JPH05251518A - Test head for probing device - Google Patents

Abstract

PURPOSE:To eliminate troublesome operation and stably maintain the optical axis of a microscope by eliminating the operation of removing the lens-barrel of the microscope from a hole at the time of releasing the bottom plane of a test head by turning the test head main body so as to replace a probe board. CONSTITUTION:A vertically driving mechanism 2 which holds a microscope 1 and vertically moves the microscope 1 is directly mounted on a test head main body 4 through a mounting table 10 so as to be integrated and the microscope 1 and the hole 4a are prevented from interfering with the turning movement of the test head main body.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probing apparatus for electrically inspecting an integrated circuit formed on the surface of a semiconductor wafer, and more particularly to a probing apparatus having a probe for contacting electrode pads which are input / output terminals of the integrated circuit. Regarding the test head.

[0002]

2. Description of the Related Art FIG. 2 is a diagram showing a probing device for explaining an example of a conventional method for mounting a microscope.

Conventionally, this type of probing apparatus has been shown in FIG.
2, a stage 3 on which a wafer 7 is placed, a main body 5 on which the stage 3 is mounted, a probe board 6 in which a probe for contacting an electrode pad of the wafer 7 and transmitting and receiving a signal is embedded, and a probe board 6 is attached to the lower surface, and a test head body 4 having an observation hole 4a formed in the upper surface, and the test head body 4 is inserted into the hole 4a of the test head body 4,
A microscope 1 for observing a portion of a probe and an electrode head, a vertical drive mechanism 2 for holding the microscope 1 and performing vertical movements, and a support column to which the vertical drive mechanism 2 is attached via a hinge mechanism 8 and which extends from a main body 5. 9 and 9.

Before inspecting an integrated circuit formed on a wafer with this probing apparatus, it is necessary to examine the contact state between the probe and the electrode pad. In such a case, the microscope 1 is moved up and down in the hole 4a, and the contact state between the probe of the probe board 6 and the electrode pad of the wafer 7 is observed. Then, after confirming the contact state, the inspection was performed.

When the wafer to be measured is changed, the probe board 6 is replaced with a corresponding one, and then the contact state between the probe and the electrode pad is confirmed and the inspection is performed.

[0006]

However, in the conventional probing apparatus, the test head is circulated in order to release it from the stage on the lower surface of the test head when replacing the probe board. At this time, the microscope, which is attached to the column extending from the main body via the vertical drive mechanism, should be taken out from the hole, and then the microscope should be rotated by the hinge mechanism on the column so that it does not interfere with the rotation of the test head. There wasn't.

Not only is this operation troublesome,
It causes rattle in the hinge mechanism and distorts the optical axis of the microscope.

In order to solve such a problem, an object of the present invention is to provide a probing device which can always stably observe the contact state between the probe and the electrode pad without removing the lens barrel of the microscope from the hole of the test head body. To provide a test head.

[0009]

A test head of a probing apparatus according to the present invention comprises a probe board having a plurality of probes for contacting with an electrode pad of a semiconductor device for transmitting and receiving an electric signal, and a probe board mounted on a lower surface of the probe board. In addition, a body is formed with a hole through which the probe can be observed from the upper surface, a microscope for inserting a lens barrel into the hole and enlarging and observing the probe and the electrode pad, and holding the microscope and moving it up and down. An up-down drive mechanism and an attachment member that holds the up-down drive mechanism and is attached to the peripheral portion of the hole are provided.

[0010]

The present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing a probing device for explaining an embodiment of the present invention. In this test head, the microscope 1 inserted into the hole 4a is mounted on the upper surface of the test head body 4 together with the vertical drive mechanism 2 via the mounting base 10. As a result, the microscope 1 can be rotated together with the test head body 4, so that it is not necessary to remove the microscope from the hole 4a as in the conventional case.

That is, even when the probe board 6 is replaced, the microscope 1 can be replaced with the probe board wafer placed in the hole 4a formed in the test head body 4 as in the case of observing the contact state.

[0013]

As described above, according to the present invention, by directly attaching the probe holding member for holding the microscope for observation by inserting it into the hole of the main body and the vertical drive mechanism for focus adjustment to the probe, The effect of removing the microscope from the hole when replacing the board and the mechanism for supporting and rotating the microscope is eliminated, and a test head that can stably maintain the optical axis without complicated operations can be obtained. There is.

[Brief description of drawings]

FIG. 1 is a diagram showing a probing device for explaining an embodiment of a test head of the present invention.

FIG. 2 is a diagram showing a probing device for explaining an example of a conventional test head.

[Explanation of symbols]

 1 microscope 2 vertical drive mechanism 3 stage 4 test head main body 4a hole 5 main body 6 probe board 7 wafer 8 hinge mechanism 9 strut 10 mounting base

Claims (1)

[Claims] 1. A probe board having a plurality of probes for contacting with electrode pads of a semiconductor device for transmitting and receiving an electric signal, and a hole for mounting the probe board on a lower surface and observing the probe from an upper surface. Main body, a microscope for inserting the lens barrel into this hole and enlarging and observing the probe and the electrode pad, a vertical drive mechanism for holding the microscope and moving it up and down, and holding the vertical drive mechanism and A test head for a probing device, comprising: a mounting member mounted on a peripheral portion of a hole.