applied by an ultrasonic welding device while pressure-welding using a heating jig 9 or the like. Melting point 1 Joint part 1 heated at a temperature higher than the melting point of metal and pressure-welded
Was welded.

【0013】このようにして加熱溶着された導電性成形
体2、3の接合部においては、加熱溶着時に、露出した
導電性金属繊維同士が直接接するうえに、各導電性金属
繊維を覆っている低融点金属が溶融されて溶融した低融
点金属を介して導電性金属繊維が強固に接合されるの
で、以下に示す測定例からも明らかなように、良好な電
気的接続が得られる。すなわち、幅 5mm厚さ 3mmのテス
トピースを使用し、実施例と同様に接合部を熱風処理に
より局部的に加熱した後超音波加熱溶着を行った場合
と、熱風処理を行わずに直ぐに超音波溶着を行った場
合、および接合部表面をブラスト処理した後超音波溶着
した場合の3つの例について、溶着部の電気抵抗をそれ
ぞれ測定した。なお、測定部には金属端子を加熱圧入
し、端子間距離 100mmで測定を行った。測定結果を下表
に示す。
In the joint portion of the conductive molded bodies 2 and 3 thus heat-welded, the exposed conductive metal fibers are in direct contact with each other and cover each conductive metal fiber at the time of heat-welding. Since the low-melting-point metal is melted and the conductive metal fibers are firmly bonded through the melted low-melting-point metal, as is apparent from the measurement examples below, good electrical connection can be obtained. That is, using a test piece having a width of 5 mm and a thickness of 3 mm, the joint was locally heated by hot air treatment and then ultrasonic heating welding was performed in the same manner as in Example, and the ultrasonic wave was immediately applied without performing hot air treatment. The electrical resistance of the welded portion was measured for each of the three cases where welding was performed and when ultrasonic welding was performed after the surface of the joint was blasted. In addition, a metal terminal was press-fitted into the measurement section, and the measurement was performed at a terminal distance of 100 mm. The measurement results are shown in the table below.

【0014】 また、実施例で得られた導電性成形品では、圧接部の樹
脂層も相互に溶着されているので、各成形体間の機械的
接続も強固になされている。そして、こうして電気的機
械的に接続された導電性成形品においては、図4に示す
ように、少なくとも端部2箇所に金属端子10を加熱圧
入するとともに、これらの端子10に樹脂被覆電線11
を連結して電源12等を接続することにより、電気回路
を形成することができる。さらに、個々の導電性成形体
の長さや断面積を標準化しておき、これらを組み合わせ
ることにより、立体的な種々の回路を形成することがで
きる。
[0014] Further, in the electroconductive molded articles obtained in the examples, since the resin layers of the pressure contact portions are also welded to each other, the mechanical connection between the respective molded articles is made firm. Then, in the electrically conductive molded product electrically and mechanically connected in this manner, as shown in FIG. 4, the metal terminals 10 are press-fitted into at least two end portions, and the resin-coated electric wires 11 are inserted into these terminals 10.
An electric circuit can be formed by connecting and connecting the power source 12 and the like. Furthermore, by standardizing the length and cross-sectional area of each conductive molded body and combining these, various three-dimensional circuits can be formed.

【0015】[0015]

【発明の効果】以上説明したように本発明によれば、個
々の導電性成形体および接合部の導電性に優れ、かつ機
械的な接続強度も高い電気回路成形品が得られる。ま
た、種々の立体的な電気回路を形成することができ、生
産性が高い。
As described above, according to the present invention, it is possible to obtain an electric circuit molded product having excellent conductivity of individual conductive molded products and joints and high mechanical connection strength. In addition, various three-dimensional electric circuits can be formed, and the productivity is high.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の電気回路成形品の製造方法の実施例に
おいて、最初の工程で成形された導電性成形体を示す斜
視図。
FIG. 1 is a perspective view showing a conductive molded body molded in a first step in an embodiment of a method for manufacturing an electric circuit molded product of the present invention.

【図2】本発明の実施例において、成形された導電性成
形体の接合部の形状を示す断面図。
FIG. 2 is a cross-sectional view showing the shape of a joint portion of a molded conductive molded body in the example of the present invention.

【図3】本発明の実施例において、導電性成形体の接合
部を圧接しながら加熱溶着する方法を示す断面図。
FIG. 3 is a cross-sectional view showing a method of heat welding while pressing the joint portion of the conductive molded body in the embodiment of the present invention.

【図4】実施例で得られた導電性成形品を示す斜視図。FIG. 4 is a perspective view showing a conductive molded product obtained in an example.

【符号の説明】 1………接合部 2………直棒状導電性成形体 3………屈曲棒状の導電性成形体 4………円錐状凹部 5………充実円柱状凸部 6………中空円柱状ボス部 7………凸部 8………貫通孔 9………加熱用治具 10………金属端子 11………樹脂被覆電線 12………電源[Explanation of Codes] 1 ......... Jointed portion 2 ......... Continuous rod-shaped conductive molded body 3 ………… Bent rod-shaped conductive molded body 4 ……… Conical concave portion 5 ……… Solid cylindrical convex portion 6…. …… Hollow cylindrical boss 7 ………… Projection 8 ………… Through hole 9 ………… Heating jig 10 ………… Metal terminal 11 ………… Resin coated electric wire 12 ………… Power supply

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 熱可塑性樹脂を主体とし導電性金属繊維
と低融点金属とをそれぞれ含む導電性樹脂組成物を、接
合部を有する所定の形状に成形した後、得られた複数の
導電性成形体の少なくとも一方の接合部を局部的に加熱
し、前記導電性金属繊維を表面から露出させ、次いでこ
れらの接合部を互いに圧接しながら、圧接部を前記熱可
塑性樹脂および低融点金属の融点より高い温度に加熱し
て溶着することを特徴とする電気回路成形品の製造方
法。
1. A plurality of conductive moldings obtained by molding a conductive resin composition mainly composed of a thermoplastic resin and containing a conductive metal fiber and a low melting point metal into a predetermined shape having a joint. At least one joint part of the body is locally heated to expose the conductive metal fibers from the surface, and then these joint parts are pressed against each other, and the press contact part is more than the melting point of the thermoplastic resin and the low melting point metal. A method for producing an electric circuit molded article, which comprises heating to a high temperature and welding.
JP4100798A 1992-04-21 1992-04-21 Manufacture of electric circuit molding Withdrawn JPH05298945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4100798A JPH05298945A (en) 1992-04-21 1992-04-21 Manufacture of electric circuit molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4100798A JPH05298945A (en) 1992-04-21 1992-04-21 Manufacture of electric circuit molding

Publications (1)

Publication Number Publication Date
JPH05298945A true JPH05298945A (en) 1993-11-12

Family

ID=14283429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4100798A Withdrawn JPH05298945A (en) 1992-04-21 1992-04-21 Manufacture of electric circuit molding

Country Status (1)

Country Link
JP (1) JPH05298945A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10288106A (en) * 1997-04-10 1998-10-27 Nok Corp Liquid cutoff valve device
CN107302142A (en) * 2017-06-30 2017-10-27 云南科威液态金属谷研发有限公司 Low-melting-point metal cable connecting arrangement and its application method, attachment structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10288106A (en) * 1997-04-10 1998-10-27 Nok Corp Liquid cutoff valve device
CN107302142A (en) * 2017-06-30 2017-10-27 云南科威液态金属谷研发有限公司 Low-melting-point metal cable connecting arrangement and its application method, attachment structure

Similar Documents

Publication Publication Date Title
US3094452A (en) Method of making interlocked welded connections between shaped thermoplastic articles
KR950011617B1 (en) Electronic circuits and a method for their manufacture by means of ultrasonic welding
CA2559707C (en) Heating element and production method therefor
US5511719A (en) Process of joining metal members
US6818839B2 (en) Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board
US6019271A (en) Method for ultrasonic bonding flexible circuits
TW583795B (en) Electric connecting apparatus using resin welding flux, electric connecting apparatus and wire connecting method therefor
JPH05298945A (en) Manufacture of electric circuit molding
TW567650B (en) A pair of electric connectors using resin welding flux on one side
US7056414B2 (en) Connecting method for metal material and electric conductive plastic material and product thereby
JP2002158238A (en) Method for connecting electronic component, electronic device and method for manufacturing the same
JP4492186B2 (en) Heating element
JPH07263050A (en) Tape electric wire for ultrasonic welding and joining structure thereof
JP2002015792A (en) Terminal structure of flexible board and joining method of connection terminal
JP2937311B2 (en) Thermoplastic welding method
JPH0576797B2 (en)
JPS59118426A (en) Jointing method of plastic body
JPH05124134A (en) Electric circuit molded product
JPH04308729A (en) Fusion bonding or sealing method and conductive fusing heating element
JPS6233352Y2 (en)
JPS62194692A (en) Electronic parts
JPH05174622A (en) Adhesive for conductive resin molded article and conductive resin molded part
JP2001127426A (en) Method and structure for connecting circuit conductor of flat conductor wiring board
JPH0145950B2 (en)
JPH0632713Y2 (en) Electromagnetic wave shield case

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990706