JPH05270936A - Method for constructing part for preventing delamination in inorganic fiberboard - Google Patents

Abstract

PURPOSE:To construct a fiberboard formed by superposing plural thin layers of an inorganic fiber raw material and hot-pressing the superposed layers into a structure capable of preventing a delamination phenomenon caused during its use. CONSTITUTION:The objective method is to laminate plural thin layers which are an inorganic fiber raw material 1 containing a proper amount of an adhesive added thereto, feed the laminated layers to a forming mold 10, collapse the lamination joining interface with recessed parts 3 formed by the pressing processing of more strongly compacted consolidated parts 2 than unconsolidated parts 6 having a dimension (H) of the set thickness of the resultant inorganic fiberboard (A) to be formed through the suitably set interval with protruding molds (10c) provided in the forming mold 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for constructing a delamination preventive portion in an inorganic fiber board obtained by heating and pressurizing inorganic fiber as a raw material.

[0002]

[Technical background] Inorganic fibers such as glass wool, rock wool, and ceramic wool in some cases,
An appropriate amount of adhesive is added to these and heated and pressed to form a plate-like body.

The above-mentioned inorganic fibers used as raw materials are
Its original form is a thin fiber layer aggregate, and when it is molded into a plate with a desired thickness, the thin layer raw material is accumulated in a set amount and provided to the molding means. It is a thing.

However, since the laminated thin-layer raw materials are rarely entangled with other layers adjacent to each other, even if the product is compression-molded into a plate-shaped product, there are traces of the layer structure in the original form. Does not disappear, and a peeling phenomenon due to these does not occur.

[0005]

2. Description of the Related Art An inorganic fiber such as glass wool or rock wool is used as a main material, and an appropriate amount of an adhesive is added to this material, which is pressed and heated to form a plate. Further, as a technique of means for coating these plate bodies with a surface layer material of a different material, for example, JP-A-59-158853, JP-A-62-121033,
There is a technology disclosed by No. 62-133165 and the like.

[0006]

The techniques disclosed in the above-mentioned conventional techniques disclosed in Japanese Patent Laid-Open Nos. 59-158853 and 62-121033 are different from those of the present invention. However, by sticking a surface layer material different from the main body on the surface, the phenomenon of peeling due to an external force from the surface direction can be protected to some extent.

However, a frequent occurrence of the peeling phenomenon of the inorganic fiber board occurs from the side of the board, that is, from the side where the side surface in the thickness direction is exposed, so that the peeling phenomenon occurs even when the surface layer material is adhered. The efficiency of defense is never high.

In this respect, in the invention of Japanese Patent Application Laid-Open No. 62-133165, the peeling prevention effect is effective, that is, even if the peeling phenomenon occurs, the range is terminated in a small scale and the propagation action can be blocked. There is.

In the present invention, even if the peeling phenomenon occurs, the object of the present invention is to minimize the damaged portion and prevent the spread of the peeling phenomenon in a wide range as in the invention of the above-mentioned JP-A-62-133165. The idea is the same.

In particular, it is an object of the present invention to simplify the process for preventing the propagation of the peeling phenomenon so that the main constitution can be performed at the same time when the inorganic fiber board is molded.

[0011]

The present invention provides a means for achieving the above object,

The first aspect of the present invention relates to an uncured inorganic fiber material to which an appropriate amount of an adhesive has been added, and at the time of heat-press molding, the inorganic fiber material is allowed to pass through a set gap at a small scale and a plurality of small-sized fibers. The solidified portion is formed by stronger consolidation than the non-solidified portion so that the solidified portion at the bottom of the recess formed by the solidified portion formation has a higher density than the non-solidified portion. is there.

A second aspect of the present invention is an uncured inorganic fiber material to which an appropriate amount of an adhesive has been added, at the time of heating and pressurizing the inorganic fiber material, through a set gap, on a small scale and in a plurality of solid fibers. The joint is formed by stronger consolidation than the non-consolidated portion, and the consolidated portion at the bottom of the recess formed by this consolidated portion formation has a higher density than the non-consolidated portion. A small-diameter hole is provided in the solidified portion having a high density, an adhesive is separately filled, and the adhesive is cured.

A third aspect of the present invention is an uncured inorganic fiber material to which an appropriate amount of an adhesive has been added, at the time of heating and pressurizing the inorganic fiber material, through a set gap, and on a small scale. The solidified portion is formed by stronger consolidation than the non-solidified portion, and the solidified portion at the bottom of the recess formed in the solidified portion is made to have a higher density than the non-solidified portion. An adhesive is separately added to the high density portion of the joint, and the hard portion is formed by the adhesive added to the high density portion and the non-consolidated portion adjacent to the periphery of the high density portion.

In a fourth aspect of the present invention, the openings of a plurality of recesses formed so that the solidified portion becomes a high density portion are formed so as to open on one side of the inorganic fiber board to be molded. ..

In a fifth aspect of the invention, the openings of the plurality of recesses are formed so that the consolidated portion becomes a high-density portion so as to open on both sides of the inorganic fiber board to be molded.

According to a sixth aspect of the present invention, the outer surface of the solidified portion at the bottom of the plurality of recesses formed so as to form the high density portion is formed flush with the flat portion of the non-solidified portion.

In a seventh aspect of the present invention, the outer surface of the solidified portion at the bottom of the plurality of recesses formed so as to form the high density portion is further outwardly projected and molded from the flat portion of the non-solidified portion. is there.

An eighth aspect of the present invention is that, at a position where the thickness directions of the front and back flat portions of the inorganic fiber board are unified, both the front and back surfaces are strongly consolidated, and the bottom portions of the recesses formed by this consolidation are formed. The high density portion to be formed is a solidified portion, and the solidified portion is molded to be in the same position as the intermediate position in the thickness direction of the non-solidified portion.

A ninth aspect of the present invention is to fill a plurality of recesses formed so that the consolidated portion becomes a high-density portion with inorganic fiber material to which an appropriate amount of an adhesive is separately added, and to adjoin the adjacent non-solidified fiber material. It is molded so as to be assimilated with the knot.

A tenth aspect of the present invention is to impregnate an adhesive used for sticking a surface layer material on a surface where the outer surface of the consolidated portion of the high density portion formed by strong consolidation is flush with the plane of the unconsolidated portion. This further strengthens the solidified portion.

In the eleventh aspect of the invention, a surface layer material is attached to the same surface as the surface having the opening portion of the recess formed by strong consolidation for forming the consolidated portion, and a smooth surface in which the recess hole is not opened is formed. To form.

According to a twelfth aspect of the invention, a surface layer material is adhered to the outer surface of each consolidating portion whose top surface is formed by projecting from the flat portion of the non-consolidating portion, and the inner surface of the surface layer material and the outer surface of the non-consolidating portion are bonded together. An air layer is formed between them.

The thirteenth aspect of the present invention is such that a consolidated portion is formed at the edge of the inorganic fiber board to be molded.

[0025]

According to the present invention, the inorganic fiber raw material formed in a thin layer is basically laminated in a plurality of layers and heated or pressed to form an inorganic fiber board, which is scattered in a mold or It is intended to partially form a solidified portion by a stronger pressure than other places by a convex shape that can be linearly arranged and strongly consolidated.

The means for forming the solidified portion is based on a concept very similar to spot welding in which a plurality of steel plates are laminated and all the laminated steel plates are integrated.

However, since the object substance of the present invention is the inorganic fiber, the consolidation portion to be formed is formed by strong consolidation, so that the area ratio occupied by the consolidation portion is large. For example, although the efficiency of peeling phenomenon propagation increases, the effects of heat insulation, soundproofing, etc., which are the original purpose of the inorganic fiber board, decrease in inverse proportion.

Therefore, the form of the solidified portion is such that the total area ratio is made as small as possible, and the total area is divided into several parts, and the individual solidified portions formed by this are
It must exhibit a stronger consolidation action.

A strong solidified portion, that is, the solidified portion has a very high density as compared with the non-solidified portion, so that the portion forming the solidified portion is consequently formed with a recessed hole state. It

These recesses are very effective from the original purpose of heat insulation and soundproofing as the inorganic fiber board, and from these purposes, the recesses forming the solidified portion are as small as possible. It is desirable to have a large scale and a large number.

However, while it is effective not only for the original purpose of the inorganic fiber board and for the purpose of preventing the peeling phenomenon, there are also unfavorable aspects.

Although this differs depending on the use as an inorganic fiber board, it is a surface having a large number of small-diameter holes or strip-shaped recesses.

In order to solve these unreasonable surfaces formed, in the present application, the formed recess is filled with a substance similar to that of the main body, or a surface layer material covering the recess is attached or both of the above are applied. This can be solved by the uniting means of.

[0034]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the present invention will be described with reference to the drawings. FIGS. 1 to 5 show a molding die 10 used for molding the inorganic fiber board of the present invention. The two molds, the upper mold 10a and the lower mold 10b, form one unit mold.

FIG. 1 shows a projecting die 10c projecting from the upper die 10a toward the lower die 10b.

FIG. 2 shows a projecting die 10c which is oriented toward the upper die 10a rather than the lower die 10b.

In FIG. 3, the protrusion mold 10 is located at a position where the tips of the upper mold 10a and the lower mold 10b are opposed to each other.
c and 10c are those provided in a convex shape.

4 and 5 show a small-diameter hole 3 described later.
FIG. 3 is an explanatory view of a small-diameter hole projection 10 d in which 1 is drilled.

As shown in FIG. 6, the inorganic fiber raw material 1 to be supplied to the molding die 10 is produced in a state in which the thin layer 1a is close to a single layer when the inorganic fiber raw material 1 is produced.

In the form of the inorganic fiber board to be produced, that is, in the standard area, the usage amount of the inorganic fiber raw material 1 is determined by the finished thickness dimension and the density, and an appropriate amount of the adhesive is added to this. Then, the determined usage amount is laminated with a set area, and the thin layer 1a shown in FIG.
Like 1b and 1c, they are stacked like multiple layers,
This is used for the molding die 10 described above.

As shown in FIG. 1, the molding die 10 is vertically contacted and separated (all the same in FIGS. 2 to 5).
The gap h is to be the finished thickness dimension of the inorganic fiber board to be molded, and the thickness h of the inorganic fiber raw material 1 to be provided is several times to several tens of times the size. ..

The height h1 of the projection die 10c of the pressing convex portion provided on the molding die 10 is calculated from the size of the gap h to the compression dimension h.
With the dimensions other than 2, the compression dimension h2 is arbitrarily set, and when the two protrusion molds 10c and 10c are opposed to each other as shown in FIG. 3, the sum of these two heights is the h1 dimension. It will be.

Also, the small-diameter hole projection 10d, which is raised from the tip surface of the projection mold 10c shown in FIGS. 4 and 5 from the surface of another mold facing the tip surface, is formed at the same time as the compression molding of the solidified portion 2. It is used when a small-diameter hole 31 is to be bored, and this is also optional for post-perforation formation by other means in the recess 3 formed to form the consolidation portion 2 as described later. The present invention is not limited to the indispensable additional configuration of the small-diameter hole projection 10d.

As described above, the upper mold 10 is used as the basic mold.
a, the inorganic fiber raw material 1 is held in contact with the molding die 10 in combination with the lower die 10b, and the desired shape of the inorganic fiber board, that is, pressure based on thickness, density, temperature and processing time is used as a reference. Only slightly increase the pressure.

Inorganic fiber raw material 1 cast in molding die 10
Is molded as shown in FIGS.

That is, the inorganic fiber raw material 1 at the portion of the molding die 10 pressed by the projection die 10c is the projection die 10
The consolidated portion 2 is formed by being compressed at a higher density than the portion pressed by the molding die 10 where there is no c.

Since all the layers of the inorganic fiber raw material 1 supplied and installed are compressed to the compression dimension h2 to form the consolidated portion 2, the dimension is equal to the gap h between the upper mold 10a and the lower mold 10b. Although the pressing force is increased more than the pressure required to form the set thickness dimension H, the numerical value of the compression force cannot be limited here because the amount of the raw material to be supplied is not constant.

The solidified portion 2 formed in this manner has a position in which one surface thereof is flush with one surface of the molded inorganic fiber board A, and a case in which the positions are alternated on both surfaces so as to have a zigzag cross section. And the intermediate layer position so that the outer surface of the solidified portion 2 projects from the flat surface portion of the non-solidified portion 6, and further the solidified portion 2 Is formed as shown in each drawing, such as by providing the edge portion of the molded inorganic fiber board A.

Since the solidified portion 2 is formed by compressing all layers of the inorganic fiber raw material 1 supplied and installed as described above, the recess 3 is necessarily formed at the place where the solidified portion 2 is formed.
Will be formed.

In addition, a small diameter hole 3 is formed in the molded consolidation portion 2.
1 is provided in a recessed or penetrating manner, and the adhesive 4 is additionally added to the small diameter hole 31, the voids due to the fine diameter holes and the like in the solidified portion 2 provided with the small diameter hole 31 and the solidified portion 2 The adhesive 4 can be impregnated up to the adjacent area where is formed to form a stronger solidified portion 2.

Since the solidified portion 2 itself molded as described above is compressed at a higher density than the non-solidified portion 6, the main purpose as an inorganic fiber board is to obtain the effect of heat insulation and soundproofing. In that respect, although the efficiency thereof is reduced, due to the use of this inorganic fiber board due to the recesses 3 necessarily formed by the constitution of the consolidation portion 2, in the result of using this inorganic fiber board, a new formation of voids causes a high-density consolidation. It is possible to make up more than the minus degree by the part 2.

However, when the formed recesses 3 hinder the appearance due to use, the surface layer material 5 for concealing the openings of the recesses 3 is applied or adhered.

Depending on the case where these surface layer materials 5 are attached,
The shape is not constant depending on the adhesive 5 used,
A part thereof is also impregnated in the solidified portion 2 to make it even stronger.

In this way, the hollowed cavity 3 formed by applying the surface layer material 5 to the surface may optionally be filled with inorganic fibers of the same series as the matrix as shown in FIG. Is.

The above-mentioned configuration of the solidified portion 2 is formed in a suitable manner in a suitable manner as shown in the figure, such as a dot shape or a linear shape. For example, in the case of a dot shape, one side or It has a square or circular shape with a diameter of about 3 mm to 6 mm, and in the case of a linear shape, its width dimension is about 3 mm to 6 mm, and the gap dimension between these adjacent is about 50 mm to 100 mm. To do.

The solidified portion 2 may be formed by projecting outward from the flat surface portion of the non-solidified portion 6.

Then, the surface layer material 5 is attached to the top surface of each of the protrusion-molded solidified portions 2, and an air layer 7 is formed between the surface of the surface layer material 5 and the non-solidified portion 6 to provide heat insulation and sound insulation. It is more effective in line with the original purpose of the homomolded inorganic fiber board A.

The solidified portion 2 molded as described above is
Of course, the flat portion of the molded inorganic fiber board A can be formed at the edge portion as well, so that the cause of the delamination phenomenon can be prevented, which is more effective.

Further, in the figure, reference numeral 1d indicates a stacking interface forming a layered structure of the molded inorganic fiber board.

[0060]

EFFECTS OF THE INVENTION The constituent means of the solidified portion, which is provided to prevent the peeling phenomenon between the plate layers during the use as the inorganic fiber for the purpose, is high density in the pressing step during the plate structure. By making it possible to simultaneously mold the partially consolidated portions, the molding means can be simplified.

The recesses that are necessarily formed during the molding of these high-density solidified portions have the effect of further promoting heat insulation, soundproofing, etc., which are the main purposes of the inorganic fiber board.

Further, according to the purpose of use, the solidified portion formed and the recess formed for molding the solidified portion are attached with an adhesive in a simple post-process, and the recess is filled. In addition, it is possible to easily attach or apply the surface layer material, and it is possible to obtain the appearance and rigidity as an inorganic fiber body, and it is also effective as an interior material.

[0063]

[Brief description of drawings]

1 is a partial sectional view of a molding die showing a state in which a protrusion die is provided on an upper die, and FIG. 2 is a partial sectional view of a molding die showing a state in which a protrusion die is provided on a lower die. Is a partial cross-sectional view of a molding die in which a projection die is provided so as to project from an upper die and a lower die. FIG. FIG. 6 is a partial cross-sectional view of a molding die having a small-diameter hole projection on the surface opposite to the projection-type tip surface, and FIG. 7 to 11 are partial cross-sectional views of the inorganic fiber board showing the opened state of the concave portion having the solidified portion at the bottom.
Is opened on one side, FIG. 8 is opened on both sides in a zigzag manner, and FIG. 9 is formed by a recess formed on both sides of one solidified portion located in the intermediate layer. FIG. 10 is a diagram in which a small-diameter hole is formed in the solidified portion and is filled with an adhesive, and FIG. 11 is a diagram in which a recess is filled with an inorganic fiber, FIG.
2 is a partial perspective view of the inorganic fiber board, FIG. 13 is a sectional view in which a surface layer material is attached to one surface of the inorganic fiber board, and FIG. 14 is a sectional view in which the surface layer material is attached to both surfaces of the inorganic fiber board. Figure 15
FIG. 16 is a partial cross-sectional view of an inorganic fiber board in which the outer surface of the solidified portion is projected outward from the flat portion of the non-solidified portion, and FIG. FIG. 17 is a partial cross-sectional view of an inorganic fiber board in which a surface layer material is attached to the top of the outer surface, and FIG.

[0064]

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Inorganic fiber raw material 1a Thin layer 2 Consolidation part 3 Recesses 31 Small diameter hole 4 Adhesive 5 Surface layer material 6 Non-consolidation part 7 Air layer A Molded inorganic fiber board

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Claims (13)

[Claims] 1. An inorganic fiber material which is uncured and to which an appropriate amount of an adhesive has been added, has a plurality of solidified portions formed on a small scale through an appropriately set gap at the time of heat and pressure molding. An inorganic material characterized in that it is formed by stronger consolidation than the non-consolidated portion, and the consolidated portion at the bottom of the recess formed by forming the consolidated portion has a higher density than the non-consolidated portion. A method for constructing a delamination prevention part in a fiberboard. 2. An uncured inorganic fiber material to which an appropriate amount of an adhesive has been added, at the time of heat-press molding of the inorganic fiber material, a small-scale and a plurality of solidified portions are formed through an appropriately set gap. It is formed by stronger consolidation than the non-consolidated part, and the consolidated part at the bottom of the recess formed by this consolidated part formation has a higher density than the non-consolidated part. A method for forming a delamination prevention part in an inorganic fiber board, characterized in that a small diameter hole is provided in the consolidated part, an adhesive is separately filled, and the adhesive is cured. 3. An inorganic fiber material, which is uncured and to which an appropriate amount of an adhesive has been added, has a plurality of solidified portions formed on a small scale through an appropriately set gap during heat-press molding. The consolidation portion is formed by stronger consolidation than the non-consolidation portion, and the consolidation portion at the bottom of the recess formed by forming the consolidation portion has a higher density than the non-consolidation portion, and the consolidation portion In the inorganic fiber board, an adhesive agent is separately added to the high-density portion of, and a hard portion is formed by the adhesive agent added to the non-consolidated portion adjacent to the high-density portion and the periphery thereof. How to configure the peeling prevention part. 4. The opening of a plurality of recesses formed so that the consolidated portion becomes a high-density portion is formed so as to open on one surface of the inorganic fiber board to be molded. 1. A method for forming an interlaminar peeling prevention portion in an inorganic fiber board according to 1, 2, or 3. 5. The consolidation part is formed as a high density part, and the openings of the plurality of recesses are formed so as to open on both sides of the inorganic fiber board to be molded. ,
4. The method for forming a delamination prevention part in the inorganic fiber board according to item 3. 6. The outer surface of the solidified portion at the bottom of the plurality of recesses formed so as to form the high density portion is formed flush with the flat portion of the non-solidified portion. 1. A method for forming an interlaminar peeling prevention portion in an inorganic fiber board according to 1, 2, or 3. 7. The outer surface of the solidified portion at the bottom of the plurality of recesses formed so as to form the high-density portion is formed by further projecting outward from the flat portion of the non-solidified portion. A method for constructing a delamination preventing portion in the inorganic fiber board according to claim 1, 2, 3, 4, 5. 8. At a position where the thickness directions of the front and back plane portions of the inorganic fiber board are unified, the both sides of the inorganic fiber board are strongly consolidated.
The high density portion which is the bottom of each recess formed by this strong consolidation process is a solidified portion, and the solidified portion is formed at the same position as the intermediate position in the thickness direction of the non-solidified portion. The method for constructing a delamination preventive portion in the inorganic fiber board according to claim 1, 2, or 3. 9. A plurality of recesses formed so that the solidified portion becomes a high-density portion is filled with an inorganic fiber material to which an appropriate amount of an adhesive is separately added to assimilate with an adjacent non-solidified portion. Molding so as to
4, 5, 6, 7, and 8, the method for constructing the delamination prevention part in the inorganic fiber board. 10. The consolidated portion by the impregnation action of an adhesive used to adhere the surface layer material to the surface of the consolidated portion of the high density portion formed by strong consolidation that is flush with the plane of the non-consolidated portion. The method for constructing an interlayer delamination prevention part in an inorganic fiber board according to claim 1, 2, 4, 6, 9 characterized in that it can be further strengthened. 11. An opening of a recess formed by strong consolidation for forming a solidified portion is closed, and a surface layer material is formed on the same surface as the surface having the opening of the recessed portion in the non-solidified portion. The structure of the delamination prevention part in an inorganic fiber board according to claim 1, 2, 3, 4, 5, 6, 7, or 8, characterized in that it is formed by adhering to form a smooth surface in which no recessed hole is opened. Method. 12. A surface layer material is adhered to the outer surface of each consolidating part formed by projecting the top surface from the flat part of the non-consolidating part, and an air layer is formed between the inner surface of the surface layer material and the outer surface of the non-consolidating part. The method for constructing an interlayer delamination prevention part in an inorganic fiber board according to claim 7, characterized in that: 13. The method according to claim 1, wherein the solidified portion is formed at the edge of the inorganic fiber board to be formed.
4, 5, 6, 7, 8, 9, 10, 11, 12, the method for constructing the delamination prevention part in the inorganic fiber board.