JPH0526543Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to a semiconductor carrier used to sequentially feed semiconductors into a testing device when testing semiconductors.

[Prior Art] Next, the state of use of a semiconductor carrier will be explained with reference to FIG. In FIG. 2, 1 is a socket, 5 is a semiconductor, 7 is a base, 9a is a magazine, and 9b is a test device. Socket 1 and base 7 constitute a semiconductor carrier.

The magazine 9a is connected to the test device 9b, and semiconductor carriers are sequentially carried into the end portion 9c of the magazine 9a, and the semiconductors 5 are sent out to the test device 9b side.

Next, a cross-sectional view of a state in which a semiconductor is mounted on a semiconductor carrier will be explained with reference to FIGS. 3 and 4. When mounting the semiconductor 5 on the semiconductor carrier, the lead 5a of the semiconductor 5 is inserted into the hole 1a of the socket 1.
In order to prevent the semiconductor 5 from shifting,
The collar 5b of the semiconductor 5 is made to fit tightly into the recessed part of the base 7.

[Problem to be solved by the invention] The outer diameter of the semiconductor 4 shown in FIG. 3 is larger than the outer diameter of the semiconductor 6 shown in FIG. In this way, when semiconductors have different outer diameters, a base with a recess that fits the semiconductors is required. The purpose of this invention is to provide a semiconductor carrier that uses a common base by preparing adapters for semiconductors with different outer diameters.

[Means for Solving the Problem] In order to achieve this object, this invention includes a socket 1 having holes 1a for leads of a plurality of semiconductors having different outer diameters, and a semiconductor having the largest outer diameter among the semiconductors. a base 2 having a recess 2a with an inner diameter L2 larger than the outer diameter L1 of the base 2; The base 2 is fixed to the socket 1, the semiconductor lead is inserted into the hole 1a of the socket 1, and the adapter 3 has a hole that matches the outer diameter of the semiconductor.
covering the semiconductor.

[Function] Next, the structure of the semiconductor carrier according to this invention will be explained with reference to FIG. 1 in Figure 1 is a socket,
2 is a base, 3 is an adapter, and 4 is a semiconductor.
Socket 1 and base 2 constitute a semiconductor carrier.

The socket 1 has holes 1a for leads of a plurality of semiconductors having different outer diameters, and the base 2 is provided with a recess 2a having an inner diameter L2 larger than the outer diameter L1 of the semiconductor having the largest outer diameter among the semiconductors. . In addition, a plurality of adapters 3 having holes that respectively match the outer diameters of semiconductors having different outer diameters, each having an outer diameter of L2, and which are attached to the recess 2a of the base 2 are prepared.

Next, the relationship between the semiconductor and the adapter will be explained with reference to FIG. FIG. 5 shows an adapter 3a having a hole matching the outer diameter of the semiconductor 5 and an adapter 3b having a hole matching the outer diameter of the semiconductor 6.

Next, the assembled sectional view of FIG. 1 will be explained with reference to FIG. 6. In FIG. 6, the base 2 is fixed to the socket 1, and the leads of the semiconductor 4 are inserted into the hole 1a of the socket 1. Then, the semiconductor 4 is fixed to the base 2 by covering it with an adapter 3 having a hole that matches the outer diameter of the semiconductor 4.

FIG. 7 is an example of a mounting configuration diagram of the semiconductor carrier shown in FIG. 6. In FIG. 7, the adapter 3 is placed over the semiconductor 4, the semiconductor 4 is held down by the holding plate 11, and the holding plate 11 is fixed with the holding plate fixing knob 12.

[Effects of the invention] According to this invention, even if the semiconductors have different outside diameters, a plurality of adapters having holes that match the outside diameters of the semiconductors are prepared, so that the semiconductors can be mounted on a common base.

[Brief explanation of the drawing]

Figure 1 is a configuration diagram of the semiconductor carrier according to this invention, Figure 2 is an explanatory diagram of the usage state of the semiconductor carrier,
3 and 4 are configuration diagrams of a semiconductor carrier according to the prior art, FIG. 5 is an explanatory diagram of the relationship between the semiconductor and the adapter, FIG. 6 is an assembled sectional view of FIG. 1, and FIG.
FIG. 2 is a diagram showing an example of a mounting configuration diagram of the semiconductor carrier shown in the figure. 1...Socket, 2...Base, 3...Adapter, 4-6...Semiconductor, 7...Base, 8...Base, 9a...Magazine, 9b...Testing device, 9
c... end.

Claims (1)

[Claims for Utility Model Registration] A socket 1 having a first hole 1a for leads of a plurality of semiconductors having different outer diameters, and an inner diameter L2 larger than the outer diameter L1 of the semiconductor having the largest outer diameter among the semiconductors. a base 2 having a recess 2a; and a second hole that matches the outer diameter of the semiconductor having different outer diameters, the outer diameter being L2, and the recess 2a having an outer diameter L2;
a, the base 2 is fixed to the socket 1, the semiconductor lead is inserted into the hole 1a of the socket 1, and the adapter has a second hole that matches the outer diameter of the semiconductor. 3 over the semiconductor.