JPH0529660A - Led lamp - Google Patents
Led lampInfo
- Publication number
- JPH0529660A JPH0529660A JP3227105A JP22710591A JPH0529660A JP H0529660 A JPH0529660 A JP H0529660A JP 3227105 A JP3227105 A JP 3227105A JP 22710591 A JP22710591 A JP 22710591A JP H0529660 A JPH0529660 A JP H0529660A
- Authority
- JP
- Japan
- Prior art keywords
- led lamp
- axis
- semiconductor chips
- lead
- envelope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＬＥＤランプの外囲器
の形状の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in the shape of an LED lamp envelope.
【０００２】[0002]
【従来の技術】図１３は、２つ以上の半導体チップを有
する従来のＬＥＤランプの外囲器の形状を示している。
図１において、１は半導体チップ、２はリ−ド、３はボ
ンディングワイヤ、４は透過性の樹脂で構成される外囲
器、５は楕円体（または球体）、６は外囲器の中心軸を
それぞれ示している。2. Description of the Related Art FIG. 13 shows a shape of a conventional LED lamp envelope having two or more semiconductor chips.
In FIG. 1, 1 is a semiconductor chip, 2 is a lead, 3 is a bonding wire, 4 is an envelope made of a transparent resin, 5 is an ellipsoid (or a sphere), and 6 is the center of the envelope. Each axis is shown.
【０００３】従来の外囲器４の形状は、大きく上部と下
部に分けることができる。上部の形状は、例えば単一の
曲面から構成されている。この曲面は、中心軸６を軸と
する回転楕円体や球体の一部から構成されている。ま
た、下部の形状は、中心軸６を軸とする円柱から構成さ
れている。なお、前記曲面は、ＬＥＤランプのレンズと
しての役割を有している。The conventional envelope 4 can be roughly divided into an upper portion and a lower portion. The shape of the upper part is composed of, for example, a single curved surface. The curved surface is composed of a part of a spheroid or a sphere having the central axis 6 as an axis. Further, the shape of the lower portion is composed of a cylinder having the central axis 6 as an axis. The curved surface serves as a lens of the LED lamp.
【０００４】しかしながら、上記ＬＥＤランプは、複数
の半導体チップを有している。このため、全ての半導体
チップをレンズの焦点位置に配置することができない。
従って、例えば図３に示すように、ＬＥＤランプから放
射された光が、互いに分離してしまう欠点があった。However, the LED lamp has a plurality of semiconductor chips. Therefore, it is impossible to arrange all the semiconductor chips at the focal position of the lens.
Therefore, for example, as shown in FIG. 3, there is a drawback that lights emitted from the LED lamps are separated from each other.
【０００５】[0005]
【発明が解決しようとする課題】このように、従来は、
複数の半導体チップをレンズの焦点位置に配置すること
ができず、ＬＥＤランプから放射された光が、互いに分
離してしまう欠点があった。As described above, the prior art is as follows.
There is a drawback that a plurality of semiconductor chips cannot be arranged at the focal position of the lens and the light emitted from the LED lamp is separated from each other.
【０００６】本発明は、上記欠点を解決すべくなされた
もので、その目的は、複数の半導体チップを有するＬＥ
Ｄランプにおいて、光を効率よくＬＥＤランプの正面方
向へ放射させることである。The present invention has been made to solve the above-mentioned drawbacks, and an object thereof is to have an LE having a plurality of semiconductor chips.
In the D lamp, the light is efficiently emitted in the front direction of the LED lamp.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明のＬＥＤランプは、リ−ドと、このリ−ドの
先端部に載置される複数の半導体チップと、前記半導体
チップおよびその近傍を取り囲む光透過性の外囲器とを
有する。そして、前記外囲器の形状が、各々の半導体チ
ップを通る各々の軸を１つの軸とする複数の楕円体また
は球体を含む立体から構成されている。また、前記外囲
器は、前記リ−ドを中心軸とする円筒によって、前記立
体の一部を切り落とした形状を有している。さらに、前
記各々の半導体チップを通る各々の軸は、互いに平行で
ある。In order to achieve the above object, an LED lamp of the present invention comprises a lead, a plurality of semiconductor chips mounted on the tip of the lead, and the semiconductor chip. And a light-transmissive envelope surrounding the vicinity thereof. The shape of the envelope is composed of a solid body including a plurality of ellipsoids or spheres with each axis passing through each semiconductor chip as one axis. The envelope has a shape in which a part of the solid body is cut off by a cylinder having the lead as a central axis. Further, the respective axes passing through the respective semiconductor chips are parallel to each other.
【０００８】また、本発明のＬＥＤランプは、リ−ド
と、このリ−ドの先端部に載置される第１および第２の
半導体チップと、前記第１および第２の半導体チップお
よびその近傍を取り囲む光透過性の外囲器とを有してい
る。そして、前記外囲器の形状は、下部形状と上部形状
とに分けられている。下部形状は、前記リ−ドを中心軸
とする円柱から構成されている。上部形状は、前記第１
の半導体チップを通り前記リ−ドに平行な第１の軸を１
つの軸とする楕円体の曲面の一部と、前記第２の半導体
チップを通り前記リ−ドに平行な第２の軸を１つの軸と
する楕円体の曲面の一部とから構成されている。Further, the LED lamp of the present invention comprises a lead, first and second semiconductor chips mounted on the tip of the lead, the first and second semiconductor chips and the same. And a light-transmissive envelope that surrounds the vicinity. The shape of the envelope is divided into a lower shape and an upper shape. The lower shape is composed of a cylinder having the lead as the central axis. The upper shape is the first
The first axis passing through the semiconductor chip and parallel to the lead is 1
A part of an ellipsoidal curved surface having one axis and a part of an ellipsoidal curved surface having a second axis passing through the second semiconductor chip and parallel to the lead as one axis. There is.
【０００９】[0009]
【作用】上記構成によれば、同時に複数の半導体チップ
をレンズの焦点位置に配置することができるため、ＬＥ
Ｄランプから放射された光が、互いに分離されてしまう
ことがない。従って、２つの半導体チップを有するＬＥ
Ｄランプにおいても、光を効率よくＬＥＤランプの正面
方向へ放射させることができる。According to the above structure, since a plurality of semiconductor chips can be arranged at the focal position of the lens at the same time, the LE
The light emitted from the D lamp is not separated from each other. Therefore, an LE having two semiconductor chips
Even in the D lamp, light can be efficiently emitted in the front direction of the LED lamp.
【００１０】[0010]
【実施例】以下、図面を参照しながら、本発明の一実施
例について詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.
【００１１】図１は、本発明の一実施例に係わるＬＥＤ
ランプを示すものである。半導体チップを搭載するため
のチップ搭載部１１は、リ−ド１３Ｃの先端部に形成さ
れている。２つの半導体チップ１２Ａ，１２Ｂは、チッ
プ搭載部１１上に配置されている。ボンディング部１４
Ａ，１４Ｂは、それぞれリ−ド１３Ａ，１３Ｂの先端部
に形成されている。また、ボンディングワイヤ（例えば
金ワイヤ）１９Ａの一端は、半導体チップ１２Ａに接続
され、その他端は、ボンディング部１４Ａに接続されて
いる。ボンディングワイヤ１９Ｂの一端は、半導体チッ
プ１２Ｂに接続され、その他端は、ボンディング部１４
Ｂに接続されている。なお、リ−ド１３Ａ〜１３Ｃの先
端部は、透明のエポキシ樹脂１５によって封止されてい
る。FIG. 1 shows an LED according to an embodiment of the present invention.
It shows a lamp. The chip mounting portion 11 for mounting a semiconductor chip is formed on the tip of the lead 13C. The two semiconductor chips 12A and 12B are arranged on the chip mounting portion 11. Bonding part 14
A and 14B are formed at the tip portions of the leads 13A and 13B, respectively. Further, one end of the bonding wire (for example, gold wire) 19A is connected to the semiconductor chip 12A, and the other end is connected to the bonding portion 14A. One end of the bonding wire 19B is connected to the semiconductor chip 12B, and the other end is connected to the bonding portion 14B.
Connected to B. The tip portions of the leads 13A to 13C are sealed with a transparent epoxy resin 15.
【００１２】上記ＬＥＤランプにおいて、エポキシ樹脂
１５により構成される外囲器の形状は、大きく上部と下
部とに分けることができる。下部の形状は、従来と同様
に、外囲器の中心軸１６を軸とする円柱から構成されて
いる。本発明は、外囲器の上部の形状に特徴があるもの
で、以下、上部の形状について詳細に説明する。In the above LED lamp, the shape of the envelope made of the epoxy resin 15 can be roughly divided into an upper portion and a lower portion. As in the conventional case, the shape of the lower portion is a cylinder having the central axis 16 of the envelope as its axis. The present invention is characterized by the shape of the upper portion of the envelope, and the shape of the upper portion will be described in detail below.
【００１３】外囲器の上部形状は、２つの曲面から構成
されている。その１つは、半導体チップ１２Ａを通りリ
−ド１３Ｃに平行な軸１６Ａを１つの軸とする楕円体
（または球体）１７Ａの表面の一部を形成している。ま
た、他の１つは、半導体チップ１２Ｂを通りリ−ド１３
Ｃに平行な軸１６Ｂを１つの軸とする楕円体（または球
体）１７Ｂの表面の一部を形成している。なお、楕円体
１７Ａの表面の一部を形成する曲面は、半導体チップ１
２Ａから発する光をＬＥＤランプの正面方向へ放射させ
るためのレンズとして働く。また、楕円体１７Ｂの表面
の一部を形成する曲面は、半導体チップ１２Ｂから発す
る光をＬＥＤランプの正面方向へ放射させるためのレン
ズとして働く。なお、ここでいう楕円体とは、軸１６
Ａ，１６Ｂを１つの軸とする直角座標系を考えた場合
に、式（１）に示す条件を満たすような立体をいう。
（Ｘ／ａ）2 ＋（Ｙ／ｂ）2 ＋（Ｚ／ｃ）2 ＝１ ……（１）The upper shape of the envelope is composed of two curved surfaces. One of them forms a part of the surface of an ellipsoid (or a sphere) 17A whose axis is an axis 16A which passes through the semiconductor chip 12A and is parallel to the lead 13C. The other one is a lead 13 passing through the semiconductor chip 12B.
It forms a part of the surface of an ellipsoid (or sphere) 17B having an axis 16B parallel to C as one axis. The curved surface forming a part of the surface of the ellipsoid 17A is the semiconductor chip 1
It functions as a lens for radiating the light emitted from 2A in the front direction of the LED lamp. The curved surface forming a part of the surface of the ellipsoid 17B functions as a lens for radiating the light emitted from the semiconductor chip 12B in the front direction of the LED lamp. The ellipsoid referred to here is the axis 16
When a rectangular coordinate system having A and 16B as one axis is considered, it means a solid body that satisfies the condition shown in Expression (1). (X / a) 2 + (Y / b) 2 + (Z / c) 2 = 1 (1)
【００１４】上記構成によれば、外囲器の上部形状の曲
面（レンズ）は、半導体チップ１２Ａ，１２Ｂに対応し
て形成されている。このため、半導体チップ１２Ａ，１
２Ｂから発する光は、ＬＥＤランプの正面方向へ効率よ
く放射される。また、外囲器の下部形状は、外囲器の中
心軸１６を軸とする円柱によって構成されている。この
ため、ＬＥＤランプの正面方向へ放射される光の投影が
円形となり、当該ＬＥＤランプの用途が広がり、見栄え
がよくなる。According to the above structure, the upper curved surface (lens) of the envelope is formed corresponding to the semiconductor chips 12A and 12B. Therefore, the semiconductor chips 12A, 1
The light emitted from 2B is efficiently radiated in the front direction of the LED lamp. In addition, the lower shape of the envelope is formed by a cylinder whose axis is the central axis 16 of the envelope. Therefore, the projection of the light radiated in the front direction of the LED lamp becomes circular, the application of the LED lamp is widened, and the appearance is improved.
【００１５】図２は、本発明のＬＥＤランプ（以下、本
発明品）の配光特性を示したもので、図３は、従来のＬ
ＥＤランプ（以下、従来品）の配光特性を示したもので
ある。このように、従来品では、ＬＥＤランプから放射
される光が互いに分離されているのに対し、本発明品で
は、２つの光が互いに重なっており、光が効率よく正面
方向へ放射されている。FIG. 2 shows the light distribution characteristics of the LED lamp of the present invention (hereinafter referred to as the present invention product), and FIG.
It shows the light distribution characteristics of an ED lamp (hereinafter, conventional product). As described above, in the conventional product, the light emitted from the LED lamp is separated from each other, whereas in the product of the present invention, the two lights are overlapped with each other, and the light is efficiently emitted in the front direction. .
【００１６】図４〜図６は、それぞれ図２のＬＥＤラン
プの変形例を示している。図４のＬＥＤランプでは、図
１のＬＥＤランプに比べて、楕円体１７Ａの曲面と楕円
体１７Ｂの曲面を滑らかにつないだ点が異なっている。
このように、楕円体１７Ａと楕円体１７Ｂが重なる部分
における不連続面をなくせば、さらに効果的に光をＬＥ
Ｄランプの正面方向へ放射できる。図５及び図６のＬＥ
Ｄランプでは、３つの半導体チップ１２Ａ〜１２Ｃがチ
ップ搭載部１１上に配置されている。このＬＥＤランプ
は、図１のＬＥＤランプに比べて、外囲器の上部形状が
３つの曲面から構成されている点が異なっている。な
お、３つの曲面は、それぞれ半導体チップ１２Ａ〜１２
Ｃに対応する３つの楕円体（または球体）１７Ａ〜１７
Ｃの表面の一部を形成している。上記図４〜図６に示す
ような構成のＬＥＤランプにおいても、図１に示した実
施例と同様の効果を得ることができる。4 to 6 each show a modification of the LED lamp shown in FIG. The LED lamp of FIG. 4 differs from the LED lamp of FIG. 1 in that the curved surface of the ellipsoid 17A and the curved surface of the ellipsoid 17B are smoothly connected.
As described above, if the discontinuous surface in the portion where the ellipsoid 17A and the ellipsoid 17B overlap each other is eliminated, the light can be more effectively LE.
It can radiate in the front direction of the D lamp. LE of FIGS. 5 and 6
In the D lamp, three semiconductor chips 12A to 12C are arranged on the chip mounting portion 11. This LED lamp is different from the LED lamp of FIG. 1 in that the upper shape of the envelope is composed of three curved surfaces. The three curved surfaces are respectively the semiconductor chips 12A to 12A.
Three ellipsoids (or spheres) 17A to 17 corresponding to C
It forms part of the surface of C. Also in the LED lamp having the structure shown in FIGS. 4 to 6, the same effect as that of the embodiment shown in FIG. 1 can be obtained.
【００１７】ところで、ＬＥＤランプは、単体としてで
はなく、多数のＬＥＤランプをマトリックス状に配置し
て使用するような場合がある。かかる場合に、外囲器の
中心軸１６に垂直な平面内において光の配光特性にむら
があると、見栄えが悪くなるなどの欠点が生じる。Incidentally, the LED lamp may be used by arranging a large number of LED lamps in a matrix form, not as a single unit. In such a case, if the light distribution characteristics of the light are uneven in a plane perpendicular to the central axis 16 of the envelope, there are drawbacks such as poor appearance.
【００１８】ここで、以下の説明を分かり易くするた
め、一つの座標系を定義することとする。この座標系
は、図１において、半導体チップ１２Ａまたは半導体チ
ップ１２Ｂを原点Ｏとし、その半導体チップ１２Ａまた
は半導体チップ１２Ｂを通りリ−ド１３Ｃに平行、すな
わち外囲器の中心軸１６に平行となるような軸１６Ａま
たは１６Ｂをｚ軸とする。また、半導体チップ１２Ａお
よび半導体チップ１２Ｂを通りｚ軸に直交するような軸
をｘ軸とし、原点Ｏを通りｚ軸およびｘ軸に直交するよ
うな軸をｙ軸とする。なお、光は、半導体チップ１２
Ａ，１２Ｂからｚ軸方向へ放射されるものとする。Here, in order to make the following description easy to understand, one coordinate system will be defined. This coordinate system has the semiconductor chip 12A or the semiconductor chip 12B as the origin O in FIG. Such axis 16A or 16B is designated as the z-axis. An axis that passes through the semiconductor chips 12A and 12B and is orthogonal to the z axis is the x axis, and an axis that passes through the origin O and is orthogonal to the z axis and the x axis is the y axis. Note that the light is emitted from the semiconductor chip 12
Radiation from A and 12B in the z-axis direction is assumed.
【００１９】次に、外囲器の曲面が、ｚ軸を中心軸とす
る回転楕円体（図８参照）または球体（図９参照）の表
面の一部を形成している場合の光の配光特性を知べてみ
た。その結果、図７に示すような結果が得られた。すな
わち、半導体チップの配列方向、すなわちｘ軸方向の光
は、ｙ軸方向の光よりも広い範囲に放射されていること
がわかった。Next, the distribution of light when the curved surface of the envelope forms part of the surface of a spheroid (see FIG. 8) or a sphere (see FIG. 9) having the z axis as the central axis. I tried to know the light characteristics. As a result, the result shown in FIG. 7 was obtained. That is, it was found that the light in the arrangement direction of the semiconductor chips, that is, the light in the x-axis direction was emitted in a wider range than the light in the y-axis direction.
【００２０】図１０および図１１は、本発明の他の実施
例に係わるＬＥＤランプを示している。このＬＥＤラン
プは、各曲面が、ｘ軸およびｙ軸およびｚ軸をそれぞれ
軸とする楕円体の表面の一部を形成している。つまり、
その曲面をｘ−ｚ平面で切断すると、図１０に示すよう
に、その切断面は、短径がａで長径がｂの楕円となる。
また、その曲面をｙ−ｚ平面で切断すると、図１１に示
すように、その切断面は、短径がａで長径がｃの楕円と
なる。10 and 11 show an LED lamp according to another embodiment of the present invention. In this LED lamp, each curved surface forms part of the surface of an ellipsoid whose axes are the x-axis, the y-axis, and the z-axis. That is,
When the curved surface is cut along the xz plane, the cut surface becomes an ellipse having a minor axis a and a major axis b, as shown in FIG.
When the curved surface is cut along the yz plane, the cut surface becomes an ellipse having a minor axis a and a major axis c, as shown in FIG.
【００２１】上記図１０および図１１に示す実施例によ
れば、半導体チップの数に応じて、外囲器の上部形状、
すなわち２つの曲面の形状を変え、ＬＥＤランプのｘ方
向およびｙ方向の配光特性をほぼ同一にすることができ
る。According to the embodiments shown in FIGS. 10 and 11, the upper shape of the envelope is changed according to the number of semiconductor chips,
That is, by changing the shapes of the two curved surfaces, the light distribution characteristics in the x direction and the y direction of the LED lamp can be made substantially the same.
【００２２】図１２は、本発明に係わるＬＥＤランプの
ｘ方向およびｙ方向の配光特性を具体的に示している。
このＬＥＤランプは、２つの半導体チップを有し、それ
ぞれの半導体チップに対応する外囲器の上部形状が、ｘ
軸、ｙ軸およびｚ軸を軸とする楕円体の曲面の一部を形
成しているものである。つまり、各半導体チップに対応
する２つの楕円体（レンズ）は、図１２に示すように、
それぞれｘ−ｚ平面で切断された場合にできる断面形状
と、ｙ−ｚ平面で切断された場合にできる断面形状が異
なっている。つまり、２つの楕円体を結合した場合に、
ＬＥＤランプのｘ方向およびｙ方向の配光特性がほぼ同
一となるように、前記２つの楕円体の形状が設定されて
いる。これにより、ユ−ザの希望に応じて、２つの半導
体チップを有するＬＥＤランプのｘ方向およびｙ方向の
配光特性を同一に設定することができる。FIG. 12 specifically shows the light distribution characteristics in the x and y directions of the LED lamp according to the present invention.
This LED lamp has two semiconductor chips, and the upper shape of the envelope corresponding to each semiconductor chip is x
It forms part of a curved surface of an ellipsoid whose axes are the axis, the y axis and the z axis. That is, the two ellipsoids (lenses) corresponding to the respective semiconductor chips are, as shown in FIG.
The cross-sectional shape formed by cutting in the x-z plane and the cross-sectional shape formed by cutting in the y-z plane are different. That is, when two ellipsoids are combined,
The shapes of the two ellipsoids are set such that the light distribution characteristics in the x direction and the y direction of the LED lamp are substantially the same. As a result, the light distribution characteristics in the x direction and the y direction of the LED lamp having two semiconductor chips can be set to be the same according to the user's request.
【００２３】[0023]
【発明の効果】以上、説明したように本発明のＬＥＤラ
ンプによれば、次のような効果を奏する。As described above, the LED lamp of the present invention has the following effects.
【００２４】外囲器の上部形状が、各々の半導体チップ
に対応する２つの楕円体の曲面の一部から構成されてい
る。従って、２つの半導体チップをレンズの焦点位置に
配置することができるため、ＬＥＤランプから放射され
た光が、互いに分離されてしまうことがない。従って、
２つの半導体チップを有するＬＥＤランプにおいても、
光を効率よくＬＥＤランプの正面方向へ放射させること
ができる。The upper shape of the envelope is composed of a part of two ellipsoidal curved surfaces corresponding to the respective semiconductor chips. Therefore, since the two semiconductor chips can be arranged at the focal position of the lens, the light emitted from the LED lamp is not separated from each other. Therefore,
Even in LED lamps with two semiconductor chips,
Light can be efficiently emitted in the front direction of the LED lamp.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の一実施例に係わるＬＥＤランプを示す
図。FIG. 1 is a diagram showing an LED lamp according to an embodiment of the present invention.
【図２】本発明のＬＥＤランプの配光特性を示す図。FIG. 2 is a diagram showing light distribution characteristics of the LED lamp of the present invention.
【図３】従来のＬＥＤランプの配光特性を示す図。FIG. 3 is a diagram showing a light distribution characteristic of a conventional LED lamp.
【図４】図２のＬＥＤランプの変形例を示す図。FIG. 4 is a diagram showing a modification of the LED lamp of FIG.
【図５】図２のＬＥＤランプの変形例を示す図。FIG. 5 is a diagram showing a modification of the LED lamp of FIG.
【図６】図２のＬＥＤランプの変形例を示す図。FIG. 6 is a diagram showing a modification of the LED lamp of FIG.
【図７】図２のＬＥＤランプのｘ−ｙ方向の配光特性を
示す図。FIG. 7 is a diagram showing the light distribution characteristics in the xy directions of the LED lamp of FIG.
【図８】図２のＬＥＤランプの外囲器のレンズを構成す
る楕円体を示す図。8 is a view showing an ellipsoid forming a lens of the envelope of the LED lamp shown in FIG.
【図９】図２のＬＥＤランプの外囲器のレンズを構成す
る球体を示す図。FIG. 9 is a view showing a sphere which constitutes a lens of the envelope of the LED lamp of FIG.
【図１０】本発明の他の実施例に係わるＬＥＤランプの
外囲器の上部形状を構成する楕円体または球体を示す
図、FIG. 10 is a view showing an ellipsoid or a sphere forming the upper shape of the envelope of the LED lamp according to another embodiment of the present invention,
【図１１】本発明の他の実施例に係わるＬＥＤランプの
外囲器の上部形状を構成する楕円体を示す図。FIG. 11 is a view showing an ellipsoid forming the upper shape of the envelope of the LED lamp according to another embodiment of the present invention.
【図１２】本発明のＬＥＤランプの配光特性を示す図。FIG. 12 is a diagram showing the light distribution characteristics of the LED lamp of the present invention.
【図１３】従来のＬＥＤランプを示す断面図。FIG. 13 is a cross-sectional view showing a conventional LED lamp.
１１…チップ搭載部、 １２Ａ，１２Ｂ…半導体チップ、 １３Ａ〜１３Ｃ…リ−ド、 １４Ａ，１４Ｂ…ボンディング部、 １５…エポキシ樹脂、 １６…外囲器の中心軸、 １７Ａ，１７Ｂ…回転楕円体。 11 ... Chip mounting part, 12A, 12B ... semiconductor chip, 13A to 13C ... Lead, 14A, 14B ... Bonding part, 15 ... Epoxy resin, 16 ... the central axis of the envelope, 17A, 17B ... Spheroid.
Claims (5)
る複数の半導体チップと、前記半導体チップおよびその
近傍を取り囲む光透過性の外囲器とを有するＬＥＤラン
プにおいて、 前記外囲器の形状が、各々の半導体チップを通る各々の
軸を１つの軸とする複数の楕円体または球体を含む立体
から構成されていることを特徴とするＬＥＤランプ。1. An LED lamp comprising a lead, a plurality of semiconductor chips mounted on a tip portion of the lead, and a light-transmissive envelope surrounding the semiconductor chips and the vicinity thereof. The LED lamp is characterized in that the shape of the envelope is a solid body including a plurality of ellipsoids or spheres each axis of which passes through each semiconductor chip.
円筒によって、前記立体の一部を切り落とした形状を有
していることを特徴とする請求項１記載のＬＥＤラン
プ。2. The LED lamp according to claim 1, wherein the envelope has a shape in which a part of the solid body is cut off by a cylinder whose center axis is the lead.
は、互いに平行であることを特徴とする請求項１記載の
ＬＥＤランプ。3. The LED lamp according to claim 1, wherein axes of the semiconductor chips are parallel to each other.
る第１および第２の半導体チップと、前記第１および第
２の半導体チップおよびその近傍を取り囲む光透過性の
外囲器とを有するＬＥＤランプにおいて、 前記外囲器の形状は、下部形状と上部形状とに分けら
れ、前記下部形状は、前記リ−ドを中心軸とする円柱か
ら構成され、前記上部形状は、前記第１の半導体チップ
を通り前記リ−ドに平行な第１の軸を１つの軸とする楕
円体の曲面の一部と、前記第２の半導体チップを通り前
記リ−ドに平行な第２の軸を１つの軸とする楕円体の曲
面の一部とから構成されていることを特徴とするＬＥＤ
ランプ。4. A lead, first and second semiconductor chips mounted on the tip of the lead, and a light-transmissive material surrounding the first and second semiconductor chips and the vicinity thereof. In the LED lamp having an envelope, the shape of the envelope is divided into a lower shape and an upper shape, and the lower shape is composed of a cylinder having the lead as a central axis and the upper shape. Is a part of an ellipsoidal curved surface having a first axis parallel to the lead passing through the first semiconductor chip and one axis, and passing through the second semiconductor chip and parallel to the lead. And a part of a curved surface of an ellipsoid having a second axis as one axis.
lamp.
平行であることを特徴とする請求項４記載のＬＥＤラン
プ。5. The LED lamp according to claim 4, wherein the first axis and the second axis are parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3227105A JPH0529660A (en) | 1990-09-07 | 1991-09-06 | Led lamp |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23764990 | 1990-09-07 | ||
| JP2-237649 | 1990-09-07 | ||
| JP3227105A JPH0529660A (en) | 1990-09-07 | 1991-09-06 | Led lamp |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9300464A Division JPH10117019A (en) | 1990-09-07 | 1997-10-31 | Led lamp |
| JP31773798A Division JP3281322B2 (en) | 1990-09-07 | 1998-11-09 | LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0529660A true JPH0529660A (en) | 1993-02-05 |
Family
ID=26527513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3227105A Pending JPH0529660A (en) | 1990-09-07 | 1991-09-06 | Led lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0529660A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0679166U (en) * | 1993-04-09 | 1994-11-04 | スタンレー電気株式会社 | LED lamp |
| US7279674B2 (en) | 2000-08-17 | 2007-10-09 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | Optical encoder module |
| US7302181B2 (en) | 2003-02-25 | 2007-11-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Single lens multiple light source device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933761B1 (en) * | 1969-08-27 | 1974-09-10 | ||
| JPS6059546B2 (en) * | 1984-05-25 | 1985-12-25 | 満雄 上和野 | Flow rate measurement method and device |
-
1991
- 1991-09-06 JP JP3227105A patent/JPH0529660A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933761B1 (en) * | 1969-08-27 | 1974-09-10 | ||
| JPS6059546B2 (en) * | 1984-05-25 | 1985-12-25 | 満雄 上和野 | Flow rate measurement method and device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0679166U (en) * | 1993-04-09 | 1994-11-04 | スタンレー電気株式会社 | LED lamp |
| US7279674B2 (en) | 2000-08-17 | 2007-10-09 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | Optical encoder module |
| US7302181B2 (en) | 2003-02-25 | 2007-11-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Single lens multiple light source device |
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