JPH05270182A - Ic card - Google Patents

Ic card

Info

Publication number
JPH05270182A
JPH05270182A JP3077454A JP7745491A JPH05270182A JP H05270182 A JPH05270182 A JP H05270182A JP 3077454 A JP3077454 A JP 3077454A JP 7745491 A JP7745491 A JP 7745491A JP H05270182 A JPH05270182 A JP H05270182A
Authority
JP
Japan
Prior art keywords
card
electric circuit
parts
loading
capacity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3077454A
Other languages
Japanese (ja)
Inventor
Kiyotaka Nishino
清隆 西野
Shigeo Onoda
重雄 小野田
Takao Okidono
貴朗 沖殿
Eitaro Nagai
英太郎 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ryoden Kasei Co Ltd
Mitsubishi Electric Corp
Original Assignee
Ryoden Kasei Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ryoden Kasei Co Ltd, Mitsubishi Electric Corp filed Critical Ryoden Kasei Co Ltd
Priority to JP3077454A priority Critical patent/JPH05270182A/en
Publication of JPH05270182A publication Critical patent/JPH05270182A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

PURPOSE:To increase the area of the loading of parts and to augment capacity though the area of the loading of parts is limited because only one substrate for an electric circuit is used in a conventional IC card. CONSTITUTION:Substrates 3a, 3b for an electric circuit incorporated into an IC card are arranged in parallel at vertical two steps, and electronic parts 2 are mounted onto both surfaces of each substrate, thus increasing the number of loading parts, then attaining the augmentation of capacity.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】この発明は、ＩＣカードの内部構
造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the internal structure of an IC card.

【０００２】[0002]

【従来の技術】図２はＩＣカードの斜視図、図３は従来
のＩＣカードの部分断面図（図２のＡ−Ａ断面）であ
り、図において、１はＩＣカード、２はＩＣ（電子部
品）、３は電気回路用基板である。なお断面図において
は、パネル及びフレーム部分は省略している。2. Description of the Related Art FIG. 2 is a perspective view of an IC card, and FIG. 3 is a partial sectional view of the conventional IC card (section AA in FIG. 2). Parts 3 are electric circuit boards. In addition, in the cross-sectional view, the panel and the frame portion are omitted.

【０００３】従来のＩＣカードにおいては、ＩＣカード
の厚み方向中心に電気回路用基板３を設置し、部品搭載
面積を増やすために基板両面（上下）にＩＣ２およびそ
の他の部品を搭載しており、それによってカード容量を
増加させていた。In the conventional IC card, the electric circuit board 3 is installed at the center of the IC card in the thickness direction, and the IC 2 and other parts are mounted on both sides (upper and lower) of the board in order to increase the parts mounting area. This increased the card capacity.

【０００４】[0004]

【発明が解決しようとする課題】従来のＩＣカードは以
上のように構成されており、カード内のスペース上、電
気回路用基板３を１枚しか使用できず、部品搭載面積が
限られ、これによって搭載部品数が限界となり、カード
の容量アップに支障をきたすという問題点があった。The conventional IC card is constructed as described above, and only one electric circuit board 3 can be used due to the space inside the card, and the component mounting area is limited. As a result, the number of mounted components becomes the limit, which hinders the increase of the card capacity.

【０００５】この発明は、上記のような問題点を解消す
るためになされたもので、電気回路用基板をもう１枚追
加し部品搭載面積を増やすことによって、搭載部品数を
増加し、カードの容量アップを図ることを目的とする。The present invention has been made in order to solve the above problems, and increases the number of parts to be mounted by increasing the number of parts to be mounted by adding another electric circuit board and increasing the parts mounting area. The purpose is to increase the capacity.

【０００６】[0006]

【課題を解決するための手段】この発明に係るＩＣカー
ドは、ＩＣを搭載した電気回路用基板を上下２段の内部
構造としたものである。In the IC card according to the present invention, an electric circuit board on which an IC is mounted has an upper and lower two-stage internal structure.

【０００７】[0007]

【作用】この発明におけるＩＣカードは、ＩＣカード内
部に２枚の電気回路用基板を用いることにより、部品実
装面積を２倍に広げることができる。The IC card according to the present invention can double the component mounting area by using two electric circuit boards inside the IC card.

【０００８】[0008]

【実施例】図１はこの発明の一実施例を示すもので、図
において、３ａ，３ｂはＩＣカードの内部に上下２段に
並行に配置された電気回路用基板であり、その各々の両
面にＩＣ２が実装されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment of the present invention. In the drawing, 3a and 3b are electric circuit boards which are arranged in parallel vertically in two stages inside an IC card. IC2 is mounted on.

【０００９】上記のような内部構造をもつＩＣカードで
は、両面に部品を実装した電気回路用基板３を２段に重
ねることで、部品搭載面積を広げて、搭載部品数を大幅
に増やすことが可能となる。In the IC card having the internal structure as described above, by stacking the electric circuit boards 3 having components mounted on both sides in two stages, the component mounting area can be expanded and the number of mounted components can be greatly increased. It will be possible.

【００１０】[0010]

【発明の効果】以上のようにこの発明によれば、電気回
路用基板を２段重ねた構造にしたので、実装部品点数を
増やすことができ、カード容量の増加につながる効果が
ある。また従来品よりも薄いＩＣを使うことによって、
カードとしての厚みも従来のカードとほぼ同等とするこ
とができる。As described above, according to the present invention, since the electric circuit boards are stacked in two stages, it is possible to increase the number of mounted components and increase the card capacity. Also, by using an IC that is thinner than conventional products,
The thickness of the card can be made almost the same as that of the conventional card.

【図面の簡単な説明】[Brief description of drawings]

【図１】この発明の一実施例によるＩＣカード内部の部
分断面図である。FIG. 1 is a partial cross-sectional view of the inside of an IC card according to an embodiment of the present invention.

【図２】ＩＣカートの斜視図である。FIG. 2 is a perspective view of an IC cart.

【図３】従来のＩＣカードの部分断面図である。FIG. 3 is a partial cross-sectional view of a conventional IC card.

【符号の説明】[Explanation of symbols]

１ ＩＣカード ２ ＩＣ（電子部品） ３ａ，３ｂ 電気回路用基板 1 IC card 2 IC (electronic parts) 3a, 3b Electric circuit board

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 23/50 Ｗ 9272−4Ｍ 25/10 25/11 25/18 (72)発明者 小野田 重雄 伊丹市瑞原４丁目１番地 三菱電機株式会 社北伊丹製作所内 (72)発明者 沖殿 貴朗 兵庫県川西市久代３丁目13番21号 株式会 社ケーディーエル内 (72)発明者 永井 英太郎 兵庫県川西市久代３丁目13番21号 株式会 社ケーディーエル内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number within the agency FI Technical indication location H01L 23/50 W 9272-4M 25/10 25/11 25/18 (72) Inventor Shigeo Onoda Itami Mizuhohara, Ichigo 4-chome, Kita Itami Works, Mitsubishi Electric Co., Ltd. (72) Inventor, Takaro Okino, 3-13-21, Hisayo, Kawanishi-shi, Hyogo Prefecture, K-D Co., Ltd. (72) Inventor, Eitaro Nagai, Kawanishi, Hyogo Prefecture 3-13-21 Ichikusyo, KDE Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 電子部品を搭載した電気回路用基板を内
蔵したＩＣカードにおいて、上記電気回路用基板をＩＣ
カードの厚み方向に上下２枚並行に配置し、その各々の
両面に電子部品を実装したことを特徴とするＩＣカー
ド。1. An IC card having a built-in electric circuit board on which electronic parts are mounted, wherein the electric circuit board is an IC
An IC card characterized in that two upper and lower parts are arranged in parallel in the thickness direction of the card, and electronic parts are mounted on both sides of each.
JP3077454A 1991-04-10 1991-04-10 Ic card Pending JPH05270182A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3077454A JPH05270182A (en) 1991-04-10 1991-04-10 Ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3077454A JPH05270182A (en) 1991-04-10 1991-04-10 Ic card

Publications (1)

Publication Number Publication Date
JPH05270182A true JPH05270182A (en) 1993-10-19

Family

ID=13634462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3077454A Pending JPH05270182A (en) 1991-04-10 1991-04-10 Ic card

Country Status (1)

Country Link
JP (1) JPH05270182A (en)

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