JPH0527012Y2 - - Google Patents
Info
- Publication number
- JPH0527012Y2 JPH0527012Y2 JP723187U JP723187U JPH0527012Y2 JP H0527012 Y2 JPH0527012 Y2 JP H0527012Y2 JP 723187 U JP723187 U JP 723187U JP 723187 U JP723187 U JP 723187U JP H0527012 Y2 JPH0527012 Y2 JP H0527012Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed
- copper wire
- printed circuit
- circuit board
- comb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000007787 solid Substances 0.000 claims description 7
- 229910001369 Brass Inorganic materials 0.000 claims description 6
- 239000010951 brass Substances 0.000 claims description 6
- 229920005668 polycarbonate resin Polymers 0.000 claims description 6
- 239000004431 polycarbonate resin Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- -1 ferrous metals Chemical class 0.000 claims 1
- 238000011835 investigation Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 239000000428 dust Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
Landscapes
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
- Tests Of Electronic Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、電子機器が設置される場所の環境の
良否を調査する装置に係り、特にプリント基板お
よび実装部品の腐蝕に対する影響を評価する設置
環境調査用プリント基板に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a device for investigating the quality of the environment in a place where electronic equipment is installed, and in particular, an installation for evaluating the influence on corrosion of printed circuit boards and mounted components. Regarding printed circuit boards for environmental research.
（従来の技術）
工業用制御機器等の電子機器は、フイールドに
設置されるので、厳しい環境で使用されると共
に、この様な環境であつても動作の信頼性は高く
なければならない。(Prior Art) Electronic equipment such as industrial control equipment is installed in the field and is therefore used in harsh environments, and must have high operational reliability even in such environments.
プリント基板に好ましくない影響を与える腐蝕
性物質として、例えば硫化系、アンモニア系、塩
素系のガスや、高温低温などの温度、高湿度、塵
や埃等がある。 Corrosive substances that have an unfavorable effect on printed circuit boards include, for example, sulfide-based, ammonia-based, and chlorine-based gases, high and low temperatures, high humidity, dust, and the like.
これらの値は、ガス検知管・温湿度計や塵埃測
定器によりもとめている。 These values are obtained using gas detection tubes, temperature/hygrometers, and dust measuring instruments.
（考案が解決しようとする問題点）
しかしながら、電子機器に対する腐蝕の影響は
ガス濃度Ｃ、温度Ｔ、湿度Ｈ、塵埃量Ｋや時間ｔ
で異なつている。(Problem that the invention aims to solve) However, the effects of corrosion on electronic equipment include gas concentration C, temperature T, humidity H, dust amount K, and time t.
It's different.
そこで、これらの変数を単独で測定しても実際
のプリント基板に対する影響は複合的でよくわか
らないという問題点がある。すなわち、腐蝕量Ｅ
はつぎの関数ｆで与えられる。 Therefore, there is a problem in that even if these variables are measured individually, the effects on the actual printed circuit board are complex and unclear. In other words, the amount of corrosion E
is given by the following function f.
Ｅ＝∫f（Ｃ，Ｔ，Ｈ，Ｋ）dt
本考案はこのような問題点を解決したもので、
設置環境を実機に近い形で短時間に総合的に調査
するのに適したプリント基板を提供することを目
的とする。 E=∫f(C,T,H,K)dt This invention solves these problems,
The purpose is to provide a printed circuit board suitable for comprehensively investigating the installation environment in a short time in a manner similar to the actual machine.
（問題点を解決するための手段）
このような目的を達成する本考案は、コーテイ
ングおよびソルダレジストの施されていない櫛型
の印刷銅線と、この印刷銅線に電圧を印加する直
流電源と、次の構成要素〜の少なくとも一つ
を具備することを特徴とするものである。(Means for Solving the Problems) The present invention that achieves the above purpose uses a comb-shaped printed copper wire that is not coated or solder resisted, and a DC power supply that applies voltage to the printed copper wire. It is characterized by comprising at least one of the following components.
アンモニアガスを評価するための、黄銅また
はポリカーボネート樹脂よりなる部品。 A component made of brass or polycarbonate resin for evaluating ammonia gas.
硫化系ガスを評価するための、銅または銀よ
りなるベタ印刷パターン。 A solid printing pattern made of copper or silver for evaluating sulfide gases.
塩素系ガスを評価するための、鉄系金属より
なる部品。 Parts made of iron-based metal for evaluating chlorine-based gases.
前記櫛型の印刷銅線またはベタ印刷パターン
と比較するための、コーテイングまたはソルダ
レジストの少なくとも一方が施された参照用印
刷パターン。 A reference printed pattern coated with at least one of a coating and a solder resist for comparison with the comb-shaped printed copper wire or solid printed pattern.
（作用）
本考案の各構成要素はつぎの作用をする。櫛型
の印刷銅線は温湿度による酸化・絶縁劣化および
塵埃による絶縁劣化を評価する。直流電源は、櫛
型の印刷銅線の絶縁劣化促進のために印加してい
る。(Function) Each component of the present invention has the following function. The comb-shaped printed copper wire is evaluated for oxidation and insulation deterioration due to temperature and humidity as well as insulation deterioration due to dust. DC power is applied to accelerate insulation deterioration of the comb-shaped printed copper wire.
（実施例） 以下図面を用いて、本考案を説明する。(Example) The present invention will be explained below using the drawings.
図は、本考案の一実施例を示す構成斜視図であ
る。図において、１はプリント基板で、ガラスエ
ポキシ基板やベークライトが使用される。 The figure is a perspective view showing an embodiment of the present invention. In the figure, 1 is a printed circuit board, and a glass epoxy board or Bakelite is used.
１０はコーテイングおよびソルダレジストの施
されていない櫛型の印刷銅線で、櫛型にして抵抗
測定および絶縁度測定を容易にしている。１１は
印刷銅線１０を横断するように僅かの間隔でプリ
ント基板１に取り付けられた抵抗である。 Reference numeral 10 denotes a comb-shaped printed copper wire without coating or solder resist, which is shaped like a comb to facilitate resistance and insulation measurements. 11 is a resistor attached to the printed circuit board 1 at a slight interval so as to cross the printed copper wire 10.
２０は印刷銅線１０に電圧を印加する直流電源
で、例えばマンガン乾電池が使用され、印刷銅線
１０の劣化を電気化学的に促進している。２１は
直流電源２０が印刷銅線１０に印加する電流を制
限する抵抗である。 Reference numeral 20 denotes a DC power supply that applies a voltage to the printed copper wire 10, for example, a manganese dry battery is used, and the deterioration of the printed copper wire 10 is electrochemically promoted. 21 is a resistor that limits the current applied to the printed copper wire 10 by the DC power supply 20.
３０はアンモニアガスを評価するための、黄銅
またはポリカーボネート樹脂よりなる部品、３１
は内部にヒユーズを有するヒユーズホルダで、窓
にはポリカーボネート樹脂が使用してある。３２
は変形させて応力の加えてある黄銅線である。 30 is a component made of brass or polycarbonate resin for evaluating ammonia gas, 31
is a fuse holder with a fuse inside, and the window is made of polycarbonate resin. 32
is a brass wire that has been deformed and stressed.
４０は銀を接点に使用したスイツチ、４１は金
を接点に使用したスイツチで、スイツチ４０の銀
が劣化したことと比較するため設けてある。 40 is a switch using silver as a contact, and 41 is a switch using gold as a contact, which are provided for comparison with the deterioration of the silver in switch 40.
５０はICのカンパツケージで、ニツケルコバ
ール等の鉄系金属が使用してある。 50 is the IC camping cage, which is made of iron-based metal such as Nickel Kovar.
６０は、銅または銀よりなるベタ印刷パター
ン、６１はコーテイングまたはソルダレジストの
施された参照用印刷パターンで、ベタ印刷パター
ン６０と比較して劣化に対する保護の効果などを
確認する。 60 is a solid print pattern made of copper or silver, and 61 is a reference print pattern coated or coated with a solder resist, which is compared with the solid print pattern 60 to confirm the effect of protection against deterioration.
７０は金１号合金を接点に使用した開放型のス
イツチで、接点圧力の小さいものを選んでいる。
ここに金１号合金は、金65％銀25％残部白金とす
るものである。 70 is an open type switch that uses Gold No. 1 alloy for the contacts, and has been selected to have low contact pressure.
Here, Gold No. 1 alloy is 65% gold, 25% silver, and the balance is platinum.
このように構成された装置の環境による影響を
次に説明する。 The influence of the environment on the device configured in this way will be explained below.
印刷銅線１０は、温湿度による絶縁抵抗の低
下、抵抗１１との隙間に滞積する塵埃による絶縁
抵抗の低下を測定する。さらに印刷銅線１０の間
で成長する樹枝状結晶（マイグレーシヨンの一
種）によるパターンの短絡の発生により、硫化系
ガス、温湿度、電圧印加の影響を見る。 The reduction in insulation resistance of the printed copper wire 10 due to temperature and humidity and the reduction in insulation resistance due to dust accumulated in the gap between the printed copper wire 10 and the resistor 11 are measured. Furthermore, the effects of sulfide-based gas, temperature, humidity, and voltage application are examined due to the occurrence of short circuits in the pattern due to dendrites (a type of migration) that grow between the printed copper wires 10.
ヒユーズホルダ３１は、アンモニアガスがある
とポリカーボネート樹脂が白濁するので、これを
目安とする。 For the fuse holder 31, polycarbonate resin becomes cloudy when ammonia gas is present, so this should be used as a guide.
黄銅線３２は、アンモニアガスがあると変色し
て応力腐蝕割れを起こす。 The brass wire 32 will change color and cause stress corrosion cracking if ammonia gas is present.
スイツチ４０，４１は、硫化水素や二酸化イオ
ウなどの硫化系ガスと反応して接触抵抗が増大
し、ついには導通がなくなり動作不良となる。 The switches 40 and 41 react with sulfide-based gases such as hydrogen sulfide and sulfur dioxide, and their contact resistance increases, eventually resulting in loss of continuity and malfunction.
カンパツケージ５０は、塩素ガスによる腐蝕を
受け、内部で保護されている電子回路に好ましく
ない影響を与える。 The camp cage 50 is subject to corrosion by chlorine gas, which has an undesirable effect on the electronic circuitry protected inside.
ベタ印刷パターン６０は硫化系ガスによる腐
蝕・浸蝕の度合いを測定するもので、好ましくは
深さ方向の影響が測定できるような厚みがあると
よい。 The solid print pattern 60 is used to measure the degree of corrosion/erosion caused by sulfide gas, and preferably has a thickness that allows the influence in the depth direction to be measured.
スイツチ７０は硫化水素や二酸化イオウなどの
硫化系ガスの影響はもとより、開放型なので塵埃
などの混入による導通不良も検出できる。 Since the switch 70 is an open type, it can detect not only the effects of sulfide-based gases such as hydrogen sulfide and sulfur dioxide, but also conduction failures caused by contamination with dust and the like.
尚、これらの各要素は適宜省略してもよく、例
えば塩素ガスのないことが明らかな環境ではカン
パツケージ５０を省略してよい。 Note that each of these elements may be omitted as appropriate; for example, in an environment where it is clear that there is no chlorine gas, the camp cage 50 may be omitted.
（考案の効果）
以上説明したように本考案によれば、次の効果
がある。(Effects of the invention) As explained above, the invention has the following effects.
環境の影響を受けやすい材料で構成されたも
のをプリント基板に搭載して使用しているの
で、電子機器への影響を短時間で総合的に評価
できる。 Since the printed circuit board is made of materials that are easily affected by the environment, it is possible to comprehensively assess the impact on electronic equipment in a short period of time.
実施例のように、電子機器に使用される部品
を用いて環境の影響を受けやすい材料をプリン
ト基板に搭載すると、安価に製造することがで
きる。 As in the embodiment, if materials that are easily affected by the environment are mounted on the printed circuit board using parts used in electronic devices, manufacturing can be done at low cost.
図は、本考案の一実施例を示す構成斜視図であ
る。
１……プリント基板、１０……印刷銅線、２０
……直流電源、３１……ポリカーボネート樹脂、
３２……黄銅線、４０，４１，７０……スイツ
チ、５０……カンパツケージ、６０……ベタ印刷
パターン、６１……参照用印刷パターン。
The figure is a perspective view showing an embodiment of the present invention. 1... Printed circuit board, 10... Printed copper wire, 20
...DC power supply, 31...polycarbonate resin,
32... Brass wire, 40, 41, 70... Switch, 50... Camper cage, 60... Solid print pattern, 61... Reference print pattern.
Claims (1)
いない櫛型の印刷銅線と、 この印刷銅線に電圧を印加する直流電源と、 次の構成要素〜の少なくとも一つを具備す
ることを特徴とする設置環境調査用プリント基
板。 黄銅またはポリカーボネート樹脂よりなる部
品。 銅または銀よりなるベタ印刷パターン。 鉄系金属よりなる部品。 コーテイングまたはソルダレジストの施され
た参照用印刷パターン。[Claims for Utility Model Registration] A comb-shaped printed copper wire without coating or solder resist, a DC power supply that applies voltage to the printed copper wire, and at least one of the following components. A printed circuit board for installation environment investigation, which is characterized by: Parts made of brass or polycarbonate resin. A solid printing pattern made of copper or silver. Parts made of ferrous metals. Reference printed pattern with coating or solder mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP723187U JPH0527012Y2 (en) | 1987-01-21 | 1987-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP723187U JPH0527012Y2 (en) | 1987-01-21 | 1987-01-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63115771U JPS63115771U (en) | 1988-07-26 |
| JPH0527012Y2 true JPH0527012Y2 (en) | 1993-07-08 |
Family
ID=30790492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP723187U Expired - Lifetime JPH0527012Y2 (en) | 1987-01-21 | 1987-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0527012Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5402528B2 (en) * | 2009-10-27 | 2014-01-29 | 富士通株式会社 | Printed circuit board and information processing apparatus |
-
1987
- 1987-01-21 JP JP723187U patent/JPH0527012Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63115771U (en) | 1988-07-26 |
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