JPH05287315A - Powder molding method by isostatic molding using metallic mold - Google Patents
Powder molding method by isostatic molding using metallic moldInfo
- Publication number
- JPH05287315A JPH05287315A JP8539192A JP8539192A JPH05287315A JP H05287315 A JPH05287315 A JP H05287315A JP 8539192 A JP8539192 A JP 8539192A JP 8539192 A JP8539192 A JP 8539192A JP H05287315 A JPH05287315 A JP H05287315A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molding
- powder
- die
- bag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Press-Shaping Or Shaping Using Conveyers (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はセラミックス粉末や金属
粉末を原料として、大型の複雑形状部品の製造に用いら
れる静水圧成形による粉末成形方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a powder molding method by hydrostatic molding, which is used for manufacturing large-sized complex shaped parts by using ceramic powder or metal powder as a raw material.
【０００２】[0002]
【従来の技術】従来から、金属、セラミックス等の粉末
を原料とし金型プレス成形、焼結を行い最終製品を得る
技術は粉末製品の製造方法としてよく用いられている。
しかし、断面形状の大きな製品に対し金型プレス成形を
行う場合には、適正な成形圧力を得るために大型のプレ
ス機が必要となってくる。通常、大型製品の成形には、
冷間静水圧加圧法（ＣＩＰ法）が用いられているが、Ｃ
ＩＰ法では成形型としてゴムを用いるため、成形後の寸
法精度は金型成形よりも劣る。このため、高寸法精度で
かつ大型の部材を成形するには粉末材料を充填した金型
をＣＩＰにより成形すれば可能となる。2. Description of the Related Art Conventionally, a technique for obtaining a final product by subjecting powder of metal, ceramics or the like as a raw material to die press molding and sintering has been often used as a method for producing a powder product.
However, when performing die press molding on a product having a large cross-sectional shape, a large press machine is required to obtain an appropriate molding pressure. Usually, when molding large products,
The cold isostatic pressing method (CIP method) is used, but C
Since the IP method uses rubber as a mold, the dimensional accuracy after molding is inferior to that of mold molding. Therefore, in order to mold a large member with high dimensional accuracy, it is possible to mold a die filled with powder material by CIP.
【０００３】しかし、この成形方法では圧力媒体である
液体が金型内に流入するのを防ぎかつ圧力を十分に伝達
することの可能な容器で金型を包み込み封入する必要が
ある。またさらに、金型を包み込んだ容器内部は十分に
圧力が伝達されるように減圧することが重要であるが、
単純に通常のゴム型で封入しただけでは成形中に金型の
摺動によりゴムの巻き込みや引裂等の可能性も生じてく
る。このように通常の金型を用いてＣＩＰを実際に行う
には金型の容器内への減圧封入方法に対して多くの課題
が残る。However, in this molding method, it is necessary to enclose and mold the mold with a container capable of preventing the liquid as the pressure medium from flowing into the mold and sufficiently transmitting the pressure. Furthermore, it is important to reduce the pressure inside the container enclosing the mold so that the pressure is sufficiently transmitted.
Simply encapsulating with a normal rubber mold may cause the rubber to be caught or torn due to sliding of the mold during molding. As described above, in order to actually perform CIP using a normal mold, many problems remain in the method of sealing the mold under reduced pressure.
【０００４】[0004]
【発明が解決しようとする課題】本発明は上記のごとき
条件の下でもたやすく粉末製品の成形が可能でかつ大型
複雑形状部材を得るための成形技術を開発することを目
的とする。SUMMARY OF THE INVENTION It is an object of the present invention to develop a molding technique capable of easily molding a powder product under the above-mentioned conditions and obtaining a large-sized complex shaped member.
【０００５】[0005]
【課題を解決するための手段】本発明に従うセラミック
スや金属粉末等の粉末成形体製造方法は、所定の形状に
成形するための金型に粉末を充填した状態で、この金型
を高分子製の薄肉容器に挿入しこの内部を減圧し真空封
入した後さらに、ゴム製の袋に挿入し減圧を行った金型
をＣＩＰ装置中に挿入し加圧成形することを特徴とする
ものである。According to the present invention, there is provided a method for producing a powder compact such as ceramics or metal powder, in which a die for molding into a predetermined shape is filled with powder and the die is made of a polymer. After being inserted into a thin-walled container, the inside of the container is decompressed and vacuum-sealed, the die is further inserted into a rubber bag and decompressed, and then inserted into a CIP device for pressure molding.
【０００６】[0006]
【作用】以下、本発明に従う金型を用いた静水圧成形
（ＣＩＰ）による粉末成形方法について詳細に説明す
る。図１は本発明に従う静水圧成形用粉末成形金型の一
例を示すものである。簡単のため、金型は円柱形状、片
押し成形（上パンチのみ可動）とした。そしてこの粉末
成形金型は上パンチ１、ダイス２、下パンチ３、締め付
けボルト４より構成される。さらに７は粉末材料で５は
高分子製の薄肉袋、６はゴム製の薄肉袋である。The powder molding method by isostatic pressing (CIP) using the mold according to the present invention will be described in detail below. FIG. 1 shows an example of a powder molding die for isostatic pressing according to the present invention. For the sake of simplicity, the mold was a cylindrical shape, and one-sided pressing (only the upper punch was movable). The powder molding die is composed of an upper punch 1, a die 2, a lower punch 3, and a tightening bolt 4. Further, 7 is a powder material, 5 is a thin polymer bag, and 6 is a thin rubber bag.
【０００７】より具体的に実際の粉末充填および成形工
程を以下に示す。まず下パンチ３を締め付けボルト４を
用いてダイス２に固定し、所定重量の粉末材料７の充填
を行い、そして上パンチ１をダイス２に挿入する。この
後、この金型を高分子製の袋５に挿入し袋内を真空ポン
プにより排気を行い所定の真空度に達した後、この袋５
を溶着し金型を真空封入する。そしてさらに、この金型
を真空封入したものをゴム製の薄肉袋６に挿入し、さら
に袋内部の真空排気を行いゴム袋内部も減圧状態にせし
める。More specifically, the actual powder filling and molding process will be described below. First, the lower punch 3 is fixed to the die 2 with the tightening bolts 4, the powder material 7 having a predetermined weight is filled, and the upper punch 1 is inserted into the die 2. After that, the mold is inserted into a bag 5 made of polymer, and the inside of the bag is evacuated by a vacuum pump to reach a predetermined degree of vacuum.
And vacuum-seal the mold. Then, the mold is vacuum sealed and inserted into a thin rubber bag 6, and the inside of the bag is evacuated to reduce the pressure inside the rubber bag.
【０００８】このように金型を高分子製およびゴム製の
袋で二重に封入した状態で、所定の静水圧加圧成形が実
施されるのである。そしてこれによって、かかる上パン
チ１、下パンチ３、ダイス２の形状に即した粉末成形体
の製造が可能となる。In this manner, the predetermined hydrostatic pressure molding is carried out in a state in which the mold is doubly enclosed by the polymer bag and the rubber bag. As a result, it becomes possible to manufacture a powder compact in conformity with the shapes of the upper punch 1, the lower punch 3 and the die 2.
【０００９】本発明で用いられる高分子製の薄肉袋は、
引裂に対する抵抗性と適度の伸びを持ちさらに、真空封
入のために良好な溶着性が必要となる。具体的にはポリ
エチレン、ポリプロピレン、軟質ポリ塩化ビニル等の材
質であり、その厚さは必要に応じて５０〜２００μｍの
中から選ばれる。また、ゴム製の薄肉袋とは通常ＣＩＰ
の型に用いられる天然ゴム、アクリルニトリルゴム、ス
チレンゴム、スチレン−ブタジエン等であり、その厚さ
は５０〜１０００μｍの範囲で適宜選ばれる。The thin polymer bag used in the present invention is
In addition to having resistance to tearing and moderate elongation, good weldability is required for vacuum encapsulation. Specifically, the material is polyethylene, polypropylene, soft polyvinyl chloride, or the like, and the thickness thereof is selected from the range of 50 to 200 μm as required. A thin rubber bag is usually CIP
Examples of the natural rubber, acrylonitrile rubber, styrene rubber, styrene-butadiene, etc. used in the mold of (1) and their thickness are appropriately selected in the range of 50 to 1000 μm.
【００１０】[0010]
（実施例１）図２に示すような円柱形状の成形を図１に
示すような金型を用いて行った。内径はｄ＝１０mmであ
る。粉末材料には銅粉末（水アトマイズ粉、平均粒径約
２５μｍ）を用いた。実際の金型の組み付け粉末の挿入
は図１に従って、まず下パンチ３を締め付けボルト４を
用いてダイス２に固定し、所定重量（５．１ｇ）の銅粉
末材料の充填を行い上パンチ１をダイス２に挿入した。
この後、この金型をポリエチレン製の薄肉袋（５０μ
ｍ）５に挿入し、袋内を真空ポンプにより排気を行い
０．１torrの真空度に達した後、ポリエチレン製の袋５
を溶着し金型を真空封入する。(Example 1) A cylindrical shape as shown in FIG. 2 was formed using a mold as shown in FIG. The inner diameter is d = 10 mm. Copper powder (water atomized powder, average particle size of about 25 μm) was used as the powder material. As for the actual insertion of the die-assembling powder, the lower punch 3 is first fixed to the die 2 with the tightening bolts 4 according to FIG. 1, and the upper punch 1 is filled with a predetermined weight (5.1 g) of copper powder material. Inserted in die 2.
After that, this mold was put into a thin polyethylene bag (50 μm).
m) 5), the inside of the bag is evacuated by a vacuum pump to reach a vacuum degree of 0.1 torr, and then the polyethylene bag 5
And vacuum-seal the mold.
【００１１】さらに、この金型を真空封入したものをア
クリルニトリルゴム製の薄肉袋（２００μｍ）に挿入
し、さらに袋内部の真空排気を行いゴム袋内部も減圧状
態にした。この真空封入した金型ＣＩＰ装置内に挿入し
４９〜３４３MPa の圧力範囲で静水圧成形を行った。Further, a vacuum-sealed mold was inserted into a thin wall bag (200 μm) made of acrylonitrile rubber, and the inside of the bag was evacuated to reduce the pressure inside the rubber bag. The mold was inserted into this vacuum-sealed mold CIP device, and hydrostatic molding was performed in the pressure range of 49 to 343 MPa.
【００１２】図３には本発明による粉末成形方法と通常
のプレス方法による成形圧力と相対密度変化を示す。両
者の相対密度は圧力に対してほぼ同一の変化を示してお
り、本発明による粉末成形方法が有効であることが判明
した。FIG. 3 shows changes in molding pressure and relative density by the powder molding method according to the present invention and the ordinary pressing method. The relative densities of the two showed almost the same change with respect to the pressure, which proved that the powder molding method according to the present invention was effective.
【００１３】（実施例２）図４に示すような形状の成形
を行った。寸法はｄ1 ＝５００mm，ｄ2 ＝２００mm，ｄ
3 ＝３００mm，ｈ1 ＝１００mm，ｈ2 ＝２０mmである。
図５にこの粉末成形体を成形するための金型を示す。粉
末材料にはアルミナ粉末（造粒後平均粒径１００μｍ）
を用いた。(Example 2) A shape as shown in FIG. 4 was formed. The dimensions are d 1 = 500 mm, d 2 = 200 mm, d
3 = 300mm, h 1 = 100mm , which is h 2 = 20mm.
FIG. 5 shows a mold for molding this powder compact. Alumina powder (average particle size of 100 μm after granulation)
Was used.
【００１４】金型への粉末の挿入、金型の真空封入は
（実施例１）と同様である。そしてこの真空封入した金
型をＣＩＰ装置内に挿入し、常法に従って静水圧成形を
行うことにより、図４に示すような粉末成形体が得られ
た。Inserting the powder into the mold and vacuum-sealing the mold are the same as in (Example 1). Then, this vacuum-sealed mold was inserted into a CIP device, and hydrostatic molding was performed according to a conventional method to obtain a powder compact as shown in FIG.
【００１５】[0015]
【発明の効果】本発明によって、粉末を所定の形状に成
形するための金型を高分子製の袋に入れ、この内部を減
圧し真空封入した後、さらに、ゴム製の袋に挿入し減圧
を行い、通常の静水圧加圧成形を行うことにより目的と
する製品形状に近い粉末成形体を得ることができる。Industrial Applicability According to the present invention, a mold for molding powder into a predetermined shape is put in a bag made of polymer, the inside of which is decompressed and vacuum-sealed, and then inserted into a bag made of rubber and decompressed. Then, the normal hydrostatic pressure molding is carried out to obtain a powder compact close to the intended product shape.
【図１】本発明に従う静水圧成形用粉末成形金型の一つ
の具体例の説明図である。FIG. 1 is an explanatory view of one specific example of a powder molding die for isostatic pressing according to the present invention.
【図２】実施例１の銅成形体の形状の模式図である。FIG. 2 is a schematic view of the shape of a copper molded body of Example 1.
【図３】本発明による粉末成形方法と通常のプレス成形
における成形圧力と相対密度変化の図表である。FIG. 3 is a diagram showing changes in molding pressure and relative density in the powder molding method and ordinary press molding according to the present invention.
【図４】実施例２のアルミナ成形体の形状の模式図であ
る。FIG. 4 is a schematic diagram of the shape of an alumina molded body of Example 2.
【図５】図４図示の成形体の金型の説明図である。5 is an explanatory view of a mold of the molded body shown in FIG.
１ 上パンチ ２ ダイス ３ 下パンチ ４ 締め付けボルト ５ 高分子製袋 ６ ゴム製袋 ７ 粉末材料 1 Upper punch 2 Die 3 Lower punch 4 Tightening bolt 5 Polymer bag 6 Rubber bag 7 Powder material
Claims (1)
チおよび下パンチからなる金型内に粉末材料を充填し、
この金型を薄肉の高分子製の容器に真空封入した後、さ
らに薄肉のゴム製の容器に封入したものをＣＩＰ装置内
に挿入し加圧成形することを特徴とする金型を用いた静
水圧成形による粉末成形方法。1. A powder material is filled in a die consisting of a die and an upper punch and a lower punch inscribed in the die,
This mold is vacuum-sealed in a thin-walled polymer container, and then further sealed in a thin-walled rubber container and inserted into a CIP device for pressure molding. Powder molding method by hydraulic molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8539192A JPH0826362B2 (en) | 1992-04-07 | 1992-04-07 | Powder molding method by hydrostatic molding using a mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8539192A JPH0826362B2 (en) | 1992-04-07 | 1992-04-07 | Powder molding method by hydrostatic molding using a mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05287315A true JPH05287315A (en) | 1993-11-02 |
| JPH0826362B2 JPH0826362B2 (en) | 1996-03-13 |
Family
ID=13857464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8539192A Expired - Lifetime JPH0826362B2 (en) | 1992-04-07 | 1992-04-07 | Powder molding method by hydrostatic molding using a mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0826362B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997017181A1 (en) * | 1995-11-09 | 1997-05-15 | Ucb, S.A. | Method for producing an optical article in a mold sealed under vacuum |
| JP2006241595A (en) * | 2005-02-01 | 2006-09-14 | Tosoh Corp | Sinter, sputtering target and molding die, and production process of sintered compact |
| US8419400B2 (en) | 2005-02-01 | 2013-04-16 | Tosoh Corporation | Sintered body, sputtering target and molding die, and process for producing sintered body employing the same |
-
1992
- 1992-04-07 JP JP8539192A patent/JPH0826362B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997017181A1 (en) * | 1995-11-09 | 1997-05-15 | Ucb, S.A. | Method for producing an optical article in a mold sealed under vacuum |
| JP2006241595A (en) * | 2005-02-01 | 2006-09-14 | Tosoh Corp | Sinter, sputtering target and molding die, and production process of sintered compact |
| US8419400B2 (en) | 2005-02-01 | 2013-04-16 | Tosoh Corporation | Sintered body, sputtering target and molding die, and process for producing sintered body employing the same |
| JP2013091322A (en) * | 2005-02-01 | 2013-05-16 | Tosoh Corp | Sintered body, sputtering target, forming mold and method for manufacturing sintered body |
| JP2014129231A (en) * | 2005-02-01 | 2014-07-10 | Tosoh Corp | Sintered compact and sputtering target |
| US9920420B2 (en) | 2005-02-01 | 2018-03-20 | Tosoh Corporation | Sintered body, sputtering target and molding die, and process for producing sintered body employing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0826362B2 (en) | 1996-03-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960827 |