JPH05259024A - Positioning device - Google Patents
Positioning deviceInfo
- Publication number
- JPH05259024A JPH05259024A JP5339592A JP5339592A JPH05259024A JP H05259024 A JPH05259024 A JP H05259024A JP 5339592 A JP5339592 A JP 5339592A JP 5339592 A JP5339592 A JP 5339592A JP H05259024 A JPH05259024 A JP H05259024A
- Authority
- JP
- Japan
- Prior art keywords
- positioning device
- rigid
- wafer
- wafer chuck
- connecting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体素子製造のリソ
グラフィ工程で用いられる露光装置や描画装置に係わ
り、とくにその試料テ−ブルの位置を高精度に測定する
位置決め装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus and a drawing apparatus used in a lithography process for manufacturing a semiconductor element, and more particularly to a positioning apparatus for measuring the position of a sample table thereof with high accuracy.
【０００２】[0002]
【従来の技術】図７は従来の半導体素子製造用露光装置
や同描画装置等におけるウェ−ハなどの被処理物体の位
置決め装置の正面図である。テ−ブル３上には被処理物
体を保持するウエハチャック４がレ−ル６上を滑動可能
に載置され、ウエハチャック４は半導体ウエハ（被処理
物体）５を載置している。テ−ブル３の端部にはレ−ザ
ミラ−２が取付けられ干渉計９からのレ−ザ光を反射
し、干渉計９はその出射光と反射光を比較してレ−ザミ
ラ−２の位置を測定する。レ−ザミラ−２とウエハ５間
の距離Ｌが固定されるので、上記レ−ザミラ−２の位置
からウエハ５の位置が決められる。また、多くの場合上
記テ−ブル３はＸ方向とＹ方向の２軸方向に移動できる
ようになっている。2. Description of the Related Art FIG. 7 is a front view of a conventional apparatus for aligning an object to be processed such as a wafer in an exposure apparatus for manufacturing a semiconductor element, the same drawing apparatus and the like. A wafer chuck 4 holding an object to be processed is slidably mounted on a table 6 on a table 3, and a semiconductor wafer (object to be processed) 5 is mounted on the wafer chuck 4. A laser mirror-2 is attached to the end of the table 3 and reflects the laser light from the interferometer 9. The interferometer 9 compares the emitted light with the reflected light and the laser mirror-2 Measure the position. Since the distance L between the laser mirror-2 and the wafer 5 is fixed, the position of the wafer 5 is determined from the position of the laser mirror-2. In many cases, the table 3 can be moved in two axial directions of the X direction and the Y direction.
【０００３】[0003]
【発明が解決しようとする課題】上記従来装置において
は、レ−ザミラ−２がテ−ブル３の熱膨張や、レ−ル６
の平面度誤差、弾性変形等により変位してその反射面の
向きが変化し、最悪の場合にはレ−ザミラ−２からの反
射光が干渉計に入射しないという問題があった。また、
上記弾性変形はテ−ブル３に作用する駆動力により変化
するので、定量的に把握しにくいことも問題であった。
上記レ−ザミラ−２の反射面の水平方向位置変動に対し
ては構成部材の熱膨張係数を小さくする事によりある程
度は改善できるものの、弾性変形に反射面の向きの変動
に対しては部材の剛性を高くするとその重量が非現実的
に増大することが問題であった。In the above conventional apparatus, the laser miller-2 is used for thermal expansion of the table 3 and the rail 6 is used.
However, there is a problem that the direction of the reflecting surface changes due to displacement due to the flatness error, elastic deformation, etc., and in the worst case, the reflected light from the laser mirror-2 does not enter the interferometer. Also,
Since the elastic deformation is changed by the driving force acting on the table 3, it is difficult to quantitatively grasp the problem.
The horizontal position variation of the reflection surface of the laser mirror-2 can be improved to some extent by reducing the coefficient of thermal expansion of the constituent members, but elastic deformation causes variation of the direction of the reflection surface of the member. It has been a problem that the weight increases unrealistically when the rigidity is increased.
【０００４】また、ウエハ距離Ｌを縮めれば上記ウエハ
の位置決め誤差を短縮できるのであるが、レ−ザミラ−
２とウエハ５間にはウエハの位置決め用マ−クや同マ−
クからの反射電子検出器等が配置されるので、距離Ｌの
短縮も困難であった。本発明の目的は、上記レ−ザミラ
−２の反射面の向きの変動を除去し、さらに距離Ｌの変
動も低減することのできる位置決め装置を提供すること
にある。Further, if the wafer distance L is shortened, the above wafer positioning error can be shortened.
Between the wafer 2 and the wafer 5 is a wafer positioning mark or the same marker.
It is also difficult to shorten the distance L because a backscattered electron detector and the like are disposed. An object of the present invention is to provide a positioning device that can eliminate the variation in the direction of the reflecting surface of the laser mirror-2 and can reduce the variation in the distance L.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に、上記レ−ザ干渉測長器のレ−ザミラ−と上記ウエハ
チャック間を、上記ウエハチャックの移動方向（水平方
向）に対して直角方向（垂直方向）のみに変位可能な４
節リンク機構を備えた連結部材により連結するようにす
る。また上記連結部材を、両端部の剛性部材と、上記二
つの剛性部材間を連結する２枚の剛性板材と、上記剛性
部材と剛性板材のそれぞれの端部を連結する弾性ヒンジ
部とにより構成するようにする。In order to solve the above-mentioned problems, between the laser mirror of the laser interferometer and the wafer chuck, with respect to the moving direction (horizontal direction) of the wafer chuck. 4 which can be displaced only at right angles (vertical direction)
The connection is made by a connecting member having a joint link mechanism. The connecting member is composed of rigid members at both ends, two rigid plate members that connect the two rigid members, and elastic hinge parts that connect the respective end members of the rigid member and the rigid plate member. To do so.
【０００６】また上記連結部材を角棒状の剛性部材と
し、上記剛性部材の長手方向に沿って少なくとも二つの
円形、４角形等の中空孔を設け、さらに上記中空孔間を
上記剛性部材の長手方向に沿って連結する中空の切り込
み部を設け、上記中空孔により肉厚の薄くなった上記剛
性部材の部分を上記４節リンク機構の弾性ヒンジ部とす
るようにする。Further, the connecting member is a rectangular rod-shaped rigid member, and at least two circular and square hollow holes are provided along the longitudinal direction of the rigid member, and the space between the hollow holes is the longitudinal direction of the rigid member. A hollow cutout portion is provided along which the hollow member is thinned by the hollow hole to serve as the elastic hinge portion of the four-joint link mechanism.
【０００７】また、上記連結部材をコロのような転がり
要素により上記テ−ブル上に支持するようにする。ま
た、上記連結部材と上記テ−ブル間に間隙を設けて上記
連結部材を上記テ−ブル上に非接触で支持するようにす
る。また、上記ウエハチャックを上記テ−ブル上に点ま
たは線状に支持するようにする。Further, the connecting member is supported on the table by a rolling element such as a roller. A gap is provided between the connecting member and the table so that the connecting member is supported on the table in a non-contact manner. Further, the wafer chuck is supported on the table in a dot or line shape.
【０００８】[0008]
【作用】上記連結部材は、垂直方向の変位に対しては上
記４節リンク機構のヒンジ部のヒンジ動作により追随
し、ウエハチャックの移動方向（水平方向）に対しては
強い剛性を示す。このため、従来のレ−ザミラ−２をテ
−ブル３上に搭載するものや、レ−ザミラ−２とウエハ
チャック４間を単純な剛性材により連結する場合に比べ
て、レ−ザミラ−２の面の向きやレ−ザミラ−２とウエ
ハ５間の距離Ｌ等の変化が大きく低減される。The connecting member follows the displacement in the vertical direction by the hinge operation of the hinge portion of the four-bar linkage, and exhibits a strong rigidity in the moving direction (horizontal direction) of the wafer chuck. Therefore, as compared with the conventional laser miller-2 mounted on the table 3 and the case where the laser miller-2 and the wafer chuck 4 are connected by a simple rigid material, the laser miller-2 is used. Changes in the orientation of the surface of the laser and the distance L between the laser mirror-2 and the wafer 5 are greatly reduced.
【０００９】また、上記弾性部材は上記転がり要素によ
り上記テ−ブル上に摩擦少なく支持される。また、上記
弾性部材と上記テ−ブル間の間隙により上記弾性部材は
上記テ−ブル上に非接触で支持され、ウエハチャックと
テ−ブル間に作用する摩擦力を低減する。Further, the elastic member is supported on the table by the rolling element with little friction. Also, the elastic member is supported on the table in a non-contact manner by the gap between the elastic member and the table, and the frictional force acting between the wafer chuck and the table is reduced.
【００１０】[0010]
【実施例】図１は本発明による位置決め装置実施例の主
要部を示す斜視図であり、本発明を半導体製造用の縮小
投影露光装置に用いられている高精度ＸＹステ−ジに適
用したものである。縮小投影露光装置はＬＳＩなどの半
導体デバイスのパタ−ンをウェハ５上に縮小して露光転
写する。ＸＹステ−ジはウェハ５を所定の間隔で逐次移
動して位置決めする。1 is a perspective view showing a main part of an embodiment of a positioning apparatus according to the present invention, in which the present invention is applied to a high precision XY stage used in a reduction projection exposure apparatus for semiconductor manufacturing. Is. The reduction projection exposure apparatus reduces a pattern of a semiconductor device such as an LSI on the wafer 5 and transfers it by exposure. The XY stage sequentially moves the wafer 5 at a predetermined interval to position it.
【００１１】図１において、テ−ブル３に固定されたチ
ャック４はウェハ５を真空吸着し、送りねじ７を介しサ
−ボモ−タ８により駆動されレ−ル６上を移動する。テ
−ブル３には弾性切欠き方式による一体型弾性ヒンジ板
ばね１ａを介してレ−ザミラ−２ａが連結され，同様に
一体型弾性ヒンジ板ばね１ｂを介してレ−ザミラ−２ｂ
が連結されている。レ−ザミラ−２ａ，同２ｂにはレ−
ザヘッド１１から分岐したレ−ザ光がそれぞれ入射さ
れ、それぞれの反射光は干渉計９ａおよび同９ｂに受光
されてレ−ザ出射光と比較され、比較結果はそれぞれデ
ィテクタ１０ａ，同１０ｂにより検出される。ディテク
タ１０ａ，同１０ｂの各出力は所要の信号処理を施され
てテ−ブル３のＸ方向とＹ方向の移動距離情報に変換さ
れる。In FIG. 1, a chuck 4 fixed to a table 3 sucks a wafer 5 in a vacuum and is driven by a servo motor 8 via a feed screw 7 to move on a rail 6. A laser miller-2a is connected to the table 3 through an elastic elastic notch type integrated elastic hinge leaf spring 1a, and similarly, a laser mirror-2b is connected through an integral elastic hinge leaf spring 1b.
Are connected. Laser Mira-2a and Laserb
The laser beams branched from the head 11 are respectively incident, the respective reflected lights are received by the interferometers 9a and 9b and compared with the laser emission light, and the comparison results are detected by the detectors 10a and 10b, respectively. It The outputs of the detectors 10a and 10b are subjected to required signal processing and converted into movement distance information of the table 3 in the X and Y directions.
【００１２】図２は上記本発明装置の正面図、図３は同
上面図である。図２において、レ−ザ−ミラ−２ａは弾
性ヒンジ板ばね１ａの先端に支持され、コロ１４（また
はボ−ル）を介してテ−ブル３に軽く接している。ま
た、弾性ヒンジ板ばね１ａは図示のように鋼性のロッド
に円形の孔を適宜設け、円形孔間をスリット状の間隙に
より連結した構造となっている。FIG. 2 is a front view of the device of the present invention, and FIG. 3 is a top view of the same. In FIG. 2, the laser mirror-2a is supported by the tip of the elastic hinge leaf spring 1a, and is in light contact with the table 3 via the roller 14 (or ball). Further, the elastic hinge leaf spring 1a has a structure in which circular holes are appropriately provided in a steel rod as shown in the figure, and the circular holes are connected by a slit-shaped gap.
【００１３】図４は弾性ヒンジ板ばね１ａのレ−ザ−ミ
ラ−２ａ支持端がテ−ブル３の変形により押し上げられ
た状態を誇張して表現した図である。弾性ヒンジ板ばね
１ａは角棒状の高剛性材に少なくとも２個の円形の中空
孔１００を設け、さらに中空孔１００間を中空のスリッ
ト１０１により連結した構造となっている。FIG. 4 is an exaggerated view of a state in which the laser-mira-2a supporting end of the elastic hinge leaf spring 1a is pushed up by the deformation of the table 3. The elastic hinge leaf spring 1a has a structure in which at least two circular hollow holes 100 are provided in a square rod-shaped high-rigidity material, and the hollow holes 100 are connected by a hollow slit 101.
【００１４】このため図示のように垂直方向の変位に対
しては各中空孔１００の端部がヒンジとして作用して折
れ曲がり、また、水平方向の力に対しては高剛性を示し
すので伸縮しない。したがって、テ−ブル３がサ−ボモ
−タ８により送りねじ７を介して駆動されレ−ル６上を
移動する際の弾性変形や外力に対して、レ−ザ−ミラ−
２ａの反射面の向きやウエハチャック４とレ−ザ−ミラ
−２ａ間の距離Ｌ等の変化が少ないという特徴が得られ
る。すなわち、レ−ザ干渉測長器によりウェハ５の位置
決め精度を向上することができる。なお、各中空孔１０
０は必ずしも円形である必要はなく、上記ヒンジ部を形
成できるものであれば４角形、その他の形状であっても
差し支えない。For this reason, as shown in the figure, the end of each hollow hole 100 acts as a hinge to bend when displaced in the vertical direction, and it does not expand or contract because it exhibits high rigidity with respect to a horizontal force. .. Therefore, when the table 3 is driven by the servomotor 8 via the feed screw 7 and moves on the rail 6, the laser mirror against the elastic deformation and external force.
The feature that the direction of the reflecting surface of 2a and the distance L between the wafer chuck 4 and the laser mirror-2a are little changed is obtained. That is, the positioning accuracy of the wafer 5 can be improved by the laser interferometer. In addition, each hollow hole 10
0 does not necessarily have to be circular, and may be square or any other shape as long as it can form the hinge portion.
【００１５】図６に示した従来装置では図５に示すよう
に、テ−ブル３の湾曲によりレ−ザ−ミラ−２ａの反射
面の向きが大きく変化していた。また、ウエハチャック
４とレ−ザ−ミラ−２ａ間の距離Ｌの変化も大きかっ
た。また、レ−ザ−ミラ−２ａとウエハチャック４間を
単純な高剛性で連結する場合も同様であった。In the conventional apparatus shown in FIG. 6, as shown in FIG. 5, the direction of the reflecting surface of the laser mirror-2a was largely changed due to the curve of the table 3. The change in the distance L between the wafer chuck 4 and the laser mirror-2a was also large. The same applies to the case where the laser mirror 2a and the wafer chuck 4 are simply connected with high rigidity.
【００１６】また、図６に示すように弾性ヒンジ板ばね
１ａとテ−ブル３間に空隙を設けてコロ１４を省略する
ようにして、弾性ヒンジ板ばね１ａ、１ｂ等には摩擦力
や垂直方向の力が作用しないようにし、中空孔１００や
スリット１０１等により各弾性ヒンジ板ばねを軽量化す
ることもできる。また、図６においてはウエハチャック
４を支持部材１３のみによりテ−ブル３上に点状または
線状に支持するようにして、ウエハチャック４とテ−ブ
ル３間の接触面積を小さくている。これによりテ−ブル
３の変形がチャック４に伝わることを防止できるので、
距離Ｌの変化をさらに少なくすることができる。Further, as shown in FIG. 6, a gap is provided between the elastic hinge leaf spring 1a and the table 3 so that the roller 14 is omitted, so that the elastic hinge leaf springs 1a, 1b, etc. have a frictional force or a vertical force. It is also possible to reduce the weight of each elastic hinge leaf spring by preventing the directional force from acting and by using the hollow hole 100, the slit 101, and the like. Further, in FIG. 6, the wafer chuck 4 is supported by the support member 13 only on the table 3 in a dot shape or a linear shape so that the contact area between the wafer chuck 4 and the table 3 is reduced. This prevents the deformation of the table 3 from being transmitted to the chuck 4,
The change in the distance L can be further reduced.
【００１７】[0017]
【発明の効果】本発明により、ウエハテ−ブルの変形に
より生じるレ−ザ−ミラ−とウェ−ハとの間の距離変化
を従来装置に比べて５０％以下に低減することができ、
例えば露光装置におけるパ−タンの配列ピッチ誤差を従
来の±０．１μｍ程度からは±０．０５μｍ以下にする
ことができる。また、ウエハテ−ブルの厚みを従来装置
に比べて薄くすることができるので、位置決め装置の高
さが低まり、装置を軽量化することができる。この軽量
化によりウエハの位置決め時間を短縮することができ
る。According to the present invention, the change in the distance between the laser mirror and the wafer caused by the deformation of the wafer table can be reduced to 50% or less as compared with the conventional apparatus.
For example, the pattern arrangement pitch error in the exposure apparatus can be reduced to ± 0.05 μm or less from the conventional ± 0.1 μm. Further, since the thickness of the wafer table can be made thinner than that of the conventional device, the height of the positioning device can be lowered and the device can be made lighter. This weight reduction makes it possible to shorten the wafer positioning time.
【図１】本発明による位置決め装置実施例の斜視図であ
る。FIG. 1 is a perspective view of an embodiment of a positioning device according to the present invention.
【図２】本発明による位置決め装置実施例の正面図であ
る。FIG. 2 is a front view of an embodiment of a positioning device according to the present invention.
【図３】本発明による位置決め装置実施例の平面図であ
る。FIG. 3 is a plan view of an embodiment of a positioning device according to the present invention.
【図４】本発明による弾性ヒンジ板ばねの変形状態を示
す図である。FIG. 4 is a view showing a deformed state of the elastic hinge leaf spring according to the present invention.
【図５】従来の連結部材の変形状態を示す図である。FIG. 5 is a diagram showing a deformed state of a conventional connecting member.
【図６】本発明による位置決め装置の正面図である。FIG. 6 is a front view of a positioning device according to the present invention.
【図７】従来の位置決め装置の正面図である。FIG. 7 is a front view of a conventional positioning device.
【符号の説明】 １ａ，１ｂ…弾性ヒンジ板ばね、２ａ，２ｂ…レ−ザミ
ラ−、３…テ−ブル、４…ウェハチャック、５…ウェ
ハ、６…レ−ル、９ａ，９ｂレ−ザ干渉計、１１…レ−
ザヘッド、１４…コロ、１００…中空孔、１０１…スリ
ット。[Explanation of reference numerals] 1a, 1b ... Elastic hinge leaf springs, 2a, 2b ... Laser miller, 3 ... Table, 4 ... Wafer chuck, 5 ... Wafer, 6 ... Rail, 9a, 9b laser Interferometer, 11 ... Ray
The head, 14 ... roller, 100 ... hollow hole, 101 ... slit.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 柏 清隆 茨城県勝田市大字市毛882番地 株式会社 日立製作所計測器事業部内 (72)発明者 小林 功 茨城県土浦市神立町502番地 株式会社日 立製作所機械研究所内 (72)発明者 古川 貴康 茨城県勝田市大字市毛882番地 株式会社 日立製作所計測器事業部内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kiyotaka Kashiwa 882 Ichimo, Katsuta City, Ibaraki Prefecture, Hitachi, Ltd. Measuring Instruments Division, Hitachi Ltd. (72) Inventor Takayasu Furukawa, 882 Ichige, Ita, Katsuta-shi, Ibaraki Hitachi Instrument Co., Ltd.
Claims (6)
ウエハチャックをテ−ブル上に支持して移動し、被処理
物体の位置決めを行なう位置決め装置において、上記レ
−ザ干渉測長器のレ−ザミラ−と上記ウエハチャック間
を、上記ウエハチャックの移動方向（水平方向）に対し
て直角方向（垂直方向）のみに変位可能な４節リンク機
構を備えた連結部材により連結するようにしたことを備
えたことを特徴とする位置決め装置。1. A positioning device for positioning an object to be processed by supporting a wafer chuck, which holds an object to be processed such as a semiconductor wafer, on a table and moving the wafer chuck. -The Zamira and the wafer chuck are connected by a connecting member provided with a four-node link mechanism which is displaceable only in a direction (vertical direction) perpendicular to the moving direction (horizontal direction) of the wafer chuck. A positioning device comprising:
端部の剛性部材と、上記二つの剛性部材間を連結する２
枚の剛性板材と、上記剛性部材と剛性板材のそれぞれの
端部を連結する弾性ヒンジ部とにより構成するようにし
たことを特徴とする位置決め装置。2. The connecting member according to claim 1, wherein the connecting member connects between the rigid members at both ends and the two rigid members.
A positioning device comprising a rigid plate material and an elastic hinge part connecting the respective ends of the rigid member and the rigid plate material.
材を角棒状の剛性部材とし、上記剛性部材の長手方向に
沿って少なくとも二つの円形、４角形等の中空孔を設
け、さらに上記中空孔間を上記剛性部材の長手方向に沿
って連結する中空の切り込み部を設け、上記中空孔によ
り肉厚の薄くなった上記剛性部材の部分を上記４節リン
ク機構の弾性ヒンジ部とするようにしたことを特徴とす
る位置決め装置。3. The rigid member according to claim 1, wherein the connecting member is a rectangular rod-shaped rigid member, and at least two circular and square hollow holes are provided along the longitudinal direction of the rigid member. A hollow notch is provided to connect the portions along the longitudinal direction of the rigid member, and the portion of the rigid member thinned by the hollow hole is used as the elastic hinge portion of the four-bar linkage mechanism. Positioning device characterized by the above.
上記連結部材を上記テ−ブル上に支持する転がり要素部
材を設けたことを特徴とする位置決め装置。4. The method according to any one of claims 1 to 3,
A positioning device comprising a rolling element member for supporting the connecting member on the table.
上記連結部材と上記テ−ブル間に間隙を設け、上記連結
部材を上記テ−ブルに対して非接触で支持するようにし
たことを特徴とする位置決め装置。5. The method according to any one of claims 1 to 3,
A positioning device characterized in that a gap is provided between the connecting member and the table so that the connecting member is supported in a non-contact manner with respect to the table.
上記ウエハチャックを上記テ−ブル上に点または線状に
支持する支持部材を備えたことを特徴とする位置決め装
置。6. The method according to any one of claims 1 to 5,
A positioning device comprising a support member for supporting the wafer chuck on the table in a point or line shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5339592A JP3160049B2 (en) | 1992-03-12 | 1992-03-12 | Positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5339592A JP3160049B2 (en) | 1992-03-12 | 1992-03-12 | Positioning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05259024A true JPH05259024A (en) | 1993-10-08 |
| JP3160049B2 JP3160049B2 (en) | 2001-04-23 |
Family
ID=12941639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5339592A Expired - Fee Related JP3160049B2 (en) | 1992-03-12 | 1992-03-12 | Positioning device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3160049B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005191150A (en) * | 2003-12-24 | 2005-07-14 | Nikon Corp | Stage device and exposure apparatus, and method of manufacturing device |
| US7119884B2 (en) | 2003-12-24 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2009065147A (en) * | 2007-08-20 | 2009-03-26 | Soonhan Engineering Corp | Test piece moving stage comprising strain mechanism module for absorbing deformation of slide |
| JP2010147468A (en) * | 2008-12-22 | 2010-07-01 | Asml Netherlands Bv | Lithographic apparatus and method of manufacturing device |
| CN112967965A (en) * | 2021-03-12 | 2021-06-15 | 长江存储科技有限责任公司 | Alignment method, alignment device, alignment apparatus, and computer storage medium |
-
1992
- 1992-03-12 JP JP5339592A patent/JP3160049B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005191150A (en) * | 2003-12-24 | 2005-07-14 | Nikon Corp | Stage device and exposure apparatus, and method of manufacturing device |
| US7119884B2 (en) | 2003-12-24 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2009065147A (en) * | 2007-08-20 | 2009-03-26 | Soonhan Engineering Corp | Test piece moving stage comprising strain mechanism module for absorbing deformation of slide |
| JP2010147468A (en) * | 2008-12-22 | 2010-07-01 | Asml Netherlands Bv | Lithographic apparatus and method of manufacturing device |
| US9041913B2 (en) | 2008-12-22 | 2015-05-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method with bearing to allow substrate holder to float with respect to substrate table |
| CN112967965A (en) * | 2021-03-12 | 2021-06-15 | 长江存储科技有限责任公司 | Alignment method, alignment device, alignment apparatus, and computer storage medium |
| CN112967965B (en) * | 2021-03-12 | 2023-11-07 | 长江存储科技有限责任公司 | Alignment method, alignment device, alignment apparatus, and computer storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3160049B2 (en) | 2001-04-23 |
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